JP2002261433A - Lifting preventing jig for soldering component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lifting preventing jig for soldering component for effectively preventing the positional deviation, such as the inclination and lifting of soldering electronic component. SOLUTION: This lifting preventing jig 10 is provided with a component retaining jig 15 having an electronic component housing recessed section 15a having the depth corresponding to the height of a relay 12 placed on a printed board 11 so that the jig 10 may be placed on the board 11 astride the relay 12. This jig 15 is held at the placed location on the printed board 11 by its own weight. The recessed section 15a is formed in such a tapered state that the section 15a gradually expands as going toward the placing surface of the printed board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for preventing an electronic component such as a relay or a connector from being lifted or inclined when the electronic component is soldered and mounted on a substrate. It is.

[0002]

2. Description of the Related Art Conventionally, when electronic components such as relays and connectors are mounted on a printed circuit board (board) by soldering using a flow solder, a multi-solder, or the like, for example, as shown in FIG. The relay 2 is placed and set with the lead 2a inserted through a hand or a robot.

[0003] After that, by passing over the solder 3 jetted by a soldering device such as a flow solder or a multi-solder, the circuit on the printed board 1 side and each lead 2 are connected.
a was being soldered.

[0004]

However, according to the above-mentioned conventional soldering method, after the relay 2 is mounted on the printed circuit board 1 and until the soldering is performed, the transfer is carried by a hand-held device or a transfer conveyor. However, during the transport, since the relay 2 is not fixed to the printed circuit board 1 at all, as shown in FIG. 6, a slight displacement such as lifting or tilting easily occurs due to slight vibration or impact. There is a risk.

[0005] Some products are held and soldered in the state of misalignment, and products soldered in such a state in which misalignment such as lifting or tilting occurs may cause interference or interference with other parts. There is a possibility that the durability may be degraded due to the decrease in solder connection points.

Further, in order to prevent such floating and inclination, a method of clinching a portion of the lead 2a protruding from the printed circuit board 1 has been adopted. However, there is a problem that it is difficult to reliably perform the clinch and the stability is poor. there were.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a jig for preventing a soldering component from floating, which more effectively prevents a displacement such as a lifting or an inclination.

[0008]

A technical means for solving the above-mentioned problem is a soldering component lifting prevention jig for preventing a displacement of an electronic component mounted on a substrate and soldered and mounted. In addition, the floating prevention jig is a component holding jig having an electronic component receiving recess having a depth corresponding to the height of the electronic component on the substrate so that the electronic component can be placed on the substrate. And a holding means for holding the component holding jig on the substrate in a state where the component holding jig is placed on the substrate across the electronic component.

The holding means may have a structure in which the component holding jig has its own weight.

Further, the holding means may have a structure comprising a holding jig for holding the substrate and the component holding jig in a sandwiched state.

[0011] The electronic component accommodating recess may be formed in a tapered shape that gradually expands in the direction of the mounting surface of the substrate.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, an anti-floating jig 10 for preventing the soldering parts from floating or the like.
Is a printed circuit board 1 as an example of a substrate in the center of the lower surface.
1, an electronic component receiving recess having a depth corresponding to the height of the relay 12 on the printed circuit board 11 on which the lead 12 a of the relay 12 as an example of the electronic component is inserted by hand or robot, as in the related art. It is constituted by a so-called cap-shaped component holding jig 15 having 15a.

The component holding jig 15 is fitted into the electronic component housing recess 15a which straddles the relay 12 placed on the printed circuit board 11, and the component holding jig 15 is mounted on the printed circuit board 11. With the component holding jig 15 placed on the printed circuit board 11,
The component holding jig 15 owns the weight of the component holding jig 15 and constitutes a holding means.

At this time, since the material of the component holding jig 15 is too heavy with iron or stainless steel and the conveyor may be bent, glass epoxy, baking material or the like may be used to appropriately have its own weight (50 to 200 g). , Aluminum or the like.

Also, the bottom surface 15 of the electronic component housing recess 15a
b and the upper surface 12b of the relay 12
The structure has a clearance of about m.

Further, the inner peripheral surface 15c of the electronic component accommodating recess 15a is formed in a tapered shape that gradually expands downward, and in the present embodiment, the taper angle θ is, for example, about 20 °. Have been.

In this embodiment, the relay 12 is placed on the printed circuit board 11 and set, and then the component holding jig 15 is placed on the printed circuit board 11 so as to cover the relay 12 as in the prior art. Place on.

At this time, since the inner peripheral surface 15c of the electronic component accommodating concave portion 15a is formed in a tapered shape, if the relay 12 is mounted in an inclined state, the mounting posture is properly corrected. .

Thereafter, the circuit on the printed circuit board 11 and each lead 1 are passed through the solder jetted by a soldering device such as a flow solder or a multi-solder.
Soldering with 2a is performed.

According to the present embodiment, the relay 12
The component holding jig 15 is placed on the printed circuit board 11 so as to cover the relay, so that the displacement of the relay 12 due to vibration or impact during transportation by a hand-held or transportation conveyor or the like, and the resulting misalignment such as inclination can be effectively performed. Good soldering can be prevented, and the problem of durability deterioration due to interference with other parts and reduction of solder connection points in the soldered product as described above can be effectively prevented.

Further, since the component holding jig 15 is fixed and held on the printed circuit board 11 by its own weight, no additional components are required, and the component holding jig 15 can be easily set and removed, and workability is improved. There is also the advantage of excellence.

Further, the mounting posture of the relay 12 can be naturally corrected by the tapered structure of the inner peripheral surface 15c of the electronic component accommodating recess 15a, and there is an advantage that the usability is excellent.

FIG. 2 shows a second embodiment, in which the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

That is, in the present embodiment, the lifting prevention jig 10 includes a component holding jig 15 and a holding jig 16 as holding means for holding the printed board 11 and the component holding jig 15 in a sandwiched state. It consists of.

The component holding jig 15 is formed in a so-called hat shape and includes a flange portion 15d that is formed to protrude laterally. The outer edge of the flange portion 15d and the edge of the printed circuit board 11 are held by the holding jig. It is held in a pinched state by 16.

The holding jig 16 is provided with a holding jig main body 16b having a step 16a in which the edge of the printed circuit board 11 is engaged in a fitting manner, and a screw mechanism or the like with respect to the holding jig main body 16b. A lock claw 16c is provided which can be moved up and down. In a state where both side edges of the printed circuit board 11 are engaged with the step 16a of each holding jig body 16b, each lock claw 16c is tightened, and a component is provided. The structure is such that the flange 15d of the holding jig 15 and the printed circuit board 11 are fixed and held in a sandwich shape.

According to the present embodiment, similarly to the first embodiment, the component holding jig 15 is placed on the printed circuit board 11 so as to cover the relay 12, so that the jig 15 can be held by hand or transferred by a transfer conveyor or the like. Relay 1 due to vibration, shock, etc.
2 can be effectively prevented from rising and the resulting positional shift such as inclination, and the problem of durability degradation due to interference with other components and a decrease in solder connection points can be effectively prevented.

The component holding jig 15 on the printed circuit board 11 is held in a holding state by a holding jig 16 so that the holding state can be obtained more firmly.
Can be more reliably prevented.

FIG. 3 shows a third embodiment. The same components as those in the second embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

That is, in this embodiment, the holding jig 1
6 is constituted by a substantially U-shaped clip body which can be expanded and deformed by elasticity, and is mounted by being pushed in from the side over the edge portion and the flange portion 15d of the printed circuit board 11 which are superposed on each other. The structure is such that the printed board 11 and the component holding jig 15 are held in a sandwiched state by the elasticity of the holding jig 16.

Also, according to the present embodiment, the first
As in the first embodiment, the printed circuit board 1
Since the component holding jig 15 is placed on the relay 1, misalignment such as lifting of the relay 12 due to vibration or impact during transportation by hand holding or a transportation conveyor or the like, and thereby inclination can be effectively prevented. It is possible to effectively prevent the problem of durability deterioration due to interference with parts and a decrease in solder connection points.

Further, the attachment / detachment operation of the holding jig 16 becomes easier.

In each of the above embodiments, the structure is shown in which the relay 12 is accommodated in the electronic component accommodating recess 15a of the component holding jig 15 and is covered over the entire week.
Alternatively, as shown in FIG. 3, the component holding jig 15 may be configured in a so-called U-shape, and may have a structure that straddles the relay 12 in only one direction.

The bottom surface 15 of the electronic component housing recess 15a
The presence or absence and the degree of clearance between b and the upper surface 12b of the relay 12 and the presence and degree of the taper angle θ of the inner peripheral surface 15c may be determined as necessary.

Further, the electronic component is not limited to the relay 12, but may be another electronic component such as a connector.

[0036]

As described above, according to the jig for preventing floating of a soldered component according to the present invention, the height of the electronic component on the substrate is adjusted so that the electronic component can be placed on the substrate. And a holding means for holding the component holding jig on the substrate while the electronic component of the component holding jig is placed on the board. Since the component holding jig is placed on the printed circuit board across the electronic components, the electronic components rise and tilt due to vibration or impact during transportation by hand-held or transport conveyors. It is possible to effectively prevent misalignment, etc. and perform good soldering, and effectively prevent the problem of durability deterioration due to interference with other parts in the soldered product and reduction of solder connection points. Cormorants has the advantage.

In addition, if the holding means has a structure in which the component holding jig has its own weight, there is an advantage that the component holding jig can be easily set and removed, and the workability is excellent.

Further, if the holding means is constituted by a holding jig for holding the substrate and the component holding jig in a sandwiched state, the holding state can be obtained more firmly, and the displacement of the electronic component can be more surely adjusted. There is an advantage that it can be prevented.

Further, if the electronic component accommodating recess is formed in a tapered shape that gradually expands in the direction of the mounting surface of the substrate, the tapered structure naturally corrects the mounting position of the electronic component. It has the advantage of being easy to use.

[Brief description of the drawings]

FIG. 1 is a cross-sectional front view of a main part according to a first embodiment of the present invention.

FIG. 2 is a sectional front view of a main part according to a second embodiment of the present invention.

FIG. 3 is a sectional front view of a main part according to a third embodiment of the present invention.

FIG. 4 is an explanatory view of a conventional soldering process.

FIG. 5 is an explanatory view of a conventional soldering step.

FIG. 6 is an explanatory diagram of a defective state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Lift prevention jig 11 Printed circuit board 12 Relay 12a Lead 12b Upper surface 15 Component holding jig 15a Electronic component accommodating recess 15b Bottom surface 15c Inner peripheral surface 15d Flange 16 Holding jig 16a Step 16b Holding jig main body 16c Lock claw

Claims (4)

[Claims] 1. A jig for preventing floating of a soldered component, which prevents displacement of an electronic component mounted on a substrate and mounted by soldering, wherein the jig for preventing soldering extends across the electronic component. A component holding jig having an electronic component accommodating concave portion having a depth corresponding to the height of the electronic component on the substrate is provided so as to be mountable on the substrate, and the electronic component of the component holding jig straddles the electronic component. A jig for preventing floating of a soldered component, comprising holding means for holding the component holding jig on the substrate in a state of being placed on the substrate. 2. The jig for preventing floating of a soldered component according to claim 1, wherein the holding means is the weight of the component holding jig. 3. The jig for preventing floating of a soldered component according to claim 1, wherein said holding means comprises a holding jig for holding said substrate and said component holding jig in a sandwiched state. 4. The soldering device according to claim 1, wherein the electronic component accommodating concave portion is formed in a tapered shape that gradually expands in a mounting surface direction of the substrate. Jig for preventing parts from floating.