JPH07201650A - Surface mounting electronic device - Google Patents
Surface mounting electronic deviceInfo
- Publication number
- JPH07201650A JPH07201650A JP5353925A JP35392593A JPH07201650A JP H07201650 A JPH07201650 A JP H07201650A JP 5353925 A JP5353925 A JP 5353925A JP 35392593 A JP35392593 A JP 35392593A JP H07201650 A JPH07201650 A JP H07201650A
- Authority
- JP
- Japan
- Prior art keywords
- board
- mounting
- terminal
- electronic component
- flexible board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装電子部品端子
部分の改善に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvement of terminal portions of surface mount electronic components.
【０００２】[0002]
【従来の技術】従来から表面実装電子部品の端子は、表
面実装電子部品の一部に導体部分を作って直接端子とし
ているのが一般的であった。2. Description of the Related Art Conventionally, a terminal of a surface mount electronic component has generally been a direct terminal by forming a conductor portion on a part of the surface mount electronic component.
【０００３】[0003]
【発明が解決しようとする課題】しかし表面実装電子部
品の小型軽量化等に伴い部品ケースの強度が補強しにく
い事情等により、部品を実装基板にはんだ付けした場合
に、落下等のショック、あるいは実装基板のネジどめそ
の他による実装基板のソリや捻れ等により部品に思わぬ
大きな応力がかかり、封止部分がはがれたりはんだ付け
部分に損傷を受ける等の課題があった。However, due to the fact that the strength of the component case is difficult to reinforce due to the downsizing and weight reduction of surface-mounted electronic components, when components are soldered to a mounting board, a shock such as a drop, or There was a problem that a large amount of unexpected stress was applied to the component due to warping or twisting of the mounting substrate due to screwing of the mounting substrate or the like, and the sealing part was peeled off or the soldering part was damaged.
【０００４】[0004]
【課題を解決するための手段】部品が実装基板にしっか
りとはんだ等で固着され、実装基板のソリや捻れの応力
が直接部品にかかり、応力の逃げ場が無いことが部品の
破損はんだ付けの損傷につながっているのであるから、
この応力を吸収してくれる部材、例えばフレキシブル基
板等に一旦部品を取り付けて、このフレキシブル基板の
端子を実装基板に取り付ける方法で課題を解決した。[Means for Solving the Problems] The component is firmly fixed to the mounting board with solder or the like, the stress of warping or twisting of the mounting board is directly applied to the component, and there is no escape area for the stress. Because it is connected to
The problem has been solved by a method of temporarily attaching a component to a member that absorbs this stress, such as a flexible substrate, and attaching the terminals of the flexible substrate to the mounting substrate.
【０００５】[0005]
【作用】表面実装電子部品を実装基板に固着する際、フ
レキシブル基板等の緩衝作用のある材料を介して固着す
ることにより、実装基板からの応力から部品を守る。When the surface mounting electronic component is fixed to the mounting substrate, the component is protected from the stress from the mounting substrate by fixing the surface mounting electronic component through a material having a buffering function such as a flexible substrate.
【０００６】[0006]
【実施例】図１に示すように、表面実装電子部品１にフ
レキシブル基板２をスポット溶接にて固着する。このフ
レキシブル基板には、表面実装電子部品の端子に相当す
る位置に導体のランドを有し、このランドよりフレキシ
ブル基板の端子まで導体で接続されている。予めスポッ
ト溶接で、該表面実装電子部品の端子と該フレキシブル
基板の導体のランドとが接続される。このことにより表
面実装電子部品の端子は直接実装基板に取り付けられる
のではなく、フレキシブル基板を介して取り付けられる
ことになる。ここではスポット溶接で止めた例を示して
いるが、はんだ付けや、高温はんだ付けで止めてもよ
い。また、フレキシブル基板は、少なくとも表面実装電
子部品の端子と接続する箇所、及び実装基板と接続する
箇所で被覆されていないことが必要であるが、必要に応
じて被覆されない箇所があってもよい。EXAMPLE As shown in FIG. 1, a flexible substrate 2 is fixed to a surface mount electronic component 1 by spot welding. The flexible board has a land of a conductor at a position corresponding to a terminal of the surface-mounted electronic component, and a conductor is connected from the land to the terminal of the flexible board. The terminal of the surface-mounted electronic component and the land of the conductor of the flexible substrate are connected to each other by spot welding in advance. As a result, the terminals of the surface mount electronic component are not directly attached to the mount board, but are attached via the flexible board. Although an example of stopping by spot welding is shown here, it may be stopped by soldering or high temperature soldering. Further, the flexible substrate needs to be uncovered at least at a portion connected to the terminals of the surface-mounted electronic component and at a portion connected to the mounting substrate, but may be uncovered if necessary.
【０００７】図２に他の実施例を示す。図１のフレキシ
ブル基板の端子部分を表面実装電子部品の下側に巻き込
んでいる。この様にすると、図１に比べて部品の高さは
高くなるが、実装基板上の占有面積は小さく出来る。FIG. 2 shows another embodiment. The terminal portion of the flexible board of FIG. 1 is wound under the surface mount electronic component. By doing so, the height of the component is higher than that in FIG. 1, but the area occupied on the mounting board can be reduced.
【０００８】図３にもう一つ他の実施例を示す。図１の
例の部品の下にシリコンゴム等の弾性シートを敷き込ん
だ例である。この様にすると、図１に比べて部品の位置
決め及び固定が容易、且つ強固にできる。図４は、図２
の例の部品の下にシリコンゴム等の弾性シートを敷き込
んだ例を示す。この様にすると、図２に比べて部品の位
置決め及び固定が容易且つ強固にできる。FIG. 3 shows another embodiment. This is an example in which an elastic sheet such as silicon rubber is laid under the component of the example of FIG. By doing so, positioning and fixing of the parts can be performed more easily and more firmly than in FIG. 4 is shown in FIG.
An example in which an elastic sheet of silicon rubber or the like is laid under the parts of the example of FIG. By doing so, positioning and fixing of the parts can be performed more easily and more firmly than in FIG.
【０００９】[0009]
【発明の効果】従来より、基板同士を接続する手段とし
て、フレキシブル基板が用いられるが、本発明では、表
面実装電子部品が実装基板にしっかりと固定されても、
実装基板のソリや捻れの応力はフレキシブル基板の弾力
性に吸収されて直接部品本体に伝わらない。このため
に、実装基板のソリや捻れの応力により実装基板に取り
付けられた表面実装電子部品が破損することが皆無とな
った。また、表面実装電子部品の下に、弾性シートを付
加することにより、表面実装電子部品の破損を防止する
ことができた。本発明は、表面積の大きいため、圧電振
動子や圧電発振器に特に有効である。Conventionally, a flexible substrate has been used as a means for connecting substrates to each other, but in the present invention, even if the surface mount electronic component is firmly fixed to the mount substrate,
The warp or twisting stress of the mounting board is absorbed by the elasticity of the flexible board and is not directly transmitted to the component body. As a result, the surface mount electronic components mounted on the mounting board are never damaged due to the warping or twisting stress of the mounting board. Also, by adding an elastic sheet below the surface-mounted electronic component, it was possible to prevent the surface-mounted electronic component from being damaged. The present invention, which has a large surface area, is particularly effective for piezoelectric vibrators and piezoelectric oscillators.
【図１】図１は、本発明のフラットなフレキシブル基板
の例を示す斜視図である。FIG. 1 is a perspective view showing an example of a flat flexible substrate of the present invention.
【図２】図２は、本発明のフレキシブル基板の端子部を
部品の下側に巻き込んだ例を示す斜視図である。FIG. 2 is a perspective view showing an example in which the terminal portion of the flexible substrate of the present invention is wound around the lower side of the component.
【図３】図３は、本発明の図１の実施例の部品の下にシ
リコンゴム等の弾性シートを敷き込んだ例を示す断面図
である。FIG. 3 is a cross-sectional view showing an example in which an elastic sheet of silicon rubber or the like is laid under the component of the embodiment of FIG. 1 of the present invention.
【図４】図４は、本発明の図２の実施例の部品の下にシ
リコンゴム等の弾性シートを敷き込んだ例を示す断面図
である。4 is a cross-sectional view showing an example in which an elastic sheet of silicon rubber or the like is laid under the component of the embodiment of FIG. 2 of the present invention.
１ 表面実装電子部品 ２ フレキシブル基板 ３ 弾性シート ４ 実装基板 1 surface mount electronic component 2 flexible board 3 elastic sheet 4 mount board
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/18 Ｈ 7128−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H05K 1/18 H 7128-4E
Claims (2)
おいて、該表面実装電子部品に端子を具備したフレキシ
ブル基板を取付け、該フレキシブル基板が該表面実装電
子部品の端子と接続されていることを特徴とする表面実
装電子部品。1. A leadless type surface mount electronic component, wherein a flexible substrate having a terminal is attached to the surface mount electronic component, and the flexible substrate is connected to a terminal of the surface mount electronic component. Surface mount electronic components.
シートを付加したことを特徴とする特許請求の範囲第１
項記載の表面実装電子部品。2. An elastic sheet is added to the lower side of the bottom surface of the surface mount electronic component.
The surface mount electronic component described in the item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5353925A JPH07201650A (en) | 1993-12-29 | 1993-12-29 | Surface mounting electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5353925A JPH07201650A (en) | 1993-12-29 | 1993-12-29 | Surface mounting electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07201650A true JPH07201650A (en) | 1995-08-04 |
Family
ID=18434151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5353925A Pending JPH07201650A (en) | 1993-12-29 | 1993-12-29 | Surface mounting electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07201650A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000100982A (en) * | 1998-09-18 | 2000-04-07 | Toyo Commun Equip Co Ltd | Electronic part package |
| WO2006090805A1 (en) * | 2005-02-23 | 2006-08-31 | Sony Corporation | Oscillatory gyro sensor |
| JP2017135275A (en) * | 2016-01-28 | 2017-08-03 | 三菱電機株式会社 | Electronic component module, circuit module, manufacturing method of electronic component module, and manufacturing method of circuit module |
-
1993
- 1993-12-29 JP JP5353925A patent/JPH07201650A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000100982A (en) * | 1998-09-18 | 2000-04-07 | Toyo Commun Equip Co Ltd | Electronic part package |
| WO2006090805A1 (en) * | 2005-02-23 | 2006-08-31 | Sony Corporation | Oscillatory gyro sensor |
| JP2006284551A (en) * | 2005-02-23 | 2006-10-19 | Sony Corp | Oscillating gyro sensor |
| US7654139B2 (en) | 2005-02-23 | 2010-02-02 | Sony Corporation | Vibratory gyrosensor having a vibration element provided with terminals |
| JP2017135275A (en) * | 2016-01-28 | 2017-08-03 | 三菱電機株式会社 | Electronic component module, circuit module, manufacturing method of electronic component module, and manufacturing method of circuit module |
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