KR200154806Y1 - A smd package - Google Patents
A smd package Download PDFInfo
- Publication number
- KR200154806Y1 KR200154806Y1 KR2019960057021U KR19960057021U KR200154806Y1 KR 200154806 Y1 KR200154806 Y1 KR 200154806Y1 KR 2019960057021 U KR2019960057021 U KR 2019960057021U KR 19960057021 U KR19960057021 U KR 19960057021U KR 200154806 Y1 KR200154806 Y1 KR 200154806Y1
- Authority
- KR
- South Korea
- Prior art keywords
- package
- smd package
- substrate
- base
- smd
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
본 고안은 칩내장용 패키지에 관한 것으로, 외부 표면에 칩과 연결된 다수개의 리드가 하면에서부터 측면으로 연장 형성되어 있으며, 이중 측면리드부(12)가 홈 형상으로 형성되어 있는 베이스(14)와 카버(16)로 구성되는 상자형의 SMD 패키지에 있어서, 상기 리드가, 상기 베이스(14) 아래면에 홈 형상으로 형성되어진 것을 특징으로 하여, 기판에 진동이나 충격이 가해진다 해도 SMD 패키지와 기판과의 접속에는 영향을 받지않아 휴대용이나 움직이는 장치에 안전하게 사용될 수 있게 된 것이다.The present invention relates to a package for chip embedded, wherein a plurality of leads connected to the chip on the outer surface is formed extending from the lower side to the side, the double side lead portion 12 is formed in the groove shape and the base 14 and the carver In the box-shaped SMD package composed of (16), the lead is formed in a groove shape on the lower surface of the base 14, so that the SMD package and the substrate may be subjected to vibration or impact even if the substrate is subjected to vibration or impact. It is not affected by the connection of the device and can be used safely in portable or moving devices.
Description
본 고안은 칩내장용 패키지에 관한 것으로, 특히 기판의 홈에 단단하게 밀착되어 진동이나 충격에도 흔들림없이 연결될 수 있게 된 SMD(surface mounting device) 패키지에 관한 것이다.The present invention relates to a package for chip mounting, and more particularly, to a surface mounting device (SMD) package that is tightly adhered to a groove of a substrate and can be connected without vibration or shock.
일반적으로 칩내장용 패키지는 표면 탄성파 필터 등의 특정 기능을 가진 칩을 기판상에 신속 용이하게 장착하게 하기 위해 사용되는 것으로, 기판과 칩과의 연결은 패키지에 구비된 리드에 의해서 이루어지게 되며, 리드가 돌출되어 기판과 납땜시켜 사용할 수 있게 된 것과 패키지에 맞게 기판상에 홈이 구비되어 이 홈에 패키지를 끼울 수 있게 된 것으로 크게 구별된다. 이중 전자를 핀타입 패키지라 하며 후자를 SMD 패키지라 한다.In general, the chip mounting package is used to quickly and easily mount a chip having a specific function such as a surface acoustic wave filter on the substrate, the connection between the substrate and the chip is made by a lead provided in the package, The lead is protruded and can be soldered to the substrate, and the groove is provided on the substrate so that the package can be inserted into the groove. The former is called a pin type package and the latter is called an SMD package.
이들은 베이스에 내장되는 칩과 이 칩에 와이어로 연결되는 리드프레임 및 상기 베이스 위에 씌워지는 카버로 이루어지는 데, 특히 SMD 패키지는 도 3에 도시된 바와 같이, 일반적인 핀타입과는 달리 베이스(30)와 카버(32)로 구성되는 패키지가 상자형으로 이루어지고, 상기 베이스(30) 외부 표면에 칩과 연결된 다수개의 리드(34)가 하면에서부터 측면으로 연장 형성되어 있으며, 패키지의 표면에 적절히 형성된 홈을 따라 연장됨으로써 외부로 돌출되지 않게 되어 있고, 측면리드부(36)는 측면에서 움푹들어간 홈 형상으로 되어 있다.They consist of a chip embedded in the base, a lead frame connected to the chip by wires, and a cover formed on the base. In particular, the SMD package is different from the base 30, unlike the general fin type, as shown in FIG. The package consisting of the cover 32 is formed in a box shape, a plurality of leads 34 connected to the chip on the outer surface of the base 30 is formed extending from the lower side to the side, and a groove formed appropriately on the surface of the package It extends along, so that it does not protrude outside, and the side lead part 36 becomes a groove shape recessed in the side surface.
이러한 구조의 SMD 패키지는 기판상의 홈에 끼워져 사용되게 되는데, 기판상의 홈에는 SMD 패키지 측면리드부에 맞게 돌출된 접속단자가 구비되어 있음으로 인해 SMD 패키지를 기판에 장착함과 동시에 SMD 패키지와 기판 접속단자가 연결되게 된다.The SMD package having such a structure is used by being inserted into a groove on the substrate. The groove on the substrate is provided with a connection terminal protruding to the SMD lead side lead portion. The terminal is connected.
그러나, SMD 패키지가 장착되는 장비가 휴대용 등으로 사용될 경우가 많은데, 이때 진동과 충격에도 견딜 수 있게 SMD 패키지가 기판에 장착되어 있어야 함에도 불구하고, 사용할 때의 진동 때문에 SMD 패키지와 기판간에 접속이 끊기는 경우가 발생되는 문제점이 있었다.However, in many cases, the equipment in which the SMD package is mounted is used for portable purposes. In this case, although the SMD package must be mounted on the board to withstand vibration and shock, the connection between the SMD package and the board is disconnected due to the vibration in use. There was a problem that occurred.
이에 본 고안은 상기한 문제점을 해결하기 위한 것으로, 기판상에 SMD 패키지가 단단히 밀착되어 진동이나 충격에도 접속이 끊기지 않게된 SMD 패키지를 제공함에 그 목적이 있다.Accordingly, an object of the present invention is to provide a SMD package in which the SMD package is firmly adhered to the substrate so that the connection is not interrupted even by vibration or shock.
상기한 목적을 달성하기 위한 본 고안의 SMD 패키지는, 외부 표면에 칩과 연결된 다수개의 리드가 하면에서부터 측면으로 연장 형성되어 있으며, 이중 측면리드부가 홈 형상으로 형성되어 있는 베이스와 카버로 구성되는 상자형의 SMD 패키지에 있어서, 상기 리드가, 상기 베이스 하면에 홈 형상으로 형성되어진 것을 특징인 것이다.The SMD package of the present invention for achieving the above object, a plurality of leads connected to the chip on the outer surface is formed extending from the lower side to the side, the box consisting of the base and the cover is formed in the groove shape of the double side In the SMD package of the type, the lead is formed in a groove shape on the lower surface of the base.
이와 같은 구조의 SMD 패키지를 베이스 하면과 측면의 홈에 맞게 돌기가 형성된 기판에 장착하게 되면, SMD 패키지가 기판과 밀착되며 결합되게 되어 진동과 충격에도 불구하고 SMD 패키지와 기판간의 신뢰성있는 접속이 가능하게 되는 것이다.When the SMD package having such a structure is mounted on a substrate formed with protrusions corresponding to the grooves on the bottom and side of the base, the SMD package is in close contact with and bonded to the substrate, so that a reliable connection between the SMD package and the substrate is possible despite vibration and shock. Will be done.
도 1은 본 고안의 실시예에 따른 SMD 패키지의 사시도,1 is a perspective view of an SMD package according to an embodiment of the present invention,
도 2는 도 1의 SMD 패키지 측면도,2 is a side view of the SMD package of FIG.
도 3은 종래의 SMD 패키지의 사시도이다.3 is a perspective view of a conventional SMD package.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10 : 하부리드부12 : 측면리드부10: lower lead portion 12: side lead portion
14 : 베이스16 : 카버14 Base 16: Carver
30 : 베이스32 : 카버30: base 32: carver
34 : 리드36 : 측면리드부34: lead 36: side lead portion
이하, 본 고안의 실시예를 첨부한 예시도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, an embodiment of the present invention will be described in detail.
도 1은 본 고안의 바람직한 실시예로서의 SMD 패키지 하면과 측면을 나타낸 사시도이고, 도 2는 도 1에 도시된 SMD 패키지의 측면도로서, 하면과 측면에 홈 형상의 하부리드부(10)와 측면리드부(12)가 형성되어 있는 베이스(14)와 이 베이스(14)를 덮어주는 카버(16)로 구성된 SMD 패키지를 나타내고 있다.1 is a perspective view showing the lower surface and the side surface of the SMD package as a preferred embodiment of the present invention, Figure 2 is a side view of the SMD package shown in Figure 1, the lower lead portion 10 and the side lead portion of the groove shape on the lower surface and side The SMD package which consists of the base 14 in which (12) is formed, and the cover 16 which covers this base 14 is shown.
이러한 구조의 SMD 패키지를 기판에 장착하는 공정은, 우선 상기 베이스(14)내의 바닥면에 칩을 부착하여 칩과 리드간에 와이어본딩을 한 후, 카버(16)를 씌워 기판의 홈에 장착하는 과정으로 이루어진다.In the process of mounting the SMD package having such a structure on the substrate, first, a chip is attached to the bottom surface of the base 14 to wire bond between the chip and the lead, and then a cover is mounted to cover the groove of the substrate. Is done.
이때 기판의 홈에는 SMD 패키지의 하부리드부(10)와 측면리드부(12)에 맞는 돌기형상의 접속단자가 구비되어 있어, SMD 패키지를 기판에 장착함과 동시에 SMD 패키지의 리드와 접속단자가 밀착되어 결합됨으로 인해 기판에 진동이나 충격이 가해진다 해도 접속에는 전혀 문제가 없게 되는 것이다.At this time, the groove of the substrate is provided with a projection-shaped connection terminal for the lower lead portion 10 and the side lead portion 12 of the SMD package, and the lead and the connection terminal of the SMD package Due to the tight coupling, even if vibration or impact is applied to the substrate, there is no problem in connection.
이와같은 본 고안의 효과는 칩이 장착된 SMD 패키지의 하부리드부와 측면리드부가 홈 형상으로 형성되어 있음으로 인해 기판에 진동이나 충격이 가해진다 해도 SMD 패키지와 기판과의 접속에는 영향을 받지않아 휴대용이나 움직이는 장치에 안전하게 사용될 수 있다는 것이다.The effect of the present invention is that the lower lead portion and the side lead portion of the chip-mounted SMD package are formed in a groove shape, so even if vibration or impact is applied to the substrate, the connection between the SMD package and the substrate is not affected. It can be used safely in portable or moving devices.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960057021U KR200154806Y1 (en) | 1996-12-26 | 1996-12-26 | A smd package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960057021U KR200154806Y1 (en) | 1996-12-26 | 1996-12-26 | A smd package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980043897U KR19980043897U (en) | 1998-09-25 |
| KR200154806Y1 true KR200154806Y1 (en) | 1999-08-16 |
Family
ID=19483374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960057021U KR200154806Y1 (en) | 1996-12-26 | 1996-12-26 | A smd package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200154806Y1 (en) |
-
1996
- 1996-12-26 KR KR2019960057021U patent/KR200154806Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR19980043897U (en) | 1998-09-25 |
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