JPH09162078A - Electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily mount a cylindrical aluminum electrolytic capacitor on a printed wiring board. SOLUTION: An insulating plate 14 which is supported by the end face 11 of a cylindrical aluminum electrolytic capacitor 10 is brought into contact with the end face 11 and slits 15 are formed in the insulating plate 14 in accordance with the lead wires 4a and 4b of the capacitor 10. The wires 4a and 4a are bent so that the wires 4a and 4a can be extended in the slits 15 and the external side faces of the wires 4a and 4a can be flush with the external surface of the insulating plate 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, especially an aluminum electrolytic capacitor, having a terminal which comes into contact with a conductor on a surface of a printed circuit board when mounted on the printed circuit board.

[0002]

There is a chip type capacitor as a type of capacitor which is mounted on a printed circuit board and soldered, and it has plate-shaped terminals provided at both ends of the lower surface of the main body. . In recent years, a cylindrical aluminum electrolytic capacitor having a lead wire has been mounted on a substrate by a method similar to that of a chip type capacitor.
No. 211214 discloses an aluminum electrolytic capacitor as shown in FIG.

In FIG. 5, a capacitor element 1 in which an electrode foil and a separator are wound and impregnated with an electrolytic solution is housed in a cylindrical aluminum case 2, and the aluminum case 2 is sealed by an elastic sealing body 3. The electrode leads 4 and 4 extending from the element 1 penetrate the elastic sealing body 3 in an airtight manner and are led to the outside. Reference numeral 5 is an annular groove formed in the aluminum case 2 to which the sealing body 3 is tightened in order to enhance airtightness.

An insulating plate 6 is brought into contact with the end surface of the capacitor in order to facilitate mounting on the substrate. The insulating plate 6 has a small hole 7,
7 and concave grooves 8 and 8 directed toward the outer peripheral direction of the insulating plate 6
And lead wires 4a, 4a connected to the electrode leads 4, 4
Are inserted into the small holes 7, 7 and bent to form the concave grooves 8, 8
It is placed inside and thus holds the insulating plate 6.

In the above-mentioned capacitor, the lead wires 4a, 4
Even if "a" is bent so as to be in close contact with the bottoms of the recessed grooves 8,8, it slightly returns due to the elastic force, and therefore the tips of the lead wires 4a, 4a float up as shown in the figure and protrude from the surface of the insulating plate 6, Stability at the time of mounting is impaired. Further, when bending, a force is applied to the electrode leads 4 and 4 in the direction of pulling them out from the element 1,
May damage the capacitor. In order to prevent such damage, the lead wires 4a, 4a are not bent at the planned bending positions.
There are cases where the notches 9 and 9 are provided as shown in FIG. 5, but this significantly weakens the strength of the lead wires 4a and 4a, which causes disconnection due to vibration during use. The present invention intends to solve these problems all at once.

[0006]

According to the present invention, a plurality of lead wires are led out from one end surface of the electronic component body, and each lead wire is at a position separated from the end surface by a predetermined distance and the periphery of the end surface. It is bent in the direction. An insulating plate supported by this end surface is in contact with the end surface,
The insulating plate has a groove-shaped window or slit through which the bent lead wire passes. The bent lead wire is in the window or slit, and the outer surface thereof is substantially flush with the outer surface of the insulating plate.

In the above-mentioned electronic component, each lead wire is clamped and bent by a tool having a predetermined thickness and one surface of which is in contact with the end face of the electronic component body. Then, the insulating plate is brought into contact with and fixed to the end face, and the bent lead wire is placed in a window or slit provided in the insulating plate. Will be located substantially flush with the outer surface of the.

Therefore, since each lead wire is bent while being clamped by a tool, no force in the direction of pulling out the lead wire from the element is generated and the lead wire is bent at a predetermined position without a cut or the like. The bent portion can be located flush with the outer surface of the insulating plate. In addition, since the insulating plate is supported not by the lead wires but by the electronic component body, when connecting it to the substrate, even if vibration or shock is applied, the effect is not transmitted to the lead wires, so high vibration resistance, Impact resistance can be obtained.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The lead wire led out from the electronic component body may have a circular cross section or may be flatly crushed. The window or slit of the insulating plate is selected to have a width that allows the lead wires to pass therethrough in accordance with the cross-sectional shape of these lead wires. The length of each lead wire may be longer than the length of the slit.

As a method of fixing the insulating plate to the electronic component main body, a method of adhering it to the end face of the electronic component main body by using an adhesive, and inserting a projection extending from the insulating plate into a hole formed in the end face of the main body It is possible to employ an appropriate method such as a method of fitting, a method of fitting a hole formed in the insulating plate to a protrusion extending from the end surface of the main body, or the like.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, a capacitor element 1 is housed in a cylindrical aluminum case 2 and is sealed by an elastic sealing body 3, and electrode leads 4 and 4 extending from the element 1 penetrate the sealing body 3 in an airtight manner to form a capacitor. It constitutes the main body 10. Lead wire 4 extending from end surface 11 of capacitor body 10
As shown in FIG. 2, a and 4a are sandwiched between the tools 12 and 13 whose one surface is in contact with the end surface 11 of the capacitor body,
It is bent in the direction of arrow 14 until it abuts on the tool 13. The thickness of the sandwiching portion of the tools 12 and 13 is g, and the end surface 11
The tool 13 placed on the peripheral side of is slightly thinner toward the peripheral direction of the end face 11. When this processing is finished, the lead wires 4a and 4a are slightly returned by the elastic force, and the distances between the respective lead wire portions and the end face 11 become equal to each other. In addition,
d is the diameter of the lead wires 4a and 4a.

Next, the insulating plate 14 shown in FIG. 3 is attached to the bottom of the capacitor body 10. Insulation plate 14 is lead wire 4
The slits 15 and 15 have a thickness corresponding to the sum of the gap width g between a and the end face 11 and the diameter d of the lead wire 4a, and have slits 15 and 15 extending from the periphery toward the center. Is appropriately wider than the diameter d. In addition, the end surface 11 of the elastic sealing body 3
A projection 16 is formed in the center of the insulating plate 14, and an engaging hole 17 is formed in the center of the insulating plate 14 correspondingly. Therefore, when the engagement hole 17 is fitted into the protrusion 16 and the insulating plate 14 is brought into contact with the end surface 11, the insulating plate 14 is held by the capacitor body 10 by the elasticity and friction of the elastic body, and the lead wires 4a, 4a. Is located in the slits 15 and 15 on substantially the same plane as the outer surface of the insulating plate 14.

FIG. 4 shows another embodiment of the present invention, in which a spike-like projection 18 is provided at the center of the insulating plate 14 and a small hole 19 is provided at the center of the elastic sealing body 3. Therefore,
When the insulating plate 14 is brought into contact with the capacitor body end face 11 while pushing the spike-like protrusion 18 into the small hole 19, the insulating plate 14 is joined to the capacitor body 10 and the lead wires 4a and 4a are in the slits 15 and 15. At insulating plate 14
Will be located on the outer surface of.

In addition, the insulating plate 14 and the capacitor body 1
It is also possible to bond 0 with an adhesive. In addition,
In each embodiment, when the metal layer 20 is formed as shown in FIG. 3 from the groove-shaped window or slit 15 on the outer surface of the insulating plate 14 to the inner wall surface of the window or slit from the adjacent portion of the window or slit, It is possible to more securely attach the capacitor to the substrate.

[0015]

As described above, according to the present invention, since the lead wire can be surely bent into a predetermined shape, the lead wire does not protrude from the surface of the insulating plate, and the lead wire is undesired during bending. There is no possibility of causing stress to damage the capacitor, and since it is not necessary to provide a notch for facilitating bending of the lead wire, the effect of not lowering the strength of the lead wire can be achieved at the same time.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.

FIG. 2 is an explanatory diagram of a lead wire bending unit in the above embodiment.

FIG. 3 is a bottom view of the embodiment.

FIG. 4 is a longitudinal sectional view of another embodiment of the present invention.

FIG. 5 is a partial vertical cross-sectional view showing an example of a conventional cylindrical aluminum electrolytic capacitor.

FIG. 6 is an explanatory diagram of a processing mode of a lead wire in the above-mentioned conventional example.

[Explanation of symbols]

 1 Capacitor Element 2 Aluminum Case 3 Elastic Sealing Body 4 Electrode Lead 4a Lead Wire 10 Capacitor Main Body 11 End Face 12, 13 Tool 14 Insulation Plate 15 Slit 16 Protrusion 17 Engagement Hole 18 Protrusion 19 Small Hole

Claims (5)

[Claims] 1. An insulating plate supported by this end face is brought into contact with the end face of an electronic component body from which a plurality of lead wires are led out from one end face, and the insulating plate corresponds to each lead wire. To form a slit or through hole from the inside to the peripheral direction, bend each lead wire so as to extend in the slit or through hole, and make the outer surface of the same substantially flush with the outer surface of the insulating plate. An electronic component characterized by being placed on top. 2. The electronic component according to claim 1, wherein the electronic component is an aluminum electrolytic capacitor having an aluminum case sealed by an elastic sealing body on the end face. 3. The insulating plate is joined to the electronic component main body by engaging an engaging hole formed at an appropriate position with a protrusion integrally formed with the elastic sealing body. The aluminum electrolytic capacitor according to claim 2, wherein 4. The insulating plate is connected to the electronic component main body by inserting a spike-like projection formed in a proper position into a small hole formed in the elastic sealing body. The aluminum electrolytic capacitor according to claim 2. 5. The electronic component according to claim 1, wherein the insulating plate is bonded to the end surface of the electronic component body with an adhesive.