JP2010040963A - Chip electrolytic capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip electrolytic capacitor which prevents deformation to the insulation plate side of an elastic sealing material and improves a vibration-resistant property. <P>SOLUTION: A chip electrolytic capacitor 1 is constituted by a capacitor body 2 and an insulation plate 3. The capacitor body 2 includes a capacitor element 4 from which a pair of lead wires 5 is derived, a cylindrical-bottom encapsulating case 6 for housing the capacitor element 4, and an elastic sealing material 7 which seals the opening edge of the encapsulating case 6 and in which a pair of through-holes 7b penetrated by the pair of lead wires 5 is formed. The insulation plate 3 is disposed while opposing the elastic sealing material 7 and penetrated by the pair of lead wires 5. With the face 7a of the insulation plate 3 side of the elastic sealing material 7, a first protrusion 8 which extends along the face 7a and whose tip is a bifurcated shape extending in the same direction as the extending direction, and second protrusions 9 and 10 connected with both edges of the first protrusion 8 are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a chip-type electrolytic capacitor that is surface-mounted on a substrate.

Conventionally, chip type electrolytic capacitors surface-mounted on a substrate include a vertical type as shown in FIG. 3 (see, for example, Patent Document 1).
Such a vertical chip-type electrolytic capacitor 91 includes a capacitor body 92 and an insulating plate 93. The capacitor body 92 includes a capacitor element 94 from which a pair of lead wires 95 is led out, and the capacitor element. A bottomed cylindrical outer case 96 that accommodates 94 and an elastic sealing member that seals the open ends of the outer case (mainly made of aluminum) 96 and has a pair of through-holes 97b through which the pair of lead wires 95 penetrate. Material 97. The insulating plate 93 is disposed so as to face the elastic sealing member 97 and the pair of lead wires 95 are penetrated.

  When the chip-type electrolytic capacitor 91 as described above is mounted on the board, surface mounting is performed by reflow soldering. In this solder surface mounting, cream solder is applied to a board land pattern using a screen mask, and a component including a chip-type electrolytic capacitor is mounted thereon, and then the board itself is heated in a high-temperature atmosphere higher than the solder melting temperature. And soldering.

In recent years, in consideration of environmental considerations, solder used for mounting has been changed from conventional leaded solder (for example, Sn-37Pb: melting point of about 183 ° C.) to lead-free solder (for example, Sn-3.0Ag) that does not contain lead. -0.5Cu: Melting point is about 217 ° C), and the temperature at which components are exposed during reflow mounting is increasing.
In addition, the evolution of board mounting technology has made it possible to mount components at higher density, which has spurred an increase in ambient temperature that leads to solder melting.

In such surface mounting by reflow soldering, the chip-type electrolytic capacitor 91 mounted on the substrate is exposed to a high temperature, whereby the air in the outer case 96 expands, and when the electrolyte is liquid, the electrolytic solution As a result, the internal pressure of the capacitor main body 92 (pressure in the outer case 96) increases.
Due to the increase in the internal pressure of the capacitor main body 92, the elastic sealing material 97 is deformed toward the insulating plate 93 as shown in FIG. As a result, the lead wire 95 is bent and deformed, or the insulating plate 93 is pressed and deformed from the elastic sealing material 97, so that the lead wire 95 is lifted from the substrate and may cause poor soldering. .

In recent years, the use of chip-type electrolytic capacitors is not limited to semi-stationary products such as home appliances, but may be used for applications that generate vibration, such as in-vehicle applications.
When vibration is applied to the chip-type electrolytic capacitor 91, as described above, a gap is generated between the elastic sealing material 97 and the insulating plate 93, so that the insulating plate 93 is laterally and vertically with respect to the capacitor body 92. It vibrates in the direction or the rotation direction with the lead wire 95 as the rotation center. Further, the capacitor main body 92 also vibrates laterally with respect to the substrate or in the rotational direction. As a result, a load due to vibration is concentrated on the lead wire 95, and the lead wire 95 may be broken to cause a malfunction.

  Therefore, in Patent Document 2, as shown in FIG. 5, by providing a plurality of conical projections 98 on the surface of the insulating plate 93 ′ on the side of the elastic sealing material 97, by contacting the projections 98 with the elastic sealing material, A chip-type electrolytic capacitor 91 ′ that prevents vibration of the insulating plate relative to the elastic capacitor body is disclosed.

Japanese Patent No. 2703718 JP 2006-41125 A

  However, in the chip-type electrolytic capacitor of Patent Document 2, since the shape of the protrusion provided on the insulating plate is conical, the insulating plate and the elastic sealing material are in point contact, and the protrusion and the elastic sealing material are Because of the small contact area, vibration resistance was not sufficient particularly when large vibrations acted on the chip-type electrolytic capacitor. In addition, the effect of suppressing deformation of the elastic sealing material was not sufficient.

  Therefore, an object of the present invention is to provide a chip-type electrolytic capacitor that more reliably suppresses deformation of the elastic sealing material toward the insulating plate and improves vibration resistance.

  The chip-type electrolytic capacitor of the present invention includes a capacitor element from which a pair of lead wires are derived, a bottomed cylindrical outer case that houses the capacitor element, an opening end of the outer case, and a pair of the pair of lead wires. A capacitor main body having a pair of through-holes through which lead wires are penetrated and an insulating plate through which the pair of lead wires are penetrated. In the chip-type electrolytic capacitor provided, one or more first protrusions extending along the surface of the elastic sealing material on the insulating plate side are formed, and the first protrusion It is characterized by having a forked shape extending in the same direction as the extending direction (first invention).

According to this configuration, when the elastic sealing material is pressed toward the insulating plate and the first protrusion having a bifurcated tip is in contact with the insulating plate, the first protrusion can be deformed so that the two branches open. The pressure on the insulating plate side of the sealing material is dispersed and the first protrusion is deformed, so that deformation of the elastic sealing material to the elastic plate side and deformation of the insulating plate can be suppressed.
At the same time, vibrations of the insulating plate and the capacitor body can be suppressed.
Furthermore, since the shape of the first protrusion is a shape extending along the surface of the elastic sealing material, the deformation of the elastic sealing material is more reliable than in the case where the shape of the protrusion is in point contact. The vibration resistance is further improved.

The first protrusion preferably extends in a direction passing through the pair of through holes and intersecting a line segment connecting the pair of through holes (second invention).
The deformation of the elastic sealing material toward the insulating plate is such that the substantially central portion of the elastic sealing material protrudes toward the insulating plate, so that it passes between the pair of through-holes that are substantially the central portion of the elastic sealing material. By providing the first protrusion, the deformation of the elastic sealing material can be more reliably suppressed.

  It is preferable that the tip of the first protrusion has a bifurcated shape composed of two protrusions having a semi-cylindrical shape or a polygonal column shape arranged adjacent to each other in parallel (third invention).

The first protrusion is preferably in contact with the insulating plate (fourth invention).
According to this configuration, deformation of the elastic sealing material toward the insulating plate can be more reliably suppressed, and vibration resistance is further improved because the elastic sealing material and the insulating plate are in close contact with each other.

Moreover, two second protrusions extending along the surface are formed on the surface of the elastic sealing material on the insulating plate side, and the two second protrusions are respectively formed on the first protrusion. It is preferable that it is connected to both ends of the part, extends in a direction intersecting the first protrusion, and is formed between the pair of through holes and the outer edge of the elastic sealing material ( (5th invention).
According to this configuration, since the transmission of force from the elastic sealing material to the insulating plate is more dispersed than when only the first protrusion is provided, the deformation of the elastic sealing material is more reliably suppressed. The vibration resistance can be further improved.

The tip of the second protrusion may have a bifurcated shape extending in the same direction as the extending direction (sixth invention).
According to this configuration, similarly to the first protrusion, when the elastic sealing material is pressed toward the insulating plate and the second protrusion comes into contact with the insulating plate, the second protrusion is opened so that the fork is opened. Since the protrusion can be deformed, the pressure of the elastic sealing material on the insulating plate side is dispersed, and the deformation of the elastic sealing material on the elastic plate side can be suppressed by the deformation of the second protrusion.
At the same time, vibrations of the insulating plate and the capacitor body can be suppressed.

Further, the second protrusion may be formed in a semi-cylindrical shape or a polygonal column shape extending along the surface of the elastic sealing material (seventh invention).
As described above, the deformation of the elastic sealing material toward the insulating plate is such that the substantially central portion of the elastic sealing material protrudes toward the insulating plate, so that the second protrusion formed near the outer edge of the elastic sealing material. Even if the tip of the part is not bifurcated, the effect of suppressing deformation of the elastic sealing material and the effect of improving vibration resistance can be obtained.

The second protrusion is preferably in contact with the insulating plate (eighth invention).
According to this configuration, the elastic sealing material can be more reliably prevented from being deformed toward the insulating plate side, and the elastic sealing material and the insulating plate are in close contact with each other, so that the vibration resistance is further improved.

According to the chip-type electrolytic capacitor of the present invention, when the elastic sealing material is pressed to the insulating plate side by forming the bifurcated first protrusion on the surface of the elastic sealing material on the insulating plate side Since the first protrusion can be deformed so that the fork is opened, the pressure on the insulating plate side of the elastic sealing material is dispersed, and the deformation of the elastic sealing material to the insulating plate side is caused by the deformation of the first protrusion. The deformation of the insulating plate can be suppressed.
At the same time, vibrations of the insulating plate and the capacitor body can be suppressed.
Furthermore, since the shape of the first protrusion is a shape extending along the surface of the elastic sealing material, the deformation of the elastic sealing material is more reliable than in the case where the shape of the protrusion is in point contact. The vibration resistance is further improved.

Embodiments of the present invention will be described below.
As shown in FIG. 1A, the chip-type electrolytic capacitor 1 according to this embodiment includes a capacitor body 2 and an insulating plate 3.
The capacitor body 2 includes a capacitor element 4, an exterior case 6, and an elastic sealing material 7. The chip-type electrolytic capacitor 1 is installed such that the vertical direction in FIG. 1 is the actual vertical direction.

  The capacitor element 4 has a structure in which an anode foil and a cathode foil are wound via a separator. The anode foil and the cathode foil are made of a valve action metal such as aluminum and have a roughened surface, and an oxide film serving as a dielectric is formed on the surface of the anode foil. Lead wires 5 are connected to the anode foil and the cathode foil, respectively. Thereby, a pair of lead wires 5 is led out from one end face of the capacitor element 4.

  The capacitor element 4 is housed in the outer case 6 in a state where it is impregnated with the electrolytic solution. The outer case 6 is made of aluminum, for example, and is formed in a bottomed cylindrical shape with one end opened.

  The open end of the outer case 6 is sealed with an elastic sealing material 7 in a state where the pair of lead wires 5 are penetrated. The elastic sealing material 7 is formed of a rubber material such as isobutylene-isoprene rubber (IIR) or ethylene propylene terpolymer (EPT).

  As shown in FIGS. 1B and 1C, the elastic sealing material 7 is formed in a cylindrical shape. The elastic sealing material 7 is formed with a pair of through holes 7b through which the pair of lead wires 5 penetrates so as to extend in the vertical direction. The pair of through holes 7 b are formed at substantially the center of the elastic sealing material 7. That is, the center of the line segment connecting the pair of through holes 7 b substantially coincides with the center of the lower surface 7 a of the elastic sealing material 7.

  Further, on the lower surface 7 a (surface on the insulating plate 3 side) of the elastic sealing material 7, the first protrusion 8 and the two second protrusions 9 and 10 are formed in an H shape. The first protrusion 8 and the two second protrusions 9 and 10 respectively extend along the lower surface 7 a and are formed on the elastic sealing material 7 by integral molding.

The first protrusion 8 is formed to extend in a direction orthogonal to the line segment connecting the pair of through holes 7b through the center of the line segment connecting the pair of through holes 7b. The first protrusion 8 is composed of two triangular prism-shaped protrusions 8a and 8b that are arranged adjacent to each other in parallel. The two protrusions 8a and 8b have a right triangle shape in cross section, and are arranged so that surfaces corresponding to the hypotenuses of the right triangle face each other, and a V-shaped recess is formed at the center. That is, the tip end of the first protrusion 8 is formed in a bifurcated shape extending in the same direction as the extending direction of the first protrusion 8.
The projecting tips of the projecting portions 8a and 8b are located slightly shifted from the center of the line segment connecting the pair of through holes 7b.

  Further, the protruding tip of the first protrusion 8 (the protruding tip of the protrusions 8 a and 8 b) is in contact with the upper surface 3 a of the insulating plate 3. The protrusion height of the protrusions 8a and 8b (the distance between the lower surface 7a of the elastic sealing material 7 and the upper surface 3a of the insulating plate 3) is, for example, about 0.2 mm, but is not limited to this value. .

The two second protrusions 9 and 10 are formed in a semi-cylindrical shape extending along the lower surface 7a. The two second protrusions 9 and 10 extend in a direction orthogonal to the first protrusion 8, that is, in a direction parallel to a line segment connecting the pair of through holes 7 b. The two second protrusions 9 and 10 are formed between the pair of through holes 7 b and the outer edge of the elastic sealing material 7, respectively, and the substantially central part in the extending direction is at both ends of the first protrusion 8. Each part is connected.
Further, the protruding tips of the two second protrusions 9 and 10 are also in contact with the upper surface 3 a of the insulating plate 3 in the same manner as the first protrusion 8.

The insulating plate 3 is made of, for example, an insulating resin, and is disposed so as to face the lower surface 7a of the elastic sealing material 7. The insulating plate 3 is formed with a pair of through holes 3b extending in a direction orthogonal to the plate thickness and a pair of storage grooves 3c extending along the lower surface.
The pair of lead wires 5 are inserted into the pair of through holes 3b of the insulating plate 3, and the tips thereof are bent and stored along the storage grooves 3c.

  A gap is formed between the upper surface 3 a of the insulating plate 3 and the lower surface 7 a of the elastic sealing material 7. A slight gap is also formed between the upper surface 3 a of the insulating plate 3 and the opening end of the outer case 6.

According to the chip type electrolytic capacitor 1 having the above configuration, for example, when performing reflow soldering, the chip type electrolytic capacitor 1 is exposed to a high temperature, whereby the internal pressure of the capacitor body 2 is increased, and the elastic sealing material 7. Tries to be deformed toward the insulating plate 3 side, but since the first protrusion 8 and the two second protrusions 9, 10 formed on the elastic sealing material 7 are already in contact with the insulating plate 3, the elastic sealing material 7 is restrained from being deformed to the insulating plate 3 side, and the two protrusions 8a and 8b constituting the first protrusion 8 are deformed in a direction in which they are separated from each other (a direction in which the fork is opened) to disperse the pressure. Therefore, deformation of the elastic sealing material 7 can be suppressed.
As a result, deformation of the lead wire 5 and deformation of the insulating plate 3 due to deformation of the elastic sealing material 7 under high temperature such as reflow can be suppressed.

Further, since the capacitor main body 2 and the insulating plate 3 are in close contact with each other by the first protrusion 8 and the two second protrusions 9 and 10, vibration is applied to the chip-type electrolytic capacitor 1 mounted on the substrate. Moreover, it can suppress that the insulating plate 3 vibrates with respect to the capacitor | condenser main body 2. FIG.
As a result, breakage of the lead wire 5 due to vibration of the insulating plate 3 can be prevented.

The deformation of the elastic sealing material 7 toward the insulating plate 3 is such that the substantially central portion of the elastic sealing material 7 protrudes toward the insulating plate 3. As described above, the first protrusion 8 is provided between the pair of through-holes 7b that are substantially the center of the elastic sealing material 7, so that the deformation of the elastic sealing material 7 can be reliably suppressed. .
At the same time, the projecting tips of the two projecting portions 8a and 8b constituting the first projecting portion 8 are located at a position slightly deviated from the center of the line segment connecting the pair of through holes 7b. Compared with the case where it is located in the center of this, it can prevent that a force acts on the insulating board 3 locally.

  Further, since the two second protrusions 9 and 10 are provided, the transmission of force from the elastic sealing material 7 to the insulating plate 3 is more dispersed than in the case where only the first protrusion 8 is provided. Thus, the deformation of the elastic sealing material 7 can be more reliably suppressed, and the vibration resistance is further improved.

  Furthermore, since the shape of the first protrusion 8 and the two second protrusions 9 and 10 is a shape extending along the lower surface 7a of the elastic sealing material 7, the shape of the protrusion is in point contact. Compared to the case, the deformation of the elastic sealing material 7 is surely suppressed, and the vibration resistance is further improved.

  Further, since the first protrusion 8 and the second protrusions 9 and 10 are formed of a rubber material, the capacitor main body 2 and the internal capacitor element 4 are mounted on the substrate or when the substrate is conveyed after reflow soldering. The vibration stress applied to the etc. can be relieved.

In the above embodiment, the protruding tip of the first protrusion 8 of the elastic sealing material 7 is in contact with the upper surface 3a of the insulating plate 3 in a state before surface mounting, but is not necessarily in contact with the insulating plate 3. It does not have to be. Even in this case, when the elastic sealing material 7 is pressed to the insulating plate 3 side and the first protrusion 8 comes into contact with the insulating plate 3, the first protrusion 8 can be deformed so as to open a fork. The pressure to the insulating plate 3 side of the elastic sealing material 7 is dispersed, and the deformation of the elastic sealing material 7 to the insulating plate 3 side can be suppressed by the first protrusion 8 being deformed.
At the same time, vibrations of the insulating plate 3 and the capacitor body 2 can be suppressed.
Furthermore, since the shape of the 1st protrusion 8 is a shape extended along the lower surface 7a of the elastic sealing material 7, compared with the case where the shape of the 1st protrusion 8 is a point contact shape, it is elastic. The deformation of the sealing material 7 is reliably suppressed, and the vibration resistance is further improved.

  Moreover, although the 1st protrusion 8 and the two 2nd protrusions 9 and 10 are provided in the elastic sealing material 7 of the said embodiment, for example, as shown in FIG. 2, only the 1st protrusion 8 is provided. It may be a chip-type electrolytic capacitor 101 provided with an elastic sealing material 107 provided with.

  Moreover, in the said embodiment, although the 1st protrusion 8 is comprised from the protrusions 8a and 8b whose cross section is a right triangular prism shape, the cross-sectional shape of the protrusions 8a and 8b does not necessarily need to be a right triangle shape. Good. For example, it may be an equilateral triangle shape or a semi-cylindrical shape. However, the cross-sectional shape of the right triangle is easier to deform so that the tips of the two protrusions 8a and 8b are separated when the first protrusion 8 is pressed against the insulating plate 3 than in these cases. Therefore, in this respect, the above embodiment is preferable.

  Moreover, if the 1st protrusion 8 is the shape which has the forked part extended in the same direction as the extension direction at the front-end | tip, it is not comprised from the two protrusions 8a and 8b like the above-mentioned embodiment. May be. For example, the first protrusion may be a quadrangular prism-shaped protrusion extending along the lower surface 7a, and a V-shaped groove shallower than the protrusion height may be formed at the tip.

  Moreover, in the said embodiment, although the 2nd protrusions 9 and 10 are formed in the semi-cylindrical shape, it is not limited to this shape. For example, a polygonal column shape such as a triangular column shape may be used. Moreover, the shape which has the forked part extended in the same direction as the extension direction like the 1st protrusion part 8 may be sufficient.

  In the above embodiment, the case where the present invention is applied to a chip-type electrolytic capacitor using a liquid electrolyte has been described. However, the present invention can also be applied to a chip-type solid electrolytic capacitor using a solid electrolyte. .

  Next, specific examples of the present invention will be described together with conventional examples.

[Example 1] First protrusion + two second protrusions
As Example 1, 60 chip-type electrolytic capacitors each having an elastic sealing material having the shape shown in FIG. This chip-type electrolytic capacitor has a diameter of 8 mm and a length of 6.5 mm. The chip type electrolytic capacitors of Example 2 and Conventional Examples 1 and 2 to be described later have the same dimensions as Example 1.

[Example 2] Only the first protrusion As Example 2, 60 chip type electrolytic capacitors each having an elastic sealing material having the shape shown in FIG.

(Conventional Example 1) No Protrusion As Conventional Example 1, as shown in FIG. 3, 60 chip-type electrolytic capacitors having no protrusion formed on the elastic sealing material were produced.

(Conventional example 2) Two conical protrusions are formed on the insulating plate As conventional example 2, as shown in FIG. 5, the surface of the insulating plate on the side of the elastic sealing material is orthogonal to the line connecting the two through holes of the insulating plate Sixty chip-type electrolytic capacitors having two conical protrusions formed on the line to be formed were produced.

For the chip type electrolytic capacitors in Examples 1 and 2 and Conventional Examples 1 and 2, the total length of the chip type electrolytic capacitor before and after the reflow soldering was performed in order to perform reflow soldering and examine the deformation of the elastic sealing material. The amount of deformation and the amount of deformation in the vertical direction of the insulating plate were measured.
In addition, after reflow soldering, the presence or absence of rattling in the horizontal direction, vertical direction, and rotation direction between the capacitor body and the insulating plate is confirmed. Further, a vibration test (acceleration 30G, frequency 10 to 2000 Hz, X, Y , 2 hours each in the Z direction), and the presence or absence of malfunction due to breakage of the lead wire after the vibration test was confirmed. The results are shown in Table 1.

The amount of deformation of the entire length of the chip-type electrolytic capacitor was defined as a difference in length from the lower end of the lead wire stored in the storage groove of the insulating plate to the upper surface of the outer case before and after reflow soldering.
Further, as shown in FIG. 4, the vertical deformation amount of the insulating plate is a difference A1 between the height of the center of the lower surface of the insulating plate after reflow soldering and the height of the peripheral edge on the anode side of the lower surface of the insulating plate. And a difference (A1 + A2) between the height of the center of the lower surface of the insulating plate and the height A2 of the peripheral edge on the cathode side of the lower surface of the insulating plate.
In addition, the confirmation of the presence or absence of backlash and the confirmation of the presence or absence of malfunction due to the breakage of the lead wires were examined for 30 of the produced 60 chip-type electrolytic capacitors.

As is apparent from Table 1, the chip-type electrolytic capacitors of Examples 1 and 2 having the elastic sealing material formed with the protrusions are deformed over the entire length of the chip-type electrolytic capacitor as compared with Conventional Examples 1 and 2. It was also found that the deformation amount of the insulating plate was small and the deformation of the elastic sealing material was suppressed.
Further, it was found that the chip type electrolytic capacitors of Examples 1 and 2 were free from backlash between the capacitor body and the insulating plate, and the vibration resistance was improved.
The conventional example 2 provided with the conical protrusions has a backlash and improved vibration resistance compared to the conventional example without the protrusions, but is inferior to the first and second examples.

  Further, the first embodiment provided with the first protrusions and the two second protrusions is different from the second embodiment in which only the first protrusions are provided in the change amount of the total length of the chip-type electrolytic capacitor and the deformation amount of the insulating plate. It was found that the vibration resistance was improved with decreasing.

BRIEF DESCRIPTION OF THE DRAWINGS (a) is structure drawing of the chip-type electrolytic capacitor of embodiment of this invention and Example 1, (b) is a top view of the elastic sealing material used for the said electrolytic capacitor, (c) is the said elastic sealing. It is sectional drawing of material. (A) is a structure figure of the chip-type electrolytic capacitor of Example 2, (b) is a top view of the elastic sealing material used for the electrolytic capacitor, and (c) is a sectional view of the elastic sealing material. . (A) is a structural view of a conventional chip-type electrolytic capacitor, (b) is a plan view of an elastic sealing material used in the electrolytic capacitor, and (c) is a cross-sectional view of the elastic sealing material. It is sectional drawing of the chip-type electrolytic capacitor in the state which the elastic sealing material of the said prior art example deform | transformed. (A) is a structure figure of the chip type electrolytic capacitor of other conventional examples, (b) is a top view of the insulating board used for the above-mentioned electrolytic capacitor, and (c) is a sectional view of an insulating board.

Explanation of symbols

1, 91, 91 ', 101 Chip-type electrolytic capacitor 2, 92 Capacitor body 3, 93 Insulating plate 3a, 93a Top surface 3b, 93b Through hole 3c, 93c Groove portion 4, 94 Capacitor element 5, 95 Lead wire 6, 96 Outer case 7, 97, 107 Elastic sealing material 7a, 97a, 107a Lower surface 7b, 97b, 107b Through hole 8 First projection 8a, 8b Projection 9, 10 Second projection 98 Conical projection

Claims (8)

A capacitor element from which a pair of lead wires are derived, a bottomed cylindrical outer case that houses the capacitor element, and a pair of penetrations that seal the opening end of the outer case and through which the pair of lead wires pass. In a chip-type electrolytic capacitor comprising a capacitor main body having an elastic sealing material in which holes are formed, and an insulating plate that is disposed opposite to the elastic sealing material and through which the pair of lead wires penetrates,
One or more first protrusions extending along the surface are formed on the surface of the elastic sealing material on the insulating plate side,
Furthermore, the chip-type electrolytic capacitor is characterized in that the tip of the first protrusion has a bifurcated shape extending in the same direction as the extending direction.   2. The chip-type electrolysis according to claim 1, wherein the first protrusion extends between the pair of through holes and in a direction intersecting a line segment connecting the pair of through holes. Capacitor.   3. The chip shape according to claim 1, wherein a tip end of the first protrusion has a bifurcated shape including two protrusions having a semi-cylindrical shape or a polygonal column shape arranged adjacent to each other in parallel. Electrolytic capacitor.   The chip-type electrolytic capacitor according to claim 1, wherein the first protrusion is in contact with the insulating plate. Two second protrusions extending along this surface are formed on the surface of the elastic sealing material on the insulating plate side,
The two second protrusions are connected to both ends of the first protrusion, respectively, extend in a direction intersecting the first protrusion, and the pair of through holes and the elastic seal 5. The chip-type electrolytic capacitor according to claim 1, wherein the chip-type electrolytic capacitor is formed between the outer edge of the material.   6. The chip-type electrolytic capacitor according to claim 5, wherein the tip of the second protrusion has a bifurcated shape extending in the same direction as the extending direction.   The chip-type electrolytic capacitor according to claim 5, wherein the second protrusion is formed in a semi-cylindrical shape or a polygonal column shape extending along a surface of the elastic sealing material.   The chip-type electrolytic capacitor according to claim 5, wherein the second protrusion is in contact with the insulating plate.

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