JP2000331862A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which is surface-mounted on a printed board, etc., with the opening part of a resin case sealed with an insulating plate comprising an L-shaped metal plate electrode. SOLUTION: A component element 16 comprising a lead wire 17, a case 18 in which the element is housed, and an insulating plate 1 which is positioned at the opening part of the case and larger in size than the case are provided. Here, the insulating plate is provided with a recessed groove 8 which is engaged with the case opening part, a plurality of holes 12 where the lead wire 17 is inserted, and a through window 3 between them, with a metal plate electrode 13 connected to the lead wire 17 provided by insert-molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to a leadless electronic component surface-mounted on a printed circuit board or the like.
Hereinafter, the dry metallized film capacitor will be described in detail. However, the present invention is not limited to the dry metallized film capacitor, and can be applied to other electronic components in the same manner.

[0002]

2. Description of the Related Art Conventionally, this kind of electronic component, for example, a metallized film capacitor is configured as shown in FIG. That is, a pair of metallized films are superposed and wound, and a lead wire 17 is joined to the component element 16 formed by spraying metallicon metal on both end surfaces to form an electrode lead portion by welding or soldering, and the like. Stored in the case 18,
It is formed by injecting and filling a resin 19 made of a thermosetting resin or the like into the case and then curing the resin.

[0003]

When the above lead-type metallized film capacitor is mounted on a printed circuit board, a lead wire is passed through a through hole provided in the printed circuit board and soldering is performed. However, as electronic parts are automatically inserted into printed circuit boards and efficiency has increased,
There is a strong demand from users for surface mount type metallized film capacitors.

However, in the above-mentioned lead wire type metallized film capacitor, since the lead wire is drawn out in the vertical direction, the lead wire is bent 90 degrees near the opening of the case for surface mounting and use. It is necessary to have a crack in the resin near the bend, and if used for a long time, there is a problem that moisture is absorbed from the crack and the capacitor characteristics are deteriorated. When it is installed and soldered, there is a problem that the soldering strength varies and the quality becomes unstable.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object to provide a leadless electronic component which can be mounted on a substrate without deterioration in characteristics.

That is, the component element 1 having the lead wire 17
6, a case 18 for accommodating the element, and an insulating plate 1 larger than the case located at the opening of the case. The insulating plate has a concave groove 8 fitted into the case opening.
In addition, a plurality of holes 12 through which the lead wires 17 are inserted and the through-holes 3 therebetween are formed, and metal plate electrodes 13 respectively connected to the lead wires 17 are provided by insert molding.

Further, the concave groove 8 is formed in a rectangular shape, a protrusion 9 is provided on at least one of the side surfaces forming the sides, and a gap 10 is formed between the concave groove 8 and the inner surface of the case.

[0008] Furthermore, the present invention is characterized in that the penetrating window 3 is expanded in a funnel shape or a step shape 4 toward the outer surface 7.

The positioning plate 1 is provided on the insulating plate 1.
1 is formed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component element having a lead wire is housed in a case, and a plurality of holes are provided in the case opening, through which the lead wire is inserted, and a through-hole and a concave groove fitted into the case opening therebetween. And an insulating plate having a size larger than that of the case. Further, metal plate electrodes respectively connected to the lead wires are previously provided on the insulating plate by insert molding.

According to the above configuration, when the electronic component is mounted on the printed circuit board, the leading end of the lead is connected to the metal plate electrode provided on the insulating plate, and the bent portion of the lead is eliminated. There is no projection on the surface that comes into contact with the printed circuit board, and there is no inclination or rattling of the electronic components, stable board mounting is possible, and mounting work can be performed easily and quickly, and product characteristics are also improved. Stabilize.

[0012]

[Embodiment 1] FIG. 1 is a drawing of a dry metallized film capacitor according to an embodiment of the present invention, wherein (a) is a plan view, (b) is a front sectional view, and (c) is a perspective view. 2 is a drawing of an insulating plate provided with an L-shaped metal plate electrode according to one embodiment of the present invention, wherein FIG. 2A is a plan view, FIG.
(C) is a bottom view.

An embodiment of the present invention will be described below with reference to the drawings. In the drawing, the same parts as those in FIG. 5 are denoted by the same reference numerals. The insulating plate 1 provided with the L-shaped metal plate electrode shown in FIG. 2 is larger in size than the case 18 and has electrical insulation and mechanical properties such as polybutylene terephthalate resin, polyphenylene sulfide resin, polyester resin, and polycarbonate resin. A plurality of holes 12 are formed of a material having excellent strength, and a plurality of holes 12 through which the lead wires 17 are inserted, and through holes 3 and concave grooves 8 which fit into the case openings are provided therebetween. The electrode 13 has a stepped recess 5 which is disposed through the window 3 so that the outer surfaces of the electrode 13 are substantially the same, and extends to the edge, and a hole 12 for leading out the lead wire 17 in the recess. The plate electrode 13 is made of an electrically and mechanically excellent material such as brass or copper, and is subjected to electric solder plating, tin plating, or the like, and one end thereof is insulated from the bent portion 15 bent in an L shape. Step when placed on board 1 And a matching step into the recess 5, and has an extruding hole 14 for deriving a lead wire 17 to the other end. The through-hole 2 is formed by matching the hole 12 of the insulating plate itself with the extrusion hole 14 of the metal plate electrode, and the bent portion 15 of the metal plate electrode 13 is disposed so as to contact the side edge of the insulating plate 1. Then, they are integrated by insert molding. At this time, a protrusion may be provided on a side edge or a part of a corner of the metal plate electrode 13 in order to increase the holding force on the insulating plate 1.

Next, a method of manufacturing a dry metallized film capacitor by closing the opening of the case 18 with the insulating plate 1 provided with the L-shaped metal plate electrode will be described. As shown in FIG. 1, a pair of metallized films are superposed and wound, and a metallicon metal such as zinc or solder is sprayed on both end surfaces to form an electrode lead portion, and a solder-plated soft CP wire is formed on the electrode lead portion. Lead wire 1 consisting of solder-plated soft copper wire, etc.
7 is a component element 16 joined by welding or soldering
Forming the element, a polybutylene terephthalate resin,
It is housed in a case 18 made of polyphenylene sulfide resin, polyester resin, polycarbonate resin or the like. Then, the lead wire 17 of the component element housed in the case was passed through the through hole 2 of the insulating plate 1 provided with the L-shaped metal plate electrode 13 and led out from the surface, and provided on the insulating plate 1. The concave groove 8 is fitted into the opening of the case 18, and a resin 19 made of a thermosetting resin such as urethane resin or epoxy resin is injected and filled from the through window 3 provided in the insulating plate 1, and then hardened to form a metal plate. The electrode 13 and the lead 17 are joined by laser welding or the like, and the lead is cut to obtain a dry metallized film capacitor.

According to the above configuration, after injecting and filling the resin,
Due to the hardening, the concave groove portion of the insulating plate fitted in the case opening and the case are tightly fixed with resin and integrated, so that it has vibration resistance. In addition, a lead wire is derived from a through hole of an insulating plate provided with an L-shaped metal plate electrode, and the lead wire and the metal plate electrode are joined. However, since the insulating plate and the case are integrally fixed, By fixing the insulating plate, the joining portion is stabilized, and the joining operation with stable quality can be performed. Furthermore, the lead wire is cut after joining with the metal plate electrode, but the stepped concave portion of the insulating plate is formed. Since the metal plate electrode has a step that conforms to the requirements, the lead wire does not protrude from the outer surface of the insulating plate, and the metal plate electrode and the printed circuit board can be easily soldered to ensure stable quality. Can be achieved. Further, by providing the insulating plate with the concave groove fitted into the case opening, even if the resin flows out from the end face of the opening of the case, the resin can be received by the concave groove of the insulating plate and the appearance can be kept clean.

Embodiment 2 FIGS. 3A and 3B are drawings of a dry metallized film capacitor according to another embodiment of the present invention, wherein FIG. 3A is a plan view, FIG. 3B is a front sectional view, and FIG. FIG. 4 is a drawing of an insulating plate provided with an L-shaped metal plate electrode according to another embodiment of the present invention, where (a) is a plan view, (b) is a front sectional view, and (c) is a bottom view. In the drawings, components denoted by the same reference numerals are the same components, and description thereof will be omitted. The difference from the previous embodiment is the structure of the insulating plate itself,
The insulating plate 1 shown in FIG.
A recess 8 and a stepped recess 5 are provided between the through-window 3 and the case opening, and the stepped recess 5 is provided therebetween. A protrusion 9 is formed on at least one of the inner surfaces, and a protruding portion 6 is provided on a side edge of the metal plate electrode 13 so that the L-shaped bent portion 15 is in contact therewith. The plate 1 is formed with a positioning projection 11 that fits into an insertion hole provided in the printed circuit board.

According to the above construction, since the through window of the insulating plate is expanded stepwise, after the resin is injected and filled, the resin adheres to and flows out of the outer surface of the insulating plate which contacts the printed circuit board or the like due to curing. In addition, since the outer surface in contact with the printed circuit board or the like is smooth, stable board mounting can be performed, soldering to the printed circuit board or the like is easy, and quality can be stabilized. Also, by providing a projection on at least one of the inner surfaces of the concave groove fitted into the case opening and forming a gap between the case and the case, the resin is filled into this gap, and the adhesion between the case and the insulating plate is further strengthened. become. Furthermore, stable mounting of the board can be achieved by fitting the positioning projections provided on the insulating plate with the insertion holes provided on the printed circuit board, etc. In addition, the mounting position accuracy can be secured, and the quality can be stabilized by stable soldering. Can be achieved. Since a protruding portion is provided on the side edge of the insulating plate and the bent portion of the L-shaped metal plate electrode is provided so as to contact the protruding portion, the state of soldering to a printed circuit board or the like is visually observed. Can be inspected.

In the above embodiment, the resin is injected and filled from the through window and then hardened. However, the through window may be expanded in a funnel shape. An air vent hole may be provided in the insulating plate other than the through window.

[0019]

As described above, according to the electronic component of the present invention, the concave groove portion of the insulating plate fitted into the case opening and the case are tightly fixed with resin and integrated, so that it has vibration resistance.
In addition, the insulating plate is provided with a projection on at least one of the inner surfaces of the concave grooves fitted into the case opening, and a gap is formed between the insulating plate and the case. Closely fix with resin. Furthermore, a lead is led out from a through hole of an insulating plate provided with an L-shaped metal plate electrode, and the lead and the metal plate electrode are joined. However, since the insulating plate and the case are integrally fixed, By fixing the insulating plate, the joining portion is stabilized, and the joining operation with stable quality can be performed. Furthermore, the lead wire is cut after joining with the metal plate electrode, but the stepped concave portion of the insulating plate is formed. Since the metal plate electrode has a step that conforms to the requirements, the lead wire does not protrude from the outer surface of the insulating plate, and the metal plate electrode and the printed circuit board can be easily soldered and the quality is stable. Become By expanding the through-hole of the insulating plate in a funnel shape or a step shape, the resin does not adhere to or flow out of the outer surface of the insulating plate where the resin comes into contact with the printed circuit board or the like, and the outer surface that contacts the printed circuit board or the like without resin. Is smooth, so that stable board mounting can be performed, soldering to a printed board or the like is easy, and quality can be stabilized. Further, by providing the insulating plate with a concave groove fitted into the case opening, even if the resin flows out from the end face of the opening of the case, the resin can be received by the concave groove of the insulating plate and the appearance can be kept clean. Furthermore, stable mounting of the board can be achieved by fitting the positioning projections provided on the insulating plate with the insertion holes provided on the printed circuit board, etc. In addition, the mounting position accuracy can be secured, and the quality can be stabilized by stable soldering. Can be achieved. Since a protruding portion is provided on the side edge of the insulating plate and the bent portion of the L-shaped metal plate electrode is provided so as to contact the protruding portion, the state of soldering to a printed circuit board or the like is visually observed. And can be industrially and practically of great value.

[Brief description of the drawings]

FIG. 1 is a drawing of a dry metallized film capacitor according to one embodiment of the present invention, wherein (a) is a plan view, (b) is a front sectional view, and (c) is a perspective view.

FIGS. 2A and 2B are drawings of an insulating plate provided with an L-shaped metal plate electrode according to an embodiment of the present invention, wherein FIG.
(B) is a front sectional view, and (c) is a bottom view.

FIG. 3 is a drawing of a dry metallized film capacitor according to another embodiment of the present invention, wherein (a) is a plan view, (b) is a front sectional view, and (c) is a perspective view.

FIG. 4 is a drawing of an insulating plate provided with an L-shaped metal plate electrode according to another embodiment of the present invention, wherein (a) is a plan view,
(B) is a front sectional view, and (c) is a bottom view.

FIG. 5 is a partial cross-sectional view of a conventional metallized film capacitor.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 insulating plate 2 through hole 3 through window 4 stepped 5 stepped recess 6 protrusion 7 outer surface 8 concave groove 9 protrusion 10 void 11 positioning protrusion 12 hole 13 metal plate electrode 14 extrusion hole 15 bent portion 16 component element 17 Lead wire 18 Case 19 Resin

Claims (4)

[Claims] 1. A component element having a lead wire, a case accommodating the element, and an insulating plate having a size larger than the case located at an opening of the case. An electronic component, wherein a concave groove to be fitted, a plurality of holes through which a lead wire is inserted, and a through window therebetween are formed, and metal plate electrodes respectively connected to the lead wire are provided by insert molding. 2. The electronic component according to claim 1, wherein the concave groove is formed in a rectangular shape, a projection is provided on at least one of side surfaces forming sides thereof, and a gap is formed between the concave groove and an inner surface of the case. . 3. The electronic component according to claim 1, wherein the through window is expanded in a funnel shape or a step shape toward an outer surface. 4. The electronic component according to claim 1, wherein a positioning projection is formed on said insulating plate.