KR0156513B1 - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- KR0156513B1 KR0156513B1 KR1019940018497A KR19940018497A KR0156513B1 KR 0156513 B1 KR0156513 B1 KR 0156513B1 KR 1019940018497 A KR1019940018497 A KR 1019940018497A KR 19940018497 A KR19940018497 A KR 19940018497A KR 0156513 B1 KR0156513 B1 KR 0156513B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- semiconductor chip
- semiconductor package
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 발명은 반도체패키지의 외부돌출형 히트싱크에 관한 것으로서, 히트싱크(2)의 단부 표면을 패키지(6)의 표면(7)과 평형하게 일치시켜 솔더부(4)를 갗도록 하고, 이 솔더부(4)의 단부표면에서 외부로 소정높이(H)를 돌출시킨 돌출부(3)를 P.C.B에 형성된 삽입공(12)에 삽착시키므로서 반도체칩에서 발생한 열의 방출성을 높이고 P.C.B에 조립되 반도체패키지의 조립견고성을 견고하게 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an externally projecting heat sink of a semiconductor package, wherein the end surface of the heat sink (2) is equally aligned with the surface (7) of the package (6) to fold the solder portion (4). By inserting the projection 3 projecting the predetermined height (H) from the end surface of the section 4 to the insertion hole 12 formed in the PCB to increase the release of heat generated from the semiconductor chip and assembled on the PCB The assembly is solid.
Description
제1도는 본 발명에 의한 반도체패키지를 도시한 단면도이다.1 is a cross-sectional view showing a semiconductor package according to the present invention.
제2도는 본 발명에 의한 반도체패키지가 인쇄회로기판에 조립된 일실시예를 도시한 상태도이다.2 is a state diagram illustrating an embodiment in which a semiconductor package according to the present invention is assembled to a printed circuit board.
제3도는 본 발명의 반도체패키지가 인쇄회로기판에 조립된 다른 실시예를 도시한 상태도이다.3 is a state diagram showing another embodiment in which the semiconductor package of the present invention is assembled to a printed circuit board.
제4도는 종래의 반도체패키지 및 인쇄회로기판에 실장된 상태를 도시한 상태도이다.4 is a state diagram showing a state mounted on a conventional semiconductor package and a printed circuit board.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 반도체패키지 2 : 반도체칩1: semiconductor package 2: semiconductor chip
3 : 히트싱크 3a : 단차3: heat sink 3a: step
3b : 솔더부 3c : 돌출부3b: solder portion 3c: protrusion
4 : 접착층 5 : 리드프레임4: adhesive layer 5: lead frame
5a : 내부리드 5b : 외부리드5a: Internal lead 5b: External lead
6a : 전도성와이어 6b : 그라운드본딩6a: conductive wire 6b: ground bonding
7 : 몸체 10 : 인쇄회로기판7 body 10 printed circuit board
15 : 삽입공15: insertion hole
본 발명은 반도체패키지에 관한 것으로서, 특히 반도체칩의 열을 효율적으로 방출하는 동시에 조립 견고성을 향상시킬 수 있는 히트싱크가 구비된 반도체패키지에 관한 것이다.The present invention relates to a semiconductor package, and more particularly, to a semiconductor package having a heat sink capable of efficiently dissipating heat of a semiconductor chip and improving assembly robustness.
일반적으로 반도체패키지에서 히트싱크는 반도체칩의 하부에 접착제로 직접 접척되어 있다. 상기 히트싱크는 고속으로 동작하는 반도체칩에서 발생하는 열을 외부로 방출하도록 함으로써 반도체칩의 전기적 성능 저하나 파손 등을 방지하는 역할을 한다. 최근에는 이러한 반도체칩의 고직접화, 고성능화, 박형화, 고방열화의 요구로 인해 더욱 방열성을 높일 수 있는 히트싱크가 요구되고 있다.In general, the heat sink in the semiconductor package is directly bonded to the lower portion of the semiconductor chip with an adhesive. The heat sink discharges heat generated from the semiconductor chip operating at a high speed to the outside to prevent electrical performance degradation or damage of the semiconductor chip. Recently, heat sinks capable of further improving heat dissipation are required due to the demand for high directivity, high performance, thinning, and high heat dissipation.
종래에 이러한 히트싱크가 구비된 반도체패키지(1')는 일본 특개평5-114669에 개시된 바 있으며, 이는 제4도에 도시된 바와 같이 히트싱크(3')의 상면이 반도체칩(2')의 저면과 직접 접착된 상태에서 하단에 돌출부(3c')가 형성되어 있고, 상기 돌출부(3c')를 제외한 나머지 부분은 수지재로 봉지되어 몸체(7')가 형성되어 있다. 여기서 상기 돌출부(3c')의 돌출된 길이(L')은 리드프레임(5')의 외부리드(5b') 끝단이 이루는 수평면(H', 인쇄회로기판의 상부표면)보다 윗쪽에 위치하거나 동일면으로 형성되어 있다.Conventionally, the semiconductor package 1 'equipped with such a heat sink has been disclosed in Japanese Patent Laid-Open No. 5-114669, which has a top surface of the heat sink 3' as shown in FIG. A protrusion 3c 'is formed at a lower end in a state in which it is directly bonded to the bottom surface of the substrate. The remaining portion except for the protrusion 3c' is sealed with a resin material to form a body 7 '. The protruding length L 'of the protruding portion 3c' is located above or equal to the horizontal surface H '(the upper surface of the printed circuit board) formed by the end of the outer lead 5b' of the lead frame 5 '. It is formed.
도면중 미설명 부호 5a'는 리드프레임(5')의 내부리드이고, 10'는 상기 반도체패키지(1')의 외부리드(5b') 끝단이 융착되어 실장되는 인쇄회로기판(Printed Circuit Board)이다.In the drawing, reference numeral 5a 'denotes an inner lead of the lead frame 5', and 10 'denotes a printed circuit board on which an end of the outer lead 5b' of the semiconductor package 1 'is fused and mounted. to be.
그러나 이러한 반도체패키지(1')는 인쇄회로기판(10')에 실장시 반도체패키지(1')의 돌출부(3c')가 인쇄회로기판(10')과 일정거리 떨어져 공기중에 노출되어 있거나 또는 단순히 인쇄회로기판(10')과 접촉된 상태에 있게 됨으로써 상기 반도체칩(2')의 열을 상기 히트싱크(3')가 효율적으로 방출하지 못하는 문제점이 있다. 즉, 상기 히트싱크(3')를 통한 반도체칩(2')의 열이 단순히 공기중으로만 발산됨으로써 그 열방출 효율이 떨어지는 것이다. 이러한 현상은 최근의 고속 동작을 하는 반도체칩(2')에 있어서 보다 많은 량의 열이 발생되기 때문에 이를 해결하지 못하게 되면 반도체칩(2')의 전기적 성능이 대폭 저하되고 반도체칩(2')의 수명이 현저히 저하되는 원인이 되고 있다. 또한 상기 반도체패키지(1')는 단지 몸체(7')의 외부로 뻗어나온 외부리드(5b')가 인쇄회로기판(10')에 실장되어 있음으로써 그 조립 견고성이 취약한 문제도 있다.However, when the semiconductor package 1 'is mounted on the printed circuit board 10', the protrusion 3c 'of the semiconductor package 1' is exposed to the air at a predetermined distance away from the printed circuit board 10 'or simply By being in contact with the printed circuit board 10 ', there is a problem that the heat sink 3' does not efficiently discharge heat of the semiconductor chip 2 '. That is, the heat dissipation efficiency of the semiconductor chip 2 'through the heat sink 3' is simply dissipated into the air, thereby decreasing its heat dissipation efficiency. This phenomenon occurs in the semiconductor chip 2 'which operates at a high speed in recent years. Therefore, if this problem cannot be solved, the electrical performance of the semiconductor chip 2' is greatly reduced and the semiconductor chip 2 'is reduced. It has been a cause of significantly lowering the service life. In addition, the semiconductor package 1 'has a problem in that its assembly robustness is weak because only the external lead 5b' extending out of the body 7 'is mounted on the printed circuit board 10'.
따라서 본 발명의 목적은 상기와 같은 종래의 문제점을 해결하기 의하여 안출한 것으로 몸체의 하부면과 평형하게 일치되는 히트싱크 부분에는 단차 및 솔더부를 형성하여 인쇄회로기판에 완전히 접착되도록 하고, 상기 단차의 내측은 외부리드의 끝단이 이루는 수평면보다 아래쪽으로 더욱 돌출된 돌출부를 형성함으로써 인쇄회로기판에 형성된 삽입공에 상기 돌출부가 삽입되도록 하여 히트싱크의 열을 공기 및 인쇄회로기판 전체로 전도되도록 하여 그 열방출 효율을 극대화할 뿐만 아니라 그 조립 견고성을 향상하는데 있다.Accordingly, an object of the present invention is to solve the conventional problems as described above to form a step and a solder portion in the heat sink portion in parallel with the lower surface of the body to be completely bonded to the printed circuit board, The inner side has a protrusion that protrudes further downward than the horizontal plane formed by the end of the outer lead so that the protrusion is inserted into the insertion hole formed in the printed circuit board so that the heat of the heat sink is conducted to the air and the entire printed circuit board. Not only to maximize the release efficiency but also to improve the assembly robustness.
상기한 목적을 달성하기 위해 본 발명은 일정한 전기적 기능을 수행하는 반도체칩과; 상기 반도체칩으로부터 발생된 열을 외부로 방출하기 위해 상기 반도체칩의 저면에 접착된 히트싱크와; 상기 히트싱크의 내주연 상부에 접착층이 개재되어 접착되어 있으며 내부리드와 외부리드로 이루어진 리드프레임과; 상기 반도체칩과 리드프레임의 내부리드를 전기적으로 연결하는 전도성와이어와; 상기 반도체칩, 전도성와이어 등을 외부의 환경으로부터 보호하기 위해 수지재로 봉지하되 상기 히트싱크의 하단부는 하부로 돌출되어 노출되도록 봉지된 몸체로 이루어진 반도체패키지에 있어서, 상기 히트싱크는 몸체의 하부면과 만나는 부분에 그 몸체의 하부면과 동일면을 가지며 외부로 노출된 단차가 형성되어 있고, 상기 단차의 표면에는 인쇄회로기판의 표면과 접착되도록 솔더부가 형성되어 있으며, 상기 단차의 내측에는 인쇄회로기판의 삽입공에 삽입되어 고정되도록 상기 외부리드의 끝단이 형성하는 수평면보다 아래쪽으로 일정길이를 갖는 돌출부가 형성된 것을 특징으로 한다.The present invention to achieve the above object is a semiconductor chip for performing a certain electrical function; A heat sink bonded to a bottom surface of the semiconductor chip to radiate heat generated from the semiconductor chip to the outside; A lead frame having an adhesive layer interposed therebetween and formed of an inner lead and an outer lead of the heat sink; Conductive wires electrically connecting the semiconductor chip and an inner lead of the lead frame; In the semiconductor package is encapsulated with a resin material to protect the semiconductor chip, conductive wire, etc. from the outside environment, the lower end of the heat sink is formed of a body sealed to protrude downward, wherein the heat sink is the lower surface of the body And a stepped portion having the same surface as the lower surface of the body and exposed to the outside, a solder portion is formed on the surface of the step to be bonded to the surface of the printed circuit board, the inside of the stepped printed circuit board A protrusion having a predetermined length is formed below the horizontal surface formed by the end of the outer lead to be inserted and fixed to the insertion hole of the.
이하 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.
제1도는 본 발명에 의한 반도체패키지(1)를 도시한 단면도로써, 반도체칩(2) 하부에 히트싱크(3)를 접착한 채 수지재로 봉지하여 형성된 몸체(7)의 하부면과 동일면을 갖도록 히트싱크(3)와 몸체(7)가 만나는 경계면에 단차(3a)가 형성되어 있고, 상기 단차(3a)에는 차후에 인쇄회로기판(10)과 용이하게 접착되도록 솔더부(3b)가 형성되어 있다. 또한 상기 단차(3a)의 내측으로는 일정길이(L) 하부로 더 돌출된 돌출부(3c)가 형성되어 차후에 인쇄회로기판(10)의 삽입공(15)에 용이하게 결합될 수 있도록 하였다. 즉, 상기 돌출부(3c)는 외부리드(5b)의 끝단이 이루는 수평면(H, 즉, 인쇄회로기판의 상부표면) 아래쪽으로 일정길이(L) 더 돌출되도록 한 것이다. 또한 상기 반도체칩(2)과 히트싱크(3)의 상면은 서로 그라운드본딩(6b)되어 있다. 여기서 상기 솔더부(3b)는 주석(Sn)과 납(Pb)의 합금이며 낮은 온도에서 용융되는 솔더페이스트를 이용함으로써 차후에 인쇄회로기판에 용이하게 접착되도록 하였다.1 is a cross-sectional view showing a semiconductor package 1 according to the present invention, the same surface as the lower surface of the body 7 formed by sealing with a resin material while adhering the heat sink 3 to the lower portion of the semiconductor chip (2). A step 3a is formed at an interface where the heat sink 3 and the body 7 meet each other, and the solder part 3b is formed on the step 3a to be easily adhered to the printed circuit board 10 later. have. In addition, the inside of the step (3a) is formed with a protrusion (3c) further protruded to a predetermined length (L) lower so that it can be easily coupled to the insertion hole 15 of the printed circuit board 10 later. That is, the protrusion 3c is to protrude a predetermined length L further below the horizontal surface H (that is, the upper surface of the printed circuit board) formed by the end of the outer lead 5b. In addition, the upper surfaces of the semiconductor chip 2 and the heat sink 3 are ground bonded to each other. Here, the solder portion 3b is an alloy of tin (Sn) and lead (Pb), and is easily bonded to the printed circuit board by using solder paste that is melted at a low temperature.
도면중 미설명 부호 5는 리드프레임, 5a는 내부리드, 6a는 반도체칩(2)과 내부리드(5a)를 전기적으로 연결하는 전도성와이어이다.In the drawing, reference numeral 5 denotes a lead frame, 5a denotes an inner lead, and 6a denotes a conductive wire that electrically connects the semiconductor chip 2 and the inner lead 5a.
제2도는 본 발명에 의한 반도체패키지(1)가 인쇄회로기판(10)에 실장 및 결합된 상태를 도시한 것으로써, 히트싱크(3)의 돌출부(3c)가 인쇄회로기판(10)의 삽입공(15)에 삽입되어 고정되어 있으며, 상기 히트싱크(3)의 단차(3a)에 형성된 솔더부(3b)로 인해 그 히트싱크(3)가 인쇄회로기판(10)의 상면에 접착되어 있다. 물론 리드프레임(5)의 외부리드(5b)는 인쇄회로기판(10)의 표면에 실장되어 있다.2 is a view illustrating a state in which the semiconductor package 1 according to the present invention is mounted and coupled to a printed circuit board 10, and the protrusion 3c of the heat sink 3 is inserted into the printed circuit board 10. The heat sink 3 is adhered to the upper surface of the printed circuit board 10 due to the solder portion 3b formed in the step 3a of the heat sink 3. . Of course, the outer lead 5b of the lead frame 5 is mounted on the surface of the printed circuit board 10.
제3도는 본 발명에 의한 반도체패키지(1)가 인쇄회로기판(11,12)에 결합된 다른 실시예를 도시한 상태도로써 히트싱크(3)의 돌출부(3c)가 부인쇄회로기판(11)을 관통하여 주인쇄회로기판(12)에 접착되어 있다. 즉, 외부리드(5b)가 이루는 수평면(H)보다 아래쪽으로 더 돌출된 돌출부(3c)가 부인쇄회로기판(11)의 삽입공(15)에 삽입되어 고정된 상태에서 하부로 일정길이(L) 더 돌출되게 하여 그 돌출부(3c)의 하단부가 주인쇄회로기판(12)의 상면에 접착되도록 하였다. 여기서 상기 주인쇄회로기판(12)과 부인쇄회로기판(11) 사이에는 소정 간격의 공간부를 구비하도록 하여, 이 공간부(S)에 위치한 돌출부(3c)가 외부에 노출되게 한 것이다. 여기서 상기 돌출부(3c)의 하단부에는 솔더부(3b)를 더 형성하여 주인쇄회로기판(12)과 양호하게 접착되도록 하였다.3 is a state diagram showing another embodiment in which the semiconductor package 1 according to the present invention is coupled to the printed circuit boards 11 and 12, and the protrusion 3c of the heat sink 3 is the non-printed circuit board 11. It penetrates through and adheres to the host printed circuit board 12. That is, the protrusion 3c protruding further downward than the horizontal plane H formed by the outer lead 5b is inserted into the insertion hole 15 of the non-printed circuit board 11 and fixed to a lower portion in a fixed state (L). ) So that the lower end of the protrusion 3c is bonded to the upper surface of the host circuit board 12. In this case, a space portion at a predetermined interval is provided between the host circuit board 12 and the non-printed circuit board 11 so that the protrusion 3c positioned in the space portion S is exposed to the outside. Here, the solder portion 3b is further formed at the lower end of the protrusion part 3c so as to be well adhered to the host circuit board 12.
이와같이 구성된 본 고안의 작용 및 효과를 상세하게 설명하면 다음과 같다.Referring to the operation and effects of the present invention configured in this way as follows.
도시된 도면 제2도에서와 같이 반도체칩(2)이 상부에 안치된 히트싱크(3)를 수지재로 봉지하여 몸체(7)를 형성하면, 상기 히트싱크(3)의 단차(3a)는 몸체(7) 하부의 표면과 평형하게 유지되고 상기 단차(3a)의 표면에 솔더부(3b)를 형성하고, 상기 단차(3a)의 내측으로는 외부리드(5b)의 끝단이 이루는 수평면(H)보다 하부에 위치되는 돌출부(3c)를 형성한다. 이 상태에서 인쇄회로기판(10)의 삽입공(15)에 히트싱크(3)의 돌출부(3c)를 삽입시키고 솔더부(3b)를 인쇄회로기판(10)의 상부면에 융용시켜 접착시키게 되면 반도체패키지(1)는 인쇄회로기판(10)에 견고히 고정되고 돌출부(3c)은 인쇄회로기판(10) 하부로 돌출된다.As shown in FIG. 2, when the semiconductor chip 2 encapsulates the heat sink 3 placed thereon with a resin material to form a body 7, the step 3a of the heat sink 3 is It is maintained in balance with the surface of the lower portion of the body (7) to form a solder portion 3b on the surface of the step (3a), the inner surface of the step (3a) a horizontal plane formed by the end of the outer lead (5b) Protruding portion (3c) located below the () is formed. In this state, when the protrusion 3c of the heat sink 3 is inserted into the insertion hole 15 of the printed circuit board 10 and the solder portion 3b is melted and bonded to the upper surface of the printed circuit board 10, The semiconductor package 1 is firmly fixed to the printed circuit board 10 and the protrusion 3c protrudes below the printed circuit board 10.
이렇게 인쇄회로기판(10)에 고정된 반도체패키지(1)는 전기적 신호에 의해 반도체칩(2)에서 발생하는 열이 히트싱크(3)를 통해 외부로 방출되어지는데, 이때 인쇄회로기판(10)의 삽입공(15)을 통과하여 하부로 돌출된 히트싱크(3)의 돌출부(3c)가 외부 공기와 접촉함으로써 열을 방출하는 동시에 상기 히트싱크(3)의 열이 인쇄회로기판(10)으로도 전도되어 그 열방출 효율이 극대화되는 것이다.The semiconductor package 1 fixed to the printed circuit board 10 is discharged to the outside through the heat sink 3 by the heat generated from the semiconductor chip 2 by an electrical signal, wherein the printed circuit board 10 The heat sink (3c) of the heat sink (3) protruding downward through the insertion hole (15) of the contact with the outside air releases heat and at the same time the heat of the heat sink (3) is transferred to the printed circuit board (10). It is also conducted to maximize its heat dissipation efficiency.
또한 상기 히트싱크(3)는 상부에 안치된 반도체칩(2)과 그라운드본딩(6b)되어 있음으로써 상기 히트싱크(3)를 솔더부(3b)를 통해 외부의 그라운드수단에 연결시키게 되는 것이 가능함으로써 별도의 그라운드를 위한 내부리드가 불필요해지기도 한다. 상기 몸체(7)의 측면 외부로 돌출된 각 외부리드(5b)의 양단 하부는 종래와 같이 인쇄회로기판(10)의 상부면에 접촉시킨 상태에서 솔더링하여 실장하게 되며, 또한 히트싱크(3)의 돌출부(3c) 및 솔더부(3b)가 인쇄회로기판(10)에 결합 및 접착됨으로써 조립 견고성이 향상된다.In addition, the heat sink 3 may be connected to the external ground means through the solder portion 3b by the semiconductor chip 2 and the ground bonding 6b disposed thereon. This eliminates the need for an internal lead for a separate ground. Lower portions of both ends of each of the outer leads 5b protruding out of the side of the body 7 are soldered and mounted in contact with the upper surface of the printed circuit board 10 as in the prior art, and also the heat sink 3 By assembling and adhering the protruding portions 3c and the solder portions 3b to the printed circuit board 10, the assembly robustness is improved.
또한 제3도와 같이 히트싱크(3)는 부인쇄회로기판(11)의 삽입공(15)에 삽입되어 하부로 일정길이(L) 돌출된 히트싱크(3)의 돌출부(3c) 하단부를 주인쇄회로기판(12)의 상부면에 솔더부(3b)를 이용하여 접착시키고, 주인쇄회로기판(12)과 부인쇄회로기판(11)에 소정간격으로 구비된 공간부(S)에 히트싱크(3)의 돌출부(3c)가 노출되게 함으로써, 외부에 별도로 구비된 블로우팬(Blow Pan)에서 발생한 에어(Air)가 히트싱크(3)의 돌출부(3c)에 접촉되어 반도체칩(2)에서 발생한 열을 보다 원할히 냉각시킬 수 있게 되며, 반도체패키지(1)가 적용되어 구비되는 각종 제품 및 기기의 내부공간에 보다 많은 회로구성을 할 수 있게 된다.In addition, as shown in FIG. 3, the heat sink 3 is inserted into the insertion hole 15 of the non-printed circuit board 11, and the main portion of the lower end of the projecting portion 3c of the heat sink 3 protrudes a predetermined length L downwardly. The upper surface of the circuit board 12 is bonded to each other using the solder portion 3b, and the heat sink (S) is provided in the space S provided at the predetermined intervals between the host circuit board 12 and the non-printed circuit board 11. By exposing the protrusion 3c of 3), the air generated in the blow pan provided separately from the outside is in contact with the protrusion 3c of the heat sink 3 and generated in the semiconductor chip 2. The heat can be cooled more smoothly, and more circuit configurations can be made in the internal spaces of various products and devices to which the semiconductor package 1 is applied.
상술한 바와 같이 본 발명은 반도체패키지의 히트싱크가 몸체의 하부면과 동일면에는 단차 및 솔더부를 형성하고 그 단차의 내측에는 외부리드의 끝단이 이루는 수평면보다 아래쪽으로 돌출된 돌출부를 형성함으로써, 상기 솔더부는 인쇄회로기판에 용융되어 접착되고 돌출부는 인쇄회로기판의 삽입공에 결합됨으로써 반도체칩에서 발생하는 열을 보다 효과적으로 공기뿐만 아니라 인쇄회로기판으로도 전달하여 방열하는 효과가 있는 동시에 반도체패키지의 조립 견고성을 향상시킬 수 있는 효과가 있다.As described above, the present invention provides the heat sink of the semiconductor package by forming a step and a solder part on the same surface as the lower surface of the body, and forming a protrusion protruding downward from the horizontal plane formed by the end of the outer lead on the inside of the step. The parts are melted and bonded to the printed circuit board, and the protrusions are coupled to the insertion holes of the printed circuit board, thereby effectively transferring heat generated from the semiconductor chip to the printed circuit board as well as air to dissipate heat, and at the same time assembling the semiconductor package. There is an effect to improve.
Claims (3)
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| KR1019940018497A KR0156513B1 (en) | 1994-07-28 | 1994-07-28 | Semiconductor package |
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| KR1019940018497A KR0156513B1 (en) | 1994-07-28 | 1994-07-28 | Semiconductor package |
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| KR100408541B1 (en) * | 1996-12-31 | 2004-03-20 | 주식회사 새 한 | Method of manufacturing fibril polyester fiber, and spinneret therefor |
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