KR960005962A - Heat Proof Heat Sink of Semiconductor Package - Google Patents

Heat Proof Heat Sink of Semiconductor Package Download PDF

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Publication number
KR960005962A
KR960005962A KR1019940018497A KR19940018497A KR960005962A KR 960005962 A KR960005962 A KR 960005962A KR 1019940018497 A KR1019940018497 A KR 1019940018497A KR 19940018497 A KR19940018497 A KR 19940018497A KR 960005962 A KR960005962 A KR 960005962A
Authority
KR
South Korea
Prior art keywords
heat sink
semiconductor package
pcb
protrusion
end surface
Prior art date
Application number
KR1019940018497A
Other languages
Korean (ko)
Other versions
KR0156513B1 (en
Inventor
신원선
도병태
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940018497A priority Critical patent/KR0156513B1/en
Publication of KR960005962A publication Critical patent/KR960005962A/en
Application granted granted Critical
Publication of KR0156513B1 publication Critical patent/KR0156513B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 반도체 패키지의 외부돌출형 히드싱크에 관한 것으로서, 히트싱크(2)의 단부표면을 패키지(6)의 표면(7)과 평형하게 일치시켜 솔더부(4)를 갖도록하고, 이 솔더부(4)의 단부표면에서 외부로 소정높이(H)를 돌출시킨 돌출부(3)를 P.C.B에 형성된 삽입공(12)에 삽착시키므로서 반도체칩에서 발생한 열의 방출성을 높이고 P.C.B에 조립된 반도체 패키지의 조립견고성을 견고하게 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an external protrusion type heat sink of a semiconductor package, wherein the end surface of the heat sink 2 is equally aligned with the surface 7 of the package 6 so as to have a solder portion 4, and the solder portion By inserting the protrusion (3) projecting the predetermined height (H) from the end surface of the (4) to the outside into the insertion hole (12) formed in the PCB to improve the release of heat generated in the semiconductor chip and the assembly of the semiconductor package It is the solidity of assembly.

Description

반도체 패키지의 외부돌출형 히트싱크(HEAT SINK)Heat Proof Heat Sink of Semiconductor Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 반도체 패키지에 적용된 히트싱크이다.1 is a heat sink applied to a semiconductor package of the present invention.

제2도는 본 발명의 히트싱크가 실장된 반도체 패키지를 P.C.B에 조립한 상태도이다.2 is a state diagram in which the semiconductor package on which the heat sink of the present invention is mounted is assembled to P.C.B.

제3도는 본 발명의 다른 실시예의 히트싱크가 P.C.B에 조립된 상태도이다.3 is a state diagram in which the heat sink of another embodiment of the present invention is assembled to P.C.B.

Claims (7)

반도체 패키지(1)에서 발생한 열 방출성을 좋게 한 히트싱크(2) 상부에 반도체칩(8)을 안치한 상태에서 컴파운드제로 패키지(6) 몰드된 것에 있어서, 상기 히트싱크(2)의 단부표면을 패키지(6)의 표면(7)과 평형하게 일치시켜 솔더부(4)를 갖도록 하고, 이 솔더부(4)의 단부표면에서 외부로 소정높이(H)를 돌출시킨 돌출부 (3)를 P.C.B에 형성된 삽입공(12)에 삽착시켜 방열성을 증대시킨 것을 특징으로 하는 반도체 패키지의 외부돌출형 히트싱크.The end surface of the heat sink 2 is formed by molding a package 6 with a compound made of a semiconductor chip 8 on an upper part of the heat sink 2 having improved heat dissipation generated in the semiconductor package 1. Equilibrium coincides with the surface 7 of the package 6 so that the solder portion 4 is provided, and the protrusion 3 protruding a predetermined height H from the end surface of the solder portion 4 to the outside is mounted on the PCB. An external protrusion type heat sink of a semiconductor package, which is inserted into the formed insertion hole 12 to increase heat dissipation. 제1항에 있어서, 히트싱크(2)와 반도체칩(8)사이에는 그라운드 본딩(10)한 것을 특징으로 하는 반도체 패키지의 외부돌출형 히트싱크 .2. The externally projecting heat sink of a semiconductor package according to claim 1, wherein a ground bonding (10) is formed between the heat sink (2) and the semiconductor chip (8). 제1항에 있어서, 히트싱크(2)의 단부표면에 구비된 솔더부(4)를 솔더페이스트(9)로 P.C.B(11)의 상부면과 접합시켜 된 것을 특징으로 하는 반도체 패키지의 외부돌출형 히트싱크.The semiconductor package according to claim 1, wherein the solder portion (4) provided on the end surface of the heat sink (2) is joined to the upper surface of the PCB (11) with a solder paste (9). Heatsink. 제1항에 있어서, 히트싱크(2)의 돌추룹(3)가 P.C.B(11)의 삽입공(12)에 삽착된 상태에서 P.C.B(11)의 하부면 외부로 돌출된 것을 특징으로 하는 반도체 패키지의 외부돌출형 히트싱크.The semiconductor package according to claim 1, wherein the stone chute (3) of the heat sink (2) protrudes outside the lower surface of the PCB (11) while being inserted into the insertion hole (12) of the PCB (11). Extruded heatsink 제1항에 있어서, 히트싱크(2)의 돌출부(3)를 부 P.C.B(14)의 삽입공(12)에 삽착시켜 외부로 일정높이(H')가 돌출된 히트싱크(2)의 돌출부(3)하단부를 주 P.C.B(13)에 접착시켜 된 것을 특징으로 하는 외부돌출형 히트싱크.The protrusion (3) of the heat sink (2) according to claim 1, wherein the protrusion (3) of the heat sink (2) is inserted into the insertion hole (12) of the sub-PCB (14). 3) An externally projecting heat sink characterized in that the lower end is bonded to the main PCB (13). 제6항에 있어서, 주 P.C.B(13)와 부P.C.B(14)사이에 형성된 공간부(S)에 히트싱크(2)의 돌출부(3) 노출되게 한 것을 특징으로 하는 외부돌출형 히트싱크.7. The externally projecting heat sink according to claim 6, wherein the protrusion (3) of the heat sink (2) is exposed in the space (S) formed between the main P.C.B (13) and the sub P.C.B (14). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940018497A 1994-07-28 1994-07-28 Semiconductor package KR0156513B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940018497A KR0156513B1 (en) 1994-07-28 1994-07-28 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940018497A KR0156513B1 (en) 1994-07-28 1994-07-28 Semiconductor package

Publications (2)

Publication Number Publication Date
KR960005962A true KR960005962A (en) 1996-02-23
KR0156513B1 KR0156513B1 (en) 1998-10-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940018497A KR0156513B1 (en) 1994-07-28 1994-07-28 Semiconductor package

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KR (1) KR0156513B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100408541B1 (en) * 1996-12-31 2004-03-20 주식회사 새 한 Method of manufacturing fibril polyester fiber, and spinneret therefor
KR100421920B1 (en) * 1996-12-20 2004-04-17 주식회사 효성 Production of opaque hollow fiber having excellent lightweight properties, heat retaining properties and low light transmittance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100421920B1 (en) * 1996-12-20 2004-04-17 주식회사 효성 Production of opaque hollow fiber having excellent lightweight properties, heat retaining properties and low light transmittance
KR100408541B1 (en) * 1996-12-31 2004-03-20 주식회사 새 한 Method of manufacturing fibril polyester fiber, and spinneret therefor

Also Published As

Publication number Publication date
KR0156513B1 (en) 1998-10-15

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