KR970023917A - Semiconductor package to prevent short circuit of wire - Google Patents
Semiconductor package to prevent short circuit of wire Download PDFInfo
- Publication number
- KR970023917A KR970023917A KR1019950038133A KR19950038133A KR970023917A KR 970023917 A KR970023917 A KR 970023917A KR 1019950038133 A KR1019950038133 A KR 1019950038133A KR 19950038133 A KR19950038133 A KR 19950038133A KR 970023917 A KR970023917 A KR 970023917A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- semiconductor package
- short circuit
- die pad
- prevent short
- Prior art date
Links
Abstract
본 발명은 와이어의 단락을 방지하기 위한 반도체 패키지에 관한 것으로, 더욱 상세하게는 와이어의 단락을 방지하기 위해 리드 프레임의 상부면에 절연수단을 부착하여 와이어의 단락을 방지하기 위한 반도체 패키지에 관한 것이다.The present invention relates to a semiconductor package for preventing a short circuit of the wire, and more particularly to a semiconductor package for preventing the short circuit of the wire by attaching an insulating means to the upper surface of the lead frame to prevent the short circuit of the wire. .
본 발명은, 내부리드와 다이 패드에 실장된 반도체 칩을 연결하는 와이어로 구성된 반도체 패키지에 있어서, 상기 다이 패드의 상부면에 절연수단을 부착 고정함을 특징으로 하는 와이어 단락을 방지하기 위한 반도체 패키지를 특징으로 한다.According to an aspect of the present invention, there is provided a semiconductor package including a wire connecting an internal lead to a semiconductor chip mounted on a die pad, wherein the semiconductor package is attached to and fixed to an upper surface of the die pad. It is characterized by.
따라서, 본 발명에 의한 구조에 따르면, 와이어의 처짐 현상에 의한 와이어 단락이 방지되는 효과가 있고, 반도체 칩이 다이패드에 접착될때 발생하는 접착제의 번짐현상이 방지됨으로써 반도체 패키지의 신뢰성을 향상할 수 있는 이점(利點)이 있다.Therefore, according to the structure of the present invention, there is an effect that the wire short circuit due to the deflection of the wire is prevented, and the bleeding of the adhesive that occurs when the semiconductor chip is bonded to the die pad is prevented, thereby improving the reliability of the semiconductor package. There is an advantage.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2A도는 본 발명의 리드 프레임을 이용하여 와이어 본딩을 했을때의 상태를 나타내는 단면도,2A is a cross-sectional view showing a state when wire bonding is performed using the lead frame of the present invention;
제2B도는 본 발명의 리드 프레임을 이용하여 와이어 본딩을 했을때의 상태를 나타내는 단면도.2B is a cross-sectional view showing a state when wire bonding is performed using the lead frame of the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950038133A KR970023917A (en) | 1995-10-30 | 1995-10-30 | Semiconductor package to prevent short circuit of wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950038133A KR970023917A (en) | 1995-10-30 | 1995-10-30 | Semiconductor package to prevent short circuit of wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970023917A true KR970023917A (en) | 1997-05-30 |
Family
ID=66583974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950038133A KR970023917A (en) | 1995-10-30 | 1995-10-30 | Semiconductor package to prevent short circuit of wire |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970023917A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100322620B1 (en) * | 1999-08-16 | 2002-03-18 | 황인길 | Cassette carrier moving device of standard mechanical interface |
| KR100878939B1 (en) * | 1999-06-30 | 2009-01-19 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor device |
-
1995
- 1995-10-30 KR KR1019950038133A patent/KR970023917A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100878939B1 (en) * | 1999-06-30 | 2009-01-19 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor device |
| KR100885606B1 (en) * | 1999-06-30 | 2009-02-24 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor device |
| KR100322620B1 (en) * | 1999-08-16 | 2002-03-18 | 황인길 | Cassette carrier moving device of standard mechanical interface |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |