KR970024101A - Lead frame with internal leads installed in the slit of the die pad - Google Patents

Lead frame with internal leads installed in the slit of the die pad Download PDF

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Publication number
KR970024101A
KR970024101A KR1019950038155A KR19950038155A KR970024101A KR 970024101 A KR970024101 A KR 970024101A KR 1019950038155 A KR1019950038155 A KR 1019950038155A KR 19950038155 A KR19950038155 A KR 19950038155A KR 970024101 A KR970024101 A KR 970024101A
Authority
KR
South Korea
Prior art keywords
die pad
lead frame
slit
internal leads
inner leads
Prior art date
Application number
KR1019950038155A
Other languages
Korean (ko)
Inventor
송영희
김진호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950038155A priority Critical patent/KR970024101A/en
Publication of KR970024101A publication Critical patent/KR970024101A/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

다이 패드의 장변에 형성된 슬릿들내에까지 연장된 내부 리드들과 다이 패드와의 사이에 와이어 본딩될 영역이 충분히 확보되어 큰 면적의 반도체 칩을 다이 패드상에 탑재할 수 있을 뿐 아니라 그 다이 패드상에 접착될 반도체 칩의 다수개의 본딩 패드들과 공통으로 와이어 본딩될 수 있다.The area to be wire-bonded between the die pad and the inner leads extending to the slits formed on the long side of the die pad is sufficiently secured to mount a large area semiconductor chip on the die pad, as well as on the die pad. The wire bonding may be performed in common with a plurality of bonding pads of a semiconductor chip to be bonded to the semiconductor chip.

Description

다이 패드의 슬릿(slit)내에 내부 리드가 설치된 리드 프레임Lead frame with internal leads installed in the slit of the die pad

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 의한 다이 패드내에 내부 리드가 설치된 리드 프레임의 구조를 나타낸 평면도.1 is a plan view showing the structure of a lead frame having an internal lead provided in a die pad according to the present invention;

제2도는 본 발명에 의한 다이 패드내에 내부리드가 설치된 리드 프레임의 다른 예의 구조를 나타낸 평면도이다.2 is a plan view showing another example of a structure of a lead frame provided with an inner lead in a die pad according to the present invention.

Claims (4)

내부 리드와 다이 패드를 갖는 리드 프레임에 있어서, 그 다이 패드의 측변에 슬릿들이 형성되고, 그 내부 리드들이 그슬릿내에까지 대응하여 연장된 것을 특징으로 하는 다이 패드의 슬릿내에 내부 리드가 설치된 리드 프레임.A lead frame having an inner lead and a die pad, wherein slits are formed on the sides of the die pad, and the inner leads are correspondingly extended to the slits. . 제1항에 있어서, 상기 슬릿내에까지 연장된 내부 리드들이 적어도 1개이상인 것을 특징으로 하는 다이 패드에 슬릿이 형성된 리드 프레임.The lead frame according to claim 1, wherein there are at least one inner lead extending into the slit. 제1항에 있어서, 상기 슬릿내에까지 연장된 내부 리드들의 영역의 폭이 그 영역을 제외한 영역의 폭보다 좁은 것을 특징으로 하는 다이 패드에 슬릿이 형성된 리드 프레임.The lead frame according to claim 1, wherein the width of the region of the inner leads extending into the slit is narrower than the width of the region excluding the region. 제1항에 있어서, 상기 슬릿내에까지 연장된 영역의 내부 리드들이 다수개의 내부 리드들에 대응하는 길이를 갖는 것을 특징으로 하는 다이 패드에 슬릿이 형성된 리드 프레임.The lead frame according to claim 1, wherein the inner leads of the region extending into the slit have a length corresponding to a plurality of inner leads. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950038155A 1995-10-30 1995-10-30 Lead frame with internal leads installed in the slit of the die pad KR970024101A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950038155A KR970024101A (en) 1995-10-30 1995-10-30 Lead frame with internal leads installed in the slit of the die pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950038155A KR970024101A (en) 1995-10-30 1995-10-30 Lead frame with internal leads installed in the slit of the die pad

Publications (1)

Publication Number Publication Date
KR970024101A true KR970024101A (en) 1997-05-30

Family

ID=66584940

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038155A KR970024101A (en) 1995-10-30 1995-10-30 Lead frame with internal leads installed in the slit of the die pad

Country Status (1)

Country Link
KR (1) KR970024101A (en)

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