KR970003871A - Semiconductor package - Google Patents
Semiconductor package Download PDFInfo
- Publication number
- KR970003871A KR970003871A KR1019950018546A KR19950018546A KR970003871A KR 970003871 A KR970003871 A KR 970003871A KR 1019950018546 A KR1019950018546 A KR 1019950018546A KR 19950018546 A KR19950018546 A KR 19950018546A KR 970003871 A KR970003871 A KR 970003871A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- semiconductor package
- attached
- package
- molding
- Prior art date
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 발명은 반도체 패캐이지에 관한 것으로서, 패드의 양면에 서로 다른 칩을 각각 부착하고 각 칩에 다수의 리드를 각각 부착하여 각 칩과 리드를 독립적으로 와이어 본딩한 후 몰딩 고정을 실시하여 두가지의 칩을 하나의 패캐이지로 구성한다.The present invention relates to a semiconductor package, in which different chips are attached to both sides of a pad, and a plurality of leads are attached to each chip, respectively, each chip and the lead are independently wire-bonded, and then molding molding is performed. Consists of one package.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제4도는 본 발명에 따른 리드 프레임중 패드의 양면에 기능이 서로 다른 칩을 각각 부착한 후, 와이어 본딩을 실시한 상태의 단면도, 제5도는 본 발명을 이용하여 패캐이지를 구성한 상태의 사시도.4 is a cross-sectional view of a state in which wire bonding is performed after attaching chips having different functions to both surfaces of a pad of a lead frame according to the present invention, and FIG. 5 is a perspective view of a state in which a package is constructed using the present invention.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950018546A KR970003871A (en) | 1995-06-30 | 1995-06-30 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950018546A KR970003871A (en) | 1995-06-30 | 1995-06-30 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970003871A true KR970003871A (en) | 1997-01-29 |
Family
ID=66526119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950018546A KR970003871A (en) | 1995-06-30 | 1995-06-30 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970003871A (en) |
-
1995
- 1995-06-30 KR KR1019950018546A patent/KR970003871A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |