KR970024094A - Lead frame with slit on die pad - Google Patents

Lead frame with slit on die pad Download PDF

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Publication number
KR970024094A
KR970024094A KR1019950038122A KR19950038122A KR970024094A KR 970024094 A KR970024094 A KR 970024094A KR 1019950038122 A KR1019950038122 A KR 1019950038122A KR 19950038122 A KR19950038122 A KR 19950038122A KR 970024094 A KR970024094 A KR 970024094A
Authority
KR
South Korea
Prior art keywords
slit
die pad
lead frame
lead
semiconductor chip
Prior art date
Application number
KR1019950038122A
Other languages
Korean (ko)
Inventor
송영희
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950038122A priority Critical patent/KR970024094A/en
Publication of KR970024094A publication Critical patent/KR970024094A/en

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Abstract

리드 프레임의 다이 패드의 측변에 슬릿(slit)이 형성되고, 그 슬릿내에 까지 연장된 내부 리드가 적어도 1개 이상 형성되어 그 다이 패드 자체의 스크레스가 감소하고, 양산성이 우수하며, 그 리드 프레임을 이용한 반도체 칩 패키지의 신뢰성이 향상되는 효과가 있다.A slit is formed on the side of the die pad of the lead frame, and at least one internal lead extending to the slit is formed, thereby reducing the scratch of the die pad itself, and excellent in mass productivity. There is an effect of improving the reliability of the semiconductor chip package using.

Description

다이 패드에 슬릿(slit)이 형성된 리드 프레임Lead frame with slit on die pad

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 다이 패드에 슬릿(slit)이 형성된 리드 프레임의 구조를 나타낸 평면도.2 is a plan view showing a structure of a lead frame in which a slit is formed in a die pad according to the present invention.

제3도는 제2도의 리드 프레임에 반도체 칩이 탑재된 상태를 나타내는 단면도이다.3 is a cross-sectional view showing a state where a semiconductor chip is mounted on the lead frame of FIG.

Claims (2)

내부 리드와 다이 패드와 타이 바를 갖는 리드 프레임에 있어서, 그 다이 패드의 측변에 슬릿이 형성되어 있는 것을 특징으로 하는 다이 패드에 슬릿이 형성된 리드 프레임.A lead frame having an internal lead, a die pad, and a tie bar, wherein a slit is formed on the side of the die pad, wherein the slit is formed on the die pad. 제1항에 있어서, 상기 슬릿내에까지 연장된 내부 리드들이 적어도 1개이상인 것을 특징으로 하는 다이 패드에 슬릿이 형성된 리드 프레임.The lead frame according to claim 1, wherein there are at least one inner lead extending into the slit. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950038122A 1995-10-30 1995-10-30 Lead frame with slit on die pad KR970024094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950038122A KR970024094A (en) 1995-10-30 1995-10-30 Lead frame with slit on die pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950038122A KR970024094A (en) 1995-10-30 1995-10-30 Lead frame with slit on die pad

Publications (1)

Publication Number Publication Date
KR970024094A true KR970024094A (en) 1997-05-30

Family

ID=66583941

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038122A KR970024094A (en) 1995-10-30 1995-10-30 Lead frame with slit on die pad

Country Status (1)

Country Link
KR (1) KR970024094A (en)

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