KR970053717A - Chip package with bent die pad structure - Google Patents
Chip package with bent die pad structure Download PDFInfo
- Publication number
- KR970053717A KR970053717A KR1019950068100A KR19950068100A KR970053717A KR 970053717 A KR970053717 A KR 970053717A KR 1019950068100 A KR1019950068100 A KR 1019950068100A KR 19950068100 A KR19950068100 A KR 19950068100A KR 970053717 A KR970053717 A KR 970053717A
- Authority
- KR
- South Korea
- Prior art keywords
- die pad
- chip package
- pad structure
- bent
- bent die
- Prior art date
Links
Abstract
본 발명은 리드프레임 패드 및 그를 이용한 반도체 칩 패키지에 관한 것으로, 다이패드 혹은 리드프레임 부분에 절곡된 모양을 형성하는 것으로서, 기계적인 구조로 되어 있는 절곡된 형상을 다이패드의 양쪽 끝부분에 형성하여 몰딩공정후 패키지 몰드가 열응력에 의해서 발생하는 뒤틀림(Warpage)을 방지하는 동시에 칩패키지 외형의 평탄 도르 유지하여 고신뢰성의 칩 패키지를 구성할 수 있는 특징을 갖는다.The present invention relates to a lead frame pad and a semiconductor chip package using the same, wherein a bent shape is formed on a die pad or a lead frame part, and a bent shape having a mechanical structure is formed on both ends of the die pad. After the molding process, the package mold prevents warpage caused by thermal stress and maintains the chip package flatness to form a highly reliable chip package.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의한 다이패드부의 절곡된 형상 구조를 보여주는 패키지 단면도.2 is a package cross-sectional view showing a curved shape structure of the die pad portion according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068100A KR970053717A (en) | 1995-12-30 | 1995-12-30 | Chip package with bent die pad structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068100A KR970053717A (en) | 1995-12-30 | 1995-12-30 | Chip package with bent die pad structure |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053717A true KR970053717A (en) | 1997-07-31 |
Family
ID=66637554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950068100A KR970053717A (en) | 1995-12-30 | 1995-12-30 | Chip package with bent die pad structure |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053717A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
KR100411812B1 (en) * | 2001-04-02 | 2003-12-24 | 앰코 테크놀로지 코리아 주식회사 | Manufacturing method of semiconductor package |
-
1995
- 1995-12-30 KR KR1019950068100A patent/KR970053717A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
KR100411812B1 (en) * | 2001-04-02 | 2003-12-24 | 앰코 테크놀로지 코리아 주식회사 | Manufacturing method of semiconductor package |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |