KR970053717A - Chip package with bent die pad structure - Google Patents

Chip package with bent die pad structure Download PDF

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Publication number
KR970053717A
KR970053717A KR1019950068100A KR19950068100A KR970053717A KR 970053717 A KR970053717 A KR 970053717A KR 1019950068100 A KR1019950068100 A KR 1019950068100A KR 19950068100 A KR19950068100 A KR 19950068100A KR 970053717 A KR970053717 A KR 970053717A
Authority
KR
South Korea
Prior art keywords
die pad
chip package
pad structure
bent
bent die
Prior art date
Application number
KR1019950068100A
Other languages
Korean (ko)
Inventor
이관재
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950068100A priority Critical patent/KR970053717A/en
Publication of KR970053717A publication Critical patent/KR970053717A/en

Links

Abstract

본 발명은 리드프레임 패드 및 그를 이용한 반도체 칩 패키지에 관한 것으로, 다이패드 혹은 리드프레임 부분에 절곡된 모양을 형성하는 것으로서, 기계적인 구조로 되어 있는 절곡된 형상을 다이패드의 양쪽 끝부분에 형성하여 몰딩공정후 패키지 몰드가 열응력에 의해서 발생하는 뒤틀림(Warpage)을 방지하는 동시에 칩패키지 외형의 평탄 도르 유지하여 고신뢰성의 칩 패키지를 구성할 수 있는 특징을 갖는다.The present invention relates to a lead frame pad and a semiconductor chip package using the same, wherein a bent shape is formed on a die pad or a lead frame part, and a bent shape having a mechanical structure is formed on both ends of the die pad. After the molding process, the package mold prevents warpage caused by thermal stress and maintains the chip package flatness to form a highly reliable chip package.

Description

절곡 형상의 다이패드 구조를 갖는 칩 패키지Chip package with bent die pad structure

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 다이패드부의 절곡된 형상 구조를 보여주는 패키지 단면도.2 is a package cross-sectional view showing a curved shape structure of the die pad portion according to the present invention.

Claims (3)

회로가 형성되어 있는 반도체 칩과 상기 칩을 지지하고 외부와 전기적으로 연결시키는 다이패드와 리드로 구성되는 반도체 패키지에 있어서, 상기 다이패드 부분에 절곡된 구조를 내장하는 것을 특징으로 하는 반도체 패키지.A semiconductor package comprising a semiconductor chip having a circuit formed thereon and a die pad and lead for supporting the chip and electrically connecting the chip, wherein the semiconductor package includes a bent structure in the die pad portion. 제1항에 있어서, 상기 절곡된 구조물의 형태가 빔 또는 바의 형태를 특징으로 하는 반도체 패키지.The semiconductor package of claim 1, wherein the bent structure is in the form of a beam or a bar. 제1항에 있어서, 상기 내부 리드 부가 절곡된 형태를 특징으로 가지고 있는 반도체 패키지.The semiconductor package of claim 1, wherein the inner lead portion is bent. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950068100A 1995-12-30 1995-12-30 Chip package with bent die pad structure KR970053717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950068100A KR970053717A (en) 1995-12-30 1995-12-30 Chip package with bent die pad structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950068100A KR970053717A (en) 1995-12-30 1995-12-30 Chip package with bent die pad structure

Publications (1)

Publication Number Publication Date
KR970053717A true KR970053717A (en) 1997-07-31

Family

ID=66637554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950068100A KR970053717A (en) 1995-12-30 1995-12-30 Chip package with bent die pad structure

Country Status (1)

Country Link
KR (1) KR970053717A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990034731A (en) * 1997-10-30 1999-05-15 윤종용 Lead-on chip lead frames and packages using them
KR100411812B1 (en) * 2001-04-02 2003-12-24 앰코 테크놀로지 코리아 주식회사 Manufacturing method of semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990034731A (en) * 1997-10-30 1999-05-15 윤종용 Lead-on chip lead frames and packages using them
KR100411812B1 (en) * 2001-04-02 2003-12-24 앰코 테크놀로지 코리아 주식회사 Manufacturing method of semiconductor package

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