KR920013684A - Semiconductor leadframe - Google Patents

Semiconductor leadframe Download PDF

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Publication number
KR920013684A
KR920013684A KR1019900022667A KR900022667A KR920013684A KR 920013684 A KR920013684 A KR 920013684A KR 1019900022667 A KR1019900022667 A KR 1019900022667A KR 900022667 A KR900022667 A KR 900022667A KR 920013684 A KR920013684 A KR 920013684A
Authority
KR
South Korea
Prior art keywords
lead
semiconductor
semiconductor leadframe
leadframe
note
Prior art date
Application number
KR1019900022667A
Other languages
Korean (ko)
Other versions
KR930011116B1 (en
Inventor
송영희
이국상
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019900022667A priority Critical patent/KR930011116B1/en
Publication of KR920013684A publication Critical patent/KR920013684A/en
Application granted granted Critical
Publication of KR930011116B1 publication Critical patent/KR930011116B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음No content

Description

반도체 리드프레임Semiconductor leadframe

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 이 발명에 따른 반도체 리드프레임의 평면도, 제4도는 제3도의 리드프레임을 이용한 패키지의 X-X'선 단면도이다.3 is a plan view of a semiconductor lead frame according to the present invention, and FIG. 4 is a cross-sectional view taken along line X-X 'of the package using the lead frame of FIG.

Claims (1)

반도체 리드프레임에 있어서, 반도체 칩의 접지패드의 도선연결되는 부분을 내부리드와 동일한 수평위치에 놓이도록 상향절곡된 것을 특징으로 하는 반도체 리드프레임.A semiconductor lead frame, wherein the lead lead portion of the ground pad of the semiconductor chip is bent upward to be in the same horizontal position as the inner lead. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900022667A 1990-12-31 1990-12-31 Lead frame of semiconductor KR930011116B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900022667A KR930011116B1 (en) 1990-12-31 1990-12-31 Lead frame of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900022667A KR930011116B1 (en) 1990-12-31 1990-12-31 Lead frame of semiconductor

Publications (2)

Publication Number Publication Date
KR920013684A true KR920013684A (en) 1992-07-29
KR930011116B1 KR930011116B1 (en) 1993-11-24

Family

ID=19309134

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900022667A KR930011116B1 (en) 1990-12-31 1990-12-31 Lead frame of semiconductor

Country Status (1)

Country Link
KR (1) KR930011116B1 (en)

Also Published As

Publication number Publication date
KR930011116B1 (en) 1993-11-24

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