KR940016705A - Semiconductor device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a resin-sealed package in which a surface mount semiconductor chip can be mounted, wherein the lead frame and the heat slug are integrated by using a rivet or an adhesive.

Therefore, according to the semiconductor package of the present invention, the heat slug itself acts as a die pad and a heat sink at the same time, so that heat generated from the semiconductor chip does not interfere with heat radiation blocking by the resin, and thus heat is directly transferred to the outside of the package through the heat slug. As it is transmitted, the thermal resistance can be reduced by about 50% by itself, and the external heat sink can be attached to the heat sink that protrudes to the outside, thereby maximizing the efficiency of the semiconductor chip.

In addition, since the heat slug is used as a die pad, it is possible to automate the heat slug without the need to load it into the mold by hand during the mold process, so that the manufacturing method of the package is simple, so that the package can be manufactured at low cost and with high reliability and yield. have.

Description

Semiconductor device

Since this is an open matter, no full text was included.

3 shows a cross-sectional view of the SMD package of the present invention, and FIGS. 8 to 10 show another embodiment of a method of combining the heat slug and lead frame of the SMD package of the present invention.

Claims (11)

In order to improve the heat dissipation function of the package, the lead frame without the die pad and the heat slug are integrally attached with an adhesive, and the semiconductor chip is mounted on the heat slug exposed to the cavity of the die pad portion where the semiconductor chip is to be mounted. And a bottom surface of the heat slug is exposed on the bottom surface of the resin-sealed package. The semiconductor device according to claim 1, wherein said adhesive is a polyimide double-sided tape. The semiconductor device of claim 1, wherein a lower surface of the lead frame is insulated. The semiconductor device according to claim 1, wherein said heat slug surface is insulated. The semiconductor device according to claim 3 or 4, wherein anodization or polyimide is applied to the insulation treatment. 2. The semiconductor device according to claim 1, wherein the semiconductor device is prevented from being flooded by providing a multi-stage step from both side surfaces of the heat slug to a lower surface. The semiconductor device according to claim 6, wherein the heat slug is formed by using any one of a metal and a metal alloy. In order to improve the heat dissipation function of the package, an embossing hole is provided on the tie bar of the lead frame without a die pad, and an embossing is provided on the heat slug, and the semiconductor chip is placed on the heat slug exposed to the cavity of the die pad portion where the semiconductor chip is to be mounted. And the bottom surface of the heat slug is exposed on the bottom surface of the package by directly mounting the wire bonding and resin sealing. The semiconductor device according to claim 8, wherein the lower surface of the lead frame is insulated. 9. The semiconductor device according to claim 8, wherein said heat slug surface is insulated. The semiconductor device according to claim 10, wherein the semiconductor device is prevented from flooding by providing a multi-stage step from both side surfaces of the heat slug to a lower surface. ※ Note: The disclosure is based on the initial application.