JPH05332862A - Assembly structure of pressure sensor - Google Patents

Abstract

PURPOSE:To obtain a highly durable assembly structure of a pressure sensor, which can sufficiently secure the vibration resistance required as a pressure sensor for an automobile. CONSTITUTION:A pressure-sensitive diaphragm chip 1 is mounted on a printed board 3, and external guiding terminals 7 are guided out from the side of the printed board 3 in this single-line-package type pressure sensor. In this pressure sensor, a terminal socket 11, which performs the function of the attaching base stage to a printed wiring board 8, is mounted on the side edge part of the printed board 3. The external guiding terminals 7 are guided through the socket 11. Pin-shaped supporting legs 11b, which are linked to the printed wiring board, are provided in parallel with the external guiding terminals 7 at the bottom surface side of the terminal socket 11. A protecting cover 10 is further attached on the printed board 3 so as to surround the pressure-sensitive diaphragm chip 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor assembly structure for a semiconductor piezoresistive pressure sensor used in the field of automobiles.

[0002]

2. Description of the Related Art First, an assembly structure of a conventional single-in-line package (SIP) type pressure sensor is shown in FIG. In the figure, 1 is a pressure-sensitive diaphragm chip formed by integrating a strain gauge resistor and its amplifier circuit on a silicon wafer, 2 is a pedestal (crystal glass) for supporting the pressure-sensitive diaphragm chip 1, and 3 is a peripheral circuit. A ceramic printed board on which the pressure-sensitive diaphragm chip 1 and the pedestal 2 are mounted, 4 is a bonding wire for connecting the chip 1 and the printed board 4, and 5 is a package.
a is a pressure guiding hole perforated in the package 5, 6 is the package 5
Reference numeral 7 denotes a sealing resin that is injected into the package, and 7 is an external lead terminal that is connected to the printed board 3 and is pulled out to the side of the package 5.

To mount the pressure sensor having such a configuration on the printed wiring board 8, the external lead-out terminal 7 of the pressure sensor is inserted into the through hole of the printed wiring board 8 and then soldered.

[0004]

By the way, when such a pressure sensor is mounted on an automobile for the purpose of engine control and the like, the following problems arise. That is, electrical components used in the field of automobiles are required to have sufficient vibration resistance and durability from the viewpoint of quality assurance, and especially lead terminals are required to have mechanical strength that will not be damaged even at an acceleration of 10 G. On the other hand, in the conventional structure shown in FIG. 2, the main body of the pressure sensor is supported on the printed wiring board 8 via the external lead-out terminal 7.
Mechanical stress tends to concentrate on the external lead-out terminal 7 when vibration or acceleration is applied from the vehicle body, and as a result, troubles such as breakage of the external lead-out terminal occur in a short use period. It is difficult to ensure durability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object thereof is to solve the above-mentioned problems and to provide a highly durable pressure that can sufficiently secure vibration resistance required as a pressure sensor for automobiles. An object is to provide an assembly structure of a sensor.

[0006]

In order to achieve such an object, the pressure sensor of the present invention has a terminal socket mounted on the side edge of a printed circuit board, the terminal socket functioning as a mounting base for a printed wiring board. The external lead-out terminal shall be pulled out through the socket. Further, in the above configuration,
A structure in which a pin-shaped support leg that is inserted into the mounting hole drilled in the printed wiring board is provided on the bottom side of the terminal socket side by side with the external lead-out terminal, or a protective cover is mounted on the printed circuit board surrounding the pressure-sensitive diaphragm chip. There are embodiments such as.

[0007]

When the pressure sensor having the above structure is mounted on the printed wiring board, the external lead-out terminal is inserted into the through hole of the printed wiring board while the bottom surface of the terminal socket is placed on the board of the mother printed wiring board. Solder joint.
Therefore, the vibration applied in the state of being mounted in the vehicle is directly propagated to the printed board through the terminal socket as the mounting base, so that the stress concentration on the external lead-out terminals hardly occurs. Also, by inserting and fixing the protruding support legs provided on the bottom side of the terminal socket into the mounting holes of the printed wiring board, the terminal socket and the printed wiring board are integrally connected, so the stress applied to the externally derived terminals Will be further alleviated.

[0008]

Embodiment An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, the same members as those in FIG. 2 are designated by the same reference numerals. In the embodiment of FIG. 1, the pressure-sensitive diaphragm chip 1, the pedestal 2 and the assembly are made of a metal spacer 9.
The protective cover 10 is mounted on the ceramic printed circuit board 3 via the pressure sensitive diaphragm chip 1 and surrounds the pressure-sensitive diaphragm chip 1 and has a pressure guiding hole 11a formed on the printed circuit board 3. Further, a terminal socket 11 serving as a mounting base is mounted on a side edge portion of the printed board 3 on the lead-out side, and an external lead-out terminal 7 is drawn through the socket 11. Here, the terminal socket 11 is a resin molded product made to match the size of the printed board 3,
The printed board 3 is sandwiched and adhered between the protrusions 11a protruding from the four corners on the upper surface side. Further, pin-shaped support legs 11b are provided side by side with the external lead-out terminals 7 at both ends on the lower surface side of the socket.

In order to mount the pressure sensor having such a configuration on the other side of the printed wiring board 8, the external lead-out terminal 7 protruding from the terminal socket 11 is inserted into the through hole of the printed wiring board 8, and at the same time, the supporting legs 11a of the socket. Is fitted into a mounting hole formed in the printed wiring board 8 and the bottom surface of the socket 11 is brought into close contact with the board surface of the wiring board 8 to solder between the external lead-out terminal 7 and the circuit of the printed wiring board 8.

As a result, vibrations applied from the vehicle body side when used in an automobile are propagated directly from the printed wiring board 8 to the printed circuit board 3 via the rigid terminal sockets 11, so that stress concentration on the external lead-out terminals 7 is prevented. Will be alleviated.

[0011]

As described above, according to the assembly structure of the pressure sensor of the present invention, the external lead-out terminal is pulled out by mounting the terminal socket functioning as a mounting base on the printed board. In a use state in which the pressure sensor is mounted on a printed wiring board and mounted on an automobile, vibration applied from the vehicle body side propagates to the printed board through the terminal socket.
Therefore, a large excitation force is not applied to the external lead-out terminal, and the concentration of stress is almost eliminated, which makes it possible to provide a pressure sensor having mechanical strength required for quality assurance and high vibration resistance and durability.

By providing the support legs on the terminal socket, the vibration resistance is further improved, and the protective cover of the pressure-sensitive diaphragm chip is mounted on the printed circuit board, so that the pressure sensor has a conventional package structure. It can be made thinner in comparison.

[Brief description of drawings]

1A and 1B are views showing an assembled structure of a pressure sensor according to an embodiment of the present invention, in which FIG. 1A is a side view and FIG. 1B is a longitudinal sectional view.

FIG. 2 is a sectional view showing an assembly structure of a conventional pressure sensor.

[Explanation of symbols]

 1 Pressure Sensitive Diaphragm Chip 3 Printed Circuit Board 7 External Lead-out Terminal 8 Printed Wiring Board 10 Protective Cover 10a Pressure Guide Hole 11 Terminal Socket 11b Support Leg

Claims (3)

[Claims] 1. A pressure sensor of a single-in-line package type in which a pressure-sensitive diaphragm chip is mounted on a printed board, and external lead-out terminals are drawn out laterally from the printed board, wherein printed wiring is provided on a side edge portion of the printed board. An assembled structure of a pressure sensor, characterized in that a terminal socket that functions as a mounting base for a plate is mounted, and an external lead terminal is pulled out through the socket. 2. The assembly structure according to claim 1, wherein a pin-shaped support leg to be inserted into an attachment hole formed in the printed wiring board is provided on the bottom side of the terminal socket side by side with the external lead-out terminal. Sensor assembly structure. 3. The pressure sensor assembly structure according to claim 1, further comprising a protective cover mounted on the printed circuit board, the pressure sensor diaphragm surrounding the pressure sensitive diaphragm chip.