JPH0735400Y2 - Hybrid integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to improvement of a sealing container for the hybrid integrated circuit.

(B) Conventional technology In a conventional hybrid integrated circuit, as shown in FIG. 3, a circuit element (16) is provided on an insulating substrate (11) made of a metal substrate to form a desired circuit function, and then a case material ( 12) Insulating board (11)
It adhered to and was sealed. The case member (12) is made of resin for the fixing portion of the external lead (13) fixed to one end of the insulating substrate (11) and the sealing portion (17) for sealing the circuit portion formed by the circuit element (16). Resin filling frame (1
8) is formed integrally with each other, and the space between the resin filling frame (18) and the substrate (11) is filled with a resin (19) such as an epoxy resin to protect the fixed portion of the external lead (13) and integrated. Be converted.

A similar hybrid integrated circuit as described above is described in Japanese Utility Model Publication No. 54-16285.

When such a hybrid integrated circuit is mounted on a mounting substrate such as a PCB substrate, the mounting substrate expands and contracts due to heat, etc., and this expansion and contraction causes stress on the external leads, causing the fixing portion to peel off.

In order to solve the above-mentioned problems, as shown in FIG. 4, a hybrid integrated circuit in which a substantially intermediate portion of the external lead (13) led out from the substrate (11) is curved and the curved portion absorbs stress is also provided. is there.

(C) Problems to be solved by the device However, in the hybrid integrated circuit shown in FIG. 4, in order to reduce the stress due to the expansion and contraction of the mounting substrate, the external leads must be separated from the terminal end of the substrate to some extent and curved. However, when mounted on a mounting board, the height of the hybrid integrated circuit is much larger than the size of the case, and there is a problem that it cannot be used as a miniaturized IC.

(D) Means for Solving Problems The present invention has been made in view of the above problems.
As shown in FIG. 1, at least two or more protrusions (4) are provided on the bottom surface of the sealed container (5) on the side to which the external leads (3) are fixed, and the protrusions (4) are attached to a substrate (8). ) To solve the problem.

According to the present invention, the protrusion (4) is provided on the bottom surface of the sealing container (5) to which the external lead (3) is fixed, and the protrusion (4) is attached to the mounting substrate. By inserting into the mounting hole provided in (8), the mounting substrate (8) can be supported by the protruding portion (4) and the sealing container (5), and expansion and contraction of the mounting substrate (8) can be prevented. can do.

(F) Embodiment An embodiment of the present invention will be described in detail below with reference to the drawings.

As shown in FIG. 1, the hybrid integrated circuit of the present invention comprises a hybrid integrated circuit board (1), a circuit element (2) and an external lead (3) provided on the hybrid integrated circuit board (1), and an external lead. It is composed of a sealed container (5) having a protrusion (4) on the bottom surface (hereinafter referred to as a mounting surface) on the side to which (3) is fixed.

Ceramics or metal is used for the hybrid integrated circuit board (1), and here, an aluminum metal board excellent in heat dissipation and mechanical strength is used. An aluminum oxide film is formed on the surface of the aluminum substrate by anodic oxidation so as to have an insulating property. An insulating resin film made of a resin such as epoxy or polyimide is formed on one surface of the aluminum oxide film, and a desired conductive path is formed on the surface. Further, a plurality of circuit elements (2) are fixed on the conductive paths, and a plurality of external leads (3) are provided on a pad provided at one side edge of the substrate (1) of the hybrid integrated circuit board (1). The composite integrated circuit board (1) is fixed so that it is led out in a direction parallel to the main surface from the end.

The sealing container (5) is made of an insulating resin such as epoxy resin, and is filled with a resin that surrounds a fixed portion between the sealing portion (6) for sealing the circuit space where the circuit element (2) is provided and the external lead (3). The frame (7) is integrated.

A feature of the present invention is that a plurality of protrusions (4) are provided on the resin filling frame (7) of the sealed container (5), that is, the bottom surface of the sealed container (5). As shown in FIG. 2, the protrusions (4) are necessarily provided with two protrusions (4) on the bottom surface located near both ends of the hybrid integrated circuit board (1). In addition, the protrusion (4) is formed at the same time as the injection molding of the sealed container (5), or after the sealed container (5) is formed, the part to be the protrusion (4) is incorporated in the container (5). There is. In the latter case, the component that will be the protrusion (4) may be the same as the material of the container (5), or a high heat resistant resin or a metal pin. Further, the shape of the protruding portion (4) is preferably a shape having a return portion (9) so that it is difficult to pull out when attached to the mounting substrate (8). Alternatively, a metallic protrusion may be formed in a straight type and connected to the mounting substrate (8) during solder reflow. The sealing container (5) thus formed and the substrate (1) are fixed and integrated with an adhesive, and then attached to the attachment substrate (8).

A desired conductor pattern and an insertion hole into which the protruding portion (4) of the sealing container (5) is inserted are formed on the mounting substrate (8). Insert the hybrid integrated circuit into the mounting substrate (8) so that the resin filling frame (7) of the sealing container (5), that is, the protrusion (4) provided on the mounting surface is inserted into the insertion hole. By this, the mounting substrate (8) can be held between the projecting portion (4) provided in the sealed container (5) and the resin filling frame (7), and the mounting substrate (8) expands and contracts due to heat or the like to the outside It is possible to prevent stress on the leads. The space formed by the resin filling frame (7) of the sealing container (5) and the substrate (1) does not require resin for reinforcing the fixed portion of the external lead (3), but the external lead (3) ) May be filled with a resin in order to strengthen the fixed portion.

(G) Effect of the Invention As described in detail above, according to the present invention, since the expansion and contraction of the mounting substrate can be prevented, the stress is not applied to the external lead fixing portion and the processing for absorbing the stress is performed. It becomes unnecessary, and the height when mounted on the mounting substrate is lower than in the past, and the size can be reduced.

Further, the step of bending the external leads is unnecessary.

Further, since the thick film IC is firmly fixed in the solder reflow process when connecting the mounting substrate and the thick film IC, the work can be easily performed.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 is a plan view of this embodiment seen from the external lead side, and FIGS. 3 and 4 are sectional views showing a conventional example. (1) is a hybrid integrated circuit board, (2) is a circuit element, and (3)
Is an external lead, (4) is a protrusion, (5) is a sealed container,
(8) is a mounting substrate.

Claims (1)

[Scope of utility model registration request] 1. A hybrid integrated circuit board provided with a plurality of circuit elements, and a plurality of pads provided on one side of the hybrid integrated circuit board, the pads being fixed to the hybrid integrated circuit board main surface. An attachment having a plurality of external leads protruding in parallel directions and a sealing container fixed to the hybrid integrated circuit board for sealing the circuit element, and having an insertion hole into which the external leads are inserted In a hybrid integrated circuit mounted on a substrate, in a bottom surface of the sealing container facing the mounting substrate, a region corresponding to both ends of a lead group including the plurality of leads and a region corresponding to an upper portion of the lead group. A hybrid integrated circuit, wherein a protrusion is provided, and the attachment substrate is sandwiched between the protrusion and the sealing container.