JP2531852Y2 - Terminal structure for hybrid IC - Google Patents
Terminal structure for hybrid ICInfo
- Publication number
- JP2531852Y2 JP2531852Y2 JP3372491U JP3372491U JP2531852Y2 JP 2531852 Y2 JP2531852 Y2 JP 2531852Y2 JP 3372491 U JP3372491 U JP 3372491U JP 3372491 U JP3372491 U JP 3372491U JP 2531852 Y2 JP2531852 Y2 JP 2531852Y2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- type lead
- lead terminal
- substrate
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案はマザーボードに接続する
ハイブリッドＩＣ基板のクリップ型リード端子の構造に
関する。本考案では、特に片側をはんだ付けでハイブリ
ッドＩＣ基板に固定するクリップ型リード端子構造の固
定強度を向上することを目的とする。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clip type lead terminal of a hybrid IC board connected to a motherboard. An object of the present invention is to improve the fixing strength of a clip-type lead terminal structure in which one side is fixed to a hybrid IC board by soldering.
【０００２】[0002]
【従来の技術】図３は従来のハイブリッドＩＣ用端子構
造を示す図である。なお全図を通じて同様の構成要素に
ついては同一参照番号又は記号をもって表す。本図の構
成には、マザーボードに接続されるハイブリッドＩＣ基
板１と、ハイブリッドＩＣ基板１と外部との電気信号の
入出力を行うためにハイブリッドＩＣ基板１を挟んで固
定されるクリップ型リード端子２と、前記ハイブリッド
ＩＣ基板１とクリップ型リード端子２とを固定するはん
だ付け部３とが含まれる。2. Description of the Related Art FIG. 3 is a view showing a conventional hybrid IC terminal structure. Note that the same components are denoted by the same reference numerals or symbols throughout the drawings. The configuration shown in FIG. 1 includes a hybrid IC board 1 connected to a motherboard, and a clip-type lead terminal 2 fixed across the hybrid IC board 1 to input and output electric signals between the hybrid IC board 1 and the outside. And a soldering portion 3 for fixing the hybrid IC substrate 1 and the clip type lead terminal 2.
【０００３】次にクリップ型リード端子２の構造につい
て説明する。クリップ型リード端子２は導電性部材から
なり、その両端にマザーボード装着端２−１と、ハイブ
リッドＩＣ基板装着端２−２を具備し、ハイブリッドＩ
Ｃ基板装着端２−２は二又構造であり、弾性を有し、そ
のバネ力でハイブリッドＩＣ基板１を挟持し、固定さ
れ、さらにハイブリッドＩＣ基板１との電気的接続、機
械的結合を確実にするために前記二又の一方と、ハイブ
リッドＩＣ基板１とをはんだ付け部３ではんだ付けす
る。Next, the structure of the clip type lead terminal 2 will be described. The clip type lead terminal 2 is made of a conductive material, and has a motherboard mounting end 2-1 and a hybrid IC substrate mounting end 2-2 at both ends thereof.
The C board mounting end 2-2 has a bifurcated structure, has elasticity, and holds and fixes the hybrid IC board 1 by its spring force, and further ensures electrical connection and mechanical coupling with the hybrid IC board 1. Then, one of the two forks and the hybrid IC substrate 1 are soldered at the soldering portion 3.
【０００４】[0004]
【考案が解決しようとする課題】しかしながら従来のハ
イブリッドＩＣ用端子構造において、図３に示すよう
に、ハイブリッドＩＣ基板１を挟む上下方向に力が加え
られると、はんだ付け部３に反力が生じこのためはんだ
付けが簡単にはがれて電気的接続不良が生じるという問
題があった。このため製造過程において慎重なハンドリ
ングが必要とされていた。However, in the conventional hybrid IC terminal structure, as shown in FIG. 3, when a force is applied in the vertical direction sandwiching the hybrid IC substrate 1, a reaction force is generated in the soldered portion 3. For this reason, there has been a problem that the soldering is easily removed and an electrical connection failure occurs. For this reason, careful handling was required in the manufacturing process.
【０００５】したがって本考案は上記問題点に鑑みて機
械的構造を強化して製造上のハンドリング性を向上する
ハイブリッドＩＣ用端子構造を提供することを目的とす
る。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a hybrid IC terminal structure in which the mechanical structure is strengthened in view of the above problems and the handling characteristics in manufacturing are improved.
【０００６】[0006]
【課題を解決するための手段】本考案は前記問題点を解
決するために、ハイブリッドＩＣ基板にクリップ型リー
ド端子をはんだ付け固定するハイブリッドＩＣ用端子構
造に、部材と、樹脂封止部を設ける。部材は前記ハイブ
リッドＩＣ基板の端部から張出し、前記クリップ型リー
ド端子の固定部と向き合う位置に穴をあけ、前記ハイブ
リッドＩＣ基板に固定される。According to the present invention, in order to solve the above-mentioned problems, a member and a resin sealing portion are provided in a hybrid IC terminal structure for fixing a clip type lead terminal to a hybrid IC substrate by soldering. . The member protrudes from an end of the hybrid IC substrate, and a hole is made at a position facing the fixing portion of the clip type lead terminal, and the member is fixed to the hybrid IC substrate.
【０００７】樹脂封止部は前記部材の張出し部と前記ク
リップ型リード端子との間に形成される。[0007] The resin sealing portion is formed between the projecting portion of the member and the clip type lead terminal.
【０００８】[0008]
【作用】本考案のハイブリッドＩＣ用端子構造によれば
部材の穴から注入された樹脂によって形成された樹脂封
止部によって、部材の張出部とクリップ型リード端子と
の接着により機械的結合が向上し、はんだ付部には外部
からの反力が生じなくなるためハンドリング時の電気的
不良発生を防止できる。According to the hybrid IC terminal structure of the present invention, the resin sealing portion formed of the resin injected from the hole of the member allows the overhanging portion of the member and the clip type lead terminal to be mechanically bonded to each other. As a result, no external reaction force is generated in the soldered portion, so that occurrence of electrical failure during handling can be prevented.
【０００９】[0009]
【実施例】以下、本考案の実施例について図面を参照し
て説明する。図１は本考案の実施例に係るハイブリッド
ＩＣ用端子構造を示す部分断面図である。本図の構成を
説明する。本図のハイブリッドＩＣ用端子は、クリップ
型リード端子２をはんだ付部３ではんだ付け固定したハ
イブリッドＩＣ基板１に固定され、ハイブリッド基板１
の端部からの張出部４−１を具備する平面な部材４を含
む。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial sectional view showing a hybrid IC terminal structure according to an embodiment of the present invention. The configuration of this drawing will be described. The hybrid IC terminal of this figure is fixed to a hybrid IC board 1 in which a clip type lead terminal 2 is soldered and fixed at a soldering portion 3, and the hybrid board 1
And a flat member 4 provided with an overhang 4-1 from the end of the first member.
【００１０】該部材４は大パワー消費用ハイブリッドＩ
Ｃ基板に貼り付けられる放熱板または保護用、耐湿用等
のケースを利用したものでもよく、クリップ型リード端
子の固定部と対向する位置に穴４−２を具備する。さら
にハイブリッドＩＣ用端子は張出部４−１との間に樹脂
封止５を含む。図２はクリップ型リード端子と部材との
関係を示す部分斜視図である。本図に示すように多数の
クリップ型リード端子２がハイブリッドＩＣ基板１に固
定される。穴４−２は本図に示すように横穴形状でもよ
い。The member 4 is a hybrid I for large power consumption.
A heat radiating plate attached to the C substrate or a case using a case for protection, moisture resistance, or the like may be used, and a hole 4-2 is provided at a position facing the fixing portion of the clip type lead terminal. Further, the hybrid IC terminal includes a resin seal 5 between the terminal and the overhang portion 4-1. FIG. 2 is a partial perspective view showing the relationship between the clip type lead terminals and members. As shown in the figure, a large number of clip-type lead terminals 2 are fixed to the hybrid IC substrate 1. The hole 4-2 may have a horizontal hole shape as shown in FIG.
【００１１】次に本実施例の構造を説明する。図２の穴
４−２から適度の粘度の量の樹脂が上方より注入される
と、クリップ型リード端子２の立上り部２−３をつたわ
って重力で下降し、下降後表面張力の作用により、張出
部４−１とクリップ型リード端子２との間に図１に樹脂
封入部５が形成される。このように形成された樹脂封入
部５によってクリップ型リード端子２が張出部４−２に
接着されてハイブリッド基板１との機械的結合が強化さ
れる。したがってクリップ型リード端子２に図３で示す
方向の力が加えられても、支点となる樹脂封入部５に反
力がかかるが、本構造によれば従来のようにはんだ付部
３に反力が生じるのを妨げることが可能になり、製造過
程のハンドリングに起因する電気的接続不良発生を防止
でき、しかも放熱板やケースにちょっとした加工を施し
て容易に実現できる。Next, the structure of this embodiment will be described. When a resin having an appropriate viscosity is injected from above from the hole 4-2 in FIG. 2, the resin descends by gravity along the rising portion 2-3 of the clip type lead terminal 2, and after descending, by the action of surface tension, A resin encapsulation portion 5 is formed between the overhang portion 4-1 and the clip type lead terminal 2 in FIG. The clip-type lead terminal 2 is adhered to the overhang portion 4-2 by the resin enclosing portion 5 thus formed, and the mechanical connection with the hybrid substrate 1 is strengthened. Therefore, even if a force in the direction shown in FIG. 3 is applied to the clip type lead terminal 2, a reaction force is applied to the resin enclosing portion 5 serving as a fulcrum. Can be prevented, and the occurrence of electrical connection failure due to handling during the manufacturing process can be prevented. Further, the heat sink and the case can be easily realized by performing a slight processing.
【００１２】さらに付加的効力として図１に示すように
ハイブリッドＩＣ基板１と固定するクリップ型リード端
子２の片側部分が樹脂で被覆されることにより、この部
分の耐湿性が向上する。As an additional effect, as shown in FIG. 1, one side portion of the clip type lead terminal 2 fixed to the hybrid IC substrate 1 is covered with a resin, thereby improving the moisture resistance of this portion.
【００１３】[0013]
【考案の効果】以上説明したように本考案によれば、ハ
イブリッドＩＣ基板からの張出部材とクリップ型リード
端子との間に樹脂封止部を設けたので、外力に対してこ
の樹脂封止部が支点となり反力を生じさせて、はんだ付
け部に反力が生じるのを妨げることによって電気的接続
不良が発生するのを防止できる。As described above, according to the present invention, the resin sealing portion is provided between the projecting member from the hybrid IC substrate and the clip-type lead terminal. The portion serves as a fulcrum to generate a reaction force, thereby preventing the occurrence of a reaction force in the soldered portion, thereby preventing the occurrence of electrical connection failure.
【図１】本考案の実施例に係るハイブリッドＩＣ用端子
構造を示す部分断面図である。FIG. 1 is a partial cross-sectional view illustrating a hybrid IC terminal structure according to an embodiment of the present invention.
【図２】クリップ型リード端子と部材との関係を示す部
分斜視図である。FIG. 2 is a partial perspective view showing a relationship between a clip-type lead terminal and a member.
【図３】従来のハイブリッドＩＣ用端子構造を示す図で
ある。FIG. 3 is a diagram showing a conventional hybrid IC terminal structure.
１…ハイブリッドＩＣ基板 ２…クリップ型リード端子 ３…はんだ付部 ４…放熱板又はケース部材 ５…樹脂封入部 DESCRIPTION OF SYMBOLS 1 ... Hybrid IC board 2 ... Clip type lead terminal 3 ... Soldering part 4 ... Heat sink or case member 5 ... Resin enclosing part
Claims (1)
ド端子をはんだ付け固定するハイブリッドＩＣ用端子構
造において、前記ハイブリッドＩＣ基板の端部から張出
し、前記クリップ型リード端子の固定部と向き合う位置
に穴をあけ、前記ハイブリッドＩＣ基板に固定される部
材と、前記部材の張出し部と前記クリップ型リード端子
との間に形成される樹脂封止部とを備える特徴とするハ
イブリッドＩＣ用端子構造。In a hybrid IC terminal structure for fixing a clip type lead terminal to a hybrid IC substrate by soldering, a hole is formed at a position protruding from an end of the hybrid IC substrate and facing a fixing portion of the clip type lead terminal. A terminal structure for a hybrid IC, comprising: a member fixed to the hybrid IC substrate; and a resin sealing portion formed between the projecting portion of the member and the clip-type lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3372491U JP2531852Y2 (en) | 1991-05-14 | 1991-05-14 | Terminal structure for hybrid IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3372491U JP2531852Y2 (en) | 1991-05-14 | 1991-05-14 | Terminal structure for hybrid IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04127971U JPH04127971U (en) | 1992-11-20 |
| JP2531852Y2 true JP2531852Y2 (en) | 1997-04-09 |
Family
ID=31916302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3372491U Expired - Lifetime JP2531852Y2 (en) | 1991-05-14 | 1991-05-14 | Terminal structure for hybrid IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531852Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101014915B1 (en) * | 2009-02-23 | 2011-02-15 | 주식회사 케이이씨 | Semiconductor package and manufacturing method thereof |
-
1991
- 1991-05-14 JP JP3372491U patent/JP2531852Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04127971U (en) | 1992-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19961029 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |