JPH0732229B2 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH0732229B2
JPH0732229B2 JP63309239A JP30923988A JPH0732229B2 JP H0732229 B2 JPH0732229 B2 JP H0732229B2 JP 63309239 A JP63309239 A JP 63309239A JP 30923988 A JP30923988 A JP 30923988A JP H0732229 B2 JPH0732229 B2 JP H0732229B2
Authority
JP
Japan
Prior art keywords
resin case
electrode terminal
semiconductor device
metal base
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63309239A
Other languages
Japanese (ja)
Other versions
JPH02154457A (en
Inventor
義夫 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63309239A priority Critical patent/JPH0732229B2/en
Publication of JPH02154457A publication Critical patent/JPH02154457A/en
Publication of JPH0732229B2 publication Critical patent/JPH0732229B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は例えば数10A〜数100Aのインバーター等に使
用されるパワーモジュールなどの半導体装置の構造に関
するものである。The present invention relates to the structure of a semiconductor device such as a power module used in, for example, an inverter of several 10 A to several 100 A.

〔従来の技術〕[Conventional technology]

第７図は従来のパワーモジュール等の半導体装置の内部
を示す斜視図であり、第８図は第７図に示すものに蓋を
取り付け、主電流用電極端子（８），（９），（10）を
折り曲げた後、ネジ閉めした状態を示した斜視図であ
る。FIG. 7 is a perspective view showing the inside of a semiconductor device such as a conventional power module, and FIG. 8 is a main current electrode terminal (8), (9), ( FIG. 10 is a perspective view showing a state where the screw is closed after bending 10).

図において（１）は半導体チップであり、（２）はモリ
ブデン板である。半導体チップ（１）はあらかじめモリ
ブデン板（２）に水素炉等により炉付されたものであ
る。（３）は信号用電極端子にあらかじめ半田付けされ
たスピードアップダイオードチップ、（４）は銅ブロッ
ク、（５）はあらかじめ銅ブロック（４）の上に炉付さ
れたフライホイルダイオードチップである。（６）は金
属ベース板、（７）は絶縁基板、（８），（９），（1
0）は主電流用電極端子、（11），（12）は信号用電極
端子である。（13）はガラスクロス入りエポキシ板、
（14）はアルミワイヤー、（15）は樹脂ケース、（16）
はシリコンゲル、（17）は樹脂封止用エポキシ樹脂、
（18）は蓋、（20）は銘板、（21）は外部信号端子、
（22）は被覆されたリード線、（23）は電極端子ネジ閉
め用ネジ、（24）は金属ベース板（６）と樹脂ケース
（15）を接着する接着剤である。In the figure, (1) is a semiconductor chip, and (2) is a molybdenum plate. The semiconductor chip (1) is a molybdenum plate (2) which has been furnace-attached in advance by a hydrogen furnace or the like. (3) is a speed-up diode chip pre-soldered to the signal electrode terminal, (4) is a copper block, and (5) is a flywheel diode chip that has been preheated on the copper block (4). (6) is a metal base plate, (7) is an insulating substrate, (8), (9), (1
0) is a main current electrode terminal, and (11) and (12) are signal electrode terminals. (13) is an epoxy board with glass cloth,
(14) is aluminum wire, (15) is resin case, (16)
Is silicone gel, (17) is epoxy resin for resin encapsulation,
(18) is a lid, (20) is a nameplate, (21) is an external signal terminal,
(22) is a covered lead wire, (23) is a screw for screwing the electrode terminal screw, and (24) is an adhesive agent for adhering the metal base plate (6) and the resin case (15).

金属ベース板（６）上に絶縁基板（７）を搭載し、その
上に主電流用電極端子（８），（９），（10）を搭載
し、更に、その上にあらかじめ炉付等で半田付けした半
導体チップ（１）その他信号用電極端子（11），（12）
を搭載し、同時に半田付けを行う。その後アルミワイヤ
ー（14）により半導体チップ（１）と電極端子間
（８），（９），（10），（11）にワイヤボンデイング
を行い、ケース（15）を金属ベース板（６）に接着した
後接着剤（24）のキュアを行う。更に内部の電極端子
（11），（12）と外部信号用端子（21）間はリード線
（22）による半田付けを行い、シリコンゲル（16）で全
体をおおい、キュア後にエポキシ樹脂封止（17）を行う
と同時に蓋（18）をかぶせてキュアを行う。その後、主
電流用電極端子（８），（９），（10）を曲げて銘板
（20）を貼付けて完成させる。The insulating substrate (7) is mounted on the metal base plate (6), the main current electrode terminals (8), (9), (10) are mounted on it, and further, it is equipped with a furnace in advance. Soldered semiconductor chip (1) and other signal electrode terminals (11), (12)
And solder at the same time. After that, wire bonding is performed between the semiconductor chip (1) and the electrode terminals (8), (9), (10), (11) with the aluminum wire (14), and the case (15) is bonded to the metal base plate (6). After that, the adhesive (24) is cured. Furthermore, the lead wires (22) are used for soldering between the internal electrode terminals (11) and (12) and the external signal terminals (21), and the whole is covered with a silicon gel (16). After curing, epoxy resin sealing ( At the same time as 17), cover with the lid (18) to cure. After that, the main current electrode terminals (8), (9) and (10) are bent and a name plate (20) is attached to complete.

従来の半導体装置は以上のように構成されているので工
程が複雑であり部品点数も多く、蓋（18）を取付ける時
に主電流用電極端子（８），（９），（10）および外部
信号用端子（21）を蓋（18）の穴部に入れにくかった
り、主電流用電極端子（８），（９），（10）にリード
線（22）が接触するという作業能率上さまざまの問題点
があった。Since the conventional semiconductor device is configured as described above, the process is complicated and the number of parts is large. When the lid (18) is attached, the main current electrode terminals (8), (9), (10) and external signals are attached. It is difficult to put the terminal (21) into the hole of the lid (18) and the lead wire (22) contacts the main current electrode terminals (8), (9) and (10), which are various problems in terms of work efficiency. There was a point.

そこで部品点数を減らし作業能率を上げるべく、金属ベ
ース板上に絶縁層または絶縁基板を設け、その上に複数
の電極板および半導体チップを搭載し、これとは別体に
上記電極板に接続される主電流用電極端子及び信号用電
極端子を樹脂ケースにあらかじめインサート又はアウト
サートしておき、この樹脂ケースを前記金属ベース板に
かぶせて接着する際にクリーム半田により樹脂ケース側
の複数の電極端子を金属ベース板側の複数の電極板に半
田付けした半導体装置が提案された（詳しくは特開昭61
−140158号参照）。これによれば、樹脂ケースに主電流
用端子および信号用電極端子をインサート又はアウトサ
ートすることにより蓋取付けを必要としないネジ閉めタ
イプの半導体装置を作ることができる。Therefore, in order to reduce the number of parts and increase work efficiency, an insulating layer or insulating substrate is provided on the metal base plate, and a plurality of electrode plates and semiconductor chips are mounted on it, and separately connected to the electrode plate. The main current electrode terminals and the signal electrode terminals are pre-inserted or outserted in a resin case, and a plurality of electrode terminals on the resin case side are applied by cream solder when the resin case is covered and adhered to the metal base plate. A semiconductor device has been proposed in which a solder is soldered to a plurality of electrode plates on the side of a metal base plate (see JP-A-61-61
-140158). According to this, by inserting or outserting the main current terminal and the signal electrode terminal into the resin case, it is possible to manufacture a screw-closed type semiconductor device that does not require lid attachment.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

この半導体装置は前述の如く部品点数を減らし作業能率
を上げるべく改善されているが主電流用電極端子のネジ
閉め部が中央に一列に並べられている（第８図と同じ）
ので、かかる半導体装置を放熱フィンに実装する時、左
右逆転しても同じに見えるので誤った装着に気づきにく
い。従ってこれらネジ閉め部に誤って電気接続する恐れ
がある。As described above, this semiconductor device has been improved to reduce the number of parts and increase work efficiency, but the screw closing portions of the main current electrode terminals are arranged in a line in the center (same as FIG. 8).
Therefore, when such a semiconductor device is mounted on the heat dissipation fin, it looks the same even if it is reversed right and left, and it is difficult to notice an incorrect mounting. Therefore, there is a risk that the screws will be erroneously electrically connected.

この発明は上記の問題点を解消するためになされたもの
で、放熱フィンに左右逆転して配置すれば明白にそのこ
とが判るようにして電気的誤接続の危険性を無くすこと
を目的とする。The present invention has been made to solve the above problems, and an object thereof is to eliminate the risk of electrical erroneous connection by making it possible to clearly understand that by arranging the heat dissipating fins in the right-left direction. .

〔課題を解決するための手段〕[Means for Solving the Problems]

この発明に係る半導体装置は、金属ベース板上に絶縁層
または絶縁基板を設け、その上に複数の電極板および半
導体チップを搭載し、上記電極板に接続される主電流用
電極端子および信号用電極端子を備え、樹脂ケースを上
記金属ベース板に接着して樹脂封止を行う半導体装置に
おいて、前記樹脂ケースにはあらかじめ主電流用電極端
子および信号用電極端子をインサート成形しておき、そ
の際、電極端子の半田付け部を樹脂ケースの内側中央の
ほぼ一直線上に配置し、主電極端子のネジ閉め部を樹脂
ケースの外側に一側辺に沿って配置し、かつ電極端子の
半田付け部が見えるようにケースに開口部を設けたこと
を特徴とする。A semiconductor device according to the present invention is provided with an insulating layer or an insulating substrate on a metal base plate, a plurality of electrode plates and semiconductor chips mounted thereon, and electrode terminals for main current and signals connected to the electrode plates. In a semiconductor device including an electrode terminal and a resin case bonded to the metal base plate for resin sealing, a main current electrode terminal and a signal electrode terminal are insert-molded in advance in the resin case. , The electrode terminal soldering part is arranged on the straight line in the center of the inside of the resin case, the main electrode terminal screw closing part is arranged outside the resin case along one side, and the electrode terminal soldering part It is characterized in that the case is provided with an opening so that the user can see.

〔作用〕[Action]

電極端子の半田付け部を中央のほぼ一直線上に配置し、
主電極端子のネジ閉め部を樹脂ケースの一側辺に沿って
並べたので、半導体装置を製造する為の作業能率が上昇
すると共に得られた半導体装置を実装する時に左右逆あ
るいは上下逆の取り付けの誤挿入を簡単に無くすことが
出来る。Place the soldered parts of the electrode terminals on a straight line in the center,
Since the screw closing parts of the main electrode terminals are arranged along one side of the resin case, the work efficiency for manufacturing the semiconductor device is increased and the obtained semiconductor device is mounted upside down or upside down. Erroneous insertion of can be easily eliminated.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図は本発明の一実施例による半導体装置に使用する
金属ベース板（６）上に厚銅箔付絶縁基板（7A）を搭載
しその上に半導体チップ（１）及びフライホイルダイオ
ードチップ（５）、スピードアップダイオードチップ
（３）を同時に半田付けした後アルミワイヤー（14）に
よりボンデイングしたものを示している。なお（Ｒ）は
半田付け面であり、後述する電極端子の半田付け面
（Ｓ）と対接するようになされている。FIG. 1 shows that an insulating substrate with thick copper foil (7A) is mounted on a metal base plate (6) used in a semiconductor device according to an embodiment of the present invention, and a semiconductor chip (1) and a flywheel diode chip ( 5), the speed-up diode chip (3) is soldered at the same time and then bonded by the aluminum wire (14). In addition, (R) is a soldering surface, and is designed to come into contact with a soldering surface (S) of an electrode terminal described later.

第２図は本発明の樹脂ケースの正面図であり、第３図は
第２図の樹脂ケースを裏面から見た図である。第４図は
第２図のＡ−Ａ′線の断面図であり、第５図はＢ−Ｂ′
線の断面図である。第６図は樹脂ケースの側面図であ
る。図において（８），（９），（10）は主電流用電極
端子、（６）は金属ベース板、（21）は外部信号用端
子、（19）は電極端子ネジ閉め用ナット、（15）は樹脂
ケースである。このように樹脂ケース（15）は主電流用
電極端子（８），（９），（10）や外部信号用端子（2
1）を一体的にインサート成形している。電極端子の半
田付け面Ｓは中央のほぼ一直線上に配置され、主電極端
子のネジ閉めナット19は一側辺に沿って配置されてい
る。2 is a front view of the resin case of the present invention, and FIG. 3 is a view of the resin case of FIG. 2 seen from the back side. FIG. 4 is a sectional view taken along the line AA ′ in FIG. 2, and FIG. 5 is a sectional view taken along the line BB ′.
It is sectional drawing of a line. FIG. 6 is a side view of the resin case. In the figure, (8), (9) and (10) are main current electrode terminals, (6) is a metal base plate, (21) is an external signal terminal, (19) is an electrode terminal screw closing nut, and (15). ) Is a resin case. In this way, the resin case (15) is connected to the main current electrode terminals (8), (9), (10) and the external signal terminals (2).
1) is integrally insert-molded. The soldering surface S of the electrode terminal is arranged on a substantially straight line at the center, and the screw closing nut 19 of the main electrode terminal is arranged along one side.

第１図まで工程を進めた後、第３図の電極端子の半田付
け面（Ｓ）にペースト状のクリーム半田を塗布し、ケー
ス（15）の裏面の金属ベース板（６）と接触する部分に
接着剤を塗布し第１図のものと組合せ電極端子の半田付
け面（Ｓ）と相手方の半田付け面（Ｒ）との半田接着と
樹脂ケース金属ベース間の接着を行う。そして、蓋に相
当するケース（15）の部分に設けられている開口（第４
図、および第５図の断面図から理解される）部を通して
接触状態を検査する。その後ゲル注入を行いキュア後樹
脂注入キュアを行う。主電流電極端子は説明をわかりや
すくする為に立てたものを図示しているが前もって曲げ
たものを使用する。After the process is advanced to FIG. 1, paste solder paste is applied to the soldering surface (S) of the electrode terminal shown in FIG. 3, and the portion of the back surface of the case (15) that contacts the metal base plate (6). An adhesive is applied to the soldering surface (S) of the combination electrode terminal of FIG. 1 and the soldering surface (R) of the other side, and the resin case metal base is bonded. Then, the opening (fourth portion) provided in the portion of the case (15) corresponding to the lid.
The contact state is inspected through the portion shown in FIG. 5 and the sectional view of FIG. After that, gel injection is performed and resin injection cure is performed after curing. The main current electrode terminals are shown upright for easy understanding, but the ones bent in advance are used.

〔発明の効果〕〔The invention's effect〕

以上のようにこの発明によれば蓋を用いることなくネジ
閉めタイプのパワーモジュールが得られ組立工程も簡略
化されることは勿論のこと、電極端子の半田付け面が中
央の一列の配置されているので、半田付け面へのクリー
ム半田の塗布作業が一列に沿って行えばよく、簡単にな
り、かつその点検も一列に沿って迅速に行え、作業能率
が一層向上すると共に、半田付け状態を、蓋に相当する
ケース部分の開口部を通して見ることが出来る。更に得
られたパワーモジュールは主電極端子のネジ閉め用ナッ
トが樹脂ケースの一側辺に沿って位置するために、これ
を放熱フィン等に実装する時に左右逆あるいは上下逆の
誤った配置にすると、ネジ閉め用ナットの列が逆の側に
来るので明白に誤りに気付き、従って、その後の電気接
続操作においても誤った接続に容易に気付き、電気的誤
接続を無くすことが出来るのである。As described above, according to the present invention, a screw-closed type power module can be obtained without using a lid and the assembling process can be simplified, and the soldering surfaces of the electrode terminals are arranged in a central row. Since it is necessary to apply the cream solder to the soldering surface along one line, it becomes easy and the inspection can be performed quickly along one line, further improving the work efficiency and improving the soldering condition. , It can be seen through the opening of the case that corresponds to the lid. Furthermore, in the obtained power module, the screw closing nut of the main electrode terminal is located along one side of the resin case, so when mounting this on the heat dissipation fin etc. , The rows of screw-closing nuts are on the opposite side, so that mistakes are clearly noticed, so that even in subsequent electrical connection operations, incorrect connections can easily be noticed and electrical misconnections can be eliminated.

【図面の簡単な説明】[Brief description of drawings]

第１図はこの発明の一実施例による金属ベース板上に絶
縁基板を載せその上にチップを搭載した後ワイヤボンデ
イングした平面図であり、第２図は主電流端子と信号用
電極端子をインサート又はアウトサートしたケースの正
面図であり、第３図は裏面より見たケースの内側図であ
る。第４図は第２図のケースのＡ−Ａ′線に於ける断面
図であり、第５図はＢ−Ｂ′線に於ける断面図であり、
第６図は側面図である。第７図は従来のモジュールの内
部構造を示す斜視図であり、第８図は従来の最終外形を
示す斜視図である。 図において（１）は半導体チップ、（２）はモリブデン
板、（３）はスピードアップダイオードチップ、（４）
は銅ブロック、（５）はフライホイルダイオードチッ
プ、（６）は金属ベース板、（７），（7A）は絶縁基
板、（８），（９），（10）は主電流用電極端子、（1
1），（12）は信号端子、（13）はガラスクロス入りエ
ポキシ板、（14）はアルミワイヤー、（15）は樹脂ケー
ス、（16）はシリコンゲル、（17）はエポキシ樹脂、
（18）は蓋、（19）はナット、（20）は銘板、（21）は
外部信号用端子、（22）はリード線、（23）はネジ、
（24）は接着剤である。 なお、図中同一符号は同一又は相当部分を示す。FIG. 1 is a plan view in which an insulating substrate is mounted on a metal base plate according to an embodiment of the present invention, a chip is mounted on the insulating substrate, and then wire bonding is performed, and FIG. 2 is a main current terminal and a signal electrode terminal are inserted. Alternatively, FIG. 3 is a front view of the outsert case, and FIG. 3 is an inside view of the case seen from the back surface. 4 is a sectional view taken along the line AA ′ of the case shown in FIG. 2, and FIG. 5 is a sectional view taken along the line BB ′.
FIG. 6 is a side view. FIG. 7 is a perspective view showing the internal structure of a conventional module, and FIG. 8 is a perspective view showing the conventional final external shape. In the figure, (1) is a semiconductor chip, (2) is a molybdenum plate, (3) is a speed-up diode chip, and (4).
Is a copper block, (5) is a flywheel diode chip, (6) is a metal base plate, (7) and (7A) are insulating substrates, (8), (9) and (10) are main current electrode terminals, (1
1) and (12) are signal terminals, (13) is an epoxy board with glass cloth, (14) is aluminum wire, (15) is a resin case, (16) is silicone gel, (17) is epoxy resin,
(18) is a lid, (19) is a nut, (20) is a nameplate, (21) is an external signal terminal, (22) is a lead wire, (23) is a screw,
(24) is an adhesive. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】金属ベース板上に絶縁層または絶縁基板を
設け、その上に複数の電極板および半導体チップを搭載
し、上記電極板に接続される主電流用電極端子および信
号用電極端子を備え、樹脂ケースを上記金属ベース板に
接着して樹脂封止を行う半導体装置において、前記樹脂
ケースにはあらかじめ主電流用電極端子および信号用電
極端子をインサート成形しておき、その際、電極端子の
半田付け部を樹脂ケースの内側中央のほぼ一直線上に配
置し、主電極端子のネジ閉め部を樹脂ケースの外側の一
側辺に沿って配置し、かつ電極端子の半田付け部が見え
るようにケースに開口部を設けたことを特徴とする半導
体装置。1. An insulating layer or an insulating substrate is provided on a metal base plate, a plurality of electrode plates and semiconductor chips are mounted thereon, and main current electrode terminals and signal electrode terminals connected to the electrode plates are provided. In a semiconductor device having a resin case adhered to the metal base plate for resin encapsulation, a main current electrode terminal and a signal electrode terminal are insert-molded in advance in the resin case. Place the soldering part on the inner center of the resin case almost in a straight line, and the screwing part of the main electrode terminal along one side of the outside of the resin case, and make the soldering part of the electrode terminal visible. A semiconductor device, wherein an opening is provided in the case.
JP63309239A 1988-12-06 1988-12-06 Semiconductor device Expired - Lifetime JPH0732229B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63309239A JPH0732229B2 (en) 1988-12-06 1988-12-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63309239A JPH0732229B2 (en) 1988-12-06 1988-12-06 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH02154457A JPH02154457A (en) 1990-06-13
JPH0732229B2 true JPH0732229B2 (en) 1995-04-10

Family

ID=17990604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63309239A Expired - Lifetime JPH0732229B2 (en) 1988-12-06 1988-12-06 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0732229B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2896454B2 (en) * 1992-11-25 1999-05-31 株式会社日立製作所 Inverter device
DE10200372A1 (en) * 2002-01-08 2003-07-24 Siemens Ag Power semiconductor module has one contact surface of semiconductor element contacting metallized structure via solder material and second contact surface contacting metallized structure via bonding wire
US9622368B2 (en) 2012-08-24 2017-04-11 Mitsubishi Electric Corporation Semiconductor device

Also Published As

Publication number Publication date
JPH02154457A (en) 1990-06-13

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