JP2552514Y2 - Hybrid integrated circuit - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit, and more particularly, to a structure for fixing external lead terminals of a hybrid integrated circuit having a large number of external lead terminals accompanying high integration or miniaturization.

[0002]

2. Description of the Related Art Generally, as shown in FIG. 3, in a hybrid integrated circuit, a plurality of circuit elements (13) are fixed to a conductive path (12) formed on a substrate (11) to form a circuit having a desired function. And a conductive path (12) extending around the peripheral end of the substrate (11).
The external lead terminals (14) are fixedly connected to each other with a brazing material such as solder or the like, and are used as electronic components in various devices.

On the other hand, recently, there is a hybrid integrated circuit in which a plurality of external lead terminals for connecting to an external circuit by mounting a plurality of memory ICs or the like are led out from at least two sides or four sides of a substrate. In the case of a hybrid integrated circuit using a metal substrate (coated with an insulating resin) on the substrate (11), the shape of the external lead terminals is set so as to prevent a short circuit with the edge of the substrate (11). ) Is bent in an L-shape so that the connection surface to be connected to the external circuit is substantially parallel to the connection surface to be connected to the external circuit.

The space between the substrate (11) and the case material (15) is filled with a resin such as an epoxy resin (16) in order to improve the fixing strength of the joint of the external lead terminals (14). .

[0005]

In the hybrid integrated circuit as shown in FIG. 3, there is no need to strengthen the joint of the external lead terminals with the sealing resin layer as described above. This is because the bonding area of the external lead terminals can be sufficiently secured and the fixing strength does not decrease. However, in a highly integrated hybrid integrated circuit on which a plurality of memory ICs and the like are mounted, a sufficient pitch between external lead terminals, that is, a lead terminal fixing pad pitch is remarkably reduced due to miniaturization, and sufficient strength cannot be obtained. There was a problem of peeling during operation or the like. In particular, when the pad pitch is 1.78 mm or less, peeling may occur only by application of a slight external force.

[0006] In order to prevent the peeling of the joint portion of the lead terminal, as described in the conventional example, the space between the case material and the substrate is filled with a resin so that the fixed portion of the lead terminal is strengthened to prevent the peeling. ing. However, in a highly integrated hybrid integrated circuit in which the external lead terminals are derived from two or four sides of the substrate, it is necessary to fill and cure the resin for each side from which the external lead terminals are derived, respectively. This requires several hours only in the step of reinforcing the joints of the external lead terminals, which significantly complicates the working process.

Further, in the hybrid integrated circuit having the conventional structure, it is necessary to solder the external lead terminals onto the substrate before the case material is fixed, so that the solder balls generated at the time of fixing the lead terminals jump into the center of the substrate and have a defect. May occur.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a conductive path having a desired shape formed on a substrate and a plurality of circuit elements mounted on the conductive path. A lid fixed to the substrate and hermetically sealing the circuit element; a frame fixed to the terminal end of the substrate and arranged at a predetermined distance from the lid; and a conductive path formed in the separation region. A plurality of connecting bodies for connecting to an external circuit fixed to a fixing pad formed by extending the sealing pad, and a sealing resin layer filled in the separation region to seal and fix a connecting portion of the connecting body. It is characterized by doing.

Further, in the hybrid integrated circuit according to the present invention, the fixing pad is formed at least near the end of the opposite side of the substrate. Further, in the hybrid integrated circuit according to the present invention, an external lead terminal is used as the connection body.

[0010]

In the hybrid integrated circuit constructed as described above, the fixed portion of the external lead terminal fixed on the hybrid integrated circuit board is fixed to the lid for hermetically sealing the circuit element and the terminal end of the board. Thus, the fixed portion of the external lead terminal can be reinforced only by filling the sealing region with the sealing region. As a result, even when the external lead terminals are led out from two or more sides of the substrate, all the fixed portions of the external lead terminals can be reinforced by one resin sealing step.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. As shown in FIGS. 1 and 2, the hybrid integrated circuit of the present invention is mounted on a substrate (1), a conductive path (2) formed on the substrate (1), and a conductive path (2). A plurality of circuit elements (3) and their circuit elements (3)
(4) for hermetically sealing, a frame (5) fixed to the terminal end of the substrate (1), and a substrate (1) in a space between the frame (5) and the lid (4). It comprises an external lead terminal (6) fixed thereon, and a sealing resin layer (7) filled in a space portion of the separated area.

As the substrate (1), a substrate usually used for a hybrid integrated circuit such as a ceramic substrate or a metal substrate is used. In this embodiment, an aluminum substrate is used in consideration of heat dissipation, noise, and the like. A conductive path (2) having a desired shape is formed on one main surface of the aluminum substrate. The conductive path (2) is formed by attaching a clad material in which a copper foil and an epoxy resin or a polyimide resin are integrated in advance on the substrate (1), and then etching the copper foil by a known method.

A plurality of circuit elements (3) such as transistors, resistors, capacitors or memory ICs are fixedly mounted at desired positions of the conductive path (2), and are electrically connected to nearby conductive paths. The plurality of circuit elements (3) are hermetically sealed with a resin lid (4). The lid (4) is formed in a substantially box shape by an epoxy resin, and is fixed on the substrate (1) so as to seal all the circuit elements (3) as described above. The lid (4) is the substrate (1)
When the lid (4) is fixed on the substrate (1), a part of the substrate (1) is formed between the terminal side of the substrate (1) and the lid (4). Will be exposed.

Further, a frame-shaped frame member (5) is fixed to the terminal side of the substrate (1), and a predetermined space is formed between the frame member (5) and the lid (4). Will be. The lid (4) and the frame material (5) may be separate and separate parts, respectively. However, when they are fixed on the substrate (1), the lid (4) and the frame material (5) are In the present embodiment, each of the corners is integrated by a connecting body (8) for fixing in the process.

By the way, a plurality of external lead terminals (6) are arranged in the above-mentioned separated portion. That is, the fixing pad (2A) at the tip end where the conductive path (2) extends is arranged to extend to the separated region formed by the lid (4) and the frame member (5). More specifically, the fixing pads (2A) are formed to extend at least on two opposite sides or four sides of the substrate (1), and they are selected according to the integration density and the substrate size. In this embodiment, the fixing pads (2A) are formed so that the external lead terminals (6) are led out from the four sides of the substrate (1).

An external lead terminal (6) is soldered on the fixing pad (2A). At this time, since the circuit element (3) is hermetically sealed in advance by the lid (4), no problem occurs even when solder balls are generated at the time of soldering the lead terminals. On the other hand, an external lead terminal (6) fixed in a space between the lid (4) and the frame member (5)
Is fixed with a sealing resin layer (7) such as an epoxy resin to reinforce the strength of the fixed portion. In this case, the fixed portions of the lead terminals (6) provided on each side of the substrate (1) are all arranged in the same direction, and are arranged in a space between the lid (4) and the frame member (5). Therefore, the filling and curing of the sealing resin layer (7) can be performed in the same step.

[0017]

As described in detail above, according to the structure of the present invention, even if the external lead terminals are led out from at least two peripheral edges of the substrate, the external lead terminals are fixed. Filling the sealing resin layer to reinforce the part in one process
Curing can be performed and workability can be greatly improved.

Further, in the structure of the present invention, even if a solder ball is generated when the external lead terminal is soldered, the short circuit of the circuit element due to the solder ball can be prevented because the circuit element is hermetically sealed by the lid. It can be completely prevented.

[Brief description of the drawings]

FIG. 1 is a plan view showing a hybrid integrated circuit of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view of a main part showing a conventional hybrid integrated circuit.

[Explanation of symbols]

 (1) Substrate (2) Conductive path (3) Circuit element (4) Lid (5) Frame material (6) Lead terminal (7) Sealing resin layer

Claims (3)

(57) [Scope of request for utility model registration] A conductive path having a desired shape formed on a substrate; a plurality of circuit elements mounted on the conductive path; a lid fixed to the substrate and hermetically sealing the circuit element; A frame fixed to the terminal end of the frame and arranged at a predetermined distance from the lid, and a gap between the lid and the frame spaced apart from each other;
A spaced area surrounding the lid body in a ring shape, and the conductive path is formed to extend on the substrate surface in the spaced area.
A fixed pad, a plurality of connecting members fixed to the fixing pad, for connecting to an external circuit, and a sealing resin layer filled in the separation region to seal and fix a connecting portion of the connecting member. A hybrid integrated circuit characterized by: 2. The hybrid integrated circuit according to claim 1, wherein said fixing pads are formed at least near the ends of the opposite sides of said substrate. 3. The hybrid integrated circuit according to claim 1, wherein an external lead terminal is used as said connection body.