JP2515515Y2 - Electronics - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an electronic device in which an electronic component is enclosed in an insulating case to form an electronic circuit, and in particular, the height of the electronic device is relatively reduced to achieve miniaturization. Related to electronic devices.

[Prior Art] An outline of an electronic device of this type will be described with reference to FIG.

In the figure, 1 is a metal base substrate. A conductor pattern is formed on the surface of the metal base substrate 1 via an insulating layer, and various electronic components 2 are soldered on the conductor pattern. In addition, on the metal base substrate 1,
A semiconductor chip (not shown), which generates a relatively large amount of heat, is also mounted and fixed. Further, one ends of the ends 3 and 3 on which the stepped portion 3a is formed are mounted and fixed on the metal base substrate 1.
The control circuit board 4 is mounted on the stepped portions 3a and 3a of the terminals 3 and 3,
Solder is fixed.

Although not shown, a conductor pattern is formed on the control circuit board 4 via an insulating layer. The electronic component 5 for the control circuit is mounted and fixed on the conductor pattern.

The metal base substrate 1 and the control circuit substrate 4 arranged on the upper and lower sides are configured such that their conductor patterns are electrically connected to each other via the terminals 3, 3.

An insulating case 6 is fitted on the outer peripheral portion of the metal base substrate 1. The insulating case 6 is filled with resin 7 and the inside thereof is sealed. The electronic device thus completed is used by mounting and fixing the metal base substrate 1 side to another heat radiator.

[Problems to be Solved by the Invention] In the conventional electronic device configured as described above, the electronic components 2 and 5 are mounted and fixed on the metal base substrate 1 and the control circuit substrate 4, and are particularly arranged on the upper portion. It is necessary to fill the resin 7 to such an extent that the electronic component 5 on the control circuit board 4 is completely embedded in the resin 7. Therefore, the height H1 of the electronic device is
However, there is a problem to be solved in that it cannot be effectively lowered, and the contribution rate to miniaturization is low.

[Object of the Invention] The present invention has been made in order to solve the above problems, and an object thereof is to provide an electronic device that can relatively reduce the height of the electronic device and contribute to downsizing. To do.

[Means for Solving the Problems] An electronic device according to the present invention includes a metal base substrate having a conductor pattern for an electronic circuit formed on one main surface of a metal plate via an insulating layer, and an outer periphery of the base substrate. An insulating case that fits into the portion, and a lid that also serves as a control circuit board that has a conductor pattern that forms a control circuit for electronic components that is mounted and fixed on the conductor pattern. The electronic circuit inserted into the opening end of the insulating case and electrically connected to the electronic circuit formed on the metal base substrate and the control circuit formed on the cover also serving as the control circuit substrate via a terminal, The outer circumference of the lid is adhered to the insulating case to seal the inside of the insulating case.

[Operation] In the electronic device of the present invention, since the control circuit board is also used as the lid of the insulating case, the control circuit board itself does not need to be resin-sealed, so that the height of the electronic device is relatively low. This can contribute to downsizing of electronic devices.

[Embodiment] An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, a conductor pattern is formed on a metal base substrate 1 through an insulating layer (not shown) as in the conventional case, and an electronic component 2 and a semiconductor pellet (not shown) that generate heat are formed on the conductor pattern. Mounted and fixed. The terminals 3 are soldered and fixed onto the conductor pattern on the peripheral portion of the metal base substrate 1. An insulating case 6 is fitted on the outer peripheral portion of the metal base substrate 1 and fixed with an adhesive. A step portion 6a is formed at the opening end of the insulating case 6, and the lid 40 also serving as a control circuit board is fitted into the step portion 6a.

Although not shown, a conductor pattern is formed on the surface of the cover 40 also serving as a control circuit board via the surface. Then, the electronic component 5 for the control circuit is soldered and fixed onto the conductor pattern. The conductor pattern is formed on both the A surface 40a inside the insulating case 6 and the B surface 40b outside the insulating case 6.

That is, the A surface 40a or the B surface 40b is selectively used depending on the type of the electronic component 5, and if the electronic component 5 is a surface mounting type, the A surface 40a is used and the electronic component 5 is an axial lead type. If so, the B side 40b is used. Therefore, a through hole 41 is formed in the control circuit board / lid body 40, and the lead 5a of the electronic component 5 is inserted into the through hole 41 to
It is soldered and fixed to the conductor pattern formed on the surface 40b side.
One ends of the terminals 3, 3 are also inserted into the through holes 42, 42 provided in the lid 40 that also serves as a substrate, and soldered to the conductor pattern. The terminals 3 and 3 are circuits formed on the metal base substrate 1 and
It serves to electrically connect to a control circuit formed on the control circuit board / cover 40. An adhesive is applied to the joint of the control circuit board and lid 40 fitted into the opening end of the insulating case 5 to hermetically seal the inside of the insulating case 5.

In the electronic device configured as described above, it is not necessary to resin-encapsulate the cover 40 also serving as the control circuit board, and therefore, the height H2 is lowered to such an extent that the electronic components 2 and 5 in the upper and lower facing arrangements do not abut each other. It becomes possible.

[Advantages of the Invention] According to the electronic device of the present invention, the control circuit board on which the electronic components for the control circuit are mounted is also used as the lid of the insulating case, and the inside of the case is hermetically sealed. Therefore, it becomes unnecessary to seal the control circuit board itself on which the electronic parts are mounted with resin. Therefore, the height of the electronic device can be relatively reduced, which can contribute to miniaturization, and since the insulating case is not filled with the sealing resin,
There is an effect that the weight of the electronic device can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing an outline of an electronic device of the present invention, and FIG. 2 is a sectional view showing an outline of a conventional electronic device. 1 ... Metal base board, 2,5 ... Electronic parts, 3 ... Terminal, 6 ... Insulation case, 40 ... Control circuit board and lid.

Claims (1)

(57) [Scope of utility model registration request] 1. A metal base substrate having a conductor pattern for an electronic circuit formed on one main surface of a metal plate via an insulating layer, an insulating case fitted to the outer peripheral portion of the base substrate, and the conductor. And a control circuit board / lid having a conductor pattern forming a control circuit of an electronic component mounted / fixed on the pattern, the control circuit board / lid being inserted into the opening end of the insulating case, and The electronic circuit formed on the metal base substrate and the control circuit formed on the lid that also serves as the control circuit board are electrically connected through terminals, and the outer periphery of the lid is adhered to the insulating case for insulation. An electronic device in which the inside of the case is sealed.