JPH05121576A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To fixedly and integrally bond a hybrid integrated circuit, from which outer lead terminals are derived out of at least two sides of a high density packaged board, with a casing material without using an adhesive sheet material. CONSTITUTION:A casing material 4 having a sealing section 4A which seals a circuit element 2 on a board 1 having an outer lead terminal 3 derived at least from a peripheral section of opposed sides and a resin sealing section 4B formed approximately in the shape of L is adapted to come into contact with a board 1 having an outer terminal lead 3 derived from at least the peripheral part on the opposite sides where a resin layer 5 is formed in an area between the board 1 and the resin sealing section 4B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit in which a hybrid integrated circuit board and a case material are integrated.

[0002]

2. Description of the Related Art Generally, in a hybrid integrated circuit, as shown in FIG. 2, a plurality of circuit elements (13) are fixed to a conductive path (12) formed on a substrate (11) to form a circuit having a desired function. And a conductive path (12) extending to the peripheral edge of the substrate (11).
The external lead terminals (14) are fixedly connected to each other with a brazing material such as solder, and are used as electronic parts in various devices.

On the other hand, recently, there is a hybrid integrated circuit in which a plurality of external lead terminals for connecting to an external circuit are provided from at least two sides or four sides of a substrate by mounting a plurality of memory ICs or the like. In a hybrid integrated circuit using a metal substrate (coated with an insulating resin) as the substrate (11), the shape of the external lead terminal is such that the conductive path (12) is formed in order to prevent short circuit with the edge of the substrate (11). ) Is bent and formed in an L-shape so that the connection surface connected to (4) and the connection surface to the external circuit are substantially parallel to each other.

Then, in order to improve the fixing strength of the joint portion of the external lead terminal (14), the space portion between the substrate (11) and the case member (15) is filled (16) with a resin such as epoxy resin. ..

[0005]

In the hybrid integrated circuit as shown in FIG. 2, it is not necessary to strengthen the joint portion of the external lead terminal with the sealing resin layer as described above. This is because the bonding area of the external lead terminal can be sufficiently secured and the fixing strength does not decrease. However, in a highly integrated hybrid integrated circuit having a plurality of memory ICs and the like, due to miniaturization, the external lead terminals, that is, the lead terminal fixing pad pitches are remarkably close to each other, and sufficient strength cannot be obtained. There was a problem of peeling during work. In particular, when the pad pitch is 1.78 mm or less, it may be peeled off by a slight external force.

In order to prevent the peeling of the joint portion of the lead terminal, as described in the conventional example, the space between the case material and the substrate is filled with resin to make the fixed portion of the lead terminal firm and prevent the peeling. ing. However, in the highly integrated hybrid integrated circuit in which the external lead terminals are led out from the two sides or the four sides of the substrate, it is necessary to fill each of the sides where the external lead terminals are led out with a resin and cure the resin. Therefore, it takes several hours only for the step of reinforcing the joint portion of the external lead terminal, which makes the working step extremely complicated.

Further, in such a hybrid integrated circuit having the conventional structure, a resin case material and a substrate are fixed by thermosetting the adhesive sheet using an epoxy adhesive sheet material in order to protect the circuit elements. Unify. The heat curing time is
There is a problem in that a thermosetting time of about 125 ° C. for about 8 hours is required to securely fix the substrate and the case material, and the manufacturing process time becomes extremely long.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a circuit element is provided on a hybrid integrated circuit board having external lead terminals derived from at least peripheral side peripheral portions. A case member having a sealing portion that seals the substrate and a resin sealing portion that is formed in a substantially L-shape and that projects from the peripheral edge of the substrate are brought into contact with each other to separate the substrate and the case material from the peripheral edge portion of the substrate and the resin. It is characterized by being integrated with a resin layer filled in a region formed between the stoppers.

[0009]

In the hybrid integrated circuit configured as described above, since the resin sealing portion of the case material is arranged on the exposed surface side of the substrate, the space area formed between the substrate and the resin sealing portion is the same. By being formed in the direction (upper surface direction), the substrate and the case material can be fixed to each other in one resin filling / curing step. As a result, the substrate and the case material can be fixed to each other without using a conventional adhesive sheet.

Further, when the substrate and the case material are fixedly integrated, the fixing portion of the external lead terminal can be reinforced at the same time.

[0011]

EXAMPLES The present invention will be described below based on the example shown in FIG. As shown in FIG. 1, the hybrid integrated circuit of the present invention comprises a hybrid integrated circuit substrate (1), a conductive path (not shown) formed on the substrate (1), and a circuit element (2) mounted on the conductive path. ), External lead terminals (3) fixed to at least opposite sides of the substrate (1), a sealing portion for sealing the circuit element (2) on the substrate (1), and a protrusion from the substrate (1). And a resin layer (5) for fixing and integrating the substrate (1) and the case member (4).

As the substrate (1), a hard substrate such as a ceramic substrate or a metal substrate which is usually used in a hybrid integrated circuit is used. In this embodiment, an aluminum substrate is used in consideration of heat dissipation and noise. Although not shown, a conductive path having a desired shape is formed on one main surface of the aluminum substrate. This conductive path is formed, for example, by adhering a clad material in which a copper foil and an epoxy resin or a polyimide resin are integrated in advance onto a substrate and then etching the copper foil by a known method.

A plurality of circuit elements (2) such as transistors, resistors, capacitors or memory ICs are fixedly mounted at desired positions on the conductive path and electrically connected to a nearby conductive path. Further, the conductive paths extend at least at the peripheral side edge portions of the substrate (1) facing each other, and the external lead terminals (3) are fixedly connected to the extended distal end portions by a brazing material such as solder. .. In this embodiment, although not apparent from FIG. 1, the external lead terminals (3) are led out from the four sides of the substrate (1).

The external lead terminals (3) are once fixed on the substrate (1), and then the substrate (1) is formed at the intermediate portion of the lead terminals.
It is bent and arranged at a substantially right angle so that the front end portion is located on the exposed surface side of. After the plurality of circuit elements (2) and the external lead terminals (3) are fixed on the board (1), the board (1) and the case member (4) are fixed and integrated to form the circuit element (2) in the case. The material (4) is hermetically sealed.

The case member (4) is the circuit element (2).
And a resin sealing portion (4A) extending from the sealing portion (4A) and protruding from the peripheral edge of the substrate (1).
B) and. That is, the sealing portion (4A) is formed in a box shape, and the resin sealing portion (4B) is formed in an L shape in the exposed surface direction of the substrate (1). At this time, the front end portion of the resin sealing portion (4B) is formed so as to be substantially flush with the substrate (1) surface. Furthermore, since the case material (4) is injection-molded with an epoxy resin, the shape of the case material (4) used in this embodiment can be formed relatively easily.

Circuit element (2) formed on the substrate (1)
When the substrate (1) and the case member (4) are brought into contact with each other so as to hermetically seal the substrate, the peripheral edge of the substrate (1) is surrounded by the resin sealing portion (4B) of the case member (4). A space area (6) is formed at a predetermined interval between the substrate (1) and the resin sealing portion (4B). All the space regions (6) are formed in the same plane and in the same direction (upper surface side),
The space area (6) is filled with a resin such as epoxy, and the space is about 12
The substrate (1) and the case member (4) can be fixedly integrated with each other only by forming the resin layer (5) by thermosetting at 5 ° C. for about 2 hours. As a result, the substrate (1) and the case material (4) can be fixedly integrated with each other in a single resin filling / curing step without using a conventional adhesive sheet material.

Further, when the substrate (1) and the case material (4) are fixedly integrated, the fixed portion of the external lead terminal (3) is made of resin by the resin layer (5) filled in the space region (6). Since the structure is sealed, the external lead terminals (3) can be reinforced at the same time. In the present embodiment, the external lead terminals (3) are arranged so as to extend in the direction of the exposed surface of the substrate (1). However, in the case of providing an SMD type hybrid integrated circuit, for example, as shown by the dotted line, It is also possible to bend 3).

[0018]

As described above in detail, according to the present invention,
As in the conventional case, the substrate and the case material can be fixedly integrated with each other without using an adhesive sheet material, and the both can be fixed in an extremely short time as compared with the conventional case. Further, according to the present invention, when the substrate and the case material are fixed, the fixed portion of the external lead terminal can be reinforced at the same time. Moreover, since the resin filling / thermosetting step can be performed once, the number of manufacturing steps can be reduced as compared with the conventional method.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a hybrid integrated circuit of the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a conventional hybrid integrated circuit.

[Explanation of symbols]

 (1) Hybrid integrated circuit (2) Circuit element (3) External lead terminal (4) Case material (5) Resin layer

Claims (2)

[Claims] 1. A conductive path having a desired shape is formed on a substrate,
A hybrid integrated circuit board having a plurality of circuit elements connected to the conductive path, and an external lead terminal fixed to at least opposite side edge portions of the board, and bent at a substantially right angle at an intermediate portion thereof, A sealing portion that is in contact with the substrate and seals the circuit element, and a substantially L that extends from the sealing portion and projects from the peripheral edge of the substrate.
A hybrid comprising: a case material having a resin-sealed portion formed in a mold shape; and a resin layer filled in a space region formed between the resin-sealed portion and the peripheral edge of the substrate. Integrated circuit. 2. A conductive path having a desired shape is formed on a substrate,
A hybrid integrated circuit board in which a plurality of circuit elements are connected to the conductive path, and is fixed to at least opposite side edge portions of the board, and is bent at a substantially right angle toward the exposed surface of the board at an intermediate portion thereof. An external lead terminal, a sealing portion that is in contact with the substrate and seals the circuit element, and a substantially L extending from the sealing portion and protruding from the peripheral edge of the substrate.
A case material having a resin-molded portion formed in a mold shape, and a resin layer for filling the space area formed between the resin-sealed portion and the peripheral edge of the substrate to integrate the substrate and the case material A hybrid integrated circuit comprising: