CN111276428B - Wafer bearing device - Google Patents
Wafer bearing device Download PDFInfo
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- CN111276428B CN111276428B CN202010002190.6A CN202010002190A CN111276428B CN 111276428 B CN111276428 B CN 111276428B CN 202010002190 A CN202010002190 A CN 202010002190A CN 111276428 B CN111276428 B CN 111276428B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the invention provides a wafer bearing device, which comprises: the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process; the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body; the second portion is arranged on the first portion, and an angle between a side face, close to the wafer, of the second portion and a side face, close to the wafer, of the first portion is larger than 90 degrees and smaller than 180 degrees. Therefore, the actual bearing requirement in the process of carrying out photoetching process on the wafer can be well met.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer bearing device.
Background
In the photolithography process flow of the wafer, a photoresist coating and developing stripping process is required to be performed on the wafer by using a photoresist coating and developing machine. In practical applications, when a wafer is subjected to photoresist coating and developing stripping, it is required to pass through a transfer device (e.g., a robot arm) for multiple times, and then to perform baking while raising the temperature of a hot plate and cooling while lowering the temperature of the cold plate. As shown in fig. 1a and 1b, for a clamping wafer-transferring type glue-coating developing machine, a position-limiting component (e.g., a guide post structure) is arranged on a bearing device (e.g., a conveying device shown in fig. 1a and 1b and a cold/hot plate shown in fig. 1 c) to limit the lateral drift of a wafer.
However, the carrier apparatus in the related art does not well satisfy the actual carrying requirement during the photolithography process for the wafer when the wafer is placed.
Disclosure of Invention
In order to solve the related technical problems, embodiments of the present invention provide a wafer carrying device, which can well meet an actual carrying requirement during a photolithography process performed on a wafer.
The embodiment of the invention provides a wafer bearing device, which comprises:
the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process;
the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body; the second portion is arranged on the first portion, and an angle between a side face, close to the wafer, of the second portion and a side face, close to the wafer, of the first portion is larger than 90 degrees and smaller than 180 degrees.
In the above scheme, the height of the first portion is less than half of the thickness of the wafer.
In the above scheme, the total height of the first portion and the second portion is greater than the thickness of the wafer.
In the above scheme, the limiting component further comprises a third part; the third portion is arranged on the second portion, and the side face, close to the wafer, of the third portion is perpendicular to the upper surface of the bearing body.
In the above scheme, the first portion is a cylinder, the second portion is a circular truncated cone, one cylindrical surface of the first portion is arranged on the upper surface of the bearing body, and the area of the other cylindrical surface is equal to the area of the cylindrical surface with a larger area in the two cylindrical surfaces of the second portion.
In the above scheme, the limiting component further comprises a third part; the third part is a cylinder, and the cylinder with the smaller area in the two cylinders of the second part is equal to the area of one cylinder of the third part.
In the above scheme, the limiting component is arranged on the bearing body in a threaded connection mode.
In the above scheme, the limiting component further comprises a threaded connection part connected with a surface of the first part, which is arranged on the bearing body; the bearing body is provided with a threaded hole structure; the limiting component is arranged in the threaded hole structure through the threaded connecting part.
In the scheme, the number of the limiting parts is 3-8.
In the above scheme, the limiting parts are uniformly distributed on the bearing body.
The wafer bearing device provided by the embodiment of the invention comprises: the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process; the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body; the second portion is arranged on the first portion, and an angle between a side face, close to the wafer, of the second portion and a side face, close to the wafer, of the first portion is larger than 90 degrees and smaller than 180 degrees. In the embodiment of the invention, in the process of carrying out photoetching process on the wafer, the condition of the contact surface between the wafer and the limiting component is improved by arranging the limiting component in a special shape, namely, the first part which is arranged in the limiting component and is vertical to the bearing surface can prevent the wafer from being lapped on the limiting component; the second part of the limiting component, which is arranged to increase the distance from the edge of the wafer along with the increase of the distance from the second part to the upper surface of the bearing body, can prevent the part of the edge of the wafer, which is provided with the photoresist, from directly contacting the limiting component, so that the actual bearing requirement in the process of carrying out the photoetching process on the wafer can be well met.
Drawings
FIG. 1a is a first schematic view of a wafer carried by a transfer apparatus in the related art;
FIG. 1b is a second schematic view of a wafer carried by a transfer apparatus according to the related art;
FIG. 1c is a schematic view of a related art cold and hot plate carrier wafer;
FIG. 2a is a first schematic view illustrating a relative position relationship between a carrier body, a position-limiting member and a wafer in a carrier device according to the related art;
FIG. 2b is a second schematic view illustrating a relative position relationship between the carrier body, the position limiting member and the wafer in the carrier device according to the related art;
FIG. 3 is a schematic structural diagram of a wafer carrier device according to an embodiment of the present invention;
FIG. 4 is a first schematic view illustrating a relative position relationship between the carrier body, the limiting member and the wafer in the wafer carrier device according to the embodiment of the invention;
FIG. 5 is a second schematic view illustrating a relative position relationship between the carrier body, the limiting member and the wafer in the wafer carrier device according to the embodiment of the invention;
FIG. 6a is a schematic view illustrating a relative position relationship between a carrier body, a position-limiting member and a wafer in a wafer carrier device according to an embodiment of the present invention;
FIG. 6b is a schematic view of a carrier body of a wafer carrier device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following describes specific technical solutions of the present invention in further detail with reference to the accompanying drawings in the embodiments of the present invention.
In the manufacturing process of semiconductors, photolithography is the most important process in fine circuit pattern processing, and the minimum feature size of a chip is determined, which accounts for 40% -50% of the manufacturing time of the chip. Photolithography is a process of removing a specific portion of a thin film on the surface of a wafer through a series of production steps. After that, a thin film with a micro-image structure is left on the surface of the wafer. The general photolithography process mainly includes: forming a base film in a gas phase, coating photoresist (short for gumming), pre-baking, aligning and exposing, baking after exposure, developing and removing photoresist (short for developing), baking for hardening, developing and checking and the like. Photoresist is a key material for selective etching in a photolithography process. In the photolithography process, photoresist coating and developing are essential steps for obtaining a good photolithography effect.
In the related art, when a photoresist coating and developing stripping process is performed on a wafer by using a photoresist coating and developing machine, the wafer needs to be transferred by a transfer device (e.g., a robot arm) for many times, baked while being heated by a hot plate, and cooled while being cooled by a cold plate. As shown in fig. 1a and 1b, for a clamping conveyor type glue spreading and developing machine, a wafer is conveyed by the conveying device shown in fig. 1a or 1 b; wafers are placed by the hot and cold plates shown in fig. 1c for the corresponding processing, and generally in order to prevent the wafers from falling, a limiting member (e.g., a guide post structure) is disposed in the carrier device to limit the lateral drift of the wafers. Meanwhile, due to the particularity of the photoetching process, the bearing device meets some special requirements while safely conveying and placing the wafer. Here, specific special requirements will be described in detail below.
In practical applications, the photoresist on the upper surface of the wafer is generally spread by rotating the wafer, so that the photoresist (such as the photoresist position shown in fig. 2 a) often exists at a position where the edge of the wafer is close to the upper surface, especially at a chamfer position where the edge of the wafer is close to the upper surface, and when the photoresist collides with the position limiting component, particles of the position limiting component are easily attached to the outer surface of the portion of the wafer where the photoresist exists, so as to form contaminants. At this time, when the developing solution nozzle performs developing through horizontal movement, there is a risk of bringing contaminants on the edge of the wafer into the interior of the wafer, which results in a defect of wider range, thereby affecting the yield of the wafer. Therefore, during the process of carrying out the photolithography process on the wafer, it is desirable that the position limiting component in the bearing component is not contacted with the part of the edge of the wafer where the photoresist exists as much as possible during the process of transferring and taking the wafer, so as to prevent the above risk.
In the related art, the structure of the guide pillars in the conveying device is configured as a cylindrical structure without considering the special requirements of the photolithography process, as shown in fig. 2 a. With the cylindrical guide pillar structure shown in fig. 2a, during the process of transferring, picking and placing the wafer, the wafer may collide with or scratch the guide pillar structure, and generate contaminants such as particles at the edge of the wafer, especially when there is photoresist at the edge of the wafer. When developing, there is a risk of introducing contaminants at the edge of the wafer into the interior of the wafer.
On the other hand, in order to prevent the stopper in the carrier from contacting the portion of the wafer edge where the photoresist is present, the structure of the guide post is changed from a cylindrical structure to a conical structure, as shown in fig. 2 b. However, with the conical guide pillar structure in fig. 2b, the collision between the edge of the wafer and the guide pillar structure occurs at the bottom of the edge of the wafer, and will not contact with the photoresist at the edge of the wafer near the upper surface, so as to avoid the problem that the wafer yield is affected by the generation of pollutants due to the collision.
In order to solve the problems of the defects of gluing and developing caused by a limiting component (a guide post structure) of a clamping sheet-transferring type gluing and developing machine table, the embodiment of the invention designs the limiting component with a novel structure to avoid the defects. In the embodiment of the invention, the situation of the contact surface between the wafer and the limiting component is improved by arranging the limiting component with a special shape in the photoetching process of the wafer, so that the actual bearing requirement in the photoetching process of the wafer can be well met.
Fig. 3 is a structural composition diagram of a wafer carrier device according to an embodiment of the invention, wherein the wafer carrier device 300 according to an embodiment of the invention includes: a bearing body 301 and a limiting component 302; wherein the content of the first and second substances,
the carrier body 301 is arranged on the carrier body 301 in the process of carrying out photoetching process on a wafer;
the limiting component 302 is used for limiting the movement of the wafer on the bearing body 301 during the photoetching process of the wafer; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body 301; the second portion is arranged on the first portion, and an angle between a side face, close to the wafer, of the second portion and a side face, close to the wafer, of the first portion is larger than 90 degrees and smaller than 180 degrees.
In practical applications, the wafer carrying device may be a conveying device for conveying a wafer during a photolithography process on the wafer, a hot plate for baking the wafer, a cold plate for cooling the wafer, or the like.
During the photolithography process, the carrier body 301 is a component mainly responsible for placing the wafer, that is, during the photolithography process, the wafer is disposed on the carrier body 301.
The shape of the carrier body 301 can be adjusted according to actual conditions, and in actual application, the shape of the carrier body 301 can be adjusted according to the size of a wafer, for example, when the wafer is 8 inches, the carrier body 301 can be a circle slightly larger than 8 inches; the shape of the bearing body 301 can be adjusted according to actual process requirements, for example, the bearing body 301 is set to be a hollow structure; the shape of the carrying body 301 can be adjusted according to specific application requirements, for example, when the carrying body 301 is used as a conveying device that can be held by hand, the carrying body 301 can be provided with a structural portion that is convenient for holding by hand.
In practical application, the material of the carrier body 301 is hard, high temperature resistant, low temperature resistant, and does not react with the gas of the gas-phase carrier film or react with the developer, such as alloy and ceramic.
During the photolithography process on the wafer, the limiting component 302 is a component that limits the wafer from moving on the carrier body 301. Here, the movement may be a movement in all directions along the surface of the bearing body 301 (e.g., in a 360 ° direction along the surface of the bearing body 301). In practical applications, the limiting component 302 limits the wafer from moving on the carrier body 301 by colliding with the edge of the wafer.
In practical applications, as shown in fig. 4, the first portion is located on the upper surface of the carrier body 301, and the side surface of the first portion close to the wafer needs to be perpendicular to the upper surface of the carrier body 301 (as viewed from fig. 4, it is a straight line portion) to prevent the wafer from overlapping the position-limiting member 302. The second portion is located above the first portion, and an angle between a side surface of the second portion close to the wafer and a side surface of the first portion close to the wafer is greater than 90 degrees and less than 180 degrees (a broken line portion is seen in fig. 4), that is, a distance between the side surface of the second portion close to the wafer and the edge of the wafer gradually increases with the distance between the second portion and the upper surface of the carrier body, so that a portion of the edge of the wafer where the photoresist exists can be prevented from directly contacting the position limiting part 302. In fig. 4, the shape of the portion of the first portion and the second portion that is located on the right side of the dashed curve may not be limited. Here, an angle between a side surface of the second portion close to the wafer and a side surface of the first portion close to the wafer is an obtuse angle, and the second portion is far from the wafer.
The specific shapes of the first part and the second part need to be correspondingly arranged, and in practical application, the first part can be a cylinder, and the second part can be a circular truncated cone correspondingly; or the first part can be a semi-cylinder, and the second part can be a semi-circular table correspondingly; or the first portion may be a cube, a cuboid, and the second portion may correspond to a quadrangular pyramid, etc.
In practical applications, the limiting member 302 is made of a material with a hard texture, high temperature resistance and low temperature resistance, such as ceramic.
In practical applications, photoresist is often present at the edge of the wafer near the chamfer of the upper surface, but in order to ensure a good process effect, the photoresist retention rate at the edge of the wafer is generally strictly controlled, and the thickness of the portion of the edge of the wafer covered by the photoresist is generally less than half of the thickness of the wafer. Therefore, in practical application, in order to better ensure that the limiting component is not in contact with the part of the edge of the wafer where the photoresist exists, the height of the first part is set to be less than half of the thickness of the wafer, so that the purpose of not being in contact with the part of the edge of the wafer where the photoresist exists is achieved, and meanwhile, the side surface of the cylinder is perpendicular to the bearing body 301, so that the wafer can be prevented from being overlapped on the side surface of the cylinder.
Based on this, in an embodiment, the height of the first portion is less than half the thickness of the wafer.
In practice, in order to reduce the probability of wafer dropping, the total height of the first portion and the second portion may be defined.
Based on this, in one embodiment, a total height of the first portion and the second portion is greater than a thickness of the wafer.
In practical application, the size of the part, with the total height higher than the thickness of the wafer, of the first part and the second part can be adjusted according to practical experience values, and finally the purpose that the probability of falling of the wafer can be effectively reduced and the wafer is not hindered in taking and placing is achieved.
To further prevent the wafer from falling, the position limiting component 302 may further include a third portion on the basis of the first portion and the second portion.
In view of this, in one embodiment, the position limiting member 302 further comprises a third portion; the third portion is arranged on the second portion, and the side face, close to the wafer, of the third portion is perpendicular to the upper surface of the bearing body.
In practical applications, as shown in fig. 5, the third portion is located above the second portion, and the side of the third portion close to the wafer needs to be perpendicular to the upper surface of the carrier body 301 (as viewed from fig. 5, it is a straight line portion) to form a better barrier layer for preventing the wafer from falling. The shape of the portion of the third portion to the right of the dotted curve in fig. 5 may not be limited.
The specific shape of the third part needs to correspond to that of the second part, and in practical application, the second part can be a circular truncated cone, and the third part can be a cylinder correspondingly; or the second part can be a semicircular platform, and the third part can be a semicircular cylinder correspondingly; or the second portion may be a quadrangular pyramid and the third portion may correspond to a cube, a cuboid, etc.
In practical application, the total height of the third part can be adjusted according to practical experience values, and finally the purposes of effectively preventing the wafer from falling and not interfering with the taking and placing of the wafer can be achieved.
The number of the limiting members 302 and the specific position on the bearing body 301 can be set according to actual requirements.
In one embodiment, the number of the limiting members 302 is 3 to 8.
In order to limit the movement of the wafer along all directions of the surface of the carrier body 301, the number of the limiting members 302 is plural, and the plurality of limiting members 302 together form a block to the possible movement direction of the wafer 360 °. In practical application, the number of the limiting parts 302 can be 3-8. Therefore, the wafer can be blocked in the possible 360-degree moving direction, and the manufacturing cost is not increased.
In an embodiment, the position limiting members 302 are evenly distributed on the bearing body 301.
In practice, each of the plurality of stop members 302 may be positioned to form a circle to properly position the wafer.
Here, the term uniform is understood to mean that the plurality of stopper members 302 are uniformly spaced or symmetrically positioned so that the force applied to each stopper member of the plurality of stopper members 302 is uniform. Meanwhile, the circle formed by the position of each of the plurality of position-limiting components 302 should be slightly larger than the diameter of the circle formed by the edge of the wafer, so as to ensure that the wafer is easy to pick and place.
The fixing manner of the limiting component 302 is various, and the limiting component can be selected according to actual requirements in actual application.
In an embodiment, the limiting member is disposed on the bearing body 301 by a threaded connection.
In an embodiment, the limiting component 302 further includes a threaded connection portion connected to a surface of the first portion disposed on the bearing body 301; a threaded hole structure is arranged on the bearing body 301; the position limiting part 302 is arranged in the threaded hole structure through the threaded connection part.
In an embodiment, the position limiting component 302 is fixed on the bearing body 301 by means of adhesion.
In an embodiment, the position limiting component 302 is disposed on the bearing body 301 by way of a pin connection.
In an embodiment, the position limiting component 302 further includes a pin connecting portion connected to a cylindrical surface of the first portion disposed on the bearing body 301; the bearing body 301 is provided with a pin hole structure; the stop member 302 is disposed in the pin hole structure via the pin.
The embodiment of the invention provides a wafer bearing device, which comprises: the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process; the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body; the second portion is arranged on the first portion, and an angle between a side face, close to the wafer, of the second portion and a side face, close to the wafer, of the first portion is larger than 90 degrees and smaller than 180 degrees. In the embodiment of the invention, in the process of carrying out photoetching process on the wafer, the condition of the contact surface between the wafer and the limiting component is improved by arranging the limiting component in a special shape, namely, the first part which is arranged in the limiting component and is vertical to the bearing surface can prevent the wafer from being lapped on the limiting component; the second part of the limiting component, which is arranged to increase the distance from the edge of the wafer along with the increase of the distance from the second part to the upper surface of the bearing body, can prevent the part of the edge of the wafer, which is provided with the photoresist, from directly contacting the limiting component, so that the actual bearing requirement in the process of carrying out the photoetching process on the wafer can be well met.
In practical application, the first part is set to be a cylinder and the second part is set to be a circular truncated cone by considering factors such as easiness in processing and easiness in installation.
In the embodiment of the present invention, an application scenario is as follows: the limiting component (also referred to as a novel guide post) at least comprises a first part which is arranged as a cylinder and a second part which is arranged as a circular truncated cone, as shown in fig. 5, the wafer carrying device comprises a carrying body 301 and a limiting component 302; wherein the content of the first and second substances,
when a wafer is disposed on the carrier body 301 during a photolithography process, the wafer is restricted from moving on the carrier body 301 by the limiting component 302.
The stopper member 302 includes: a first portion and a second portion; the bearing body is provided with a bearing body, the first part is a cylinder, the second part is a circular truncated cone, one cylindrical surface of the first part is arranged on the upper surface of the bearing body, and the other cylindrical surface is equal to the cylindrical surface with the larger area in the two cylindrical surfaces of the second part.
The stop member 302 comprises a first portion configured as a cylinder and a second portion configured as a truncated cone, it being understood by those skilled in the art that the first portion and the second portion are one piece, i.e. the first portion and the second portion have a common connecting surface.
Here, when the wafer is disposed on the carrier body 301, a surface of the wafer contacting the carrier body 301 is a back surface, which is an upper surface of the carrier body 301. The other cylindrical surface of the first part is equal to the larger cylindrical surface of the two cylindrical surfaces of the second part, which means that the cylindrical surface of the first part remote from the carrier body 301 and the cylindrical surface of the second part having the larger cylindrical surface have a common connection surface, i.e. the two cylindrical surfaces are flush-connected.
In practical applications, the thickness of the portion of the wafer edge covered by the photoresist is generally less than half of the wafer thickness, and in order to better ensure that the position limiting component does not contact the portion of the wafer edge where the photoresist exists, the height of the first portion may be defined to be less than half of the wafer thickness.
In practical applications, in order to reduce the probability of wafer dropping, the total height of the first portion and the second portion may be greater than the thickness of the wafer. In practical application, the size of the part, with the total height higher than the thickness of the wafer, of the first part and the second part can be adjusted according to practical experience values, and finally, the probability of falling of the wafer can be effectively reduced without hindering the taking and placing of the wafer.
In order to further prevent the wafer from falling, the limiting member 302 may further include a third portion of the cylinder on the basis of the first portion of the cylinder and the second portion of the circular truncated cone.
In view of this, in one embodiment, the position limiting member 302 further comprises a third portion; the third part is a cylinder, and the cylinder with the smaller area in the two cylinders of the second part is equal to the area of one cylinder of the third part.
The position limiting member 302 comprises a first portion configured as a cylinder, a second portion configured as a truncated cone, and a first portion configured as a cylinder, and it is understood by those skilled in the art that the first portion, the second portion, and the third portion are an integral body, i.e. the first portion, the second portion, and the third portion have a common connecting surface.
Here, when the wafer is disposed on the carrier body 301, a surface of the wafer contacting the carrier body 301 is a back surface, which is an upper surface of the carrier body 301. The other cylindrical surface of the first part is equal to the larger cylindrical surface of the two cylindrical surfaces of the second part, which means that the cylindrical surface of the first part remote from the carrier body 301 and the cylindrical surface of the second part having the larger cylindrical surface have a common connection surface, i.e. the two cylindrical surfaces are flush-connected.
In practical application, the structure of the limiting part 302, i.e. the novel guide post, is as shown in fig. 5, and adopts a configuration of a large cylinder, a circular truncated cone and a small cylinder, so that not only can direct contact between a wafer and a part of the edge of the wafer where photoresist exists be prevented, but also the wafer can be prevented from being lapped on the limiting part 302, and the actual bearing requirement in the process of carrying out the photoetching process on the wafer can be met.
In practical application, as shown in fig. 5, the position limiting component 302, i.e. the novel guide pillar, includes three sections: the first section is a cylinder with a larger diameter, and the top end of the cylindrical surface is lower than the median line of the side surface of the wafer; the second section is a circular truncated cone, the lower end of the conical surface is connected with the top end of the cylindrical surface, the upper end of the conical surface is slightly higher than the upper surface of the wafer in the vertical direction, and the conical surface is gradually far away from the edge of the wafer from bottom to top, so that excessive contact between the part and the wafer can be avoided, further, the upper half part of the edge of the wafer is prevented from colliding with or scratching the novel guide column to generate pollutants, and the pollutants are prevented from being brought into the wafer during development; the third section is a cylinder with a smaller diameter, the lower end of the third section is higher than the upper surface of the wafer and keeps enough height, and the wafer is prevented from falling off in the moving process of the conveying device.
In an embodiment, the position-limiting component 302 is fixed to the carrying body 301 by a threaded connection.
In practical application, as shown in fig. 5, the limiting part 302, i.e. the novel guide pillar, further includes a threaded connection portion, which is connected to the cylindrical surface of the first portion disposed on the bearing body; a threaded hole structure is arranged on the bearing body 301; the limiting component is arranged in the threaded hole structure through the threaded connecting part.
The embodiment of the invention provides a wafer bearing device, which comprises: the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process; the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the bearing body is provided with a bearing body, the first part is a cylinder, the second part is a circular truncated cone, one cylindrical surface of the first part is arranged on the upper surface of the bearing body, and the other cylindrical surface is equal to the cylindrical surface with the larger area in the two cylindrical surfaces of the second part. In the embodiment of the invention, in the photoetching process of the wafer, the shape of the limiting part is set into the shape of combining the special cylinder and the circular truncated cone, so that the collision between the wafer and the limiting part is generated at the bottom of the wafer, the defect problem caused by pollutants generated at the edge of the wafer is avoided, and the yield of the wafer is ensured; meanwhile, the wafer can be prevented from being lapped on the limiting component in the collision process of the wafer and the limiting component, so that the risk of uneven heating and cooling or falling of the wafer caused by the limiting component is reduced. In addition, on the premise that the wafer bearing device provided by the embodiment of the invention can well meet the actual bearing requirement in the photoetching process of the wafer, the normal work of a clamping wafer type glue spreading developing machine table can be ensured, so that the high cost caused by adopting an automatic wafer position calibration system is avoided.
It should be noted that: "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In addition, the technical solutions described in the embodiments of the present invention may be arbitrarily combined without conflict.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (9)
1. A wafer carrier apparatus, comprising:
the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process;
the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body; the second part is arranged on the first part, and the angle between the side face of the second part close to the wafer and the side face of the first part close to the wafer is larger than 90 degrees and smaller than 180 degrees so as to prevent the part of the edge of the wafer with the photoresist from being in direct contact with the limiting part;
the limiting component further comprises a third part; the third portion is arranged on the second portion, and the side face, close to the wafer, of the third portion is perpendicular to the upper surface of the bearing body.
2. The apparatus of claim 1, wherein the height of the first portion is less than half the thickness of the wafer.
3. The apparatus of claim 1, wherein a total height of the first portion and the second portion is greater than a thickness of the wafer.
4. The apparatus of claim 1, wherein the first portion is a cylinder and the second portion is a circular truncated cone, and one of the cylindrical surfaces of the first portion is disposed on the upper surface of the load bearing body, and the other cylindrical surface is equal to the larger of the two cylindrical surfaces of the second portion.
5. The device of claim 4, wherein the stop member further comprises a third portion; the third part is a cylinder, and the cylinder with the smaller area in the two cylinders of the second part is equal to the area of one cylinder of the third part.
6. The device of claim 1, wherein the stop member is threadably disposed on the carrier body.
7. The device of claim 6, wherein the stop member further comprises a threaded connection portion connected to a face of the first portion disposed on the carrier body; the bearing body is provided with a threaded hole structure; the limiting component is arranged in the threaded hole structure through the threaded connecting part.
8. The device of claim 1, wherein the number of the limiting members is 3 to 8.
9. Device according to claim 8, characterized in that the stop members are evenly distributed on the carrier body.
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| CN202010002190.6A CN111276428B (en) | 2020-01-02 | 2020-01-02 | Wafer bearing device |
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| CN202010002190.6A CN111276428B (en) | 2020-01-02 | 2020-01-02 | Wafer bearing device |
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| CN112820689B (en) * | 2021-01-06 | 2022-10-18 | 长鑫存储技术有限公司 | Floating pin, wafer bearing device and deposition equipment |
| CN112908920A (en) * | 2021-01-19 | 2021-06-04 | 深圳中科飞测科技股份有限公司 | Bearing device and semiconductor processing equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533529B (en) * | 2002-02-06 | 2003-05-21 | Silicon Integrated Sys Corp | Positioning device of automatic handler for testing integrated circuit |
| KR20040005359A (en) * | 2002-07-10 | 2004-01-16 | 주식회사 실리콘 테크 | Sensing apparatus for substrate loading ststus |
| CN1746776A (en) * | 2004-09-06 | 2006-03-15 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate positioning device |
| CN103515264A (en) * | 2012-06-26 | 2014-01-15 | 盛美半导体设备（上海）有限公司 | Detection apparatus and detection method for wafer position |
| CN105244303A (en) * | 2015-11-02 | 2016-01-13 | 南通富士通微电子股份有限公司 | Jig for chip packaging structure and workbench |
| CN105280537A (en) * | 2014-07-14 | 2016-01-27 | 西安永电电气有限责任公司 | Positioning device |
| CN106531679A (en) * | 2015-09-10 | 2017-03-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing device and reaction chamber |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
-
2020
- 2020-01-02 CN CN202010002190.6A patent/CN111276428B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533529B (en) * | 2002-02-06 | 2003-05-21 | Silicon Integrated Sys Corp | Positioning device of automatic handler for testing integrated circuit |
| KR20040005359A (en) * | 2002-07-10 | 2004-01-16 | 주식회사 실리콘 테크 | Sensing apparatus for substrate loading ststus |
| CN1746776A (en) * | 2004-09-06 | 2006-03-15 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate positioning device |
| CN103515264A (en) * | 2012-06-26 | 2014-01-15 | 盛美半导体设备（上海）有限公司 | Detection apparatus and detection method for wafer position |
| CN105280537A (en) * | 2014-07-14 | 2016-01-27 | 西安永电电气有限责任公司 | Positioning device |
| CN106531679A (en) * | 2015-09-10 | 2017-03-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Bearing device and reaction chamber |
| CN106558519A (en) * | 2015-09-25 | 2017-04-05 | 盛美半导体设备（上海）有限公司 | Whether wafer bearing device and inspection wafer place stable method |
| CN105244303A (en) * | 2015-11-02 | 2016-01-13 | 南通富士通微电子股份有限公司 | Jig for chip packaging structure and workbench |
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