533529 A7533529 A7
經濟部智慧財產局員工消費合作社印製 五、發明説明（） 發明領域： 本發明係有關於一種積體電路（lntegrated Circuit; Ic) 測試用之自動分類機（handler)的定位裝置。特別是有關於 將導梢（guide pins)依序自電路承載板（1〇ad b〇ard)和表面 黏著矩陣片（Surface Mount Matrix; SMM)框架元件的背面 頂出之自動分類機的定位裝置。 發明背景： 球格陣列（Ball Grid Array; BGA)的封裝方式係將銲錫 球以陣列型式平均分散在包裝底部的整個或部分面積之 中，如此可以增加積體電路接線的腳數，而不致有間距太 小的問題》因此，BGA的封裝方式經常被應用於製造高腳 數的1C元件。 ^ BGA元件製造完成之後，BGA元件必須經過電性測 试’以峰保BGA元件的品質。BGA元件的測試通常是使用 自動分類機來進行，而自動分類機的主要功用係用來提起 和放置（pick and place) BGA元件，及分類通過（pass)或失 敗的分箱（bin)裝置，自動分類機可為例如日本精工艾普生 (Seiko Epson)公司生產之型號NS5000的自動分類機。請參 照第1圖，第1圖為緣示習知之積體電路測試用之自動分 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ----.............-訂 (請先閲讀背面之注意事項再填寫本頁} 533529 五、發明説明（） ;員機的疋位裝置文裝在電路承載板的示意圖。自動分類機 將BGA元件自IC放置裝置（未繪示）提起後，再將bga 兀件送至插入底座110的上方，然後將BGA元件放入插入 底座no中，再藉由自動分類機的測試臂（test arm)下壓 bga元件，使BGA元件藉SMM與電路承載板ι〇〇接觸以 進行測試，電路承載板1〇〇再將所得之測試訊號傳至測試 機台。由於自動分類機係以自動模式來進行測試，自動分 類機和BGA元件的定位便非常重要，否則極易產生測試失 誤以及損壞BGA元件和測試設備等問題，故通常需要配備 有自動分類機的定位裝置來定位自動分類機和BGA元件。 自動分類機的定位裝置主要是靠兩組導梢來分別定位自動 分類機和待測試之BGA元件。 經濟部智慧財產局員工消費合作社印製 請繼續參照第1圖，習知之積體電路測試用之自動分 類機的定位裝置主要係由插入底座（socket base)110所組 成，其中插入底座110上安裝有一對第一導梢12〇和一對 第二導梢130,第一導梢120係用來定位輸送bga元件的 自動分類機（未繪示），而第二導梢13〇係用來定位bga元 件。而插入底座110之中心區域具有一開口 145 ,且此開 口 145的背面安裝有SMM 14〇β習知的1(：電性測試裝^ 係將具有測試電路的電路承載板100安裝在測試機台（未繪 示）上，其中電路承載板1〇〇朝測試機台的下表面安裝有— …+一………: 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533529 A7 B7Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention () Field of the invention: The present invention relates to a positioning device for an automatic sorter (handler) used for testing integrated circuits (ICs). In particular, it relates to a positioning device of an automatic sorting machine for sequentially pulling out guide pins from the back of a circuit carrier board (10ad b〇ard) and a surface mount matrix (SMM) frame element. . Background of the Invention: Ball Grid Array (BGA) packaging method uses solder balls to be evenly distributed throughout the entire or part of the bottom of the package in an array. This can increase the number of pins of the integrated circuit wiring without "Pitch too small" Therefore, the BGA packaging method is often used to make high pin count 1C components. ^ After the BGA device is manufactured, the BGA device must undergo electrical test 'to guarantee the quality of the BGA device. The testing of BGA components is usually carried out using an automatic sorting machine, and the main function of the automatic sorting machine is to pick and place BGA components, and to pass or fail the bin device, The automatic sorting machine may be, for example, an automatic sorting machine of model NS5000 manufactured by Seiko Epson, Japan. Please refer to Figure 1. Figure 1 shows the conventional paper size for automatic integrated circuit testing. It is applicable to China National Standard (CNS) A4 specification (210X297 mm) ----....... ......- Order (please read the precautions on the back before filling in this page) 533529 V. Description of the invention (); Schematic diagram of the positioning device of the passenger aircraft mounted on the circuit board. The automatic sorting machine will BGA components After the IC placement device (not shown) is lifted, the bga element is sent above the insertion base 110, and then the BGA component is inserted into the insertion base no, and then under the test arm of the automatic sorter Press the bga component to make the BGA component contact the circuit carrier board ιOO for testing by SMM, and the circuit carrier board 100 will pass the obtained test signal to the test machine. Because the automatic sorting machine performs the test in automatic mode The positioning of automatic classifiers and BGA components is very important, otherwise problems such as test errors and damage to BGA components and test equipment are extremely easy, so a positioning device equipped with an automatic classifier is usually required to locate the automatic classifier and BGA components. Positioning equipment of sorting machine Mainly rely on two sets of guide pins to locate the automatic sorter and the BGA component to be tested. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, please continue to refer to Figure 1, the positioning of the automatic sorter used in the test of the integrated circuit. The device is mainly composed of a socket base 110. A pair of first guide pins 120 and a pair of second guide pins 130 are installed on the socket base 110. The first guide pins 120 are used for positioning and conveying bga components. Automatic sorting machine (not shown), while the second guide pin 13 is used to locate the bga component. The center area of the insertion base 110 has an opening 145, and the back of this opening 145 is equipped with a SMM 14〇β 1 (: electrical test equipment) is a circuit carrier board 100 having a test circuit installed on a test machine (not shown), wherein the circuit carrier board 100 is installed toward the lower surface of the test machine—… + a ………: This paper size applies to China National Standard (CNS) A4 (210X297 mm) 533529 A7 B7
經濟部智慧財產局員工消費合作社印製 五、發明説明（） 100之與不具有電子電路元件的上表面上，並使開口 145 不具有SMM 140之表面朝上，藉以承接bga元件（未繪 示”所以SMM 140係位於BGA元件和電路承載板1〇〇之 間，藉以避免BGA元件下之銲錫球與電路承載板1〇〇直接 接觸，因而在測試時測試臂下壓BGA元件的動作中，銲錫 球和電路承載板100不致受到損害。 當BGA元件在做電性測試時，測試臂的下壓動作會使 BGA元件下方的銲錫球承受一定程度的·壓力，這壓力施加 在SMM上之後會影響SMM的使用壽命，也就是說，如SMM 所受的壓力太大，SMM的使用壽命便會縮短。而測試臂的 出力大小係隨著測試臂的工作行程而增加，即工作行程愈 長其所需之出力亦愈大。再加上工作行程愈長會使整個測 試過程的穩定性變差，因而降低測試的良率（yield)。 然而’如第1圖所示之自動分類機的定位裝置係安裝 在電路承載板100上，其中插入底座110的高度會增加測 試臂的工作行程，而使測試臂的出力必須增加。如上所述， 測試臂之工作行程和出力的增加會影響測試過程的穩定 性，降低測試的良率，更會縮短SMM的使用壽命，造成生 產成本的增加。 因此，非常迫切需要發展一種積體電路測試用之自動 .——.............itr......... (請先閲讀背面之注意事項再填寫本頁) 533529Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () 100 and the upper surface without electronic circuit components, and the surface of the opening 145 without SMM 140 facing up, to accept bga components (not shown) "So the SMM 140 is located between the BGA component and the circuit carrier board 100, in order to avoid the solder balls under the BGA component from directly contacting the circuit carrier board 100. Therefore, during the test, the test arm presses the BGA component. The solder ball and the circuit carrier board 100 will not be damaged. When the BGA component is being tested for electrical properties, the pressing action of the test arm will cause the solder ball under the BGA component to bear a certain degree of pressure. This pressure will be applied to the SMM. Affects the service life of the SMM, that is, if the pressure on the SMM is too large, the service life of the SMM will be shortened. The output of the test arm increases with the working stroke of the test arm, that is, the longer the working stroke The greater the required output, the longer the working stroke will make the stability of the entire test process worse, thereby reducing the yield of the test. However, 'as shown in Figure 1 The positioning device of the automatic sorting machine is installed on the circuit carrier board 100. The height of the insertion base 110 will increase the working stroke of the test arm, and the output force of the test arm must be increased. As described above, the working stroke and output of the test arm The increase will affect the stability of the test process, reduce the yield of the test, and shorten the service life of the SMM, resulting in an increase in production costs. Therefore, it is urgent to develop an automatic for integrated circuit testing .... .......... itr ......... (Please read the notes on the back before filling this page) 533529
五、發明説明( 分類機的定位裝置來取代習知之自動分類機的定位裝置， 以縮短測試臂的工作行程，來增加測試的穩定性，並使 SMM的受力減少，藉以提高測 的良率和延長SMM的使 用壽命。 發明目的及概述： 赛於上述之習知之自動公翻掩 目動刀類機的定位裝置係將插入底 座安裝在電路承載板上，其中插入底座的高度會增加測試 臂的工作行程而影響測試的穩定性，使得測試的良率降 低。另外，工作行程加長則須增加測試臂的出力，使得bga 元捧下之料球施加至SMM的壓力増加，目而減少smm 的使用壽命。 ----.....··裝........·-訂 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 因此，本發明的主要目的為提供一種積體電路測試用 之自動分類機的定位裝置，藉以取代習知之自動分類機的 定位裝置。本發明之自動分類機的定位裝置不使用插入底 座來安裝定位用之導梢，藉以縮短測試臂的工作行程，來 增加測試的穩定性，並由於工作行程變短而可減少測試臂 的出力，故可減少SMM的受力，因而提高測試的良率和延 長SMM的使用壽命。 根據以上所述之目的，本發明提供了一種積體電路測 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) i 533529 經濟部智慧財產局員工消費合作社印製 電路承載板 插入底座 A7 B7 五、發明説明（） 試用之自動分類機的定位裝置。本發明之自動分類機的定 位裝置係於承载板加固元件（load board stiffener)上安裝複 數個第一導梢和複數個第二導梢，例如2個第一導梢和2 個第二導梢，並使這些第一導梢和第二導梢依序自電路承 載板和SMM框架元件的背面頂出。其中第一導梢係用來定 位自動分類機；第二導梢係用來定位1C元件例如bgA元 件；而SMM框架元件之中心區域具有一開口，且此開口的 背面安裝有SMM，藉以固定SMM。 圈式簡單說明： '本發明的較佳實施例將於往後之說明文字中輔以下列 圖形做更詳細的闡述，其中： 第1圖為繪示習知之積體電路測試用之自動分類機的 定位裝置安裝在電路承載板的示意圖；以及 第2圖為繪示本發明之較佳實施例之積體電路測試用 之自動分類機的定位裝置的安裝示意圖。 圖统對照說明： 100 110 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) .... .....·裝.........-訂........Φ (請先閲if,?背面之注意事項再填寫本頁) 533529 經 濟 部 智 慧 財 產 局 員 X 消 費 合 社 印 製 A7 B7 五、發明説明（） 120 第一導梢 120a 第一 SMM孔 120b 第一導梢孔 130 第二導梢 130a 第二SMM孔 130b 第二導梢孔 140 SMM 145 、 345 開口 200 承載板加固元件 210 第一凹陷區域 220 第二凹陷區域 300 SMM框架元件 發明詳知說明： 本發明揭露一種積體電路測試用之自動分類機的定 裝置。請參照第2圖，第2圖為繪示本發明之較佳實施 之積體電路測試用之自動分類機的定位裝置的安裝示 圖。本發明之自動分類機的定位裝置至少包括：承載板 固70件200 ;複數個第一導梢120(例如·· 2個）安裝於承 板加固το件200上，藉以定位自動分類機；複數個第二 梢13〇(例如：2個）安裝於承載板加固元件200上，藉以 位1C元件例如BGA元件；在電路承载板100上設置與 本紙張尺度適用中國國家標準(CNS)Μ規格(21〇χ撕公爱） ...................•訂：.......蠢 (請先閲讀背面之注意事項再填寫本頁) 533529 A7 B7 五、發明説明（） 一導梢1 20相對應的複數個第一導梢孔1 20b和與第二導梢 130相對應的複數個第二導梢孔13 〇b，其中電路承載板1〇〇 係安裝於承載板加固元件200上，而第一導梢120和第二 導梢130係藉由第一導梢孔120b和第二導梢孔130b，從電 路承載板1〇〇具有電子電路元件的表面朝另一相反面頂 出；以及SMM框架元件300安裝於電路承載板1〇〇之不具 有電子電路元件的表面，其中SMM框架元件300的中心區 域具有一開口 345，藉以安裝SMM 140於開口 345的一表 面而使SMM 140暴露出來。SMM框架元件300的主要功 用係用來固定SMM 140» SMM框架元件300更具有與第一 導梢120相對應的複數個第一 SMM孔120a，和與第二導梢 130相對應的複數個第二SMM孔130a，使第一導梢120和 第二導梢130可藉由第一 SMM孔120a和第二SMM孔 130a，從SMM框架元件300具有SMM的表面朝另一相反 面頂出。另外，承載板加固元件200更至少包括：至少一 個第一凹陷區域210和至少一個第二凹陷區域220。第一凹 陷區域210的深度較淺，藉以容納電路承載板1〇〇的下表 面之高度較小的電子電路元件。而第二凹陷區域220的深 度較深，甚或可為洞孔，藉以容納電路承載板1〇〇的下表 面之兩度較大的電子電路元件。又，第一凹陷區域21〇亦 可為一較大區域，並使第二凹陷區域220位於其中。 值得一提的是，本發明如第2圖所示之各組成部分的 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) '-訂· # 經濟部智慧財產局員工消費合作社印製 533529V. Description of the invention (The positioning device of the classifier replaces the positioning device of the conventional automatic classifier to shorten the working stroke of the test arm, increase the stability of the test, and reduce the stress on the SMM, thereby improving the yield of the test. The purpose of the invention is to extend the service life of the SMM. The purpose of the invention is to locate the positioning device of the automatic public turning and blind-moving knife machine that is known above. The insertion base is installed on the circuit carrier board, and the height of the insertion base will increase the test arm. The working stroke affects the stability of the test, which reduces the yield of the test. In addition, the longer the working stroke, the greater the output of the test arm, which increases the pressure exerted by the ball held by the bga yuan on the SMM, thereby reducing the smm. Service life. ----..... · Installation .........- Order (please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The main purpose of the present invention is to provide a positioning device of an automatic classifier for integrated circuit testing, thereby replacing the positioning device of a conventional automatic classifier. The positioning device of the automatic classifier of the present invention By not using the insertion base to install the guide pins for positioning, thereby shortening the working stroke of the test arm to increase the stability of the test, and because the working stroke is shortened, the output of the test arm can be reduced, so the force of the SMM can be reduced. Therefore, the yield of the test is improved and the service life of the SMM is prolonged. According to the above-mentioned purpose, the present invention provides an integrated circuit test paper size applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) i 533529 Ministry of Economic Affairs The Intellectual Property Bureau employee consumer cooperative printed circuit carrier board is inserted into the base A7 B7 V. Description of the invention () Positioning device of the automatic classifier for trial use. The positioning device of the automatic classifier of the present invention is on the load board stiffener A plurality of first guide pins and a plurality of second guide pins, such as 2 first guide pins and 2 second guide pins, and make the first and second guide pins sequentially from the circuit carrier board and The back of the SMM frame element is ejected. The first guide pin is used to locate the automatic sorter; the second guide pin is used to locate 1C elements such as bgA elements; and among the SMM frame elements, The heart region has an opening, and an SMM is installed on the back of the opening to fix the SMM. The ring type is simply explained: 'The preferred embodiment of the present invention will be described in more detail in the following explanatory texts, Among them: FIG. 1 is a schematic diagram showing a conventional automatic sorter positioning device installed on a circuit carrier board for testing a conventional integrated circuit test; and FIG. 2 is a schematic diagram illustrating a integrated circuit test for a preferred embodiment of the present invention The installation diagram of the positioning device of the automatic sorting machine. The comparison of the drawings: 100 110 The paper size is applicable to the Chinese National Standard (CNS) A4 (210x297 mm) ..... .....- Order ........ Φ (Please read the notes on the back of if ,? before filling out this page) 533529 Member of Intellectual Property Bureau of Ministry of Economic Affairs X Printed by Consumer Cooperative A7 B7 V. Description of Invention (120) The first guide pin 120a, the first SMM hole 120b, the first guide pin hole 130, the second guide pin 130a, the second SMM hole 130b, and the second guide pin hole 140 SMM 145, 345. 220 Second recessed area 300 SMM frame element Detailed description of the invention: The present invention discloses a fixing device of an automatic classifier for integrated circuit testing. Please refer to FIG. 2. FIG. 2 is a diagram showing the installation of the positioning device of the automatic sorter for the integrated circuit test of the preferred embodiment of the present invention. The positioning device of the automatic sorting machine of the present invention includes at least: a load plate fixing 70 pieces 200; a plurality of first guide pins 120 (for example, · 2) are installed on the supporting plate reinforcement το piece 200, thereby positioning the automatic sorting machine; Two second pins 13 (for example, two) are installed on the carrier board reinforcing element 200, so that 1C elements such as BGA elements are installed; the circuit carrier board 100 is set to the Chinese paper standard (CNS) M specification (this standard applies to this paper) ( 21〇χTear public love) ......... Order: ....... Stupid (Please read the precautions on the back before filling this page) 533529 A7 B7 V. Description of the invention () A plurality of first guide pin holes 1 20b corresponding to a guide pin 1 20 and a plurality of second guide pin holes 13 〇b corresponding to the second guide pin 130, wherein the circuit bears The board 100 is mounted on the carrier board reinforcing element 200, and the first guide pin 120 and the second guide pin 130 are from the circuit carrier board 100 through the first guide pin hole 120b and the second guide pin hole 130b. The surface with the electronic circuit element protrudes toward the other opposite side; and the SMM frame element 300 is mounted on the circuit carrier board 100 without the electronic circuit element Surface, wherein the frame member SMM central area 300 has an opening 345, is mounted so as to SMM 140 in a surface of the opening 345 of the SMM 140 exposed. The main function of the SMM frame element 300 is to fix the SMM 140 ». The SMM frame element 300 further has a plurality of first SMM holes 120a corresponding to the first guide pin 120 and a plurality of first SMM holes corresponding to the second guide pin 130. The two SMM holes 130a enable the first and second guide pins 120 and 130 to be pushed out from the surface of the SMM frame element 300 having the SMM toward the opposite side through the first SMM hole 120a and the second SMM hole 130a. In addition, the carrier plate reinforcing element 200 further includes at least one first recessed area 210 and at least one second recessed area 220. The depth of the first recessed area 210 is relatively shallow, thereby accommodating electronic circuit components with a lower height on the lower surface of the circuit carrier board 100. The depth of the second recessed area 220 is deeper, or may even be a hole, to accommodate electronic circuit components that are two degrees below the circuit carrier board 100. In addition, the first recessed area 21 may be a larger area, and the second recessed area 220 is located therein. It is worth mentioning that the paper size of each component of the present invention as shown in Figure 2 is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) '-定 · # Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533529
五、發明說明（） 數目、形狀和尺寸等僅為舉例說明，本發明可因實際狀況 而有所調整，故本發明並不在此限。 經濟部智慧財產局員工消費合作社印製 転繼續參、照第2圖。如第2圖所示，本發明之自動分 類機的定位裝置組裝在電路承載板1〇〇時，由於不必使用 如第1圖所示之較厚的插入底座110，SMM 14〇上只有厚 度很小的SMM框架元件300 ,故測試臂的工作行程可大幅 縮短，例如：縮短約8公釐。另一方面，由於測試臂的工 作行程的大幅縮短，使測試臂的出力變小，故作用在BGA 元件下方之銲錫球的壓力亦大幅減少。當然，在BGA元件 下方之SMM在與BGA元件接觸時，SMM所受的壓力亦大 中田減少。以測試矽統科技所生產之型號73〇的晶片組為例， 型號730的晶片組上有672顆銲錫球，當使用如第i圖所 不之習知的自動分類機的定位裝置來進行測試時，每顆銲 錫球須承党約45公克的力方能通過測試，，672顆銲錫球總 共須承觉約30公斤的力；而當使用如第2圖所示之本發明 之自動分類機的定位裝置來進行測試時，每顆銲錫球則只 須承受約32公克的力便能通過測試，平均每顆銲錫球的受 力減少約13公克，#即減少大、約1/3的受力。目此，受銲 踢球撞擊之SMM的受力也隨之減少，&的使用壽命 估計可以增加約1/3。 綜合以上所述，本發明之優點為提供一種積艘電路測 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)V. Description of the invention () The number, shape, and size are merely examples, and the present invention may be adjusted according to actual conditions, so the present invention is not limited thereto. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs As shown in FIG. 2, when the positioning device of the automatic sorting machine of the present invention is assembled on the circuit carrier board 100, it is not necessary to use a thicker insertion base 110 as shown in FIG. Small SMM frame element 300, so the working stroke of the test arm can be greatly shortened, for example: shortened by about 8 mm. On the other hand, because the working stroke of the test arm is greatly shortened, the output force of the test arm is reduced, so the pressure of the solder ball under the BGA component is also greatly reduced. Of course, when the SMM under the BGA component is in contact with the BGA component, the pressure on the SMM is also greatly reduced. Take the test of chipset type 73 manufactured by SiS Technology as an example. There are 672 solder balls on the chipset type 730. When using the positioning device of a conventional automatic sorter as shown in Figure i for testing In order to pass the test, each solder ball must bear a force of about 45 grams, and a total of 672 solder balls must bear a force of about 30 kg. When using the automatic sorting machine of the present invention as shown in FIG. 2 When the positioning device is used for testing, each solder ball only needs to withstand about 32 grams of force to pass the test. The average stress of each solder ball is reduced by about 13 grams, # that reduces the large, about 1/3 of the force. For this reason, the force of the SMM impacted by the welding kick is also reduced, and the service life of the & is estimated to increase by about 1/3. In summary, the advantage of the present invention is to provide a building block circuit test. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)
533529 A7 B7 五、發明説明（） 試用之自動分類機的定位裝置。本發明可以取代習知之自 動分類機的定位裝置。由於本發明之自動分類機的定位裝 置不需使用插入底座來安裝第一導梢和第二導梢，故可縮 短測試臂的工作行程，使得測試的穩定性增加，減少測試 臂的出力而減少SMM的受力。因此，本發明之自動分類機 的定位裝置可以提高測試的良率和延長SMM的使用壽命。 如熟悉此而技術之人員所暸解的，以上所述僅為本發 明之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 ——·：：·.....囔........-訂：.......參 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製533529 A7 B7 V. Description of the invention () Positioning device of the automatic classification machine on trial. The invention can replace the positioning device of the conventional automatic classifier. Since the positioning device of the automatic sorting machine of the present invention does not need to use the insertion base to install the first and second guide pins, the working stroke of the test arm can be shortened, the test stability can be increased, and the output of the test arm can be reduced to reduce Force of SMM. Therefore, the positioning device of the automatic sorter of the present invention can improve the test yield and extend the service life of the SMM. As will be understood by those skilled in the art, the above descriptions are merely preferred embodiments of the present invention, and are not intended to limit the scope of patent application for the present invention; all others that are completed without departing from the spirit disclosed by the present invention Equivalent changes or modifications should be included in the scope of patent application described below. —— · :: · ..... 囔 ........- Order: ......... Refer to (Please read the notes on the back before filling out this page) Staff of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Consumer Cooperatives
^紙張尺度適用中國國家標準(CNS)A4規格(2!0X的7公釐)^ Paper size applies to Chinese National Standard (CNS) A4 (2 mm of 7 mm)