CN105244303A - Jig for chip packaging structure and workbench - Google Patents
Jig for chip packaging structure and workbench Download PDFInfo
- Publication number
- CN105244303A CN105244303A CN201510732094.6A CN201510732094A CN105244303A CN 105244303 A CN105244303 A CN 105244303A CN 201510732094 A CN201510732094 A CN 201510732094A CN 105244303 A CN105244303 A CN 105244303A
- Authority
- CN
- China
- Prior art keywords
- chip
- workbench
- annular protrusion
- hole
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention relates to a jig for a chip packaging structure and a workbench. The jig body is provided with a through hole for exposing a chip to be detected; an annular protrusion is formed at the edge of the through hole on a surface of the jig body; and a plurality of first positioning structures are arranged on the surface, where the annular protrusion is formed, of the jig body. The workbench is provided with a workbench surface, and the workbench surface is provided with a chip placing hole for placing the chip to be detected and second positioning structures matched with the first positioning structures of the jig for the chip packaging structure. The annular protrusion of the jig can be used for pressing against the chip, so that an operator does not need to press the warped chip with one hand and adjust the focal length of a lens with the other hand; the problem that the human pressing force cannot be controlled and the problems that the chip is crushed and the warped part is not flattened due to too high or too low pressure are solved. The jig and the workbench are used together to facilitate positioning; and a microscope can be directly placed on the workbench, so that the detection process is convenient and fast and does not damage the chip.
Description
Technical field
The present invention relates to chip detecting equipment, particularly relate to chip-packaging structure tool and workbench.
Background technology
Wafer level packaging product, after completing thinning process, can produce warpage (angularity is generally at 1mm-3mm) to a certain degree.And through back side brush coating, solidify, plant the operation such as ball, printing after, disk angularity can progressively increase.Especially complete after the disk back side prints, use coaxial microscope when entirely examining, because disk exists warpage, operator cannot accurately be focused, and needs to pin disk warped portion with hand, could be checked through print What completely and whether print position is correct.
Because coaxial microscope uses upper and lower camera lens, microscope carrier is that (its structure is two concentric plans to circular shape workbench: interior disk is glass surface, and its diameter is the same with 8 cun of disks, for placing disk; Outer disk is 6cm larger than interior circular diameter, and higher than interior disk, for the protection of interior disk inner circle sheet, prevents disk from moving.Disk is manually placed on microscope carrier by operator, and upper camera lens is single light source direct light, and lower camera lens is side light source scattered light, and disk is generally placed as and faces up, and the inspection of print What and position, by regulating the focal length of upper and lower camera lens, is carried out down in the back side.If disk exists warpage, operator need pin disk on the other hand, focuses on the other hand and carries out operation, affect checking efficiency.And because disk warped portion is by operator Manual press, there is pressing force and spend and cause greatly fragmentation risk.
Summary of the invention
Provide hereinafter about brief overview of the present invention, to provide about the basic comprehension in some of the present invention.Should be appreciated that this general introduction is not summarize about exhaustive of the present invention.It is not that intention determines key of the present invention or pith, and nor is it intended to limit the scope of the present invention.Its object is only provide some concept in simplified form, in this, as the preorder in greater detail discussed after a while.
The invention provides a kind of chip-packaging structure tool, comprise jig body, described jig body has through hole, exposes for chip to be detected; In the one side of described jig body, annular protrusion is set along described through hole edge; The one side of described annular protrusion is set in described jig body, is also provided with multiple first location structure.
On the other hand, the present invention also provides a kind of workbench, has work top, and described work top is provided with: chip putting hole, for placing chip to be detected; Second location structure, matches with the first location structure of said chip encapsulating structure tool.
At least one beneficial effect of the present invention is: the annular protrusion of tool may be used for mortgaging chip, and operator is without the need to pressing warpage disk on the other hand, and another hand also wants adjustable lens focal length; Also solve owing to artificially pressing dynamics this problem uncontrollable simultaneously, avoid because pressing strength is excessive or too small, the crushing disk caused and warped portion is not flattened problem.With above-mentioned workbench with the use of, convenient location, and this workbench directly can place microscope, make testing process convenient and swift, again can not defective chip.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of chip-packaging structure tool of the present invention;
Fig. 2 is the schematic diagram of workbench of the present invention;
Fig. 3 is the schematic diagram that tool of the present invention and workbench coordinate.
Reference numeral:
1-jig body; 11-through hole; 2-annular protrusion; 3-first location structure; 4-work top; 5-chip putting hole; 6-second positioner; 7-ledges.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.The element described in an accompanying drawing of the present invention or a kind of execution mode and feature can combine with the element shown in one or more other accompanying drawing or execution mode and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of unrelated to the invention, parts known to persons of ordinary skill in the art and process in illustrating.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not paying creative work, all belongs to the scope of protection of the invention.
In the following embodiment of the present invention, the sequence number of embodiment and/or sequencing are only convenient to describe, and do not represent the quality of embodiment.The description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiments.
The present invention discloses a kind of chip-packaging structure tool, jig body 1 has the through hole 11 exposed for chip to be detected, in the one side of this jig body, be formed with annular protrusion 2, this annular protrusion 2 is formed along the edge of above-mentioned through hole 11, and the object of this annular protrusion 2 is when checking chip, compresses chip, the part of warpage is recovered, to facilitate inspection.Forming the same face of this annular protrusion, be provided with the first detent mechanism 3, for giving this tool location.Optionally, annular protrusion is that acetal is made, and adopts this material to chip five wearing and tearing, can directly contact with chip surface.Certainly this is only as a kind of optional execution mode, and other materials also may be used for the present invention.
Optionally, the size of through hole can be generally 100-300mm, preferably 200mm, and the size of this size and chip is suitable, and chip can be made to expose, and certainly, this is only optional scheme, is not limited to the present invention.
In the optional execution mode of one, the first location structure is column-shaped projection, and the height of column-shaped projection is higher than described annular protrusion.In this embodiment, need with the use of workbench there is the hole corresponding with column-shaped projection.This is only a kind of optional execution mode, and such as this first detent mechanism also groove, the workbench matched is formed protruding coupling.Certainly, configuration mode or the matching way of other the first detent mechanism also may be used for the present invention, can to the positioning instant of tool as long as can realize.Optionally, column-shaped projection is irony cylindrical projection.
In one embodiment, the first location structure is three column-shaped projections, and three column-shaped projections are arranged around described annular protrusion uniformly.
On the other hand, the invention still further relates to a kind of workbench, have work top 4, work top is provided with: chip putting hole 5 and the second location structure 6, and wherein, chip putting hole is for placing chip to be detected; Second location structure and any one first location structure above-mentioned match.Such as the first location structure is columnar projections, then the second location structure is the groove matched with this columnar protrusions.
Optionally, chip putting hole is through hole, is formed in through-holes and protrudes platform 7, puts chip to be detected for holder.
The tool that the present invention is above-mentioned and workbench, be particularly suitable for using when using coaxial microscope detection chip.
Although last it is noted that described the present invention and advantage thereof in detail above, be to be understood that and can carry out various change when not exceeding the spirit and scope of the present invention limited by appended claim, substituting and converting.And scope of the present invention is not limited only to the specific embodiment of process, equipment, means, method and step described by specification.One of ordinary skilled in the art will readily appreciate that from disclosure of the present invention, can use perform the function substantially identical with corresponding embodiment described herein or obtain and its substantially identical result, existing and that will be developed in the future process, equipment, means, method or step according to the present invention.Therefore, appended claim is intended to comprise such process, equipment, means, method or step in their scope.
Claims (7)
1. a chip-packaging structure tool, is characterized in that,
Comprise jig body, described jig body has through hole, exposes for chip to be detected;
In the one side of described jig body, annular protrusion is set along described through hole edge;
The one side of described annular protrusion is set in described jig body, is also provided with multiple first location structure.
2. chip-packaging structure tool according to claim 1, is characterized in that,
Described first location structure is column-shaped projection, and the height of described column-shaped projection is higher than described annular protrusion.
3. chip-packaging structure tool according to claim 2, is characterized in that,
Described column-shaped projection is irony cylindrical projection.
4. the chip-packaging structure tool according to Claims 2 or 3, is characterized in that,
Described annular protrusion is that acetal is made.
5. the chip-packaging structure tool according to Claims 2 or 3, is characterized in that,
Described first location structure is three column-shaped projections, and three described column-shaped projections are arranged around described annular protrusion uniformly.
6. a workbench, is characterized in that,
Have work top, described work top is provided with:
Chip putting hole, for placing chip to be detected;
Second location structure, matches with the first location structure of chip-packaging structure tool described in any one of claim 1-5.
7. workbench according to claim 6, is characterized in that,
Described chip putting hole is through hole, is formed with protrusion platform in described through hole, puts chip to be detected for holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732094.6A CN105244303A (en) | 2015-11-02 | 2015-11-02 | Jig for chip packaging structure and workbench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732094.6A CN105244303A (en) | 2015-11-02 | 2015-11-02 | Jig for chip packaging structure and workbench |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105244303A true CN105244303A (en) | 2016-01-13 |
Family
ID=55041892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732094.6A Pending CN105244303A (en) | 2015-11-02 | 2015-11-02 | Jig for chip packaging structure and workbench |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105244303A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276428A (en) * | 2020-01-02 | 2020-06-12 | 长江存储科技有限责任公司 | Wafer bearing device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2483835Y (en) * | 2001-03-16 | 2002-03-27 | 矽统科技股份有限公司 | Register parts of holding unit of sequencer used for IC measurement |
| JP2005083863A (en) * | 2003-09-08 | 2005-03-31 | Kobe Steel Ltd | Electrical connection inspection device |
| CN2720624Y (en) * | 2004-08-17 | 2005-08-24 | 北京有色金属研究总院 | Large-area double-side supercnoductive film base-piece clamp |
| KR20070045059A (en) * | 2005-10-26 | 2007-05-02 | 삼성테크윈 주식회사 | Jig to measuring for laser power |
| CN203134773U (en) * | 2013-03-14 | 2013-08-14 | 欣兴电子股份有限公司 | Testing jig |
-
2015
- 2015-11-02 CN CN201510732094.6A patent/CN105244303A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2483835Y (en) * | 2001-03-16 | 2002-03-27 | 矽统科技股份有限公司 | Register parts of holding unit of sequencer used for IC measurement |
| JP2005083863A (en) * | 2003-09-08 | 2005-03-31 | Kobe Steel Ltd | Electrical connection inspection device |
| CN2720624Y (en) * | 2004-08-17 | 2005-08-24 | 北京有色金属研究总院 | Large-area double-side supercnoductive film base-piece clamp |
| KR20070045059A (en) * | 2005-10-26 | 2007-05-02 | 삼성테크윈 주식회사 | Jig to measuring for laser power |
| CN203134773U (en) * | 2013-03-14 | 2013-08-14 | 欣兴电子股份有限公司 | Testing jig |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276428A (en) * | 2020-01-02 | 2020-06-12 | 长江存储科技有限责任公司 | Wafer bearing device |
| CN111276428B (en) * | 2020-01-02 | 2021-07-06 | 长江存储科技有限责任公司 | Wafer bearing device |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
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| CB02 | Change of applicant information |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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| COR | Change of bibliographic data | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160113 |