CN109637928A - Remove the ancillary equipment and method of crystal column surface indigo plant film - Google Patents
Remove the ancillary equipment and method of crystal column surface indigo plant film Download PDFInfo
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- CN109637928A CN109637928A CN201811477128.1A CN201811477128A CN109637928A CN 109637928 A CN109637928 A CN 109637928A CN 201811477128 A CN201811477128 A CN 201811477128A CN 109637928 A CN109637928 A CN 109637928A
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- wafer
- column surface
- crystal column
- gas pipeline
- indigo plant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The present invention provides a kind of ancillary equipments and method for removing crystal column surface indigo plant film, belong to wafer fabrication techniques field, the ancillary equipment for removing crystal column surface indigo plant film includes vacuum generator, wafer-supporting platform, ultraviolet lamp, controller and pressure sensor, wafer-supporting platform is connect by first gas pipeline with vacuum generator, for adsorbing fixed wafer；Ultraviolet lamp is oppositely arranged with wafer-supporting platform, for irradiating the blue film of crystal column surface；Controller is electrically connected with ultraviolet lamp and vacuum generator respectively, for controlling the opening and closing of ultraviolet lamp and vacuum generator；Pressure sensor is arranged on first gas pipeline, is electrically connected with controller, for detecting the pressure in first gas pipeline and feeding back to controller.The ancillary equipment of removal crystal column surface indigo plant film provided by the invention, ultraviolet lamp reduce the separating difficulty of blue film and wafer, the destruction caused by wafer when avoiding removal indigo plant film for irradiating blue film to slacken the viscosity of blue film.
Description
Technical field
The invention belongs to wafer fabrication techniques fields, more specifically, be related to it is a kind of removal crystal column surface indigo plant film it is auxiliary
Help device and method.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
It is can be processed on wafer and is fabricated to various circuit component structures, become the IC products for having specific electrical functionality.
There are many chip and figure in the two sides of wafer, is generally made using wet corrosion technique or plating.It is brilliant in processing
When the figure of certain one side of circle, it is common practice to one layer of blue film is pasted in the another side of wafer, with blue film not needing processing
It protects on one side, makes the figure on the face from damage.After process finishing, need to remove blue film, and blue film usually with
Crystal column surface stickup is closer, this causes when removing blue film, it is easy to damage wafer.
Summary of the invention
The purpose of the present invention is to provide a kind of ancillary equipments for removing crystal column surface indigo plant film, to solve to deposit in the prior art
Removal indigo plant film when be easily damaged wafer the problem of.
To achieve the above object, the present invention provides a kind of ancillary equipment for removing crystal column surface indigo plant film, comprising:
Vacuum generator；
Wafer-supporting platform is connect, for adsorbing fixed wafer with the vacuum generator by first gas pipeline；
Ultraviolet lamp is oppositely arranged with the wafer-supporting platform, for irradiating the blue film of crystal column surface；
Controller is electrically connected with the ultraviolet lamp and the vacuum generator respectively, for control the ultraviolet lamp and
The opening and closing of the vacuum generator；
Pressure sensor is arranged on the first gas pipeline, is electrically connected with the controller, described for detecting
Pressure in first gas pipeline simultaneously feeds back to the controller.
Further, the wafer-supporting platform is equipped with several vacuum sucking holes being connected to the first gas pipeline.
Further, the vacuum sucking holes include that the first vacuum for adsorbing wafer being distributed on the first circumference is inhaled
Hole, the diameter of first circumference are less than brilliant diameter of a circle.
Further, the vacuum sucking holes further include that the second vacuum for adsorbing wafer being distributed on the second circumference is inhaled
Hole, second circumference and first circumferential concentric, the diameter of second circumference between first circumference diameter and
Between brilliant diameter of a circle.
Further, the wafer-supporting platform one side opposite with the ultraviolet lamp is equipped with the circle for accommodating crystal column surface tube core
Shape slot, the circular trough and second circumferential concentric, the diameter of the circular trough are less than the diameter of second circumference.
Further, the another side of the wafer-supporting platform be equipped with closed cylinder, the closed cylinder be equipped with for it is described
The interface of first gas pipeline connection.
Further, the ancillary equipment of the removal crystal column surface indigo plant film further include:
Gas source is connect by second gas pipeline with the first gas pipeline；
Solenoid valve is arranged on the second gas pipeline, is electrically connected with the controller.
The beneficial effect of the ancillary equipment of removal crystal column surface indigo plant film provided by the invention is: compared with the prior art,
The ancillary equipment of removal crystal column surface indigo plant film provided by the invention generates vacuum using vacuum generator, and holds piece by connection
Wafer is sucked vacuum handling to wafer-supporting platform the first gas pipeline of platform and vacuum generator, passes through pressure sensor detection the
Pressure in one gas pipeline is opened ultraviolet lamp and is irradiated to wafer, slacken wafer blueing film after pressure reaches setting value
Viscosity, blue film is removed using the method that manually tears later, so that achieving the purpose that can lossless, quick removal indigo plant film.
Another object of the present invention is to provide a kind of methods for removing crystal column surface indigo plant film, comprising:
Step 1: being fixed wafer using wafer-supporting platform, and the wafer-supporting platform connects vacuum generator by first gas pipeline,
The first gas pipeline is equipped with pressure sensor, and the pressure sensor and the vacuum generator are electric with controller respectively
Property connection；
Step 2: with the blue film of ultraviolet light irradiation crystal column surface；
Step 3: blue film is removed using the method manually torn.
Further, gas source is connected by second gas pipeline on first gas pipeline in said step 1, it is described
Solenoid valve is provided on second gas pipeline, the solenoid valve and the controller are electrically connected, when the detection of pressure sensor
When value is lower than setting value, vacuum generator is closed by controller, opens solenoid valve, tamper is blown out wafer-supporting platform by gas source.
Further, in step 2, ultraviolet lamp irradiation time is 10-30s.
The beneficial effect of the method for removal crystal column surface indigo plant film provided by the invention is: compared with the prior art, this hair
The method of the removal crystal column surface indigo plant film of bright offer, it is first blue with ultraviolet light irradiation before removal by the fixed wafer of wafer-supporting platform
Film slackens the viscosity of blue film, to reduce the separating difficulty of blue film and wafer, later uses the method that manually tears can be with
Easily blue film is removed while guaranteeing that wafer is intact.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the structural schematic diagram one of the ancillary equipment of removal crystal column surface indigo plant film provided in an embodiment of the present invention；
Fig. 2 is the cross-sectional view of the wafer-supporting platform of the ancillary equipment of removal crystal column surface indigo plant film provided in an embodiment of the present invention；
Fig. 3 is the partial enlarged view in Fig. 2 at A；
Fig. 4 is the top view of the wafer-supporting platform of the ancillary equipment of removal crystal column surface indigo plant film provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram two of the ancillary equipment of removal crystal column surface indigo plant film provided in an embodiment of the present invention.
Wherein, each appended drawing reference in figure:
1- vacuum generator；2- wafer-supporting platform；The first vacuum sucking holes of 21-；The first circumference of 211-；The second vacuum sucking holes of 22-；
The second circumference of 221-；23- circular trough；24- closed cylinder；241- interface；3- ultraviolet lamp；4- controller；5- first gas pipeline；
51- pressure sensor；6- gas source；7- second gas pipeline；71- solenoid valve；The first two-position three-way valve of 72-；73- the second two three
Port valve.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Refering to fig. 1, now the ancillary equipment of removal crystal column surface indigo plant film provided by the invention is illustrated.Remove wafer table
The ancillary equipment of face indigo plant film, including vacuum generator 1, wafer-supporting platform 2, ultraviolet lamp 3, controller 4 and pressure sensor 51, wafer-supporting platform
2 are connect by first gas pipeline 5 with vacuum generator 1, for adsorbing fixed wafer；Ultraviolet lamp 3 is opposite with wafer-supporting platform 2 to be set
It sets, for irradiating the blue film of crystal column surface；Controller 4 is electrically connected with ultraviolet lamp 3 and vacuum generator 1 respectively, for controlling
The opening and closing of ultraviolet lamp 3 and vacuum generator 1；Pressure sensor 51 is arranged on first gas pipeline 5, with controller 4
It is electrically connected, for detecting the pressure in first gas pipeline 5 and feeding back to controller 4.Optionally, using two ultraviolet lamps 3
The blue film of backside of wafer is irradiated, using the photodissociation principle of ultraviolet light, achievees the purpose that slacken, remove blue film viscosity.
The ancillary equipment of removal crystal column surface indigo plant film provided by the invention, compared with prior art, wafer-supporting platform 2 is for fixing
Wafer, ultraviolet lamp 3 is for irradiating blue film to slacken the viscosity of blue film, by rationally controlling irradiation time, slackens the viscosity of blue film,
The separating difficulty for reducing blue film and wafer, enables blue film relatively easily to remove from wafer.
A kind of specific embodiment of ancillary equipment as removal crystal column surface indigo plant film provided by the invention, wafer-supporting platform 2
It is equipped with several vacuum sucking holes being connected to first gas pipeline 5.Vacuum sucking holes are stepped hole, it is therefore an objective to increase wafer and true
Empty contact area, enables wafer to be firmly adsorbed on wafer-supporting platform 2.
A kind of specific embodiment of ancillary equipment as removal crystal column surface indigo plant film provided by the invention, refering to Fig. 2
To Fig. 4, vacuum sucking holes include the first vacuum sucking holes 21 for being used to adsorb wafer being distributed on the first circumference 211, the first circumference
211 diameter is less than brilliant diameter of a circle.
A kind of specific embodiment of ancillary equipment as removal crystal column surface indigo plant film provided by the invention, refering to Fig. 2
To Fig. 4, vacuum sucking holes further include the second vacuum sucking holes 22 for being used to adsorb wafer being distributed on the second circumference 221, the second circle
Week is 221 concentric with the first circumference 211, the diameter of the second circumference 221 between the first circumference 211 diameter and crystalline substance diameter of a circle it
Between.
A kind of specific embodiment of ancillary equipment as removal crystal column surface indigo plant film provided by the invention, refering to Fig. 2
And Fig. 3, the one side opposite with ultraviolet lamp 3 of wafer-supporting platform 2 are equipped with circular trough 23 for accommodating crystal column surface tube core, circular trough 23 with
Second circumference 221 with one heart, the diameter of the diameter of circular trough 23 less than the second circumference 221.Wafer adsorption is when on wafer-supporting platform 2, very
The tube core that empty adsorption capacity will lead to surface is squeezed and damages, and in addition during removing blue film, tube core also will receive sliding
Damage.The present invention wafer-supporting platform 2 center processing one circular trough 23, it is therefore an objective to keep the die sections of wafer hanging, from
It inhales the process of vacuum and removes and tube core is caused to damage in blue membrane process.
A kind of specific embodiment of ancillary equipment as removal crystal column surface indigo plant film provided by the invention, referring to Fig.2,
The another side of wafer-supporting platform 2 is equipped with closed cylinder 24, and closed cylinder 24 is equipped with the interface for connecting with first gas pipeline 5
241.Specifically, interface 241 is equipped with pipe screw thread, for connecting with first gas pipeline 5.
A kind of specific embodiment of ancillary equipment as removal crystal column surface indigo plant film provided by the invention, refering to fig. 1,
The ancillary equipment of removal crystal column surface indigo plant film further includes gas source 6 and solenoid valve 71, and gas source 6 passes through second gas pipeline 7 and first
Gas pipeline 5 connects；Solenoid valve 71 is arranged on second gas pipeline 7, is electrically connected with controller 4.Due to wet etching and
What electroplating technology came out is the wafer with liquid and residue, and first gas pipeline 5 can be blocked during vacuum suction, is made
Poor at vacuum adsorption force, wafer is easy to fall off damage.When 51 detected value of pressure sensor is lower than setting value, vacuum is closed
Device 1, opens simultaneously solenoid valve 71, and tamper can be blown out wafer-supporting platform 2 by gas source 6.Therefore, it can not only remove on dry wafer
Blue film, also can remove with chemical solution wafer on blue film.
Optionally, solenoid valve 71 can be two-position three-way valve.For example, by using a two-position three-way valve, it is named as first at this time
Two-position three-way valve 72, refering to Fig. 5, which connect with controller 4, the air inlet of the first two-position three-way valve 72
It is connected to wafer-supporting platform 2, two working interfaces of the first two-position three-way valve 72 are connected to gas source 6 and vacuum generator 1 respectively, are utilized
The working characteristics of two-position three-way valve can guarantee that vacuum generator and wafer-supporting platform are disconnected when gas source 6 is connected to wafer-supporting platform 2, protect
Demonstrate,prove the independent progress for vacuumizing and deflating.Since the first two-position three-way valve 72 is easy blocking, therefore can be in the first two-position three-way valve
Increase the second two-position three-way valve 73 for being electrically connected with controller 4 between 72 and vacuum generator 1, the second two-position three-way valve 73 into
Port is connected to wafer-supporting platform 2, and two working interfaces are communicated with gas source 6 and vacuum generator 1 respectively, when the first two-position three-way valve 72
When blocking, can control the second two-position three-way valve 73 connects gas source 6 and wafer-supporting platform 2, realizes to the first two-position three-way valve 72
Purging.The controller 4 of the application can be PLC controller, and quantity can be single or multiple, the controller 4 of the application
It is also possible to integrated manipulator such as CPU, integrated control cabinet etc..
Another object of the present invention is to provide a kind of methods for removing crystal column surface indigo plant film, comprising:
Step 1: being fixed wafer using wafer-supporting platform 2, and wafer-supporting platform 2 connects vacuum generator 1 by first gas pipeline 5,
First gas pipeline 5 is equipped with pressure sensor 51, and pressure sensor 51 and vacuum generator 1 electrically connect with controller 4 respectively
It connects；
Step 2: with the blue film of ultraviolet light irradiation crystal column surface；
Step 3: blue film is removed using the method manually torn.
A kind of specific embodiment of method as removal crystal column surface indigo plant film provided by the invention, in step 1
Gas source 6 is connected by second gas pipeline 7 on first gas pipeline 5, is provided with solenoid valve 71, electromagnetism on second gas pipeline 7
Valve 71 and controller 4 are electrically connected, and when the detected value of pressure sensor 51 is lower than setting value, close vacuum by controller 4
Generator 1, opens solenoid valve 71, and tamper is blown out wafer-supporting platform 2 by gas source 6.
A kind of specific embodiment of method as removal crystal column surface indigo plant film provided by the invention, it is purple in step 2
Outer 3 irradiation time of lamp is 10-30s.
It is illustrated below with reference to the course of work of the Fig. 1 to Fig. 4 to the ancillary equipment of removal crystal column surface indigo plant film.
Normal suction piece process: vacuum generator 1 is controlled by controller 4 and generates vacuum, and then generates wafer-supporting platform 2 very
Wafer is sucked in sky.If pressure sensor 51 is shown normally at this time, after opening the irradiation a period of time of ultraviolet lamp 3 by controller 4,
The viscosity of blue film is weaker, can easier remove blue film.
Improper suction piece process: it during above-mentioned normal suction piece, is set if the detected value of pressure sensor 51 is lower than
Definite value closes vacuum generator 1 by controller 4 at this time, opens solenoid valve 71, and tamper can be blown out wafer-supporting platform by gas source 6
2。
Deflation course: after removing blue film, needing to remove wafer, close vacuum generator 1 at this time, open solenoid valve 71,
Gas source 6 will enter wafer-supporting platform 2 by first gas pipeline 5, second gas pipeline 7, complete release.
A kind of specific embodiment of method as removal crystal column surface indigo plant film provided by the invention, solenoid valve 71 can be with
It is two-position three-way valve.For example, by using a two-position three-way valve, it is named as the first two-position three-way valve 72 at this time, refering to Fig. 5, this first
Two-position three-way valve 72 is connect with controller 4, and the air inlet of the first two-position three-way valve 72 is connected to wafer-supporting platform 2, the first two-bit triplet
Two working interfaces of valve 72 are connected to gas source 6 and vacuum generator 1 respectively, using the working characteristics of two-position three-way valve, work as gas
Source 6 can guarantee that vacuum generator and wafer-supporting platform disconnect when being connected to wafer-supporting platform 2, guarantee the independent progress for vacuumizing and deflating.
Due to the first two-position three-way valve 72 be easy blocking, therefore can increase between the first two-position three-way valve 72 and vacuum generator 1 and
The second two-position three-way valve 73 that controller 4 is electrically connected, the air inlet of the second two-position three-way valve 73 are connected to wafer-supporting platform 2, two works
Make interface to communicate with gas source 6 and vacuum generator 1 respectively, when the blocking of the first two-position three-way valve 72, can control the second two
Triple valve 73 connects gas source 6 and wafer-supporting platform 2, realizes the purging to the first two-position three-way valve 72.The controller 4 of the application can be with
It is PLC controller, quantity can be single or multiple, and the controller 4 of the application is also possible to integrated manipulator for example
CPU, integrated control cabinet etc..
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. removing the ancillary equipment of crystal column surface indigo plant film characterized by comprising
Vacuum generator；
Wafer-supporting platform is connect, for adsorbing fixed wafer with the vacuum generator by first gas pipeline；
Ultraviolet lamp is oppositely arranged with the wafer-supporting platform, for irradiating the blue film of crystal column surface；
Controller is electrically connected with the ultraviolet lamp and the vacuum generator respectively, for controlling the ultraviolet lamp and described
The opening and closing of vacuum generator；
Pressure sensor is arranged on the first gas pipeline, is electrically connected with the controller, for detecting described first
Pressure in gas pipeline simultaneously feeds back to the controller.
2. the ancillary equipment of removal crystal column surface indigo plant film as described in claim 1, which is characterized in that the wafer-supporting platform is equipped with
Several vacuum sucking holes being connected to the first gas pipeline.
3. the ancillary equipment of removal crystal column surface indigo plant film as claimed in claim 2, which is characterized in that the vacuum sucking holes include
The diameter of the first vacuum sucking holes for being used to adsorb wafer being distributed on the first circumference, first circumference is less than the straight of wafer
Diameter.
4. the ancillary equipment of removal crystal column surface indigo plant film as claimed in claim 3, which is characterized in that the vacuum sucking holes also wrap
The second vacuum sucking holes for being used to adsorb wafer being distributed on the second circumference are included, second circumference and first circumference are same
The heart, the diameter of second circumference is between the diameter and brilliant diameter of a circle of first circumference.
5. as claimed in claim 4 removal crystal column surface indigo plant film ancillary equipment, which is characterized in that the wafer-supporting platform with it is described
The opposite one side of ultraviolet lamp is equipped with the circular trough for accommodating crystal column surface tube core, and the circular trough and second circumference are same
The heart, the diameter of the circular trough are less than the diameter of second circumference.
6. as claimed in claim 5 removal crystal column surface indigo plant film ancillary equipment, which is characterized in that the wafer-supporting platform it is another
Face is equipped with closed cylinder, and the closed cylinder is equipped with the interface for connecting with the first gas pipeline.
7. the ancillary equipment of removal crystal column surface indigo plant film as described in claim 1, which is characterized in that the removal crystal column surface
The ancillary equipment of blue film further include:
Gas source is connect by second gas pipeline with the first gas pipeline；
Solenoid valve is arranged on the second gas pipeline, is electrically connected with the controller.
8. the method for removing crystal column surface indigo plant film characterized by comprising
Step 1: being fixed wafer using wafer-supporting platform, and the wafer-supporting platform connects vacuum generator by first gas pipeline, described
First gas pipeline is equipped with pressure sensor, and the pressure sensor and the vacuum generator electrically connect with controller respectively
It connects；
Step 2: with the blue film of ultraviolet light irradiation crystal column surface；
Step 3: blue film is removed using the method manually torn.
9. the method for removal crystal column surface indigo plant film as claimed in claim 8, which is characterized in that in said step 1 first
Gas source is connected by second gas pipeline on gas pipeline, is provided with solenoid valve, the solenoid valve on the second gas pipeline
It is electrically connected with the controller, when the detected value of pressure sensor is lower than setting value, vacuum is closed by controller
Device, opens solenoid valve, and tamper is blown out wafer-supporting platform by gas source.
10. the method for removal crystal column surface indigo plant film as claimed in claim 8, which is characterized in that in step 2, ultraviolet light irradiation
Time is 10-30s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811477128.1A CN109637928B (en) | 2018-12-05 | 2018-12-05 | Auxiliary equipment and method for removing blue film on surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811477128.1A CN109637928B (en) | 2018-12-05 | 2018-12-05 | Auxiliary equipment and method for removing blue film on surface of wafer |
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| CN109637928A true CN109637928A (en) | 2019-04-16 |
| CN109637928B CN109637928B (en) | 2021-04-06 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110790007A (en) * | 2019-10-14 | 2020-02-14 | 湖北光安伦科技有限公司 | Stripping and transferring device and method for Bar-shaped Bar of semiconductor laser |
| CN113571462A (en) * | 2021-07-12 | 2021-10-29 | 深圳市华星光电半导体显示技术有限公司 | Substrate bearing table and bearing device |
| CN114799488A (en) * | 2022-05-26 | 2022-07-29 | 卡门哈斯激光科技（苏州）有限公司 | Method for removing PET blue film of power battery with assistance of laser |
| WO2023036314A1 (en) * | 2021-09-10 | 2023-03-16 | 隆基绿能科技股份有限公司 | Demasking method for solar cell mask, and preparation method for solar cell |
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| CN106684025A (en) * | 2016-12-23 | 2017-05-17 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer positioning device |
| CN207367937U (en) * | 2017-11-15 | 2018-05-15 | 德淮半导体有限公司 | Wafer bonding device |
| CN108257851A (en) * | 2018-01-11 | 2018-07-06 | 上海华虹宏力半导体制造有限公司 | Wafer grinding method |
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| CN110790007A (en) * | 2019-10-14 | 2020-02-14 | 湖北光安伦科技有限公司 | Stripping and transferring device and method for Bar-shaped Bar of semiconductor laser |
| CN113571462A (en) * | 2021-07-12 | 2021-10-29 | 深圳市华星光电半导体显示技术有限公司 | Substrate bearing table and bearing device |
| WO2023036314A1 (en) * | 2021-09-10 | 2023-03-16 | 隆基绿能科技股份有限公司 | Demasking method for solar cell mask, and preparation method for solar cell |
| CN114799488A (en) * | 2022-05-26 | 2022-07-29 | 卡门哈斯激光科技（苏州）有限公司 | Method for removing PET blue film of power battery with assistance of laser |
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