CN109712906A - Wafer storage device with cleaning function and semiconductor production equipment - Google Patents
Wafer storage device with cleaning function and semiconductor production equipment Download PDFInfo
- Publication number
- CN109712906A CN109712906A CN201711009584.9A CN201711009584A CN109712906A CN 109712906 A CN109712906 A CN 109712906A CN 201711009584 A CN201711009584 A CN 201711009584A CN 109712906 A CN109712906 A CN 109712906A
- Authority
- CN
- China
- Prior art keywords
- air inlet
- wafer
- gas
- storage device
- inlet pipeline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 63
- 238000003860 storage Methods 0.000 title claims abstract description 51
- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000005192 partition Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000007789 gas Substances 0.000 claims description 84
- 230000003139 buffering effect Effects 0.000 claims description 27
- 238000012806 monitoring device Methods 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 10
- 238000010926 purge Methods 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 126
- 230000006870 function Effects 0.000 description 25
- 239000002184 metal Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer storage device with a cleaning function and semiconductor production equipment, wherein the wafer storage device with the cleaning function comprises: the buffer material storage rack and the cleaning system comprise a frame and a plurality of partition plates, wherein the partition plates are fixed on the frame and isolate a plurality of placing areas for placing wafer boxes in the frame; the cleaning system is arranged on the buffer storage rack and comprises an air inlet pipeline assembly and an air outlet pipeline assembly; one end of the air inlet pipeline component is communicated with the gas source, and the other end of the air inlet pipeline component is communicated with the air inlet; one end of the exhaust pipeline component is communicated with the exhaust port; the cleaning system is used for introducing cleaning gas into the wafer box so as to clean the interior of the wafer box. The invention can clean the interior of the wafer box temporarily stored in the buffer storage area in the semiconductor equipment between processes or batches so as to remove residual gas in the wafer box, thereby effectively preventing the wafer in the wafer box from being polluted.
Description
Technical field
The invention belongs to technical field of manufacturing semiconductors, more particularly to a kind of wafer storage device with cleaning function
And semiconductor production equipment.
Background technique
In the batch process (for example, the batch processing of diffusion technique) of existing semiconductor, between preceding, posterior segment, dress
The wafer cassette of wafer to be handled can be generally temporarily stored into the buffering storing area of batch processing equipment.However, not passing through one in wafer
After procedure, reaction gas, air and reaction can be remained for example after the process before diffusion technique, in wafer cassette and is generated
Gas etc., and the buffering storing area of existing batch processing equipment only serves the effect of temporary wafer cassette, it can not be to the crystalline substance
Circle box is cleaned to remove the gas of its internal residual.It is brilliant if the residual gas in the wafer cassette cannot be timely removed
After certain Q-time, residual gas can be polluted or be damaged to the wafer in the wafer cassette circle: as shown in Figure 1,
If remaining F in the wafer cassette-Or Cl-When, remaining F-Or Cl-Sour gas corruption can be generated by reacting with the aqueous vapor in air
The metal interconnecting layer 12 being connected with its inner metal layer 11 for losing semiconductor device surface in wafer, thus mutual in the metal
Join and form etching hole 13 in layer 12, and then influences the performance of semiconductor devices；As shown in Fig. 2, the residual gas in wafer cassette
The side for the metal connecting column 14 that can be connected with the metal layer 11 reacts, and in the side of the metal connecting column 14
Face forms sufficient shape defect 15, to influence the performance of semiconductor devices, wherein the metal connecting column 14 is located at dielectric layer 16
It is interior；As shown in figure 3, if remaining air in the wafer cassette, the contact surface of the metal layer 11 and the metal connecting column 14
It can be oxidized and form interface oxide layer 17, to influence the connection effect of the metal layer 11 and the metal connecting column 14.
In order to remove the residual gas in the wafer cassette, a kind of existing solution be will carry out a procedure or
The wafer cassette of one batch processed spreads out of semiconductor production equipment, is temporarily stored in specific storage region with to the wafer
Nitrogen is passed through in box to be cleaned.But this method needs to have carried out the wafer cassette after one procedure or a batch processed i.e.
Outflow semiconductor equipment is stored, and carries out that the wafer cassette is transmitted back to institute again when next process or next time batch processed
It states in semiconductor equipment, this undoubtedly will increase the interval time between process or batch, to influence production efficiency.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of wafers with cleaning function
Storage device and semiconductor production equipment, the buffering storing area for solving in semiconductor production equipment in the prior art can not
The problem of to cleaning inside wafer cassette placed thereon, not can be removed the residual gas in wafer cassette disposed thereon,
And keep in clearly to remove the residual gas in wafer cassette for wafer cassette outflow semiconductor equipment to particular memory region
The low problem of production efficiency caused by washing.
To achieve the above object and other related purposes, the present invention provide a kind of wafer storage dress with cleaning function
It sets, is located in semiconductor production equipment, for keeping in wafer cassette, the air inlet being connected with inside it is provided in the wafer cassette
Mouth and exhaust outlet,
The wafer storage device with cleaning function includes:
Material stock frame is buffered, including frame and several partitions, the partition are fixed on the frame, and in the frame
Several are inside isolated for placing the placement region of the wafer cassette；
Cleaning system is set on the buffering material stock frame, and the cleaning system includes air inlet pipeline component and exhaust pipe
Road component；One end of the air inlet pipeline component is connected with gas source, and the other end is connected with the air inlet；The exhaust
Pipeline assembly one end is connected with the exhaust outlet；The cleaning system is used to be passed through purge gas into the wafer cassette, with
To being cleaned inside the wafer cassette.
As a preferred solution of the present invention, the air inlet pipeline component includes air inlet port and air inlet pipeline；It is described
Air inlet port is set on each partition, and one end is connected with the air inlet, and the other end is connected with the air inlet pipeline；
The one end of the air inlet pipeline far from the air inlet port is connected with the gas source；
The gas exhaust piping component includes exhaust port and gas exhaust piping；The exhaust port is set to each partition
On, one end is connected with the exhaust outlet, and the other end is connected with the gas exhaust piping.
As a preferred solution of the present invention, the air inlet port includes nozzle of air supply or air inlet；The exhaust end
Mouth includes exhaust nozzle or gas vent.
As a preferred solution of the present invention, the air inlet port is correspondingly arranged up and down with the air inlet；The row
Gas port is correspondingly arranged up and down with the exhaust outlet.
As a preferred solution of the present invention, the air inlet pipeline includes main air inlet pipe road and several branch air inlet pipe
Road；Main air inlet pipe road one end is connected with the gas source, and the other end is connected with one end of each branch air inlet pipeline
It is logical；Each one end of the branch air inlet pipeline far from the main air inlet pipe road respectively with the air inlet port that is set on each partition
Correspond connection.
As a preferred solution of the present invention, the wafer storage device with cleaning function further include:
First flow monitoring device is set to the main air inlet pipe road, for the gas stream to the main air inlet pipe road
Amount is monitored；
Second flow monitoring device is set on each branch air inlet pipeline and the gas exhaust piping, for each described
The gas flow of gas flow and each wafer cassette of discharge in branch air inlet pipeline is monitored.
As a preferred solution of the present invention, the wafer storage device with cleaning function further includes alarm dress
It sets, the warning device is connected with the second flow monitoring device being set on each branch air inlet pipeline, is used for
Alarm is issued when the second flow monitoring device monitors the gas flow in the branch air inlet pipeline beyond setting value.
As a preferred solution of the present invention, the wafer storage device with cleaning function further includes the first pressure regulation
Valve, first pressure regulator valve are set to the main air inlet pipe road, gas flow and each institute suitable for the adjusting main air inlet pipe road
State the gas flow of branch air inlet pipeline.
As a preferred solution of the present invention, the wafer storage device with cleaning function further include:
Second pressure regulator valve is set on each branch air inlet pipeline；
Control device is connected with wafer detecting apparatus and second pressure regulator valve, is suitable for detecting dress according to the wafer
The wafer situation set in the wafer cassette of detection controls opening or closing for second pressure regulator valve.
As a preferred solution of the present invention, when the wafer detecting apparatus detects in the wafer cassette without wafer
Or the wafer in the wafer cassette, when being virtual wafer, the control device controls second pressure regulator valve and closes, to stop pair
Gas is passed through in the wafer cassette.
As a preferred solution of the present invention, the gas source is source nitrogen.
The present invention also provides a kind of semiconductor production equipment, the semiconductor production equipment includes:
Storing area is buffered, is provided in the buffering storing area there is cleaning function as described in above-mentioned either a program
Wafer storage device；
Wafer loading zone has load interlocking vacuum plant；The wafer loading zone is connected to the buffering storing area；
Batch type DIFFUSION TREATMENT chamber is connected to the wafer loading zone.
As described above, the wafer storage device and semiconductor production equipment provided by the invention with cleaning function, has
Below the utility model has the advantages that the present invention passes through the wafer with cleaning function in the buffering storing area being located in semiconductor production equipment
Storage device, can be between process or between batch in semiconductor equipment by the way that cleaning system is arranged on buffering material stock frame
Buffering storing area to being cleaned inside temporary wafer cassette, to remove the residual gas in wafer cassette, so as to effective
It prevents from polluting the wafer in wafer cassette, grain defect and oxide skin(coating) will not be generated in the crystal column surface in wafer cassette；
Further, since not needing that wafer cassette inside can be cleaned wafer cassette outflow semiconductor production equipment, work can be shortened
Interval time between sequence or between batch, to improve production efficiency.
Detailed description of the invention
Fig. 1 is shown as being formed with the structural schematic diagram of etching hole in interconnection metal in the prior art.
Fig. 2 is shown as the structural schematic diagram that metal connecting column in the prior art surface is formed with sufficient shape defect.
The contact surface that Fig. 3 is shown as metal connecting column and metal layer in the prior art is formed with the structure of interface oxide layer
Schematic diagram.
Fig. 4 is shown as the structural representation of the wafer storage device with cleaning function provided in the embodiment of the present invention one
Figure.
The structure that the wafer cassette that Fig. 5 is shown as providing in the embodiment of the present invention one is placed on the partition of buffering material stock frame is shown
It is intended to.
Fig. 6 is shown as the partial structural diagram of the semiconductor production equipment provided in the embodiment of the present invention two.
Reference numerals explanation
11 metal layer, 12 interconnection metal
13 etching 14 metal connecting columns of hole
15 sufficient 16 dielectric layers of shape defect
17 interface oxide layers
2 wafer storage devices
20 buffering storage racks
201 frame, 202 partition
203 air inlet port, 204 exhaust port
21 cleaning systems
211 air inlet pipeline components
2111 air inlet pipeline, 2112 main air inlet pipe road
2113 air inlet pipelines
212 gas exhaust piping component, 2121 gas exhaust piping
205 first flow monitoring device, 206 second flow monitoring device
207 first pressure regulator valve, 208 second pressure regulator valve
30 wafer cassettes
31 air inlet, 32 exhaust outlet
4 semiconductor production equipments
40 buffering stockpiling areas
41 wafer loading zone, 42 batch type DIFFUSION TREATMENT chamber
43 load interlocking 44 cassettes of vacuum plant
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Disclosed content understands further advantage and effect of the invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Please refer to fig. 4 to fig. 6.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, though only show in diagram with related component in the present invention rather than package count when according to actual implementation
Mesh, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind, and its
Assembly layout form may also be increasingly complex.
Embodiment one
Fig. 4 and Fig. 5 is please referred to, the present invention provides a kind of wafer storage device with cleaning function, described to have cleaning
The wafer storage device of function is located in semiconductor production equipment, for keeping in wafer cassette 30, is arranged in the wafer cassette 30
There are the air inlet 31 and exhaust outlet 32 being connected with inside it；The wafer storage device with cleaning function includes: buffering
Material stock frame 20 and cleaning system 21, wherein the buffering material stock frame 20 includes frame 201 and several partitions 202, the partition
202 are fixed on the frame 201, and isolate several for placing putting for the wafer cassette 30 in the frame 201
Set region；The wafer cassette 30 is placed on the partition 202；The cleaning system 21 is set to the buffering material stock frame 20
On, the cleaning system 21 includes air inlet pipeline component 211 and gas exhaust piping component 212；The air inlet pipeline component 2111
One end is connected with gas source 213, and the other end is connected with the air inlet 31；Described 212 one end of gas exhaust piping component and institute
Exhaust outlet 32 is stated to be connected；The cleaning system 21 is for being passed through purge gas into the wafer cassette 30, to the wafer
It is cleaned inside box 30.
As an example, the semiconductor production equipment can be but be not limited only to batch type processing equipment, it is preferable that this reality
It applies in example, the semiconductor production equipment is the batch processing equipment of diffusion technique.
It should be noted that for the ease of display, on the partition 202 in the buffering storage rack 20 in Fig. 4 simultaneously
The wafer cassette 30 is not placed.
As an example, the air inlet pipeline component 211 includes air inlet port 203 and air inlet pipeline 2111；The inlet end
Mouth 203 is set on each partition 202, and one end is connected with the air inlet 31, the other end and the air inlet pipeline 2111
It is connected；The air inlet pipeline 2111 is connected far from one end of the air inlet port 203 with the gas source；The exhaust pipe
Road component 212 includes exhaust port 204 and gas exhaust piping 2121；The exhaust port 204 is set on each partition 202,
One end is connected with the exhaust outlet 32, and the other end is connected with the gas exhaust piping 2121.
In one example, the air inlet port 203 is a nozzle of air supply, and the nozzle of air supply is from the bottom of the partition 202
The partition 202 is run through in portion, to ensure that the upper end of the nozzle of air supply is located at the top of the partition 202；The nozzle of air supply
Spout be connected with the air inlet 31, can be inserted into the air inlet 31 for the spout of the nozzle of air supply, it is described into
The other end of gas jets is connected with the air inlet pipeline 2111.The exhaust port 204 is an exhaust nozzle, the exhaust spray
Mouth runs through the partition 202 from the bottom of the partition 202, to ensure that the upper end of the exhaust nozzle is located at the partition 202
Top；The spout of the exhaust nozzle is connected with the exhaust outlet 32, can be inserted into institute for the spout of the exhaust nozzle
It states in exhaust outlet 32, the other end of the exhaust nozzle is connected with the gas exhaust piping 2121.
In another example, the air inlet port 203 is an air inlet；The exhaust port 204 is a gas vent.
As an example, the air inlet port 203 is correspondingly arranged with about 31 air inlet, i.e., the described air inlet port 203
When for air inlet, after the wafer cassette 30 is placed on the partition 202, the air inlet port 203 and the air inlet 31
Corresponding fitting up and down；The exhaust port 204 is correspondingly arranged with about 32 exhaust outlet, i.e., the described exhaust port 204 is row
When stomata, after the wafer cassette 30 is placed on the partition 202, the exhaust port 204 and about 32 exhaust outlet
Corresponding fitting.
As an example, as shown in figure 4, the air inlet pipeline 2111 includes main air inlet pipe road 2112 and several branch air inlet pipe
Road 2113；Described 2112 one end of main air inlet pipe road is connected with the gas source, the other end and each branch air inlet pipeline 2113
One end be connected；Each one end of the branch air inlet pipeline 2113 far from the main air inlet pipe road 2112 respectively be set to it is each
Air inlet port 203 on the partition 202 corresponds connection.
As an example, using the quantity of the branch air inlet pipeline 2113 and the air inlet port 203 being 8 as showing in Fig. 4
Example, but not as example in actual example.
It should be noted that the branch air inlet pipeline 2113 in Fig. 4 is far from the main air inlet pipe road for the ease of display
2112 one end is not shown to be connected with the air inlet port 203, is only illustrated outside the frame 201 in Fig. 4
The part of the part of the branch air inlet pipeline 2113, the branch air inlet pipeline 2113 in the frame 201 do not show that,
In practical structures, the branch air inlet pipeline 2113 extends to the frame 201 far from the one end on the main air inlet pipe road 2112
It is interior, and be connected with the air inlet port 203.
It should be further noted that only illustrating the institute outside the frame 201 in Fig. 4 for the ease of display
The part of the part for stating gas exhaust piping 2121, the gas exhaust piping 2121 in the frame 201 does not show that, in reality
In structure, the gas exhaust piping 2121 extends in the frame 201 close to one end of the frame 201, and with the row
Gas port 204 is connected.
As an example, the wafer storage device with cleaning function further include: first flow monitoring device 205, institute
It states first flow monitoring device 205 to be set on the main air inlet pipe road 2112, for the gas to the main air inlet pipe road 2112
Body flow is monitored；Second flow monitoring device 206, the second flow monitoring device 206 are set to each Zhi Jinqi
On pipeline 2113 and the gas exhaust piping 2121, for in each branch air inlet pipeline 2113 gas flow and each institute of discharge
The gas flow for stating wafer cassette 30 is monitored.
As an example, the wafer storage device with cleaning function further includes warning device 209, the warning device
209 are connected with the second flow monitoring device 206 being set on each branch air inlet pipeline 2113, for described the
Alarm is issued when two flow monitoring devices 206 monitor the gas flow in the branch air inlet pipeline 2113 beyond setting value.
As an example, the wafer storage device with cleaning function further includes the first pressure regulator valve 207, described first is adjusted
Pressure valve 207 is set to the main air inlet pipe road 2112, suitable for adjusting the gas flow on the main air inlet pipe road 2112 and each described
The gas flow of branch air inlet pipeline 2113.
As an example, the wafer storage device with cleaning function further include: the second pressure regulator valve 208, described second
Regulating valve 208 is set on each branch air inlet pipeline 2113；Control device 210, the control device 210 are filled with wafer detection
It sets (not shown) and second pressure regulator valve 208 is connected, suitable for the wafer cassette detected according to the wafer detecting apparatus
Wafer situation in 30 controls opening or closing for second pressure regulator valve 208.Specifically, when the wafer detecting apparatus detects
When without the wafer in wafer or the wafer cassette 30 being virtual wafer in the wafer cassette 30, the control device 210 is controlled
It makes second pressure regulator valve 208 to close, to stop being passed through gas into the wafer cassette 30.I.e. in the wafer cassette 30 without wafer or
When for virtual wafer, second pressure regulator valve 208 is closed, purge gas is not passed through into the wafer cassette 30 and is cleaned.
As an example, the gas source 213 is source nitrogen, that is, the purge gas being passed through in the wafer cassette 30 is nitrogen.
Certainly, in other examples, the gas source 213 can also be inert gas source etc..
It should be noted that dotted arrow in Fig. 5 indicates the flow direction of purge gas, i.e., the described purge gas is from institute
Air inlet 31 is stated to enter in the wafer cassette 30 to cleaning inside the wafer cassette 30, then, the purge gas with
Residual gas in the wafer cassette 30 is discharged except the wafer cassette 30 from the exhaust outlet 32.
Embodiment two
Referring to Fig. 6, the semiconductor production equipment 4 is batch type the present invention also provides a kind of semiconductor production equipment 4
Processing equipment, it is preferable that in the present embodiment, the semiconductor production equipment 4 is the batch processing equipment of diffusion technique, described partly to lead
Body production equipment 4 includes: buffering storing area 40, and being provided in the buffering storing area 40 has clearly as described in embodiment one
Wash the wafer storage device of function；Wafer loading zone 41, the wafer loading zone 41 have load interlocking vacuum plant 43；It is described
Wafer loading zone 41 is connected to the buffering storing area 40；Batch type DIFFUSION TREATMENT chamber 42, the batch type DIFFUSION TREATMENT chamber
Room 42 is connected to the wafer loading zone 41.
As an example, the semiconductor production equipment 4 further includes cassette 44, the cassette 44 is located at the wafer loading zone
In 41, for loading wafer cassette 30；The cassette 41 can be in the wafer loading zone 41 and the batch type DIFFUSION TREATMENT chamber
It is transmitted back and forth between 42.
In conclusion the present invention provides a kind of wafer storage device and semiconductor production equipment with cleaning function, institute
It states the wafer storage device with cleaning function to be located in semiconductor production equipment, for keeping in wafer cassette, in the wafer cassette
It is provided with the air inlet and exhaust outlet being connected with inside it, the wafer storage device with cleaning function includes: buffering
Material stock frame, including frame and several partitions, the partition are fixed on the frame, and are isolated in the frame several
A placement region for being used to place the wafer cassette；Cleaning system, the cleaning system are set on the buffering material stock frame, institute
Stating cleaning system includes air inlet pipeline component and gas exhaust piping component；One end of the air inlet pipeline component is connected with gas source
Logical, the other end is connected with the air inlet；Gas exhaust piping component one end is connected with the exhaust outlet；The cleaning system
System is for being passed through purge gas into the wafer cassette, with to cleaning inside the wafer cassette.The present invention is by being located at
The wafer storage device with cleaning function of buffering storing area in semiconductor production equipment on buffering material stock frame by setting
Set cleaning system, can buffering storing area between process or between batch in semiconductor equipment in temporary wafer cassette
Portion is cleaned, to remove the residual gas in wafer cassette, so as to effectively prevent polluting the wafer in wafer cassette,
Grain defect and oxide skin(coating) will not be generated in the crystal column surface in wafer cassette；Further, since not needing wafer cassette spreading out of half
Conductor production equipment can clean wafer cassette inside, can shorten the interval time between process or between batch, from
And improve production efficiency.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (12)
1. a kind of wafer storage device with cleaning function is located in semiconductor production equipment, described for keeping in wafer cassette
The air inlet and exhaust outlet being connected with inside it are provided in wafer cassette, which is characterized in that the wafer storage device includes:
Buffer material stock frame, including frame and several partitions, the partition be fixed on the frame, and in the frame every
Several are separated out for placing the placement region of the wafer cassette；And
Cleaning system is set on the buffering material stock frame, and the cleaning system includes air inlet pipeline component and gas exhaust piping group
Part；One end of the air inlet pipeline component is connected with gas source, and the other end is connected with the air inlet；The gas exhaust piping
Component one end is connected with the exhaust outlet；The cleaning system is for being passed through purge gas into the wafer cassette, to institute
It states and is cleaned inside wafer cassette.
2. the wafer storage device according to claim 1 with cleaning function, which is characterized in that
The air inlet pipeline component includes air inlet port and air inlet pipeline；The air inlet port is set on each partition, and one
End is connected with the air inlet, and the other end is connected with the air inlet pipeline；The air inlet pipeline is far from the air inlet port
One end be connected with the gas source；
The gas exhaust piping component includes exhaust port and gas exhaust piping；The exhaust port is set on each partition, and one
End is connected with the exhaust outlet, and the other end is connected with the gas exhaust piping.
3. the wafer storage device according to claim 2 with cleaning function, which is characterized in that the air inlet port packet
Include nozzle of air supply or air inlet；The exhaust port includes exhaust nozzle or gas vent.
4. the wafer storage device according to claim 2 with cleaning function, which is characterized in that the air inlet port with
The air inlet is correspondingly arranged up and down；The exhaust port is correspondingly arranged up and down with the exhaust outlet.
5. the wafer storage device according to claim 2 with cleaning function, which is characterized in that the air inlet pipeline packet
Include main air inlet pipe road and several branch air inlet pipelines；Main air inlet pipe road one end is connected with the gas source, the other end with
One end of each branch air inlet pipeline is connected；Each one end of the branch air inlet pipeline far from the main air inlet pipe road respectively with
The air inlet port being set on each partition corresponds connection.
6. the wafer storage device according to claim 5 with cleaning function, which is characterized in that the wafer storage dress
It sets further include:
First flow monitoring device is set to main air inlet pipe road, for the gas flow to the main air inlet pipe road into
Row monitoring；And
Second flow monitoring device is set on each branch air inlet pipeline and the gas exhaust piping, for each branch into
The gas flow of gas flow and each wafer cassette of discharge in air pipe is monitored.
7. the wafer storage device according to claim 6 with cleaning function, which is characterized in that the wafer storage dress
Setting further includes warning device, the warning device and the second flow monitoring device being set on each branch air inlet pipeline
It is connected, for monitoring the gas flow in the branch air inlet pipeline beyond setting value in the second flow monitoring device
When issue alarm.
8. the wafer storage device according to claim 5 with cleaning function, which is characterized in that the wafer storage dress
Setting further includes the first pressure regulator valve, and first pressure regulator valve is set to the main air inlet pipe road, is suitable for adjusting the main air inlet pipe road
Gas flow and each branch air inlet pipeline gas flow.
9. the wafer storage device according to claim 8 with cleaning function, which is characterized in that the wafer storage dress
It sets further include:
Second pressure regulator valve is set on each branch air inlet pipeline；And
Control device is connected with wafer detecting apparatus and second pressure regulator valve, is suitable for examining according to the wafer detecting apparatus
The wafer situation in the wafer cassette surveyed controls opening or closing for second pressure regulator valve.
10. the wafer storage device according to claim 9 with cleaning function, which is characterized in that when the wafer is examined
Survey device detect in the wafer cassette without the wafer in wafer or the wafer cassette be virtual wafer when, the control device
It controls second pressure regulator valve to close, to stop to being passed through gas in the wafer cassette.
11. the wafer storage device according to any one of claim 1 to 10 with cleaning function, which is characterized in that
The gas source is source nitrogen.
12. a kind of semiconductor production equipment, which is characterized in that the semiconductor production equipment includes:
Storing area is buffered, the wafer as described in claim 1 with cleaning function is provided in the buffering storing area and stores
Device；
Wafer loading zone, has load interlocking vacuum plant, and the wafer loading zone is connected to the buffering storing area；And
Batch type DIFFUSION TREATMENT chamber is connected to the wafer loading zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711009584.9A CN109712906B (en) | 2017-10-25 | 2017-10-25 | Wafer storage device with cleaning function and semiconductor production equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711009584.9A CN109712906B (en) | 2017-10-25 | 2017-10-25 | Wafer storage device with cleaning function and semiconductor production equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109712906A true CN109712906A (en) | 2019-05-03 |
| CN109712906B CN109712906B (en) | 2021-05-11 |
Family
ID=66252025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711009584.9A Active CN109712906B (en) | 2017-10-25 | 2017-10-25 | Wafer storage device with cleaning function and semiconductor production equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109712906B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112509941A (en) * | 2020-11-09 | 2021-03-16 | 广州粤芯半导体技术有限公司 | Method and device for improving corrosion defect of aluminum etching process |
| CN113451183A (en) * | 2020-06-03 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | Wafer box |
| CN113871282A (en) * | 2021-09-26 | 2021-12-31 | 长鑫存储技术有限公司 | Gas removal equipment, method, device, control system and storage medium |
| CN114623862A (en) * | 2020-12-11 | 2022-06-14 | 中国科学院微电子研究所 | Semiconductor measuring equipment and cleaning method |
| CN117133691A (en) * | 2023-10-25 | 2023-11-28 | 江苏芯梦半导体设备有限公司 | Environment detection method, detection device and cleaning equipment for wafer box after cleaning |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1035574A1 (en) * | 1997-11-28 | 2000-09-13 | Ebara Corporation | Box for transferring semiconductor wafer |
| CN1307326A (en) * | 2000-01-26 | 2001-08-08 | 三菱电机株式会社 | Device and method for manufacture of liquid crystal display |
| TW200413113A (en) * | 2003-01-17 | 2004-08-01 | Chinese United Semiconductor Equipment Mfg Inc | Automatic spraying and blowing clean device of wafer box base |
| CN1536639A (en) * | 2003-04-03 | 2004-10-13 | 力晶半导体股份有限公司 | Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution |
| CN1630930A (en) * | 2001-05-17 | 2005-06-22 | 株式会社荏原制作所 | Substrate transport container |
| CN201601119U (en) * | 2010-01-18 | 2010-10-06 | 北京七星华创电子股份有限公司 | Storing and transportation system of wafer storing box |
| CN202163829U (en) * | 2011-07-25 | 2012-03-14 | 浙江思博恩新材料科技有限公司 | Silicon sheet carrying device |
| CN103170469A (en) * | 2011-12-22 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | Device and method for cleaning and drying wafer cassettes |
| CN104241174A (en) * | 2013-06-14 | 2014-12-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Film magazine chamber, plasma processing device and method for purging film magazine chamber |
| CN104253073A (en) * | 2013-06-28 | 2014-12-31 | 株式会社日立国际电气 | Substrate processing apparatus, method of manufacturing semiconductor device and flow monitoring method |
| CN204257606U (en) * | 2014-12-25 | 2015-04-08 | 上海集成电路研发中心有限公司 | A kind of nitrogen filling device of wafer cabinet |
| CN106505023A (en) * | 2015-09-08 | 2017-03-15 | 古震维 | A kind of with the wafer handler for blowing off function |
-
2017
- 2017-10-25 CN CN201711009584.9A patent/CN109712906B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1035574A1 (en) * | 1997-11-28 | 2000-09-13 | Ebara Corporation | Box for transferring semiconductor wafer |
| CN1307326A (en) * | 2000-01-26 | 2001-08-08 | 三菱电机株式会社 | Device and method for manufacture of liquid crystal display |
| CN1630930A (en) * | 2001-05-17 | 2005-06-22 | 株式会社荏原制作所 | Substrate transport container |
| TW200413113A (en) * | 2003-01-17 | 2004-08-01 | Chinese United Semiconductor Equipment Mfg Inc | Automatic spraying and blowing clean device of wafer box base |
| CN1536639A (en) * | 2003-04-03 | 2004-10-13 | 力晶半导体股份有限公司 | Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution |
| CN201601119U (en) * | 2010-01-18 | 2010-10-06 | 北京七星华创电子股份有限公司 | Storing and transportation system of wafer storing box |
| CN202163829U (en) * | 2011-07-25 | 2012-03-14 | 浙江思博恩新材料科技有限公司 | Silicon sheet carrying device |
| CN103170469A (en) * | 2011-12-22 | 2013-06-26 | 中芯国际集成电路制造(上海)有限公司 | Device and method for cleaning and drying wafer cassettes |
| CN104241174A (en) * | 2013-06-14 | 2014-12-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Film magazine chamber, plasma processing device and method for purging film magazine chamber |
| CN104253073A (en) * | 2013-06-28 | 2014-12-31 | 株式会社日立国际电气 | Substrate processing apparatus, method of manufacturing semiconductor device and flow monitoring method |
| CN204257606U (en) * | 2014-12-25 | 2015-04-08 | 上海集成电路研发中心有限公司 | A kind of nitrogen filling device of wafer cabinet |
| CN106505023A (en) * | 2015-09-08 | 2017-03-15 | 古震维 | A kind of with the wafer handler for blowing off function |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451183A (en) * | 2020-06-03 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | Wafer box |
| CN112509941A (en) * | 2020-11-09 | 2021-03-16 | 广州粤芯半导体技术有限公司 | Method and device for improving corrosion defect of aluminum etching process |
| CN114623862A (en) * | 2020-12-11 | 2022-06-14 | 中国科学院微电子研究所 | Semiconductor measuring equipment and cleaning method |
| CN114623862B (en) * | 2020-12-11 | 2024-04-16 | 中国科学院微电子研究所 | Semiconductor measuring equipment and cleaning method |
| CN113871282A (en) * | 2021-09-26 | 2021-12-31 | 长鑫存储技术有限公司 | Gas removal equipment, method, device, control system and storage medium |
| CN117133691A (en) * | 2023-10-25 | 2023-11-28 | 江苏芯梦半导体设备有限公司 | Environment detection method, detection device and cleaning equipment for wafer box after cleaning |
| CN117133691B (en) * | 2023-10-25 | 2024-01-23 | 江苏芯梦半导体设备有限公司 | Environment detection method, detection device and cleaning equipment for wafer box after cleaning |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109712906B (en) | 2021-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109712906A (en) | Wafer storage device with cleaning function and semiconductor production equipment | |
| US9073103B2 (en) | Liquid processing apparatus, liquid processing method, and recording medium having computer program for performing the same method | |
| US9305817B2 (en) | Method for purging a substrate container | |
| US9666454B2 (en) | Wafer storage apparatus having gas charging portions and semiconductor manufacturing apparatus using the same | |
| US10504718B2 (en) | Substrate processing apparatus, substrate processing method, and storage medium | |
| US10395950B2 (en) | Substrate processing apparatus, substrate processing method, and recording medium | |
| US10381246B2 (en) | Substrate processing apparatus | |
| TWI775948B (en) | Substrate processing device | |
| US20180158699A1 (en) | Method of cleaning substrate processing apparatus and system of cleaning substrate processing apparatus | |
| US8978670B2 (en) | Substrate processing apparatus | |
| CN109417027B (en) | Substrate processing apparatus | |
| KR102581139B1 (en) | Substrate processing apparatus and method for detecting clogging of exhaust pipe in substrate processing apparatus | |
| TW201239974A (en) | Liquid processing apparatus | |
| KR20160132138A (en) | Load lock assembly and method for particle reduction | |
| US20200388512A1 (en) | Substrate processing apparatus and control method thereof | |
| US20100143081A1 (en) | Semiconductor manufacturing apparatus and method | |
| CN105321852A (en) | Method and apparatus for liquid treatment of wafer shaped articles | |
| TWI702383B (en) | Container mounting device, semiconductor manufacturing device, and method for controlling ambient gas in the container | |
| US10964570B2 (en) | Semiconductor wafer storage system and method of supplying fluid for semiconductor wafer storage | |
| TWI656915B (en) | Processing liquid supplying apparatus, substrate processing apparatus and processing liquid supplying method | |
| TWI738904B (en) | Substrate processing device, discharge method and computer readable recording medium | |
| US20180269079A1 (en) | Substrate treatment method and substrate treatment device | |
| CN211263094U (en) | Device for detecting semiconductor equipment | |
| CN204696087U (en) | For carrying load port and the front equipment end device of Foup | |
| CN209804605U (en) | Liquid treatment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |