TWI656915B - Processing liquid supplying apparatus, substrate processing apparatus and processing liquid supplying method - Google Patents

Abstract

The present invention provides a processing liquid supply device for supplying a processing liquid to a plurality of processing sections. The processing liquid supply device includes: a processing liquid tank for storing a processing liquid; and a plurality of circulation pipes corresponding to the plurality of processing sections. Each of them is provided, and the processing liquid in the processing liquid tank is circulated separately; the supply piping is branched to each of the circulation pipes and supplies the processing liquid to the corresponding plurality of processing units; the flow detection unit, the system Interposed on each of the circulation pipes to detect the flow rate of the processing liquid flowing in the circulation pipes; a flow adjustment valve is provided on each of the circulation pipes to adjust the flow rate of the treatment liquid in the circulation pipes; And the opening degree adjustment unit adjusts the opening degree of the corresponding flow rate adjustment valve based on the detection flow rate of the processing liquid detected by the flow rate detection unit provided in each of the circulation pipes.

Description

Processing liquid supply device, substrate processing device, and processing liquid supply method

The invention provides a processing liquid supply device, a substrate processing device, and a processing liquid supply method. The processing liquid supply device supplies processing liquid to a processing unit for processing a substrate. The substrate processing device includes the processing liquid supply device. The processing liquid supply method uses the processing liquid supply device and the substrate processing device. Examples of substrates to be processed include semiconductor wafers, substrates for liquid crystal display devices, substrates for flat panel displays (FPDs) such as organic electroluminescence (EL) display devices, and optical disks. Substrates such as substrates, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramics substrates, and substrates for solar cells.

The liquid processing apparatus described in US Patent Application Publication No. 2011/023909 is provided with a plurality of processing units. The processing unit processes a substrate using a processing liquid supplied from a liquid supply mechanism. The liquid supply mechanism includes a liquid supply source and a circulation path. The liquid supply source is used to supply a temperature-adjusted processing liquid, and the circulation path is used to circulate the temperature-adjusted processing liquid supplied from the liquid supply source.

In the liquid supply device described in the specification of US Patent Application Publication No. 2011/023909, the processing liquid flowing in the circulation path is radiated to the outside through the circulation path. Therefore, the temperature of the processing liquid flowing in the circulation path decreases during the process from the liquid supply source to the processing unit. The degree to which the temperature of the processing liquid decreases due to heat radiation depends on the flow rate of the processing liquid in the circulation path.

Here, in a liquid supply device provided with a plurality of processing units, a plurality of circulation paths may be provided. In such a liquid processing apparatus, a group in which a plurality of processing units are laminated is referred to as a processing unit (processing tower). The circulation path is provided corresponding to each processing unit. In this case, it is preferable that the liquid supply sources are not provided one by one with respect to each circulation path, but a plurality of circulation paths are connected to a common liquid supply source.

Depending on the length of the circulation path or the components intervening in the circulation path, the resistance to the treatment fluid flowing in the circulation path is different. Therefore, even if the processing liquid is sent to the circulation paths at the same pressure, the flow rate of the processing liquid in each circulation path is not necessarily constant between the circulation paths. In this case, since the degree of temperature drop of the processing liquid in each circulation path is not necessarily, the temperature of the processing liquid supplied to the processing unit may be different depending on the circulation path. Therefore, there is a possibility that the state (degree of processing) of the substrate may be different depending on which processing unit is selected for processing the substrate.

Therefore, an object of the present invention is to provide a processing liquid supply device, a substrate processing device, and a processing liquid supply method. In the configuration in which the processing liquid is circulated in a plurality of circulation pipes, the temperature difference of the processing liquid between the circulation pipes can be reduced.

An embodiment of the present invention provides a processing liquid supply device for supplying a processing liquid to a plurality of processing sections. The processing liquid supply device includes a processing liquid tank for storing a processing liquid, and a plurality of circulation pipes corresponding to the foregoing. Each of a plurality of processing units is provided, and the processing liquid in the processing liquid tank is respectively circulated; a supply pipe is branched and connected to each of the circulation pipes and supplies a processing liquid to the corresponding processing unit; Is installed in each of the circulation pipes to detect the flow rate of the processing liquid flowing in the circulation pipes; a flow adjustment valve is installed in each of the circulation pipes to adjust the treatment liquid in the circulation pipes; The flow rate; and the opening degree adjustment unit adjusts the opening degree of the corresponding flow rate adjustment valve based on the detection flow rate of the processing liquid detected by the flow rate detection unit provided in each of the circulation pipes.

According to the foregoing configuration, the processing liquid system in the processing liquid tank is circulated in the plurality of circulation pipes. A plurality of circulation pipes are connected to a common processing liquid tank. The processing liquid circulating in each circulation pipe is supplied to a corresponding processing unit through a supply pipe branched to each circulation pipe.

The opening degree adjustment unit adjusts the opening degree of the corresponding flow adjustment valve based on the detection flow rate of the processing liquid detected by the flow rate detection unit provided in each circulation pipe. At this time, in order to reduce the difference between the detected flow rates, the opening degree of each flow rate adjustment valve is adjusted, whereby the difference in the flow rate of the processing liquid between the circulation pipes can be reduced. In this case, reduce the processing between circulation pipes Liquid temperature difference. Thereby, the processing liquid in which the temperature difference between circulation pipes is reduced is supplied from each circulation pipe to a processing part via a supply pipe. Thereby, it is possible to reduce the temperature difference of the processing liquid between the processing sections.

In one embodiment of the present invention, the flow rate detection unit is disposed in the corresponding circulation piping and is disposed on the circulation piping on an upstream side from a branch position of the supply piping.

The flow rate of the processing liquid in the circulating pipe is more susceptible to changes in the supply state of the processing liquid flowing to the supply pipe than the upstream side of the branching position. The supply state of the processing liquid to the supply piping refers to a change in the supply amount of the processing liquid from the circulation piping to the supply piping or from the circulation piping to the supply piping. Therefore, if the flow detection unit is interposed in the circulation piping upstream of the branch position of the supply piping in the circulation piping, the change in the supply state of the processing liquid to the supply piping can be reduced. Impact of flow detection. That is, the flow rate detection unit can stably detect the flow rate of the processing liquid in the circulation pipe. Therefore, it is possible to further reduce the difference in the detection flow rate between the circulation pipes.

In one embodiment of the present invention, the flow rate adjustment valve is interposed in the circulation pipe on a downstream side from a branch position of the supply pipe in the corresponding circulation pipe.

In the circulation piping, the treatment liquid flows from the upstream side to a portion where a flow rate adjustment valve is provided. Therefore, by adjusting the opening degree of the flow rate adjustment valve, the pressure in the circulation line upstream of the flow rate adjustment valve can be changed more stably than the pressure in the circulation line downstream of the flow rate adjustment valve. So if the flow The quantity adjustment valve is a circulation pipe that is located further downstream than the branch position of the supply pipe in the corresponding circulation pipe, so that the pressure in the vicinity of the branch position can be stably changed. This makes it possible to stabilize the flow rate of the processing liquid flowing from the circulation pipe to the supply pipe.

In one embodiment of the present invention, the processing unit includes a plurality of processing units for processing a substrate. In addition, the supply piping includes a plurality of branch piping branches from the corresponding circulation piping, and supplying the processing liquid to each of the processing units.

According to the aforementioned configuration, the supply piping has a plurality of branch piping, and the plurality of branch piping branches from the corresponding circulation piping and supplies the processing liquid to each processing unit of the corresponding processing unit. Therefore, it is possible to reduce the number of circulation pipes as compared with a structure in which the circulation pipes are provided one by one in each processing unit.

According to an embodiment of the present invention, there is provided a substrate processing apparatus including the processing liquid supply device and a plurality of the processing units for processing a substrate. According to the aforementioned configuration, the same effects as described above can be achieved.

According to an embodiment of the present invention, there is provided a processing liquid supply method for supplying a processing liquid to a plurality of processing sections. The processing liquid supply method includes a circulation step. The circulation piping allows the processing liquid in the processing liquid tank for storing the processing liquid to be circulated separately; the flow rate detection step detects the flow rate of the processing liquid flowing through each of the circulation pipes in the circulation step; and the opening adjustment step, It is based on the detection flow rate of the processing liquid in each of the circulation pipes detected in the flow detection step to reduce the number of circulation pipes. The opening degree of the flow rate adjustment valve provided in each of said circulation pipes is adjusted so that the flow rate of the processing liquid may differ.

According to this method, a plurality of circulation pipes are connected to a common processing liquid tank. In the circulation step, the treatment liquid in the treatment liquid tank is circulated through a plurality of circulation pipes.

In the opening degree adjustment step, the opening degree of the corresponding flow rate adjustment valve is adjusted based on the detected flow rate of the processing liquid detected in the flow rate detection step interposed in each circulation pipe. At this time, in order to reduce the difference in the detection flow rate, by adjusting the opening degree of each flow rate adjustment valve, it is possible to reduce the difference in the flow rate of the processing liquid between the circulation pipes. This reduces the temperature difference of the processing liquid between the circulation pipes.

The above and other objects, features, and effects of the present invention will become more apparent from the description of embodiments described below with reference to the drawings.

1‧‧‧ substrate processing device

2‧‧‧ treatment tower

2A‧‧‧The first processing tower (processing tower)

2B‧‧‧Second Processing Tower (Processing Tower)

2C‧‧‧Third Processing Tower (Processing Tower)

2D‧‧‧Fourth Processing Tower (Processing Tower)

3‧‧‧ treatment liquid supply device

4, 4A, 4B, 4C, 4D‧‧‧fluid units

5‧‧‧ transport path

6‧‧‧ Cabinet

7‧‧‧controller

7A‧‧‧Processor

7B‧‧‧Memory

20‧‧‧ processing unit

21‧‧‧ treatment tank

22, 22A, 22B, 22C, 22D‧‧‧Circular Piping

23, 23A, 23B, 23C, 23D ‧‧‧ supply piping

24‧‧‧Total wild tube

26, 26A, 26B, 26C, 26D‧‧‧ branch positions

27, 27A, 27B, 27C, 27D‧‧‧Circulation flowmeter

28, 28A, 28B, 28C, 28D‧‧‧Circulation flow adjustment valve

30‧‧‧Pump

31‧‧‧Filter

32‧‧‧Heating unit

33, 34, 35‧‧‧ branch piping

33a, 34a, 35a ‧‧‧ branch locations

36‧‧‧Supply flowmeter

37‧‧‧Supply flow regulating valve

38‧‧‧supply valve

40‧‧‧rotary chuck

41‧‧‧ cup body

42‧‧‧first nozzle

43‧‧‧Second Nozzle

44‧‧‧Processing chamber

45‧‧‧Clamping pin

46‧‧‧Swivel base

47‧‧‧rotation axis

48‧‧‧ Electric motor

50‧‧‧ supply source

51‧‧‧Piping

52‧‧‧ Valve

60‧‧‧First piping on the upstream side

61‧‧‧The first piping on the downstream side

62‧‧‧Second Piping

63‧‧‧ Upstream third piping

64‧‧‧Third side piping

A1‧‧‧axis of rotation

CR‧‧‧ transfer robot

IR‧‧‧ transfer robot

LP‧‧‧ Loading port

P‧‧‧ target pressure

P1‧‧‧First pressure

P2‧‧‧Second pressure

C‧‧‧ carrier

Q‧‧‧Target traffic

Q1‧‧‧First traffic

Q2‧‧‧Second traffic

W‧‧‧ substrate

X‧‧‧ extension direction

p‧‧‧ pressure

q‧‧‧ traffic

△ P‧‧‧predetermined amount

△ Q‧‧‧ predetermined amount

FIG. 1 is a schematic plan view for explaining an internal layout of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic longitudinal sectional view of the substrate processing apparatus.

FIG. 3 is a schematic diagram showing a configuration of a processing liquid supply device provided in a substrate processing device.

FIG. 4 is a schematic diagram showing a structure of a circulation pipe and a peripheral structure of a corresponding processing unit.

FIG. 5 is a block diagram for explaining an electrical structure of a main part of the substrate processing apparatus.

FIG. 6 is a diagram for explaining a process liquid supply performed by the substrate processing apparatus; Give an example of a flowchart.

FIG. 7 is a flowchart for explaining specific steps of the feedback control (step S4 in FIG. 6) of the supply of the processing liquid.

FIG. 8A is a diagram showing a change in the flow rate of the processing liquid in the circulation pipe after adjusting the opening degree of the flow rate adjustment valve based on the detected pressure.

FIG. 8B is a diagram showing pressure fluctuations in the circulation piping after adjusting the opening degree of the flow rate adjustment valve based on the detected flow rate.

FIG. 1 is a schematic plan view for explaining a layout inside a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a schematic vertical cross-sectional view of the substrate processing apparatus 1.

The substrate processing apparatus 1 is a monolithic apparatus that processes substrates W such as silicon wafers one by one. In the foregoing embodiment, the substrate W is a disc-shaped substrate. The substrate processing apparatus 1 includes a plurality of (four in this embodiment) processing towers 2A to 2D (processing sections) for processing a substrate W with a processing liquid such as a chemical liquid or a rinse liquid. The plurality of processing towers 2A to 2D are collectively referred to as a processing tower 2. The substrate processing apparatus 1 further includes: a processing liquid supply device 3 for supplying a processing liquid to a plurality of processing towers 2A to 2D; and a fluid unit 4A to 4D, which is provided corresponding to each of the processing towers 2A to 2D and accommodates the processing tower 2A The columns 2A to 2D supply pipes for processing liquid.

Each of the processing towers 2A to 2D includes a plurality of (for example, three) processing units 20 (see FIG. 2) at the base layer above and below. The processing unit 20 is a single-chip processing unit for processing the substrates W one by one. Each of the plurality of processing units 20 has, for example, the same structure.

The substrate processing apparatus 1 includes a load port LP, on which a carrier C for receiving a plurality of substrates W processed by the processing unit 20 is placed, and a transfer robot IR and a transfer robot CR for loading and processing on the load port LP and LP. The substrate W is transported between the units 20; and the controller 7 is used to control the substrate processing apparatus 1.

The substrate processing apparatus 1 further includes a transport path 5 extending in the horizontal direction. The transport path 5 extends linearly from the transfer robot IR to the transfer robot CR. The transfer robot IR transfers the substrate W between the carrier C and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 20.

The plurality of processing towers 2 are arranged symmetrically across the transport path 5. The plurality of processing towers 2 are arranged on both sides of the conveying path 5 along the direction in which the conveying path 5 extends (elongation direction X). In this embodiment, two processing towers 2 are arranged on each side of the transport path 5.

Among the plurality of processing towers 2A to 2D, the two processing towers 2 near the IR side of the transfer robot are referred to as a first processing tower 2A and a second processing tower 2B, respectively. The first processing tower 2A and the second processing tower 2B face each other across the transport path 5.

Among the plurality of processing towers 2A to 2D, the two processing towers 2 located on the far side from the transfer robot IR are referred to as a third processing tower 2C and a fourth processing tower 2D, respectively. The third processing tower 2C and the fourth processing tower 2D face each other across the transport path 5. The first processing tower 2A and the third processing tower 2C are arranged in the extension direction X. The second processing tower 2B and the fourth processing tower 2D are arranged in the extension direction X. Corresponding fluid units 4A to 4D are being extended The direction X is adjacent to each of the processing towers 2A to 2D.

The processing liquid supply device 3 includes a processing liquid tank 21 that stores a processing liquid such as a chemical liquid. The substrate processing apparatus 1 includes a cabinet 6 and is disposed on the side opposite to the transfer robot IR in the extension direction X, and is used to store the processing liquid tank 21. The processing liquid tank 21 is disposed in the cabinet 6 and is located closer to the processing tower 2D than the processing tower 2C. The processing tower 2C is disposed in the processing towers 2C and 2D on both sides with the transport path 5 interposed therebetween. On one side, the processing tower 2D is the other of the processing towers 2C and 2D disposed on both sides with the transport path 5 interposed therebetween.

FIG. 3 is a schematic diagram showing a configuration of a processing liquid supply device 3 included in the substrate processing device 1.

The processing liquid supply device 3 further includes: a plurality of circulation pipes 22A to 22D, which respectively circulate the processing liquid in the processing liquid tank 21; and supply pipes 23A to 23D, which are branched and connected to each of the circulation pipes 22A to 22D. The processing towers 2A to 2D supply processing liquid; a common pipe 24 is connected to the upstream of the processing liquid tank 21 and a plurality of circulation pipes 22A to 22D. The plurality of circulation pipes 22A to 22D are branched from the downstream end of the common bypass pipe 24. The circulation pipes 22A to 22D are collectively referred to as the circulation pipes 22. The supply pipes 23A to 23D are collectively referred to as a supply pipe 23.

The circulation pipes 22A to 22D are provided corresponding to the plurality of processing towers 2A to 2D, respectively. The portions of the circulation pipes 22A to 22D to which the supply pipes 23A to 23D are branched are referred to as branch positions 26A to 26D. The branch positions 26A to 26D are collectively referred to as branch positions 26.

The processing liquid supply device 3 contains: circulating flow meters 27A to 27D, Provided in each of the circulation pipes 22A to 22D for detecting the flow rate of the processing liquid flowing in the circulation pipes 22A to 22D; and circulation flow adjustment valves 28A to 28D are provided in each of the circulation pipes 22A to 22D for adjusting the aforementioned circulation The flow rate of the processing liquid in the pipes 22A to 22D.

The circulation flow meters 27A to 27D are collectively referred to as the circulation flow meter 27. An example of a flow detection unit of a circulating flow meter 27A to 27D. The circulation flow rate adjustment valves 28A to 28D are collectively referred to as a circulation flow rate adjustment valve 28. The circulation flow rate adjusting valves 28A to 28D are, for example, motor needle valves, but they are not limited to this, and may be valves such as relief valves. The circulating flow rate adjustment valves 28A to 28D are one embodiment of the flow rate adjustment valve.

Each of the circulation flow meters 27A to 27D is provided with circulation pipes 22A to 22D located upstream of branching positions 26A to 26D of the supply pipes 23A to 23D of the corresponding circulation pipes 22A to 22D. Each of the circulation flow rate adjustment valves 28A to 28D is provided at a corresponding circulation pipe 22A to 22D located further downstream than the corresponding branch positions 26A to 26D. Therefore, each of the circulation flow rate adjustment valves 28A to 28D is interposed on the downstream side of the circulation flow meters 27A to 27D in the corresponding circulation pipes 22A to 22D.

In the common bypass pipe 24, the pump 30, the filter 31, and the heating unit 32 are sequentially arranged from the upstream side. The pump 30 sends the processing liquid in the common pipe 24 to the downstream side. The filter 31 filters the processing liquid flowing through the common pipe 24. The heating unit 32 is a heater or the like for heating the processing liquid in the common pipe 24.

The pump 30 sends the processing liquid in the common pipe 24 to the downstream side, whereby each of the circulation pipes 22A to 22D feeds the processing liquid in the processing liquid tank 21 Line loop. At this time, the processing liquid in the processing liquid tank 21 is supplied to the circulation pipes 22A to 22D via the common bypass pipe 24. Therefore, the processing liquid in the processing liquid tank 21 is heated by the heating unit 32 interposed in the common pipe 24. Therefore, the heated processing liquid is supplied to the circulation pipes 22A to 22D. The heating unit 32 functions as a temperature adjustment unit for adjusting the temperature of the processing liquid supplied from the processing liquid supply source to the plurality of circulation pipes 22A to 22D.

The components of the processing liquid supply device 3 associated with each of the processing towers 2A to 2D have substantially the same structure in all of the processing towers 2A to 2D. Therefore, in the following description, components corresponding to the first processing tower 2A in the processing liquid supply device 3 will be mainly described. FIG. 4 is a schematic diagram showing the surrounding structure of the first processing tower 2A and the corresponding circulation pipe 22A.

Referring to FIG. 4, each processing unit 20 of the first processing tower 2A includes a rotating chuck 40, while holding a substrate W in a horizontal posture, while rotating the substrate W through a vertical axis of rotation of a central portion of the substrate W. A1 rotates; the cup 41 surrounds the rotating chuck 40; the first nozzle 42 and the second nozzle 43 supply the processing liquid to the substrate W; and the processing chamber 44 is used for receiving the rotating chuck 40, the cup 41, the first A nozzle 42 and a second nozzle 43.

An entrance (not shown) is formed in the processing chamber 44 for carrying the substrate W into or from the processing chamber 44. The processing chamber 44 includes a shutter unit (not shown) for opening and closing the entrance and exit.

The rotating chuck 40 includes a plurality of clamping pins 45, a rotating base 46, a rotating shaft 47, and an electric motor for applying a rotating force to the rotating shaft 47. 48. The rotation shaft 47 extends in the vertical direction along the rotation axis A1. The upper end of the rotation shaft 47 is coupled to the center of the lower surface of the rotation base 46.

The rotation base 46 has a disc shape along the horizontal direction. A plurality of clamping pins 45 are arranged on the peripheral edge portion of the upper surface of the rotation base 46 in the circumferential direction at intervals. The rotation base 46 and the clamping pin 45 are included in a substrate holding unit for horizontally holding the substrate W. The rotation shaft 47 is rotated by the electric motor 48, whereby the substrate W is rotated around the rotation axis A1. The electric motor 48 is included in a substrate rotation unit for rotating the substrate W about the rotation axis A1.

In the present embodiment, each of the first nozzle 42 and the second nozzle 43 is a fixed nozzle that is disposed so as to eject the processing liquid toward the center of rotation of the upper surface of the substrate W. A processing liquid such as a chemical liquid stored in the processing liquid tank 21 is supplied to the first nozzle 42 through the circulation pipe 22A and the supply pipe 23A. A processing liquid such as a rinsing liquid is supplied to the second nozzle 43 from a supply source 50 such as a tank other than the processing liquid tank 21 via a pipe 51. A valve 52 is provided in the piping 51 to switch whether or not the processing liquid is supplied to the second nozzle 43.

The chemical solution is, for example, hydrofluoric acid (hydrogen fluoride water (HF)). The medicinal solution is not limited to hydrofluoric acid. It can also contain: sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, buffered hydrofluoric acid (BHF), diluted hydrofluoric acid (DHF), and ammonia. , A solution of at least one of hydrogen peroxide water, an organic acid (for example, citric acid, oxalic acid, etc.), an organic base (for example, tetramethyl ammonium hydroxide (TMAH), etc.), a surfactant, and an anticorrosive agent. Examples of the chemical solution in which the above-mentioned liquid is mixed include SPM (sulfuric acid hydrogen peroxide mixed solution) and SC1 (ammonia peroxygen) Hydrogen hydride mixed solution), SC2 (hydrogen peroxide mixed solution of hydrogen peroxide), and the like.

The rinsing liquid is, for example, deionized water (DIW). The rinsing solution is not limited to DIW, and may be carbonated water, electrolytic ion water, ozone water, hydrochloric acid water, diluted water (for example, 10 ppm to about 100 ppm), ammonia water, and reduced water (hydrogen water). The rinse solution contains water.

Examples of the treatment liquid include a chemical solution and a rinse solution, and a low surface tension liquid having a lower surface tension than water. The low surface tension liquid system is used to replace the rinse liquid on the substrate after the rinse liquid is supplied onto the substrate. After the rinsing liquid on the substrate W is replaced with a low surface tension liquid, the upper surface of the substrate W can be dried well by removing the low surface tension liquid from the substrate W. When the upper surface of the substrate W is dried using a low surface tension liquid, the effect on the formation can be reduced compared to a case where the rinse liquid is removed from the upper surface of the substrate W to dry the substrate W without using a low surface tension liquid. The surface tension of the pattern on the substrate W.

As the low surface tension liquid, an organic solvent other than IPA (isopropyl alcohol) that does not cause a chemical reaction (poor reactivity) with the upper surface of the substrate W and the pattern formed on the substrate W can be used. More specifically, a liquid containing at least one of IPA, HFE (hydrofluoroether), methanol, ethanol, acetone, and trans-1,2-dichloroethylene can be used as the low surface tension liquid. In addition, the low surface tension liquid need not be composed of only a monomer component, and may be a liquid mixed with other components. For example, the low surface tension liquid may be a mixed liquid of IPA liquid and pure water, or may be a mixed liquid of IPA liquid and HFE liquid.

The supply piping 23A has a branch from the circulation piping 22A and is disposed in the processing tower. A plurality of branch pipes 33 to 35 for supplying a processing liquid to each processing unit 20 of 2A. The upstream ends of the respective branch pipes 33 to 35 are connected to the circulation pipes 22A located at the corresponding branch positions 33a to 35a. The downstream ends of the respective branch pipes 33 to 35 are connected to the first nozzle 42 of the corresponding processing unit 20.

The branch positions 26A of the supply piping 23A in the circulation piping 22A are branch positions 33a to 35a including the branch pipings 33 to 35, respectively. Therefore, the circulation flow meter 27A is interposed in the circulation piping 22A located in the circulation piping 22A more upstream than the branch position 33 a of the branch pipe 33 on the most upstream side. In addition, the circulation flow rate adjustment valve 28A is a circulation pipe 22A that is located upstream of the branch pipe 35 of the branch pipe 35 on the most downstream side among the circulation pipes 22A. The circulation flow meter 27A and the circulation flow adjustment valve 28A are installed in the cabinet 6.

In each of the plurality of branch pipes 33 to 35, the supply flow meter 36, the supply flow rate adjustment valve 37, and the supply valve 38 are sequentially arranged from the upstream side. Each supply flow meter 36 detects the flow rate of the processing liquid flowing in the branch pipes 33 to 35 corresponding to the supply pipe 23A. Each supply flow rate adjustment valve 37 adjusts the flow rate of the processing liquid in the branch pipes 33 to 35 corresponding to the supply pipe 23A. Each supply valve 38 is a valve that switches whether or not the processing liquid is supplied to the branch pipes 33 to 35 corresponding to the supply pipe 23A. The supply flow rate adjustment valve 37 is, for example, an electric motor needle valve. The supply valve 38 is, for example, a release valve.

The circulation piping 22A includes: the first upstream piping 60 having the upstream end of the circulation piping 22A and accommodated in the cabinet 6; the first downstream piping 61 having the downstream end of the circulation piping 22A and accommodated in the cabinet 6 in And the second pipe 62 is already contained in the fluid unit 4A. The circulating pipe 22A further includes: an upstream third pipe 63 connected to the upstream first pipe 60 and the second pipe 62 and spanning between the cabinet 6 and the fluid unit 4A; and a downstream third pipe 64, It is connected to the first piping 61 and the second piping 62 on the downstream side, and spans between the cabinet 6 and the fluid unit 4A. The upstream-side third pipe 63 is also referred to as an upstream-side relay pipe. The downstream-side third pipe 64 is also referred to as a downstream-side relay pipe. The circulation flow meter 27A is provided on the upstream first pipe 60, and the circulation flow adjustment valve 28A is provided on the second pipe 62.

FIG. 5 is a block diagram for explaining the electrical structure of the main part of the substrate processing apparatus 1. The controller 7 is provided with a microcomputer, and the controller 7 controls a control target provided in the substrate processing apparatus 1 according to a predetermined program. More specifically, the controller 7 includes a CPU (Central Processing Unit) 7A and a memory 7B in which a control program is stored. The controller 7 has the following structure: The processor 7A executes a program to execute the program. Various controls for substrate processing. In particular, the controller 7 controls the transfer robot IR, CR, electric motor 48, circulation flow meters 27A to 27D, supply flow meter 36, and circulation flow rate adjustment valves 28A to 28D, supply flow rate adjustment valve 37, supply valve 38, and valve 52. And other actions.

FIG. 6 is a flowchart for explaining an embodiment of the processing liquid supply step by the processing liquid supply device 3, and mainly shows the processing realized by the controller 7 executing a program.

In the step of supplying the processing liquid by the processing liquid supply device 3, first, the controller 7 sets the target value (target flow rate Q) of the flow rate of the processing liquid flowing in each circulation pipe 22 (target flow rate setting step: step) S1). At this time, the target flow rate Q is set for all the circulation pipes 22. The target flow rate Q is common to all the circulation pipes 22. In this way, the controller 7 functions as a target flow rate setting unit.

Furthermore, the pump 30 interposed in the common pipe 24 is started, and the circulation of the processing liquid in each circulation pipe 22 is started (step S2). Accordingly, each of the plurality of circulation pipes 22 performs a circulation step of circulating the treatment liquid in the treatment liquid tank 21.

The flow rate of the corresponding circulation piping 22 is detected by each of the circulation flow meters 27 (step S3). Thereby, a flow rate detection step for detecting the flow rate of the processing liquid flowing through the circulation pipe 22 is performed. The flow rate of the processing liquid detected by the circulation flow meter 27 is referred to as a detected flow rate. The flow detection step is performed after the cycle step is started. Furthermore, feedback control is performed based on the detected flow rate (step S4). The feedback control is continuously performed when the processing liquid in the processing liquid tank 21 is circulated by the circulation pipe 22.

FIG. 7 is a flowchart for explaining specific steps of the feedback control (step S4 in FIG. 6) for the supply of the processing liquid.

In the feedback control, first, the controller 7 determines whether or not the detected flow rate in each of the circulation pipes 22 is consistent with the target flow rate Q (set value) (step T1). If the detected flow rate is different from the target flow rate Q (NO is displayed in step T1), the opening degree of each circulation flow rate adjustment valve 28 is adjusted (opening degree adjustment step: step T2). In the opening adjustment step, the opening degree of the circulation flow rate adjustment valve 28 is adjusted so that the detection flow rate approaches the target flow rate Q based on the detected flow rates detected in the respective circulation pipes 22. This reduces the difference in the flow rate of the processing liquid between the circulation pipes 22. In this way, the controller 7 is used as the opening degree. The adjustment unit is functioned, and the aforementioned opening degree adjustment unit is used to adjust the opening degree of the corresponding circulating flow rate adjustment valve 28 based on the detected flow rate. When the detected flow rate is consistent with the target flow rate Q (YES in step T1), the opening degree adjustment step is not performed. Next, the controller 7 determines again whether the detected flow rate in each of the circulation pipes 22 matches the target flow rate Q (set value) (step T1).

The processing liquid supply is performed by the processing liquid supply device 3, and the substrate processing is performed by the substrate processing device 1. In the substrate processing, the unprocessed substrate W is transferred from the carrier C to the processing unit 20 by the transfer robots IR and CR, and is mounted on the rotary chuck 40. Thereafter, the substrate W is held horizontally at intervals from above the upper surface of the rotary base 46 while being carried out by the transfer robot CR (substrate holding step). The electric motor 48 rotates the rotary base 46. Thereby, the substrate W held horizontally on the chucking pin 45 is rotated (substrate rotation step).

After that, the transfer robot CR retreats to the outside of the processing unit 20 and executes the chemical liquid processing. Specifically, when the supply valve 38 is opened, for example, a chemical liquid is supplied from the processing liquid supply device 3 to the first nozzle 42 (supplying step). Before the step of supplying the medicinal solution from the first nozzle 42 is performed, the feedback control is started (step S4 in FIG. 6).

Furthermore, the chemical solution is discharged (supplyed) from the first nozzle 42 toward the upper surface of the substrate W in the rotating state. The supplied chemical solution is spread over the entire upper surface of the substrate W by centrifugal force. Thereby, the upper surface of the substrate W is processed with the chemical solution.

After a certain period of time for the chemical solution treatment, a DIW rinse is performed to replace the chemical solution on the substrate W with the DIW to exclude the chemical solution from the substrate W. deal with. Specifically, the supply valve 38 is closed and the valve 52 is opened. Thereby, for example, the rinse liquid is supplied (discharged) from the second nozzle 43 toward the upper surface of the substrate W. The DIW supplied onto the substrate W is spread over the entire upper surface of the substrate W by centrifugal force. With this DIW, the chemical solution on the substrate W is washed away.

After rinsing for a certain period of time, drying is performed. Specifically, the electric motor 48 rotates the substrate W at a high rotation speed (for example, 3000 revolutions) faster than the rotation speed of the substrate W in the chemical liquid processing and the rinse liquid processing. Accordingly, a large centrifugal force acts on the washing liquid on the upper surface of the substrate W, and the washing liquid on the upper surface of the substrate W is shaken around the substrate W. In this way, the rinse liquid is removed from the substrate W, and the substrate W is dried. Furthermore, when the substrate W is rotated at a high speed from the start and a predetermined time has elapsed, the electric motor 48 stops the rotation of the substrate W by the rotation base 46.

After that, the transfer robot CR enters the processing unit 20, the processed substrate W is picked up by the rotary chuck 40, and is carried out of the processing unit 20. The substrate W is transferred from the transfer robot CR to the transfer robot IR, and is stored in the carrier C by the transfer robot IR. Such substrate processing is performed by each of the processing towers 2A to 2D.

According to this embodiment, the processing liquid in the processing liquid tank 21 is circulated through the plurality of circulation pipes 22. The processing liquid tanks 21 are not provided for each circulation piping 22 one by one, but a plurality of circulation pipings 22 are connected to a common processing liquid tank 21. The processing liquid for circulating each of the circulation pipes 22 is supplied to the corresponding processing tower 2 from a supply pipe 23 branched to each of the circulation pipes 22.

The controller 7 is based on the circulation flow sandwiched between the circulation pipes 22 The detection flow rate of the processing liquid detected by the meter 27 adjusts the opening degree of the corresponding circulation flow rate adjustment valve 28 (feedback control). At this time, by adjusting the opening degree of each circulation flow rate adjustment valve 28 so as to reduce the difference in the detected flow rate, the difference in the flow rate of the processing liquid between the circulation pipes 22 can be reduced. In this case, the temperature difference of the processing liquid between the circulation pipes 22 is reduced. Therefore, the processing liquid system after reducing the temperature difference between the circulation pipes 22 is supplied from each circulation pipe 22 to the processing tower 2 through the supply pipe 23. Thereby, the temperature difference between the processing liquid and the processing tower 2 can be reduced.

Even after the supply of the processing liquid to the supply pipe 23 is started, the feedback control is continued, whereby the supply state of the processing liquid to the supply pipe 23 can be tracked, and the opening degree of the circulation flow rate adjustment valve 28 can be adjusted. This makes it possible to reduce the difference in the flow rate of the processing liquid between the circulation pipes 22 regardless of whether the processing liquid is supplied to the supply pipe 23 or not.

When the processing liquid stored in the processing liquid tank 21 is a chemical liquid such as hydrofluoric acid, by reducing the temperature difference between the processing liquids supplied to the processing liquid 2 in the processing liquid 2, it is possible to reduce the temperature in each processing liquid 2. The difference in the degree of etching between the substrates W. When the processing liquid stored in the processing liquid tank 21 is a rinse liquid such as DIW or a low surface tension liquid such as IPA, the difference between the dryness of the surface above the substrate W between the processing towers 2 can be reduced. .

The flow rate of the processing liquid in the circulation pipe 22 located more upstream than the branch position 26 is more easily affected by changes in the supply state of the processing liquid flowing to the supply pipe 23 than the branch pipe 26. The change in the supply state of the processing liquid flowing to the supply piping 23 refers to whether the processing liquid is supplied from the circulation piping 22 to the supply piping 23 and whether the processing liquid is supplied from the circulation piping. A change in the supply amount of the processing liquid flowing from 22 to the supply pipe 23.

According to this embodiment, the circulation flow meter 27 is interposed in the circulation pipe 22 on the upstream side of the circulation pipe 22 from the branch position 26 of the supply pipe 23. Therefore, it is possible to reduce the influence of the change in the supply state of the processing liquid flowing to the supply pipe 23 on the detection of the flow rate of the processing liquid in the circulation pipe 22. That is, the circulation flow meter 27 can stably detect the flow rate of the processing liquid in the circulation pipe 22. Therefore, the difference in the detected flow rate between the circulation pipes 22 can be further reduced.

In the circulation piping 22, a portion through which the circulation flow rate adjusting valve 28 is provided flows into the processing liquid from the upstream side. Therefore, by adjusting the opening degree of the circulation flow rate adjustment valve 28, it is possible to make the circulation flow rate adjustment valve 28 on the upstream side of the circulation line 22 more stable than the pressure in the circulation line 22 located on the downstream side of the circulation flow rate adjustment valve 28. Pressure changes. According to this embodiment, the circulation flow rate adjustment valve 28 is interposed in the circulation pipe 22 on the downstream side of the corresponding circulation pipe 22 from the branch position 26 of the supply pipe 23. Therefore, the pressure in the vicinity of the branch position 26 can be stably changed. Therefore, it is possible to stabilize the flow rate of the processing liquid flowing from the circulation pipe 22 to the supply pipe 23.

Furthermore, according to this embodiment, each of the supply pipes 23A to 23D is provided with a plurality of branch pipes 33 to 35, branched from the corresponding circulation pipes 22A to 22D, and supplied to the respective processing units 20 of the corresponding processing towers 2A to 2D. Treatment solution. Therefore, it is possible to reduce the number of circulation pipes 22 compared to a configuration in which the circulation pipes 22 are provided one by one in each processing unit 20.

In order to stably supply the processing liquid to the processing unit 20, the flow rate q of the processing liquid in the circulating pipe 22 needs to be a flow rate close to the target flow rate Q. In addition, the pressure p in the circulation pipe 22 needs to be a pressure close to the target pressure P. Each of the pressure p in the circulation pipe 22 and the flow rate q of the processing liquid in the circulation pipe 22 needs to be at least within a predetermined range.

8A and 8B, the predetermined range of the flow rate q of the processing liquid in the circulation pipe 22 refers to, for example, a first flow rate Q1 that is larger than the target flow rate Q by a predetermined amount △ Q and a predetermined flow rate Q1 that is smaller than the target flow rate Q. The range between the second flow rates Q2 (Q2 ≦ q ≦ Q1). The predetermined range of the pressure p in the circulation piping 22 is, for example, a range between a first pressure P1 that is larger than the target pressure P by a predetermined amount ΔP and a second pressure P2 that is smaller than the target pressure P by a predetermined amount ΔP (P2 ≦ p ≦ P1).

FIG. 8A is a graph showing a change in the flow rate q after the opening degree of the circulation flow rate adjustment valve 28 is adjusted based on the detected pressure. FIG. 8B is a graph showing a change in the pressure p after the opening degree of the circulation flow rate adjustment valve 28 is adjusted based on the detected flow rate. In this embodiment, as shown in FIG. 8B, the flow rate is detected by the circulation flow meter 27, and the opening degree of the circulation flow rate adjustment valve 28 is adjusted based on the detected flow rate, thereby controlling the flow rate q. Since the flow rate q and the pressure p are related to each other, the pressure p is indirectly controlled by the aforementioned control of the flow rate q.

Therefore, as shown in FIG. 8A, unlike the present embodiment, it is assumed that the pressure p is controlled by detecting the pressure p using a pressure gauge instead of the circulation flow meter 27 and adjusting the circulation flow rate adjusting valve 28 based on the detected pressure. The flow rate q of the processing liquid in the circulation pipe 22 can be controlled indirectly by the aforementioned pressure control. However, the degree of change in the flow rate q accompanying the change in the pressure p is greater than the degree of change in the pressure p accompanying the change in the flow rate q. Therefore, as shown in FIG. 8A, by controlling the pressure p using a pressure gauge, In the case where the flow rate q is controlled, as shown in FIG. 8B, the circulation flow rate adjustment valve 28 needs to be adjusted more accurately than in the case where the flow rate q is controlled by using the circulation flow meter 27 to control the pressure p. Therefore, when the circulation flow rate adjusting valve 28 according to this embodiment is used, the flow rate q can be easily controlled as compared with the case where a pressure gauge different from this embodiment is used.

The present invention is not limited to the embodiments described above, and may be implemented in other forms.

For example, unlike the above-mentioned embodiment, a heater for heating the processing liquid in the processing liquid tank 21 may be provided. The processing liquid in the processing liquid tank 21 is heated by the heater.

Furthermore, unlike the above-mentioned embodiment, a cooler for cooling the processing liquid may be interposed in the common pipe 24. Furthermore, unlike the above-mentioned embodiment, a cooler for cooling the processing liquid in the processing liquid tank 21 may be provided. The processing liquid circulating through the plurality of circulation pipes 22A to 22D is cooled by these coolers. It may be configured such that the processing liquid supplied to the plurality of circulation pipes 22A to 22D is cooled by the aforementioned cooler, or a heating unit 32 (heater) or a heater provided in the processing liquid tank 21 is used. The processing liquid supplied to the plurality of circulation pipes 22A to 22D is heated to adjust the temperature of the processing liquid circulating through the plurality of circulation pipes 22A to 22D. In this case, a temperature adjustment unit is constituted by a heater and a cooler. Furthermore, a single unit having two functions of a heater and a cooler may be provided as the temperature adjustment unit.

Furthermore, in the above-mentioned embodiment, it has been explained as follows: The ratio of each circulation flow meter 27 to the supply pipe 23 in the corresponding circulation pipe 22 The branch position 26 is further upstream of the circulation pipe 22. However, unlike the above embodiment, each circulation flow meter 27 may be interposed in the circulation pipe 22 of the corresponding circulation pipe 22 on the downstream side of the circulation pipe 22 from the branch position 26 of the supply pipe 23. In addition, it is also possible to adopt a form in which each circulation flowmeter 27 is interposed between the corresponding circulation pipe 22 between the branch position 33a on the most upstream side and the branch position 35a on the most downstream side.

Furthermore, in the above-mentioned embodiment, it has been described as follows: each circulation flow rate adjusting valve 28 is interposed in the circulation pipe 22 of the corresponding circulation pipe 22 on the downstream side from the branch position 26 of the supply pipe 23. However, unlike the embodiment described above, each circulation flow rate adjusting valve 28 may be interposed in the circulation pipe 22 of the corresponding circulation pipe 22 on the upstream side from the branch position 26 of the supply pipe 23. In addition, the following configuration may be adopted: between the branch position 33 a on the most upstream side and the branch position 35 a on the most downstream side, each circulation flow rate adjustment valve 28 is interposed between the corresponding circulation pipes 22.

It should be noted that in the above embodiment, the circulation flow meter 27 and the circulation flow rate adjustment valve 28 are provided in the cabinet 6. However, unlike the embodiment described above, the circulation flow meter 27 and the circulation flow adjustment valve 28 may be provided outside the cabinet 6. For example, each of the circulation flow meters 27 and each of the circulation flow adjustment valves 28 may be provided in the corresponding fluid unit 4.

The configuration similar to that of the processing liquid supply device 3 of the present embodiment can be applied to a processing liquid supply device for supplying a processing liquid to the second nozzle 43.

In addition, in the above embodiment, the processing unit 20 is assumed to have a first A nozzle 42 and a second nozzle 43. However, the number of nozzles is not limited to two, and may be set to three or more. In this case, the same configuration as the processing liquid supply device 3 of the present embodiment can be applied to a processing liquid supply device for supplying a processing liquid to each nozzle.

If the number of nozzles is three, a chemical solution such as hydrofluoric acid can be supplied from the first nozzle 42 to the substrate W, and a rinse solution such as DIW can be supplied from the second nozzle 43 to the substrate W. The IPA and other An organic solvent (low surface tension liquid) is supplied to the substrate W from another nozzle. Thus, in the substrate processing described above, an organic solvent treatment in which the DIW is replaced with IPA can be performed between the DIW rinse processing and the drying processing.

Although the embodiments of the present invention have been described in detail, these are only specific examples used for understanding the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples. The scope of the present invention is only Limited by the scope of the attached patent application.

This application corresponds to Japanese Patent Application No. 2017-051860 filed at the Japan Patent Office on March 16, 2017, and the entire disclosure of this application is incorporated herein by reference.

Claims (7)

A processing liquid supply device for supplying a processing liquid to a plurality of processing sections. The processing liquid supply device includes a processing liquid tank for storing a processing liquid, and a plurality of circulation pipes corresponding to each of the plurality of processing sections. It is provided to circulate the processing liquid in the processing liquid tank separately; the supply piping is branched to each of the circulation pipes and supplies the processing liquid to the corresponding processing section; the flow detection unit is provided in each of the foregoing A circulation piping for detecting the flow rate of the processing liquid flowing in the circulation piping; a flow adjustment valve is provided in each of the circulation pipings to adjust the flow of the processing liquid in the circulation piping; and an opening adjustment unit Based on the detection flow rate of the processing liquid detected by the flow rate detection unit provided in each of the circulation pipes, the opening degree of the corresponding flow rate adjustment valve is adjusted. The processing liquid supply device according to claim 1, wherein the opening degree adjustment unit adjusts the opening degree of each of the flow rate adjustment valves so as to reduce a difference in the detection flow rate. The processing liquid supply device according to claim 1 or 2, wherein the flow rate detection unit is interposed in the circulation pipe on an upstream side from a branch position of the supply pipe in the corresponding circulation pipe. The processing liquid supply device according to claim 1 or 2, wherein the flow rate adjustment valve is interposed in the circulation pipe on a downstream side of the corresponding circulation pipe from a branch position of the supply pipe. The processing liquid supply device according to claim 1 or 2, wherein the processing unit has a plurality of processing units for processing a substrate, the supply piping system has a plurality of branch pipes, and the plurality of branch piping systems are provided by the supply pipes. The corresponding circulation pipes are branched, and the processing liquid is supplied to each of the processing units. A substrate processing apparatus includes: the processing liquid supply apparatus described in claim 1 or 2; and a plurality of processing sections for processing a substrate. A processing liquid supply method is to supply a processing liquid to a plurality of processing units. The processing liquid supply method includes a circulation step. The processing liquid supply method is used for storing and processing by a plurality of circulation pipes provided respectively corresponding to the plurality of processing units. The processing liquid in the liquid processing tank is circulated separately; the flow rate detection step detects the flow rate of the processing liquid flowing through each of the circulation pipes in the foregoing circulation step; the opening degree adjustment step is based on the flow rate detection step The detected flow rate of the processing liquid in each of the circulation pipes is adjusted so as to reduce the difference in the flow rate of the processing liquid between the circulation pipes so as to adjust the opening degree of the flow adjustment valve provided in each of the circulation pipes.