TWI660790B - Processing liquid supplying apparatus, substrate processing apparatus, and processing liquid supplying method - Google Patents

Abstract

A processing liquid supply device supplies a processing liquid to a plurality of processing sections. The processing liquid supply device includes: a processing liquid supply source for supplying the heating or cooling processing liquid; and a plurality of circulation pipes provided respectively corresponding to the plurality of the processing units for enabling supply from the processing liquid supply source. The processing liquid is circulated separately; the supply piping is branched to each of the foregoing circulation piping to supply the processing liquid to the corresponding processing section; the flow adjustment valve is clamped to each of the circulation piping to adjust the circulation piping The flow rate of the processing liquid inside; and a temperature detection unit, which is sandwiched between each of the circulation pipes, for detecting the temperature of the processing liquid flowing in the circulation pipe.

Description

   Processing liquid supply device, substrate processing device, and processing liquid supply method   

The present invention relates to a processing liquid supply device that supplies a processing liquid to a processing unit that processes a substrate, a substrate processing device including the processing liquid supply device, and a processing liquid supply method. The substrates to be processed include, for example, substrates for FPD (Flat Panel Display) such as semiconductor wafers, substrates for liquid crystal display devices, organic EL (Electroluminescence) display devices, and optical discs Substrates such as substrates, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

The liquid processing apparatus described in US Patent Application Publication No. 2011/023909 is provided with a plurality of processing units that process a substrate using a processing liquid supplied from a liquid supply mechanism. The liquid supply mechanism includes: a liquid supply source for supplying a temperature-adjusted processing liquid; and a circulation flow path for circulating the temperature-adjusted processing liquid supplied from the liquid supply source.

In the liquid supply device of US Patent Application Publication No. 2011/023909, the processing liquid flowing in the circulation flow path is radiated to the outside through the circulation flow path. For this reason, the temperature of the processing liquid flowing in the circulation flow path is reduced during the period from the liquid supply source toward the processing unit. The degree to which the temperature of the processing liquid decreases due to heat dissipation depends on the flow rate of the processing liquid inside the circulation flow path.

A liquid supply device provided with a plurality of processing units may be provided with a plurality of circulation flow paths. A group of processing units formed by stacking a plurality of processing units is referred to as a processing unit (treatment tower). In such a liquid supply device, a circulation flow path is provided corresponding to each processing unit. In such a liquid supply device, it is preferable not to separately provide a liquid supply source for each circulation flow path, but to connect a plurality of circulation flow paths to a common liquid supply source. In a configuration in which a plurality of circulation flow paths are connected to a common liquid supply source, the processing liquid is sent from the liquid supply source to each circulation pipe at the same pressure.

Due to the difference in the length of the circulation flow path or the components sandwiched between the circulation flow path, the resistance to the processing liquid flowing in the circulation flow path will also be different. For this reason, even if the processing liquid is sent to the circulation flow paths at the same pressure, the flow rate of the processing liquid in each circulation flow path is not necessarily fixed between the circulation flow paths. In this way, the degree of reduction in the temperature of the processing liquid in each circulation flow path is not fixed, and there is a possibility that the temperature of the processing liquid supplied to the processing unit may be different due to the circulation flow path. For this reason, the state (degree of processing) of the substrate may be different depending on which processing section the substrate has been processed in.

Therefore, an object of the present invention is to provide a processing liquid supply device and a substrate capable of reducing the temperature difference of the processing liquid between the circulation pipes in a configuration in which the processing liquid supplied from the processing liquid supply source is circulated in a plurality of circulation pipes. Processing device and processing liquid supply method.

According to an embodiment of the present invention, a processing liquid supply device for supplying a processing liquid to a plurality of processing units is provided. The processing liquid supply device includes a processing liquid supply source for supplying the heating or cooling processing liquid, and a plurality of circulation pipes for setting. In order to respectively correspond to the plurality of processing units, the processing liquid supplied from the processing liquid supply source is respectively circulated; and the supply piping is branched and connected to each of the circulation pipes to supply processing to the corresponding processing portion. Fluid; flow adjustment valves, which are clamped to each of the circulation pipes, to adjust the flow rate of the processing liquid in the circulation pipes; and temperature detection units, which are clamped to each of the circulation pipes, to detect the flow in the circulation pipes The temperature of the processing liquid inside.

According to this configuration, the processing solution supply source supplies the processing solution after heating or cooling (after temperature adjustment), and the processing solution supply from the processing solution supply source is circulated in a plurality of circulation pipes. The processing liquid circulating in each circulation pipe is supplied to a corresponding processing unit through a supply pipe branched to each circulation pipe.

By adjusting the opening degree of the flow adjustment valve, the flow rate of the processing liquid in the circulation pipe can be adjusted. The degree of temperature change of the processing liquid caused by heat exchange (radiation or heat absorption) around the circulation pipe depends on the flow rate of the processing liquid in the circulation flow path. Therefore, when the flow rate of the processing liquid in the circulation pipe is changed, The temperature detected by the temperature detection unit will change accordingly. For this reason, in order to reduce the temperature difference of the processing liquid between circulation pipes, the opening degree of each flow rate adjustment valve can be adjusted. In this case, the processing liquid in which the temperature difference between the circulation pipes has been reduced is supplied from each circulation pipe to the processing unit through the supply pipe. Thereby, the temperature difference between the processing parts of a processing liquid can be reduced.

In one embodiment of the present invention, the processing liquid supply device further includes an opening degree adjusting unit for adjusting a difference between the circulation pipes for detecting a temperature detected by each of the temperature detecting units. The opening degree of the flow adjustment valve.

According to this configuration, the opening degree of the pressure regulating valve can be adjusted by the opening degree adjusting unit to reduce the difference in the detection temperature. Therefore, it is possible to reliably reduce the temperature difference of the processing liquid between the circulation pipes.

In one embodiment of the present invention, the processing liquid supply device further includes a target temperature setting unit configured to set a target temperature for all the circulation pipes. Then, the opening degree adjusting unit adjusts the opening degree of the flow rate adjustment valve so that the detection temperature detected by each of the temperature detecting units is consistent with the target temperature.

According to this configuration, the target temperature can be set for all the circulation pipes by the target temperature setting unit. The opening degree adjustment unit adjusts the opening degree of the flow adjustment valve in order to make each detected temperature consistent with the target temperature. Therefore, it is possible to further reduce the temperature difference of the processing liquid between the circulation pipes.

In one embodiment of the present invention, the temperature detection unit is sandwiched between the circulation piping so as to be positioned further downstream than a branch position of the supply piping in the corresponding circulation piping. For this reason, the temperature detection unit can detect the temperature of the processing liquid after radiating or absorbing heat during the period from the processing liquid supply source toward the branch position. Therefore, the temperature detection unit can reliably detect the difference between the circulation pipes of the temperature of the processing liquid supplied to the processing unit. Therefore, the temperature difference between the circulation pipes can be further reduced.

In one embodiment of the present invention, the flow rate adjusting valve is interposed between the circulation piping so as to be positioned further downstream than a branch position of the supply piping in the corresponding circulation piping.

A part in which a flow rate adjustment valve is sandwiched between the circulation pipes flows into the processing liquid from the upstream side. For this reason, by adjusting the opening degree of the flow adjustment valve system, the flow rate in the circulation pipe upstream of the flow adjustment valve can be compared with the flow rate in the circulation pipe downstream of the flow adjustment valve. Also stable.

Therefore, as long as the flow regulating valve is provided in the circulation piping clamp so as to be located further downstream than the branch position of the supply piping in the corresponding circulation piping, the flow rate of the processing liquid flowing from the circulation piping to the supply piping can be made. stable.

In one embodiment of the present invention, it further includes: a pressure detection unit, which is sandwiched between each of the circulation pipes and is used to detect the pressure in the circulation pipes. There is a correlation between the pressure in the circulation piping and the flow rate of the processing liquid in the circulation piping. Therefore, it is easy to adjust the flow rate of the processing liquid in the circulation pipe to an appropriate range by adjusting the opening degree of the flow adjustment valve while confirming the pressure of each circulation pipe detected by the corresponding pressure detection unit.

In one embodiment of the present invention, the pressure detecting unit is sandwiched between the circulation piping so as to be positioned more upstream than a branch position of the supply piping in the corresponding circulation piping.

The flow rate of the processing liquid in the circulation piping is further downstream than the branch position, and is more likely to be changed by a change in the supply state of the processing liquid to the piping than the branch position is more upstream.

Therefore, as long as the pressure detection unit is sandwiched in the circulation pipe so as to be positioned more upstream than the branch position of the supply pipe in the circulation pipe, the change in the supply state of the processing liquid to the supply pipe can be reduced to the circulation pipe The effect of the pressure detection of the processing fluid inside. In other words, the pressure detection unit can stably detect the pressure of the processing liquid in the circulating pipe. Therefore, the pressure of the processing liquid in each circulation pipe becomes easy to confirm, and it is easier to adjust the flow rate of the processing liquid in the circulation pipe to an appropriate range.

In one embodiment of the present invention, the processing unit is a processing unit having a plurality of processing substrates. The supply piping system includes a plurality of branch piping branches from the corresponding circulation piping to supply the processing liquid to each of the processing units.

According to this configuration, the supply piping system includes a plurality of branch piping that branch from the corresponding circulation piping and supply the processing liquid to each processing unit of the corresponding processing unit. For this reason, the number of circulation piping can be reduced compared with a configuration in which the circulation piping is provided for each processing unit one by one.

According to an embodiment of the present invention, there is provided a substrate processing apparatus including: the processing liquid supply device; and a plurality of the processing units that process a substrate. According to this configuration, the same effects as described above can be achieved.

According to an embodiment of the present invention, there is provided a processing liquid supply method for supplying a processing liquid to a plurality of processing sections, which includes a circulation step by a plurality of circulation pipes provided to correspond to the plurality of processing sections, respectively. The heating or cooling process liquid supplied from the process liquid supply source is circulated separately; the temperature detection process detects the temperature of the process liquid flowing through each of the circulation pipes in the circulation process; and the opening degree adjustment process is In order to reduce the difference between the circulation piping at the detection temperature detected in the temperature detection step, the opening degree of the flow adjustment valve sandwiched between each of the circulation piping is adjusted.

According to this method, in the circulation process, the heating or cooling (temperature-adjusted) processing liquid system can be supplied from the processing liquid supply source to a plurality of circulation pipes and circulated through the plurality of circulation pipes.

In the opening degree adjustment process, in order to reduce the difference in the detection temperature of the processing liquid between the circulating pipes, the opening degree of the corresponding flow adjustment valve is adjusted, so that the difference in the flow rate of the processing liquid between the circulating pipes can be reliably reduced. . This makes it possible to reduce the temperature difference of the processing liquid between the circulation pipes.

In one embodiment of the present invention, the processing liquid supply method further includes a target temperature setting step of setting a target temperature for all the circulation pipes. The opening degree adjusting step includes a step of adjusting an opening degree of a flow rate adjustment valve sandwiched between each of the circulation pipes so that the detection temperature corresponding to each of the circulation pipes coincides with the target temperature.

According to this method, the target temperature can be set for all the circulation pipes in the target temperature setting step. In the opening degree adjustment process, the opening degree of the flow rate adjustment valve is adjusted in order to make each detected temperature consistent with the target temperature. Therefore, it is possible to further reduce the temperature difference of the processing liquid between the circulation pipes.

In one embodiment of the present invention, the piping lengths of the plurality of circulation pipes are different from each other. The opening degree adjustment step includes a sequential adjustment step of sequentially adjusting the opening degree from the flow rate adjustment valve corresponding to the circulation pipe having a longer piping length.

In the circulation piping, the longer the length of the piping, the larger the change in the temperature of the processing liquid when the flow rate in the circulation piping has changed. Therefore, when the temperature of the processing liquid in the circulating pipe having a longer piping length is set to a proper flow rate, the processing liquid having the same flow rate is circulated to the circulating pipe having a shorter piping length, and the cycle having the shorter piping length The temperature of the processing liquid in the piping easily becomes an appropriate temperature.

In the sequential adjustment process, the flow rate can be adjusted sequentially from a circulation pipe with a longer piping length of the circulation pipe. For this reason, it is possible to easily find the flow rate at which the temperature of the processing liquid in all the circulation pipes becomes an appropriate temperature. Therefore, it is possible to reduce the temperature difference of the processing liquid between the circulating pipes in a short time.

The above-mentioned or further other objects, features, and effects in the present invention can be understood by referring to the drawings and the description of the embodiments described below.

1.1P‧‧‧ substrate processing equipment

2‧‧‧ treatment tower

2A‧‧‧The first processing tower

2B‧‧‧Second Processing Tower

2C‧‧‧Third Processing Tower

2D‧‧‧Fourth Processing Tower

3, 3P‧‧‧ treatment liquid supply device

4A to 4D‧‧‧fluid units

5‧‧‧ port

6‧‧‧ Boxes

7‧‧‧control device

7A‧‧‧Processor

7B‧‧‧Memory

20‧‧‧ processing unit

21‧‧‧ treatment tank

22, 22A to 22D‧‧‧Circular Piping

23, 23A to 23D‧‧‧ supply piping

24‧‧‧Total wild tube

Branch positions 26, 26A to 26D, 33a to 35a

27, 27A to 27D‧‧‧ manometer

28, 28A to 28D‧‧‧ Pressure regulating valve

29, 29A to 29D‧‧‧ thermometer

30‧‧‧Pump

31‧‧‧Filter

32‧‧‧Heating unit

33 to 35‧‧‧ branch piping

36‧‧‧Supply flowmeter

37‧‧‧Supply flow regulating valve

38‧‧‧supply valve

40‧‧‧rotary chuck

41‧‧‧ cup body

42‧‧‧first nozzle

43‧‧‧Second Nozzle

44‧‧‧Processing Room

45‧‧‧ chuck pin

46‧‧‧Swivel base

47‧‧‧rotation axis

48‧‧‧ Electric motor

50‧‧‧ supply source

51‧‧‧Piping

52‧‧‧ Valve

60‧‧‧First piping on the upstream side

61‧‧‧The first piping on the downstream side

62‧‧‧Second Piping

63‧‧‧ Upstream third piping

64‧‧‧Third side piping

A1‧‧‧axis of rotation

C‧‧‧ Vehicle

CR, IR‧‧‧handling robot

LP‧‧‧ Loading port

R‧‧‧ Treatment liquid supply source

T‧‧‧ target temperature

W‧‧‧ substrate

X‧‧‧ extension direction

q‧‧‧ traffic

q1‧‧‧first flow

q2‧‧‧Second traffic

t‧‧‧temperature

t1‧‧‧first temperature

t2‧‧‧Second temperature

△ t‧‧‧ predetermined amount

FIG. 1 is a schematic plan view for explaining an internal layout of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of the aforementioned substrate processing apparatus.

FIG. 3 is a schematic diagram showing a configuration of a processing liquid supply apparatus provided in the substrate processing apparatus.

FIG. 4 is a schematic diagram showing the configuration of the periphery of the processing unit and the corresponding circulation piping.

FIG. 5 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus.

FIG. 6 is a flowchart for explaining an example of processing liquid supply by the processing liquid supply device.

Fig. 7 is a graph showing the difference between the processing sections in the ratio of the temperature change of the processing liquid to the change in the flow rate.

FIG. 8 is a schematic diagram showing a configuration of a processing unit and a periphery of a corresponding circulation pipe in a substrate processing apparatus according to a second embodiment.

FIG. 9 is a flowchart for explaining an example of the processing liquid supply by the processing liquid supply device of the second embodiment.

FIG. 10 is a flowchart for explaining the details of the feedback control (feedback control) (S14 in FIG. 9) of the processing liquid supply by the processing liquid supply device of the second embodiment.

    [First embodiment]    

FIG. 1 is a schematic plan view for explaining the layout inside the substrate processing apparatus 1 according to the first embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view of the substrate processing apparatus 1.

The substrate processing apparatus 1 refers to a single-chip type apparatus that processes a substrate W such as a silicon wafer one by one. In this embodiment, the substrate W is a disc-shaped substrate. The substrate processing apparatus 1 includes a plurality of (four in this embodiment) processing towers 2A to 2D (processing sections) for processing a substrate W with a processing liquid such as a chemical solution or a rinse liquid. When a plurality of processing towers 2A to 2D are collectively referred to as a processing tower 2. The substrate processing apparatus 1 further includes: a processing liquid supply device 3 for supplying a processing liquid to a plurality of processing towers 2A to 2D; and a fluid unit 4A to 4D corresponding to each of the processing towers 2A to 2D, and containing the Pipes for supplying the processing liquid to the plurality of processing towers 2A to 2D.

Each of the processing towers 2A to 2D includes a plurality of (for example, three) processing units 20 (see FIG. 2) formed by stacking up and down. The processing unit 20 refers to a single-chip processing unit that processes the substrate W one by one. The plurality of processing units 20 have the same configuration, for example.

The substrate processing apparatus 1 further includes: a load port LP, which is a carrier C for receiving a plurality of substrates W processed by the processing unit 20; a robot IR and a CR Is for carrying the substrate W between the loading port LP and the processing unit 20; and a control device 7 for controlling the substrate processing device 1.

The substrate processing apparatus 1 further includes a conveyance path 5 extending in the horizontal direction. The conveyance path 5 extends straight from the conveyance robot IR toward the conveyance robot CR. The transfer robot IR transfers the substrate W between the carrier C and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 20.

The plurality of processing towers 2 are arranged symmetrically across the conveyance path 5. The plurality of processing towers 2 are arranged on each side of both sides of the conveyance path 5, and are arranged along a direction in which the conveyance path 5 extends (elongation direction X). In this embodiment, two processing towers 2 are arranged on each side of the conveyance path 5.

Each of the two processing towers 2A to 2D, which is closer to the handling robot IR on each side, is referred to as a first processing tower 2A and a second processing tower 2B. The first processing tower 2A and the second processing tower 2B are opposed to each other across the transport path 5. Among the plurality of processing towers 2A to 2D, the two processing towers 2 on the side farther from the handling robot IR are referred to as a third processing tower 2C and a fourth processing tower 2D, respectively. The third processing tower 2C and the fourth processing tower 2D are opposed to each other across the transport path 5. The first processing tower 2A and the third processing tower 2C are arranged side by side in the extension direction X. The second processing tower 2B and the fourth processing tower 2D are arranged side by side in the extension direction X. Corresponding fluid units 4A to 4D are adjacent to each of the first processing tower 2A, the second processing tower 2B, the third processing tower 2C, and the fourth processing tower 2D from the extension direction X.

The processing liquid supply device 3 includes a processing liquid supply source R. The substrate processing apparatus 1 includes a cabinet 6 that is disposed on the opposite side of the transfer robot IR in the extension direction X, and is used to receive a processing liquid supply source R. The processing liquid supply source R is arranged closer to the third processing tower 2C than the third processing tower 2C and the fourth processing tower 2D disposed on both sides across the transportation path 5, and is disposed closer to the transportation processing path 5. The positions of the fourth processing tower 2D on the other side of the third processing tower 2C and the fourth processing tower 2D are arranged inside the cabinet 6.

FIG. 3 is a schematic diagram showing a configuration of a processing liquid supply device 3 provided in the substrate processing device 1.

3, the processing liquid supply device 3 further includes: a plurality of circulation pipes 22A to 22D, which respectively circulate the processing liquid in the processing liquid tank 21; and supply pipes 23A to 23D, which are branched and connected to the respective circulation pipes 22A to 22D is used to supply the processing liquid to the corresponding first processing tower 2A, second processing tower 2B, third processing tower 2C, and fourth processing tower 2D. The processing liquid supply source R includes: a processing liquid tank 21 for storing the processing liquid; and a common pipe 24 for connecting the processing liquid tank 21 and the upstream ends of the plurality of circulation pipes 22A to 22D. The plurality of circulation pipes 22A to 22D branch from the downstream end of the common wild pipe 24. When the circulation pipes 22A to 22D are collectively referred to as circulation pipes 22. When the supply pipes 23A to 23D are collectively referred to as the supply pipes 23.

The circulation pipes 22A to 22D are provided so as to correspond to the first processing tower 2A to the fourth processing tower 2D, respectively. The portions where the supply pipes 23A to 23D are branched to the circulation pipes 22A to 22D are referred to as branch positions 26A to 26D. The branch positions 26A to 26D are collectively referred to as branch positions 26.

The processing liquid supply device 3 includes: pressure gauges 27A to 27D, which are clamped in each of the circulation pipes 22A to 22D to detect the pressure in the circulation pipes 22A to 22D; and pressure regulating valves 28A to 28D, which are clamped in Each of the circulation pipes 22A to 22D is used to adjust the pressure of the processing liquid in the circulation pipes 22A to 22D. The processing liquid supply device 3 further includes: thermometers 29A to 29D, which are sandwiched between the circulation pipes 22A to 22D, and are used to detect the temperature of the processing liquid in the circulation pipes 22A to 22D. The pressure gauges 27A to 27D are collectively referred to as the pressure gauge 27. The pressure regulating valves 28A to 28D are collectively referred to as a pressure regulating valve 28. The thermometers 29A to 29D are collectively referred to as the thermometers 29A to 29D.

Although the pressure adjustment valves 28A to 28D are, for example, motor needle valves, they are not limited thereto, and may be valves such as relief valves.

The pressure gauges 27A to 27D are examples of a pressure detection unit that detects the pressure of the processing liquid in the circulation pipes 22A to 22D. The thermometers 29A to 29D are examples of temperature detection units that detect the flow rate of the processing liquid in the circulation pipes 22A to 22D.

Because the pressure and the flow rate are related to each other, the flow rate of the processing liquid in the circulation pipes 22A to 22D can be adjusted by adjusting the pressure in a circulation pipe 22A to 22D. That is, the pressure adjustment valves 28A to 28D are examples of flow rate adjustment valves that adjust the flow rate of the processing liquid in the circulation pipes 22A to 22D.

Each of the pressure gauges 27A to 27D is interposed between the corresponding circulation pipes 22A to 22D so as to be positioned more upstream than the branch positions 26A to 26D of the supply pipes 23A to 23D among the circulation pipes 22A to 22D. Each of the pressure regulating valves 28A to 28D is sandwiched between the corresponding circulation pipes 22A to 22D so as to be positioned further downstream than the corresponding branch positions 26A to 26D. Each of the thermometers 29A to 29D is sandwiched between the corresponding circulation pipes 22A to 22D so as to be positioned further downstream than the corresponding branch positions 26A to 26D.

A pump 30, a filter 31, and a heating unit 32 are sequentially sandwiched from the upstream side of the common pipe 24 from the upstream side. The pump 30 sends the processing liquid in the common pipe 24 to the downstream side. The filter 31 filters the processing liquid flowing through the common pipe 24. The heating unit 32 refers to a heater or the like that heats the processing liquid in the common pipe 24.

The processing liquid in the common pipe 24 is sent to the downstream side by the pump 30, and the processing liquid in the processing liquid tank 21 is circulated in each of the circulation pipes 22A to 22D. At this time, the processing liquid in the processing liquid tank 21 is supplied to each of the circulation pipes 22A to 22D through the common pipe 24. For this reason, the processing liquid system located in the processing liquid tank 21 can be heated by the heating unit 32 sandwiched by the common pipe 24. To this end, the processing liquid supply source R supplies the heated (temperature-adjusted) processing liquid to the circulation pipes 22A to 22D. The heating unit 32 has a function as a temperature adjustment unit that adjusts the temperature of the processing liquid supplied from the processing liquid supply source R to the plurality of circulation pipes 22A to 22D.

The components of the processing liquid supply device 3 associated with each of the first processing tower 2A, the second processing tower 2B, the third processing tower 2C, and the fourth processing tower 2D are all in the first processing tower 2A, the second processing tower 2B, The third processing tower 2C and the fourth processing tower 2D have substantially the same configuration. For this reason, the following description will focus on the components corresponding to the first processing tower 2A in the processing liquid supply device 3. FIG. 4 is a schematic diagram showing the configuration of the periphery of the first processing tower 2A and the corresponding circulation pipe 22A.

Referring to FIG. 4, each processing unit 20 of the first processing tower 2A includes a spin chuck 40 that holds the substrate W in a horizontal posture while holding the substrate W around the vertical portion of the center of the substrate W. The rotation axis A1 rotates; the cup 41 surrounds the rotating chuck 40; the first nozzle 42 and the second nozzle 43 supply the processing liquid to the substrate W; and the process chamber 44. It is used to receive the rotating chuck 40, the cup 41, the first nozzle 42 and the second nozzle 43.

The processing chamber 44 is formed with an entrance (not shown) for carrying the substrate W into the processing chamber 44 or for carrying the substrate W out of the processing chamber 44. The processing chamber 44 is provided with a shutter unit (not shown) that opens and closes the entrance and exit.

The rotary chuck 40 includes a plurality of chuck pins 45, a spin base 46, a rotary shaft 47, and an electric motor 48. The rotation shaft 47 extends in the vertical direction along the rotation axis A1. The upper end of the rotation shaft 47 is coupled to the center of the lower surface of the rotation base 46.

The rotation base 46 has a circular plate shape along the horizontal direction. A plurality of chuck pins 45 are arranged on the peripheral edge portion of the upper surface of the rotary base 46 in the circumferential direction at intervals. The rotation base 46 and the chuck pin 45 have a function as a substrate holding unit that holds the substrate W horizontally. The electric motor 48 provides a rotational force to the rotation shaft 47. The rotation shaft 47 is rotated by the electric motor 48, whereby the substrate W can rotate around the rotation axis A1. The electric motor 48 has a function as a substrate rotation unit that rotates the substrate W about the rotation axis A1.

Each of the first nozzle 42 and the second nozzle 43 is a fixed nozzle arranged in this embodiment so that the processing liquid is discharged toward the center of rotation of the upper surface of the substrate W. The first nozzle 42 is supplied with a processing liquid such as a chemical liquid stored in the processing liquid tank 21 of the processing liquid supply source R through the circulation pipe 22A and the supply pipe 23A. The second nozzle 43 is supplied with a processing liquid such as a rinsing liquid through a pipe 51 from another supply source 50 different from the processing liquid supply source R. A valve 52 is provided between the piping 51 to switch the supply of the processing liquid to the second nozzle 43.

The chemical solution is, for example, hydrofluoric acid (hydrogen fluoride water: HF). The chemical liquid system is not limited to hydrofluoric acid, and may include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), ammonia water, hydrogen peroxide water, organic At least one of an acid (for example, citric acid, oxalic acid, etc.), an organic base (for example, TMAH: tetramethyl ammonium hydroxide, etc.), a surfactant, and a preservative A liquid. Examples of the chemical solution prepared by mixing these include SPM (sulfuric acid / hydrogen peroxide mixture), SC1 (ammonia / hydrogen peroxide mixture), and SC2 (hydrochloric acid / hydrogen peroxide mixture; hydrochloric acid-hydrogen peroxide mixture) and the like.

The so-called rinsing liquid is, for example, Deionized Water (DIW). The washing liquid system is not limited to DIW, and may be carbonated water, electrolytic ion water, ozone water, hydrochloric acid water, diluted water (for example, about 10 ppm to 100 ppm), ammonia water, and reduced water (hydrogen water). The rinse solution contains water.

Examples of the treatment liquid system include a chemical solution and a rinse solution, and a low surface tension liquid having a surface tension lower than that of water. The low surface tension liquid system refers to a liquid used to replace the rinse liquid on the substrate W after the rinse liquid is supplied onto the substrate W. After the rinsing liquid on the substrate W is replaced with a low surface tension liquid, the upper surface of the substrate W can be dried well by removing the low surface tension liquid from the substrate W. When using a low surface tension liquid to dry the upper surface of the substrate W, the effect can be reduced compared to the case where the substrate W is dried by removing the rinse liquid from the upper surface of the substrate W without using a low surface tension liquid. The surface tension of a pattern formed on the substrate W.

As the low surface tension liquid system, an organic solvent other than IPA (isopropyl alcohol) that does not chemically react with the upper surface of the substrate W and the pattern formed on the substrate W (lack of reactivity) can be used. More specifically, IPA, HFE (hydrofluoroether), methanole, ethanol, acetone, and trans-1,2-dichloroethylene (Trans-1,2- Dichloroethylene) is used as a low surface tension liquid. In addition, the low surface tension liquid system does not need to be composed of only monomer components, and may be a liquid mixed with other components. For example, it may be a mixed liquid of IPA liquid and pure water, or a mixed liquid of IPA liquid and HFE liquid.

The supply pipe 23A is branched from the circulation pipe 22A. The supply pipe 23A includes a plurality of branch pipes 33 to 35 for supplying a processing liquid to each processing unit 20 of the first processing tower 2A. The upstream ends of the respective branch pipes 33 to 35 are connected to the circulation pipe 22A at the corresponding branch positions 33a to 35a. The downstream ends of the branch pipes 33 to 35 are connected to the first nozzle 42 of the corresponding processing unit 20.

The branch positions 26A of the supply piping 23A in the circulation piping 22A include branch positions 33a to 35a of the respective branch pipings 33 to 35. For this reason, the pressure gauge 27A is sandwiched between the circulation pipe 22A and the branch pipe 33 on the upstream side of the branch pipe 33 on the upstream side of the circulation pipe 22A. The pressure regulating valve 28A and the thermometer 29A are interposed in the circulation pipe 22A so as to be located further downstream than the branch position 35a of the branch pipe 35 on the most downstream side of the circulation pipe 22A.

A supply flow meter 36, a supply flow rate adjustment valve 37, and a supply valve 38 are sandwiched between the plurality of branch pipes 33 to 35 in this order from the upstream side. Each of the supply flow meters 36 detects a flow rate of the processing liquid flowing through the corresponding branch pipes 33 to 35 of the supply pipe 23A. Each supply flow rate adjustment valve 37 adjusts the flow rate of the processing liquid flowing through the corresponding branch pipes 33 to 35 of the supply pipe 23A. Each supply valve 38 switches the presence or absence of the supply of the processing liquid to the corresponding branch pipes 33 to 35 of the supply pipe 23A. The supply flow adjustment valve 37 is, for example, a motor-driven needle valve. The supply valve 38 is, for example, a release valve.

The circulation pipe 22A includes an upstream-side first pipe 60, a downstream-side first pipe 61, and a second pipe 62. The upstream-side first pipe 60 has an upstream end of the circulation pipe 22A and is housed in the cabinet 6. The downstream-side first pipe 61 has a downstream end of the circulation pipe 22A and is housed in the cabinet 6. The second pipe 62 is housed in the fluid unit 4A. The pressure regulating valve 28A and the thermometer 29A are sandwiched between the second piping 62 and arranged in the fluid unit 4A.

The circulation pipe 22A further includes an upstream-side third pipe 63 and a downstream-side third pipe 64. The upstream third pipe 63 is connected to the upstream first pipe 60 and the second pipe 62 and extends between the tank 6 and the fluid unit 4A. The downstream-side third pipe 64 is connected to the downstream-side first pipe 61 and the second pipe 62 and extends between the tank 6 and the fluid unit 4A. The upstream-side third pipe 63 is also referred to as an upstream-side relay pipe. The downstream-side third pipe 64 is also referred to as a downstream-side relay pipe.

The total length of the upstream first pipe 60, the second pipe 62, the upstream third pipe 63, the downstream third pipe 64, and the downstream first pipe 61 is referred to as the pipe length of the circulation pipe 22A.

Referring to FIG. 1, the piping lengths of the circulation pipes 22A to 22D are different from each other according to the relative positions of the processing tower 2 and the processing liquid tank 21. Specifically, the longer the distance between the processing liquid supply source R and the corresponding first processing tower 2A, second processing tower 2B, third processing tower 2C, and fourth processing tower 2D, the longer the piping length of each circulation pipe 22A to 22D The longer. More specifically, among the first processing tower 2A, the second processing tower 2B, the third processing tower 2C, and the fourth processing tower 2D, the circulation pipe corresponding to the first processing tower 2A farthest from the processing liquid supply source R. 22A has the longest piping length. Next, the circulation piping 22B corresponding to the second processing tower 2B is longer, and the circulation piping 22C below the circulation piping 22B corresponding to the third processing tower 2C is longer. Then, the pipe length of the circulation pipe 22D corresponding to the fourth processing tower 2D closest to the processing liquid supply source R is the shortest.

FIG. 5 is a block diagram for explaining the electrical configuration of the main parts of the substrate processing apparatus 1. Referring to FIG. 5, the control device 7 is provided with a microcomputer and controls a control target that is already provided in the substrate processing device 1 according to a predetermined program. More specifically, the control device 7 includes a processor (CPU: Central Processing Unit) 7A and a memory 7B storing a program, and the program is executed by the processor 7A. It is configured to perform various controls for substrate processing. In particular, the control device 7 controls operations of the transfer robot IR, CR, electric motor 48, pressure gauges 27A to 27D, thermometers 29A to 29D, flow meter 36, supply flow adjustment valve 37, supply valve 38, and valve 52, and the like.

FIG. 6 is a flowchart for explaining an example of processing liquid supply by the processing liquid supply device 3.

In the processing liquid supply, first, a target value (target temperature T) of the temperature of the processing liquid flowing in each circulation pipe 22 is set (target temperature setting step: step S1). At this time, a common target temperature T is set for all the circulation pipes 22.

Then, the control device 7 starts the heating unit 32 and the pump 30 sandwiched by the common pipe 24. Thereby, the heated processing liquid can be supplied from the processing liquid supply source R to each of the circulation pipes 22 and the circulation is started in each of the circulation pipes 22 (circulation step: step S2).

Then, the control device 7 controls each thermometer 29 and detects the temperature of the corresponding circulation pipe 22 (temperature detection process: step S3). The temperature of the processing liquid detected by the thermometer 29 is referred to as a detection temperature. The temperature detection process is performed after the cycle process is started.

Simultaneously with the temperature detection step, the pressure in the corresponding circulation pipe 22 is detected by each pressure gauge 27. Thereby, the pressure in each circulation pipe 22 can be confirmed appropriately.

The control device 7 may also calculate the flow rate of the processing liquid in the circulation pipe 22 based on the detection pressure detected by each of the pressure gauges 27A to 27D. Thereby, the flow rate of the processing liquid in the circulation pipe 22 can be detected indirectly. The flow rate calculated by the detection pressure detected by the pressure gauges 27A to 27D is referred to as a detection flow rate.

Then, in order to reduce the difference in the detected temperature between the circulation pipes 22, an opening degree adjustment process is performed to adjust the opening degree of the pressure adjustment valves 28 sandwiched between the circulation pipes 22.

Specifically, first, an operator (hereinafter referred to as an operator) of the substrate processing apparatus 1 determines whether or not the detected temperatures in all the circulation pipes 22 are within a predetermined range (to be described later) including the target temperature T. Temperature (temperature determination step: step S4). When the detection temperature of any of the circulation pipes 22 is outside the predetermined range (NO in step S4), the operator changes the opening degree of the corresponding pressure adjustment valve 28 so that the detection temperature approaches the target. Temperature T (opening degree changing step: step S5). Thereby, the difference in the flow rate between the circulation pipes 22 can be reduced, and the difference in the temperature of the processing liquid between the circulation pipes 22 can be reduced.

Specifically, the opening degree of the pressure adjustment valve 28 can be changed by an operator operating an operation panel (not shown) of the control device 7 or by an operator directly operating the pressure adjustment valve 28.

Then, when the detected temperature in all the circulation pipes 22 is a temperature within a predetermined range (YES in the step), the opening degree of the pressure adjustment valve 28 is not changed, and the control device 7 opens the supply valve 38. Thereby, the supply of the processing liquid from the branch pipes 33 to 35 to the substrate W can be started (step S6). Even if the detected temperature in any of the circulation pipes 22 is a temperature outside a predetermined range of the target temperature T (NO in step S4), after the opening degree of the pressure regulating valve 28 has been changed, The control device 7 will still open the supply valve 38. Thereby, the supply of the processing liquid from the branch pipes 33 to 35 to the substrate W can be started (step S6).

FIG. 7 is a graph showing the difference between the processing tower 2 and the ratio of the change in the temperature of the processing liquid to the change in the flow rate of the processing liquid. In FIG. 7, the horizontal axis shows the flow rate of the processing liquid calculated from the detection pressure in the circulation pipe 22, and the vertical axis shows the detection temperature in the circulation pipe 22. FIG. 7 illustrates a ratio of a change in the temperature of the processing liquid to a change in the flow rate of the processing liquid in each of the circulation pipes 22A to 22D.

In order to properly process the substrate W, the temperature t of the processing liquid in the circulation pipes 22A to 22D needs to be a temperature within a predetermined range. The predetermined range is, for example, a range between a first temperature t1 that is larger than the target temperature T by a predetermined amount Δt and a second temperature t2 that is smaller than the target temperature T by a predetermined amount Δt (t2 ≦ t ≦ t1).

As shown in FIG. 7, the ratio of the change in the detection temperature to the change in the flow rate q of the processing liquid is that the circulation pipe 22A is the largest, the second circulation pipe 22B is larger, then the second circulation pipe 22C is larger, and the circulation pipe 22D is smallest. In other words, the longer the piping length of the circulation pipes 22A to 22D (see also FIG. 1), the larger the ratio of the change in the detection temperature to the change in the flow rate q of the processing liquid becomes.

Therefore, when the temperature of the treatment liquid in the circulation pipe 22 (for example, the circulation pipe 22A) having a relatively long piping length is brought to a temperature within a predetermined range, the treatment liquid of the same flow rate q is circulated to the comparison of the piping length. In the case of a short circulation pipe 22 (for example, the circulation pipe 22B), the temperature of the processing liquid in the relatively short circulation pipe 22 (the circulation pipe 22B) tends to be an appropriate temperature.

In detail, as long as the flow rate q of the processing liquid in the circulation pipe 22A is equal to or lower than the first flow rate q1 and above the second flow rate q2 (q2 ≦ q ≦ q1), the temperature of the processing liquid in the circulation pipe 22A becomes a predetermined range. Internal temperature (t2 ≦ t ≦ t1). Even in the circulation piping 22B, as long as the flow rate q is equal to or less than the first flow rate q1 and equal to or greater than the second flow rate q2, the temperature of the processing liquid will still be a temperature within a predetermined range. Even in the circulation piping 22C and the circulation piping 22D, as with the circulation piping 22B, as long as the flow rate q is equal to or less than the first flow rate q1 and equal to or greater than the second flow rate q2, the temperature of the processing liquid becomes a temperature within a predetermined range.

Therefore, in the opening degree adjusting step, it is preferable that the operator sequentially adjusts the opening degree from the pressure adjusting valve 28 corresponding to the circulation pipe 22 having a longer piping length (sequential adjustment step).

The supply of the processing liquid by the processing liquid supply device 3 is performed, and the processing of the substrate by the substrate processing device 1 is performed. In the substrate processing, the unprocessed substrate W is transferred from the carrier C to the processing unit 20 by the transfer robots IR and CR, and is delivered to the spin chuck 40. Thereafter, while the substrate W is being carried out by the transfer robot CR, the substrate W is held horizontally with a gap from the upper surface of the rotary base 46 upward (the substrate holding step). The electric motor 48 rotates the rotary base 46. As a result, the substrate W held horizontally by the chuck pins 45 is rotated (substrate rotation step).

Next, after the transfer robot CR retreats to the outside of the processing unit 20, the chemical liquid processing is performed. Specifically, when the supply valve 38 is opened, a supply step of supplying, for example, a chemical liquid from the processing liquid supply device 3 to the first nozzle 42 is performed (step S6 in FIG. 6). As described above, the opening degree adjustment process (steps S4 and S5 in FIG. 6) is performed earlier than the supply of the chemical liquid from the first nozzle 42 to the substrate W.

Then, the chemical solution is discharged (supplyed) from the first nozzle 42 toward the upper surface of the substrate W in the rotating state. The supplied chemical solution is spread throughout the entire upper surface of the substrate W by centrifugal force. Thereby, the upper surface of the substrate W can be processed with the chemical solution.

After the chemical solution is processed for a certain period of time, a DIW rinse process for removing the chemical solution from the substrate W can be performed by replacing the chemical solution on the substrate W with DIW. Specifically, the supply valve 38 is closed and the valve 52 is opened. Thereby, a rinse liquid can be supplied (discharged) from the second nozzle 43 toward the upper surface of the substrate W, for example. The DIW supplied to the substrate W is spread throughout the entire upper surface of the substrate W by centrifugal force. The DIW is used to wash away the chemical solution on the substrate W.

After a certain period of rinsing treatment, a drying treatment is performed. Specifically, the electric motor 48 rotates the substrate W at a higher rotation speed (for example, 3000 rpm) than the rotation speed of the substrate W in the chemical solution processing and the rinse solution processing. Thereby, a large centrifugal force acts on the washing liquid on the upper surface of the substrate W, and the washing liquid on the upper surface of the substrate W can be thrown away around the substrate W. In this way, the rinse liquid can be removed from the substrate W, and the substrate W can be dried. Then, when a predetermined time elapses after the high-speed rotation of the substrate W is started, the electric motor 48 stops the rotation of the substrate W by the rotation base 46.

After that, the transfer robot CR enters the processing unit 20, picks up the processed substrate W from the rotary chuck 40, and carries it out of the processing unit 20. The substrate W is delivered from the transfer robot CR to the transfer robot IR, and is stored in the carrier C by the transfer robot IR. Such substrate processing is performed by each of the first processing tower 2A, the second processing tower 2B, the third processing tower 2C, and the fourth processing tower 2D.

According to the first embodiment, the processing liquid whose temperature is supplied from the processing liquid supply source R is adjusted to be circulated through the plurality of circulation pipes 22. The processing liquid circulating in each circulation pipe 22 is supplied to the corresponding processing tower 2 through a supply pipe 23 branched to each circulation pipe 22.

When the operator adjusts the opening degree of the pressure adjustment valve 28, the flow rate of the processing liquid in the circulation pipe 22 can be adjusted. The degree of temperature change of the processing liquid caused by heat exchange (radiation or heat absorption) with the periphery of the circulation pipe 22 depends on the flow rate of the processing liquid in the circulation pipe 22. Therefore, when the flow rate of the processing liquid in the circulation pipe 22 is changed, the temperature detected by the thermometer 29 changes accordingly. Therefore, the operator can adjust the opening degree of each of the pressure adjustment valves 28 in order to reduce the temperature difference of the processing liquid between the circulation pipes 22. In this case, the processing liquid system in which the temperature difference between the circulation pipes 22 has been reduced can be supplied from each circulation pipe 22 to the processing tower 2 through the supply pipe 23. This can reduce the temperature difference between the processing towers 2 of the processing liquid. Thereby, the processing liquid system in which the temperature difference between the circulation pipes 22 has been reduced can be supplied from each circulation pipe 22 to the processing tower 2 through the supply pipe 23. For this reason, the temperature difference between the processing towers 2 of the processing liquid can be reduced.

In addition, even if a heater or the like is not provided for each circulation piping 22 to heat the processing liquid, as long as the heated processing liquid is supplied from the processing liquid supply source R to each circulation piping 22, the amount of processing liquid between the circulation piping 22 can be reduced The difference in temperature. Therefore, since it is not necessary to provide a heater for each circulation pipe 22, the number of parts can be reduced.

In addition, according to the first embodiment, by sequentially adjusting the flow rate from the circulation pipe 22 having a longer piping length, it is possible to easily find that the temperature t of the processing liquid in all the circulation pipes 22 becomes an appropriate temperature (t2 ≦ t ≦ t1). Therefore, the temperature difference of the processing liquid between the circulation pipes 22 can be reduced in a short time.

Further, according to the first embodiment, the thermometer 29 is sandwiched between the circulation piping 22 so as to be positioned further downstream than the branch position 26 of the supply piping 23 in the circulation piping 22. For this reason, the thermometer 29 can detect the temperature of the processing liquid after radiating or absorbing heat from the processing liquid supply source R toward the branch position 26. Therefore, the difference between the circulation pipes 22 of the temperature of the processing liquid supplied to the thermometer 29 and the processing tower 2 can be reliably detected. Therefore, the temperature difference between the circulation pipes 22 can be further reduced.

A portion in which the pressure regulating valve 28 is interposed in the circulation pipe 22 flows into the processing liquid on the upstream side. For this reason, the pressure adjustment valve 28 can adjust the opening degree so that the flow rate in the circulation pipe 22 on the upstream side of the pressure adjustment valve 28 and the circulation pipe 22 on the downstream side than the pressure adjustment valve 28 can be adjusted. Compared with the flow rate, it also fluctuates steadily.

Therefore, as in the first embodiment, as long as the pressure regulating valve 28 is sandwiched between the circulation piping 22 so as to be positioned further downstream than the branch position 26 of the supply piping 23 in the corresponding circulation piping 22, it is possible to make The flow rate of the processing liquid flowing from the circulation pipe 22 to the supply pipe 23 is stable.

In addition, according to the first embodiment, a pressure gauge 27 is provided in each circulation pipe 22 to detect the pressure in the circulation pipe 22. As described above, there is a correlation between the pressure in the circulation piping 22 and the flow rate of the processing liquid in the circulation piping 22. Therefore, as long as the opening degree of the pressure adjustment valve 28 is adjusted while confirming the pressure of each circulation pipe 22 detected by the pressure gauge 27, it is easy to adjust the flow rate of the processing liquid in the circulation pipe 22 to an appropriate range. When the flow rate of the processing liquid in the circulation pipe 22 is changed, the temperature detected by the thermometer 29 changes accordingly. As long as the flow rate of the processing liquid in the circulation pipe 22 can be adjusted to an appropriate range, the circulation can be adjusted. The temperature of the processing liquid in the pipe 22 is adjusted to an appropriate range (predetermined range: t2 ≦ t ≦ t1).

In addition, the pressure gauge 27 and the thermometer 29 are small and inexpensive compared with a general flow meter. For this reason, it is possible to achieve space saving and cost reduction of the processing liquid supply device 3 as compared with a configuration in which a flow meter is sandwiched between the circulation pipes 22.

The pressure of the processing liquid in the circulation piping 22 is more downstream than the branch position 26 and is more upstream than the branch position 26, and is susceptible to change due to changes in the supply state of the processing liquid supplied to the piping 23.

As long as the pressure gauge 27 is sandwiched between the circulation piping 22 and the branch pipe 26 of the supply piping 23 in the circulation piping 22 on the upstream side, the change band of the supply state of the processing liquid to the supply piping 23 can be reduced. Influence of pressure detection of the processing liquid in the circulation pipe 22. In other words, the pressure gauge 27 can stably detect the pressure of the processing liquid in the circulation pipe 22. Therefore, it becomes easy to confirm the pressure of the processing liquid in each circulation pipe 22, and it becomes easier to adjust the flow rate of the processing liquid in the circulation pipe 22 to an appropriate range.

According to the first embodiment, the supply piping 23 includes a plurality of branch pipings 33 to 35 that branch from the corresponding circulation piping 22 and supply the processing liquid to the respective processing units 20 of the corresponding processing tower 2. For this reason, the number of circulation pipes 22 can be reduced as compared with a configuration in which the circulation pipes 22 are provided one by one for each processing unit 20.

Different from the first embodiment, instead of the pressure gauge 27, a flow meter capable of detecting the flow rate may be sandwiched between the circulation pipe 22 and the branch pipe 26 of the supply pipe 23 in the corresponding circulation pipe 22.

Different from the first embodiment, when the target temperature T is set in the target temperature setting step S1, a target pressure corresponding to the target temperature T may be set in advance. In this case, by adjusting the opening degree of the pressure adjustment valve 28 in the opening degree adjustment process so that each detection pressure approaches the target pressure, the temperature of the processing liquid in each circulation pipe 22 can be adjusted so that the detection temperature approaches the target temperature. T. Therefore, it becomes easy to adjust the temperature of the processing liquid in each circulation pipe 22.

    [Second Embodiment]    

FIG. 8 is a schematic diagram showing the configuration of the periphery of the first processing tower 2A and the corresponding circulation pipe 22A in the substrate processing apparatus 1P according to the second embodiment. In FIG. 8, the same reference numerals are attached to the same components as those described so far, and descriptions thereof are omitted. The substrate processing apparatus 1P of the second embodiment is different from the substrate processing apparatus 1 (see FIG. 4) of the first embodiment in that the processing liquid supply device 3P does not have pressure gauges 27A to 27D, and the control device 7 controls pressure adjustment. Valves 28A to 28D (refer to FIG. 5).

FIG. 9 is a flowchart for explaining an example of the processing liquid supply by the processing liquid supply device 3P.

In the processing liquid supply by the processing liquid supply device 3P, first, the control device 7 sets a target value (target temperature T) of the temperature of the processing liquid flowing in each circulation pipe 22 (target temperature setting step: step S11 ). At this time, a common target temperature T can be set for all the circulation pipes 22. In this way, the control device 7 has a function as a target temperature setting unit.

Then, the control device 7 activates the pump 30 sandwiched by the common pipe 24. Thereby, the heated processing liquid can be supplied from the processing liquid supply source R to each of the circulation pipes 22, and the circulation is started in each of the circulation pipes 22 (cycle process: step S12).

Then, the control device 7 controls each thermometer 29 to detect the temperature of the corresponding circulation pipe 22 (temperature detection step: step S13). The temperature detection process is performed after the cycle process is started. Then, the control device 7 performs feedback control based on the detected temperature (step S14). The feedback control is continuously performed while the processing liquid in the processing liquid tank 21 is circulated through the circulation pipe 22.

FIG. 10 is a flowchart for explaining the details of the feedback control (S14 in FIG. 9) of the processing liquid supply by the processing liquid supply device 3P.

In the feedback control, the control device 7 first determines whether or not the detected temperature in each of the circulation pipes 22 matches the target temperature T (temperature determination step: step T1).

When the detected temperature is different from the target temperature T (NO in step T1), the opening degree of each pressure regulating valve 28 can be changed by the control device 7 (opening degree changing step: step T2). In the opening degree changing step, the control device 7 changes the opening degree of the pressure adjustment valve 28 so that the detection temperature approaches the target temperature T. Thereby, the temperature difference of the processing liquid between the circulation pipes 22 can be reduced. Then, by the control device 7, it can be judged again whether or not the detected temperature in each of the circulation pipes 22 matches the target temperature T (target value) (step T1).

When the detected temperature matches the target temperature T (YES in step T1), the opening degree changing step is not executed. Then, by the control device 7, it can be judged again whether or not the detected temperature in each of the circulation pipes 22 agrees with the target temperature T (target value) (step T1).

When the detected temperature and the target temperature T coincide with each other in the temperature determination process (YES in step T1), the temperature determination process is executed again. When the detected temperature is different from the target temperature T in the temperature determination step again (NO in step T1), the temperature change step is performed, and thereafter, the temperature determination step is performed.

In this way, the control device 7 adjusts the opening degree of the pressure adjustment valve 28 by repeating the temperature determination step and the opening degree changing step (opening degree adjusting step). In this way, the control device 7 has a function as an opening degree adjustment unit that adjusts the opening degree of the corresponding pressure adjustment valve 28 to reduce the difference in the detected temperature between the circulation pipes 22.

The opening degree adjustment step of the treatment liquid supply by the treatment liquid supply device 3P is the same as the opening degree adjustment step of the treatment liquid supply by the treatment liquid supply device 3 of the first embodiment, and preferably from the length of the pipe. The pressure adjustment valve 28 corresponding to the longer circulation pipe 22 sequentially adjusts the opening degree (sequential adjustment process).

In the processing liquid supply by the processing liquid supply device 3P, the feedback control is started earlier than the supply of the chemical liquid from the first nozzle 42 (step S14 in FIG. 9).

In the second embodiment, the same effects as the first embodiment are achieved.

Further, in the second embodiment, the flow rate of the processing liquid in the circulation pipe 22 can be adjusted by adjusting the opening degree of the pressure adjustment valve 28 by the control device 7. The degree of temperature change of the processing liquid due to heat radiation or heat absorption depends on the flow rate of the processing liquid in the circulation pipe 22, so when the flow rate of the processing liquid in the circulation pipe 22 is changed, the temperature detected by the thermometer 29 will be Changes accordingly. For this reason, the control device 7 can reliably reduce the temperature difference of the processing liquid between the circulation pipes 22 by adjusting the opening degree of each pressure adjustment valve 28. In this case, the processing liquid system in which the temperature difference between the circulation pipes 22 has been reduced can be supplied from each circulation pipe 22 to the processing tower 2 through the supply pipe 23. This can reduce the temperature difference between the processing towers 2 of the processing liquid.

In the second embodiment, the control device 7 (target temperature setting means) can set the target temperature T for all the circulation pipes 22. The control device 7 (opening degree adjustment means) adjusts the opening degree of the pressure adjustment valve 28 in order to make each detected temperature coincide with the target temperature T. Therefore, the temperature difference of the processing liquid between the circulation pipes 22 can be further reduced.

By continuously adjusting the opening degree of the pressure adjusting valve 28 by the control device 7 so that each detected temperature is consistent with the target temperature T, the state where the temperature difference of the processing liquid between the circulation pipes 22 has been reduced can be maintained.

Here, when the supply state of the processing liquid to the supply pipe 23 changes, the flow rate of the processing liquid in the circulation pipe 22 changes, and the temperature of the processing liquid in the circulation pipe 22 changes. For this reason, even when the detection temperature and the target temperature T are made to coincide with each other in the opening adjustment process, there may be a case where the supply of the processing liquid to the supply pipe 23 changes during the supply of the processing liquid. The detected temperature does not agree with the target temperature T. Even in such a case, the control device 7 continuously adjusts the opening degree of the pressure adjustment valve 28 to be consistent with the target temperature T, thereby reducing the temperature difference of the processing liquid between the circulation pipes 22.

The present invention is not limited to the embodiments described above, but can be implemented in other forms.

For example, different from the embodiment described above, a heater for heating the processing liquid in the processing liquid tank 21 may be provided as the temperature adjustment unit. The processing liquid in the processing liquid tank 21 is heated by this heater. Therefore, the heated processing liquid can be supplied from the processing liquid supply source R to the plurality of circulation pipes 22.

In addition, unlike the embodiment described above, a cooler for cooling the processing liquid may be interposed in the common pipe 24. In addition, unlike the embodiment described above, a cooler for cooling the processing liquid in the processing liquid tank 21 may be provided. In these cases, the cooler has a function as a temperature adjustment unit, and the cooled processing liquid can be supplied from the processing liquid supply source R to the plurality of circulation pipes 22.

In addition, the processing liquid whose temperature is adjusted by the heater and the cooler may be supplied from the processing liquid supply source R to the plurality of circulation pipes 22. In addition, as the temperature adjustment unit, a single unit having both functions of a heater and a cooler may be provided.

Furthermore, in the above-mentioned embodiment, it has been described that each of the pressure gauges 27 is sandwiched between the circulation pipes 22 so as to be positioned more upstream than the branch position 26 of the supply pipes 23 in the corresponding circulation pipes 22. However, unlike the embodiment described above, the pressure gauge 27 may be sandwiched between the circulation pipe 22 and the branch pipe 26 of the supply pipe 23 in the circulation pipe 22 on the downstream side. The pressure gauge 27 may have a configuration in which the circulation pipe 22 is sandwiched between the branch position 33 a and the branch position 35 a.

Furthermore, in the above-mentioned embodiment, it has been described that each pressure regulating valve 28 and each thermometer 29 is interposed in the cycle so as to be positioned further downstream than the branch position 26 of the supply pipe 23 in the corresponding cycle pipe 22. The piping 22. However, unlike the embodiment described above, the pressure regulating valve 28 may be sandwiched between the circulation pipe 22 and the branch pipe 26 of the supply pipe 23 in the circulation pipe 22 so as to be positioned upstream. The thermometer 29 may be sandwiched between the circulation pipe 22 and the branch pipe 26 of the supply pipe 23 in the circulation pipe 22. The pressure regulating valve 28 or the thermometer 29 may have a configuration in which the circulation pipe 22 is sandwiched between the branch position 33 a and the branch position 35 a.

The configuration similar to that of the processing liquid supply device 3 of the present embodiment may be applied to a processing liquid supply device that supplies a processing liquid to the second nozzle 43.

In the embodiment described above, it is assumed that the processing unit 20 includes the first nozzle 42 and the second nozzle 43. However, the number of nozzles is not limited to two, and three or more may be provided. In this case, the same configuration as the processing liquid supply device 3 of this embodiment can be applied to a processing liquid supply device that supplies a processing liquid to each nozzle.

When the number of nozzles is three, a chemical solution such as hydrofluoric acid can be supplied from the first nozzle 42 to the substrate W, a rinse solution such as DIW can be supplied from the second nozzle 43 to the substrate W, and then IPA or the like can be supplied. The organic solvent (low surface tension liquid) is supplied to the substrate W from another nozzle. Thereby, in the above-mentioned substrate processing, between the DIW rinse processing and the drying processing, an organic solvent treatment in which the DIW is replaced with IPA can be performed.

Although the embodiments of the present invention have been described in detail, these are only specific examples used for understanding the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples. The scope of the present invention is only Limited by the scope of the attached patent application.

This application corresponds to Japanese Patent Application No. 2017-003608 filed at the Japan Patent Office on February 24, 2017, and the entire disclosure of this application is incorporated herein by reference.

Claims (12)

A processing liquid supply device for supplying a processing liquid to a plurality of processing sections, and comprising: a processing liquid tank for supplying a heating or cooling processing liquid; and a plurality of circulation pipes provided to correspond to the plurality of processing sections, respectively. It is used to circulate the processing liquid supplied from the processing liquid tank and return to the processing liquid tank respectively; the supply piping is connected to each of the circulation piping branches to supply the processing liquid to the corresponding processing section; a flow adjustment valve And a temperature detection unit is clamped to each of the aforementioned circulation pipes to detect the flow of the processing fluid flowing in the circulation pipe; temperature. The processing liquid supply device according to claim 1, further comprising: an opening degree adjustment unit that adjusts the flow rate adjustment in order to reduce the difference between the circulation pipes of the detection temperature detected by each of the temperature detection units. Valve opening. The processing liquid supply device according to claim 2, further comprising: a target temperature setting unit that sets a target temperature for all of the circulation pipes; and the opening degree adjustment unit is configured to enable the detection by each of the temperature detection units. The detection temperature is consistent with the target temperature, and the opening degree of the flow adjustment valve is adjusted. The processing liquid supply device according to claim 1 or 2, wherein the temperature detection unit is sandwiched in the circulation pipe so as to be located further downstream than a branch position of the supply pipe in the corresponding circulation pipe. . The processing liquid supply device according to claim 1 or 2, wherein the flow rate adjustment valve is sandwiched in the circulation pipe so as to be located further downstream than a branch position of the supply pipe in the corresponding circulation pipe. . The processing liquid supply device according to claim 1 or 2, further comprising: a pressure detection unit, which is sandwiched between each of the circulation pipes and is used to detect the pressure in the circulation pipes. The processing liquid supply device according to claim 6, wherein the pressure detection unit is sandwiched between the circulation piping so as to be positioned upstream of a branch position of the supply piping among the corresponding circulation piping. The processing liquid supply device according to claim 1 or 2, wherein the processing unit includes a plurality of processing units for storing substrates; the supply piping system includes: a plurality of branch piping branches from the corresponding circulation piping, and The processing liquid is supplied to each of the aforementioned processing units. A substrate processing apparatus includes: the processing liquid supply device according to claim 1 or 2; and a plurality of the aforementioned processing units for processing a substrate. A method for supplying a processing liquid is to supply a processing liquid to a plurality of processing sections, and includes a circulation process, wherein the processing liquid is supplied from a processing liquid tank by setting a plurality of circulation pipes corresponding to the plurality of processing sections, respectively. The heating or cooling process liquid is circulated and returned to the processing liquid tank respectively; the temperature detection process is to detect the temperature of the processing liquid flowing through each of the circulation pipes in the circulation process; and the opening degree adjustment process is to reduce the The difference between the circulation pipes of the detected temperature detected in the temperature detection process is to adjust the opening degree of the flow adjustment valve sandwiched between the circulation pipes. The method for supplying a processing liquid according to claim 10, further comprising: a target temperature setting step for setting a target temperature for all of the circulation pipes; and an opening degree adjustment step for the aforementioned detection corresponding to each of the circulation pipes. The temperature is the same as the target temperature, and a step of adjusting the opening degree of the flow rate adjustment valve sandwiched between the circulation pipes is adjusted. The processing liquid supply method according to claim 10 or 11, wherein the piping lengths of the plurality of circulation pipes are different from each other; and the opening degree adjustment process includes the flow rate corresponding to the circulation pipe having a longer piping length. The adjustment valve sequentially adjusts the opening degree in a sequential adjustment process.