JP7312304B2 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing method.

2. Description of the Related Art A substrate processing apparatus for processing a substrate has been used in a manufacturing process of a device including a substrate such as a semiconductor device and a liquid crystal display device. The substrate is, for example, a semiconductor wafer or a glass substrate for a liquid crystal display device.

Japanese Unexamined Patent Application Publication No. 2002-200002 discloses a single-wafer type substrate processing apparatus that processes substrates one by one. A substrate processing apparatus disclosed in Patent Document 1 includes a spin chuck and a processing liquid supply device. A spin chuck rotates the substrate. The processing liquid supply device supplies the processing liquid to the substrate held by the spin chuck. The processing liquid supply device includes a nozzle, a supply pipe, and a valve. The nozzle ejects the processing liquid toward the substrate. A supply pipe supplies the processing liquid to the nozzle. A valve is provided in the delivery line. The processing liquid is supplied to the substrate by being discharged from the nozzle. The valve has a valve body and a valve seat. The valve is closed when the valve body comes into contact with the valve seat, and the valve is opened when the valve body leaves the valve seat.

JP 2009-222189 A

However, after the valve was closed, some processing liquid remained between the valve and the nozzle. In this case, the processing liquid existing between the valve and the nozzle sometimes drips from the nozzle while the substrate processing apparatus is not processing the substrate.

SUMMARY OF THE INVENTION The present invention provides a substrate processing apparatus and a substrate processing method capable of suppressing dripping of a processing liquid from a nozzle while the substrate processing apparatus is not processing a substrate.

According to the first aspect of the present invention, the substrate processing apparatus processes the substrate by supplying the processing liquid to the substrate from the nozzle. A substrate processing apparatus includes a liquid sending pipe, a supply pipe, a return pipe, an adjustment valve, and a controller. The liquid feeding pipe guides the processing liquid. A supply pipe guides the processing liquid guided by the liquid-sending pipe to the nozzle. The return pipe guides the processing liquid guided by the liquid-sending pipe along a path different from that of the supply pipe. A regulating valve is provided in the return line. A control unit controls the adjustment valve. The controller adjusts the flow rate of the processing liquid supplied to the supply pipe by adjusting the opening of the adjustment valve when the opening of the adjustment valve is smaller than a predetermined opening. The control unit stops the supply of the processing liquid to the supply pipe by setting the opening of the adjustment valve to the predetermined opening or more.

In the substrate processing apparatus of the present invention, the processing liquid flow path has a branching portion, a first flow path, a second flow path, and a third flow path. A branch part is a branch point of the liquid-sending pipe, the supply pipe, and the return pipe. The first flow path is located on the liquid feeding pipe side with respect to the branching portion. The second flow path is located on the supply pipe side with respect to the branch portion. A third flow path is positioned on the return pipe side with respect to the branching portion. The first angle is greater than the second angle. The first angle is an angle formed by a first direction from the branch portion toward the first flow channel and a third direction from the branch portion toward the third flow channel. The second angle is an angle formed by the first direction and the second direction from the branch portion to the second flow path.

The substrate processing apparatus of the present invention further includes a throttle section. A narrowed portion is provided in the first flow path.

In the substrate processing apparatus of the present invention, the diameter of the upstream portion of the third flow path is equal to or greater than the diameter of the portion of the first flow path located downstream of the narrowed portion.

In the substrate processing apparatus of the present invention, when the opening degree of the adjustment valve is equal to or greater than the predetermined opening degree, if the opening degree of the adjustment valve is fixed at a constant value, the processing liquid remains in the supply pipe. The end position is held in a fixed position.

In the substrate processing apparatus of the present invention, when the opening of the adjustment valve is fixed at a constant value equal to or greater than the predetermined opening, the larger the fixed opening of the adjustment valve, the higher the retention end position. held in position.

The substrate processing apparatus of the present invention further includes a circulation pipe. The processing liquid circulates in the circulation pipe. The processing liquid flowing through the circulation pipe is supplied to the liquid-sending pipe.

In the substrate processing apparatus of the present invention, the processing liquid guided by the return pipe is supplied to the circulation pipe.

According to a second aspect of the present invention, a substrate processing method is a method for processing a substrate by supplying a processing liquid to the substrate from a nozzle. The substrate processing method includes the step of changing the opening degree of an adjustment valve provided in the flow path of the processing liquid. The processing liquid flow path is formed by a liquid sending pipe, a supply pipe, and a return pipe. The liquid feeding pipe guides the processing liquid. A supply pipe guides the processing liquid guided by the liquid-sending pipe to the nozzle. The return pipe guides the processing liquid guided by the liquid-sending pipe along a path different from that of the supply pipe. The regulating valve is provided on the return line. In the step of changing the opening degree of the adjustment valve, when the opening degree of the adjustment valve is smaller than a predetermined opening degree, the processing liquid supplied to the supply pipe is reduced by adjusting the opening degree of the adjustment valve. Adjust the flow rate. In the step of changing the opening degree of the adjustment valve, the supply of the processing liquid to the supply pipe is stopped by setting the opening degree of the adjustment valve to the predetermined opening degree or more.

According to the substrate processing apparatus and the substrate processing method of the present invention, it is possible to prevent the processing liquid from dripping from the nozzle while the substrate processing apparatus is not processing the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically the structure of the substrate processing apparatus which concerns on embodiment of this invention. 4 is a side view schematically showing the configuration of the processing unit; FIG. FIG. 4 is a flow chart showing an example of substrate processing performed by the substrate processing apparatus; It is a schematic diagram which shows the structure of a chemical|medical-solution supply apparatus. It is a schematic diagram which shows the structure of a supply mechanism. It is a cut end view of an interposed member. It is a schematic diagram which shows the pressure of a chemical|medical solution. FIG. 4 is a schematic diagram showing a state in which a chemical solution is being discharged from a chemical solution nozzle; 4 is a first graph showing the relationship between the degree of opening of the adjustment valve and the amount of liquid medicine discharged from the liquid medicine nozzle. FIG. 4 is a schematic diagram showing a state in which ejection of a chemical solution from a chemical solution nozzle is stopped; FIG. 11 is a second graph showing the relationship between the opening degree of the adjustment valve and the liquid retention end position; FIG. It is a figure which shows the modification of a supply mechanism.

An embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

A substrate processing apparatus 100 according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a plan view schematically showing the configuration of a substrate processing apparatus 100 according to an embodiment of the invention.

As shown in FIG. 1, the substrate processing apparatus 100 is a single-wafer type apparatus that processes substrates W one by one.

The substrate W is, for example, a silicon wafer, a resin substrate, or a glass/quartz substrate. In this embodiment, as the substrate W, a disk-shaped semiconductor substrate is exemplified. However, the shape of the substrate W is not particularly limited. The substrate W may be formed, for example, in a rectangular shape.

A substrate processing apparatus 100 includes a plurality of load ports LP, a plurality of processing units 1 , a storage section 2 and a control section 3 .

The load port LP holds a carrier C containing substrates W therein. The processing unit 1 processes the substrate W transported from the load port LP with a processing fluid. A processing fluid indicates, for example, a processing liquid or a processing gas.

The storage unit 2 includes a main storage device (eg, semiconductor memory) such as ROM (Read Only Memory) and RAM (Random Access Memory), and may further include an auxiliary storage device (eg, hard disk drive). The main memory and/or auxiliary memory store various computer programs executed by the controller 3 .

The control unit 3 includes processors such as a CPU (Central Processing Unit) and an MPU (Micro Processing Unit). The control unit 3 controls each element of the substrate processing apparatus 100 .

The substrate processing apparatus 100 further includes a transfer robot. The transport robot transports the substrate W between the load port LP and the processing unit 1 . The transport robots include an indexer robot IR and a center robot CR. The indexer robot IR transports substrates W between the load port LP and the center robot CR. The center robot CR transports substrates W between the indexer robot IR and the processing units 1 . Each of the indexer robot IR and the center robot CR includes a hand that supports the substrate W. As shown in FIG.

The substrate processing apparatus 100 further includes a plurality of fluid boxes 4 and chemical liquid cabinets 5 . A plurality of fluid boxes 4 and processing units 1 are arranged inside a housing 100 a of the substrate processing apparatus 100 . The chemical solution cabinet 5 is arranged outside the housing 100 a of the substrate processing apparatus 100 . The chemical solution cabinet 5 may be arranged on the side of the substrate processing apparatus 100 . Further, the chemical solution cabinet 5 may be arranged under (underground) the clean room in which the substrate processing apparatus 100 is installed.

A plurality of processing units 1 constitute a tower U stacked vertically. A plurality of towers U are provided. A plurality of towers U are arranged so as to surround the center robot CR in plan view.

In this embodiment, the tower U is stacked with three treatment units 1 . Also, four towers U are provided. The number of treatment units 1 constituting the tower U is not particularly limited. Also, the number of towers U is not particularly limited.

A plurality of fluid boxes 4 correspond to a plurality of towers U, respectively. The chemical liquid in the chemical liquid cabinet 5 is supplied to the tower U corresponding to the fluid box 4 via the fluid box 4 . As a result, all the processing units 1 included in the tower U are supplied with the chemical solution.

The processing unit 1 will be described with reference to FIG. FIG. 2 is a side view schematically showing the configuration of the processing unit 1. As shown in FIG.

As shown in FIG. 2 , processing unit 1 includes chamber 6 , spin chuck 10 and cup 14 .

Chamber 6 includes partition 8, shutter 9 and FFU 7 (fan filter unit). The partition 8 has a hollow shape. The partition wall 8 is provided with a transfer port. The shutter 9 opens and closes the transfer port. The FFU 7 creates a downflow of clean air inside the chamber 6 . Clean air is air that has been filtered.

The center robot CR loads the substrate W into the chamber 6 through the transfer port and unloads the substrate W from the chamber 6 through the transfer port.

A spin chuck 10 is arranged in the chamber 6 . The spin chuck 10 holds the substrate W horizontally and rotates it around the rotation axis A1. The rotation axis A1 is a vertical axis that passes through the central portion of the substrate W. As shown in FIG.

The spin chuck 10 includes multiple chuck pins 11 , a spin base 12 , a spin motor 13 , a cup 14 and a cup lifting unit 15 .

The spin base 12 is a disk-shaped member. A plurality of chuck pins 11 hold the substrate W horizontally on the spin base 12 . The spin motor 13 rotates the chuck pins 11 to rotate the substrate W around the rotation axis A1.

The spin chuck 10 of this embodiment is a clamping type chuck that brings a plurality of chuck pins 11 into contact with the outer peripheral surface of the substrate W. As shown in FIG. However, the invention is not so limited. The spin chuck 10 may be a vacuum chuck. The vacuum chuck holds the substrate W horizontally by sucking the back surface (lower surface) of the substrate W, which is the non-device forming surface, onto the upper surface of the spin base 12 .

The cup 14 receives the processing liquid discharged from the substrate W. As shown in FIG. The cup 14 includes an inclined portion 14a, a guide portion 14b, and a liquid receiving portion 14c. The inclined portion 14a is a tubular member extending obliquely upward toward the rotation axis A1. The inclined portion 14 a includes an annular upper end having an inner diameter larger than that of the substrate W and the spin base 12 . The upper end of the inclined portion 14 a corresponds to the upper end of the cup 14 . The upper end of the cup 14 surrounds the substrate W and the spin base 12 in plan view. The guide portion 14b is a cylindrical member that extends downward from the lower end (outer end) of the inclined portion 14a. The liquid receiving portion 14c is positioned below the guide portion 14b and forms an upwardly open annular groove.

The cup elevating unit 15 elevates the cup 14 between a raised position and a lowered position. When the cup 14 is positioned at the raised position, the upper end of the cup 14 is positioned above the spin chuck 10 . When the cup 14 is positioned at the lowered position, the upper end of the cup 14 is positioned below the spin chuck 10 .

When the processing liquid is supplied to the substrate W, the cup 14 is positioned at the raised position. The processing liquid splashed outward from the substrate W is received by the inclined portion 14a and then collected in the liquid receiving portion 14c via the guide portion 14b.

The processing unit 1 further includes a rinse liquid nozzle 16 , a rinse liquid pipe 17 and a rinse liquid valve 18 . The rinse liquid nozzle 16 discharges the rinse liquid toward the substrate W held by the spin chuck 10 . The rinse liquid nozzle 16 is connected to the rinse liquid pipe 17 . A rinse liquid valve 18 is interposed in the rinse liquid pipe 17 .

When the rinse liquid valve 18 is opened, the rinse liquid is supplied from the rinse liquid pipe 17 to the rinse liquid nozzle 16 . Then, the rinse liquid is discharged from the rinse liquid nozzle 16 . The rinse liquid is, for example, pure water (deionized water). The rinse liquid is not limited to pure water, and may be carbonated water, electrolytic ion water, hydrogen water, ozone water, and/or dilute hydrochloric acid water. The diluted concentration is, for example, a concentration of 10 ppm or more and 100 ppm or less.

Processing unit 1 further includes a chemical liquid nozzle 21 and a nozzle moving unit 22 . The chemical liquid nozzle 21 ejects the chemical liquid toward the substrate W held by the spin chuck 10 . The nozzle moving unit 22 moves the chemical liquid nozzle 21 between the processing position and the retracted position. The processing position indicates a position where the chemical nozzle 21 discharges the chemical toward the substrate W. FIG. The retracted position indicates a position where the chemical nozzle 21 is separated from the substrate W. FIG. The nozzle moving unit 22 moves the chemical liquid nozzle 21 by rotating the chemical liquid nozzle 21 around the swing axis A2, for example. The swing axis A2 is a vertical axis positioned around the cup 14 .

The substrate processing apparatus 100 further includes a chemical supply device 30 . The chemical liquid supply device 30 supplies the chemical liquid to the chemical liquid nozzle 21 of the processing unit 1 . The chemical liquid supplied to the chemical liquid nozzle 21 contains, for example, isopropyl alcohol (IPA).

A chemical solution is an example of the treatment liquid of the present invention. The chemical liquid nozzle 21 is an example of the nozzle of the present invention.

With reference to FIG. 3, an example of the processing of the substrate W performed by the substrate processing apparatus 100 will be described. FIG. 3 is a flow chart showing an example of the processing performed on the substrate W by the substrate processing apparatus 100. As shown in FIG.

As shown in FIG. 3 , in step S<b>1 , the control unit 3 performs a transfer process for transferring the substrate W into the chamber 6 . The procedure of the transport process will be described below.

First, while the chemical nozzle 21 is retracted from above the substrate W, the center robot CR moves the hand into the chamber 6 while supporting the substrate W with the hand. Then, the center robot CR places the substrate W supported by the hand on the spin chuck 10 . As a result, the substrate W is transferred onto the spin chuck 10 .

When the substrate W is transferred onto the spin chuck 10, the chuck pins 11 grip the substrate W. As shown in FIG. Then, the spin motor 13 rotates the chuck pin 11 . As a result, the substrate W rotates. After the substrate W rotates, the process proceeds to step S2.

In step S<b>2 , the control unit 3 performs chemical liquid supply processing for supplying the chemical liquid to the substrate W. FIG. The procedure of the chemical solution supply process will be described below.

First, the nozzle moving unit 22 moves the chemical liquid nozzle 21 to the processing position. Then, the cup lifting unit 15 lifts the cup 14 to the raised position. Then, the chemical liquid supply device 30 starts supplying the chemical liquid to the chemical liquid nozzle 21 . As a result, the chemical liquid nozzle 21 discharges the chemical liquid toward the substrate W. FIG.

While the chemical liquid nozzle 21 is discharging the chemical liquid, the nozzle moving unit 22 may move the chemical liquid nozzle 21 between the central processing position and the outer peripheral processing position. The central processing position indicates a position where the chemical solution discharged from the chemical solution nozzle 21 lands on the central portion of the upper surface of the substrate W. As shown in FIG. The peripheral processing position indicates a position where the chemical solution discharged from the chemical solution nozzle 21 lands on the outer peripheral portion of the upper surface of the substrate W. FIG. Further, when the chemical nozzle 21 is discharging the chemical, the nozzle moving unit 22 may make the chemical nozzle 21 stationary so that the chemical liquid landing position is positioned at the center of the upper surface of the substrate W.

The chemical solution discharged from the chemical solution nozzle 21 lands on the upper surface of the substrate W, and then flows outward from the substrate W while following the upper surface of the substrate W during rotation. As a result, a liquid film of the chemical liquid is formed so as to cover the entire upper surface of the substrate W. FIG.

In particular, when the nozzle moving unit 22 moves the chemical liquid nozzle 21 between the central processing position and the peripheral processing position, the entire upper surface of the substrate W is scanned at the chemical liquid landing positions. Therefore, it is possible to uniformly supply the chemical solution to the entire upper surface of the substrate W. FIG.

After a predetermined time has elapsed since the supply of the chemical solution to the chemical solution nozzle 21 was started, the supply of the chemical solution to the chemical solution nozzle 21 is stopped. Then, the nozzle moving unit 22 moves the liquid medicine nozzle 21 to the retracted position. When the chemical liquid nozzle 21 reaches the retracted position, the process proceeds to step S3.

In step S<b>3 , the control unit 3 performs a rinse liquid supply process of supplying pure water, which is an example of a rinse liquid, to the substrate W. FIG. The procedure of the rinse liquid supply process will be described below.

First, the rinse liquid valve 18 is opened, and the rinse liquid nozzle 16 starts discharging pure water. The pure water that has landed on the upper surface of the substrate W flows outward from the substrate W along the upper surface of the substrate W during rotation. The chemical liquid on the substrate W is washed away by pure water discharged from the rinse liquid nozzle 16 . As a result, a liquid film of pure water is formed over the entire upper surface of the substrate W. As shown in FIG.

After a predetermined period of time has passed since the rinse liquid valve 18 was opened, the rinse liquid valve 18 is closed and the discharge of pure water onto the substrate W is stopped. When the ejection of pure water onto the substrate W is stopped, the process proceeds to step S4.

In step S4, the controller 3 performs a drying process of drying the substrate W by rotating the substrate W. FIG. The procedure of the drying process will be described below.

First, the spin motor 13 rotates the substrate W at a high rotational speed (for example, several thousand rpm) greater than the rotational speed of the substrate W during the chemical liquid supply process and the rotational speed of the substrate W during the rinse liquid supply process. As a result, the liquid is removed from the substrate W, so that the substrate W is dried.

The spin motor 13 stops the rotation of the substrate W after a predetermined time has elapsed since the substrate W started to rotate at high speed. When the substrate W stops rotating, the process proceeds to step S5.

In step S<b>5 , the control unit 3 performs unloading processing for unloading the substrate W from the chamber 6 . In the following, the procedures of the unloading process will be described.

First, the cup lifting unit 15 lowers the cup 14 to the lower position. Then, the center robot CR causes the hand to enter the chamber 6 . Then, the plurality of chuck pins 11 release the substrate W from its grip.

After the multiple chuck pins 11 release the grip of the substrate W, the center robot CR supports the substrate W on the spin chuck 10 with a hand. Then, the center robot CR withdraws the hand from the inside of the chamber 6 while supporting the substrate W with the hand. As a result, the processed substrate W is unloaded from the chamber 6 .

When the processed substrate W is unloaded from the chamber 6, the unloading process shown in step S5 is completed.

A plurality of substrates W transported to the substrate processing apparatus 100 are processed one by one by repeating the processing shown in steps S1 to S5.

Next, the chemical liquid supply device 30 will be described with reference to FIG. FIG. 4 is a schematic diagram showing the configuration of the chemical supply device 30. As shown in FIG.

A plurality of chemical liquid supply devices 30 are provided. A plurality of chemical supply devices 30 respectively correspond to a plurality of towers U (see FIG. 1). The chemical solution supply device 30 supplies the chemical solution to all the processing units 1 constituting the corresponding tower U.

In this embodiment, one tower U is composed of three treatment units 1 . Therefore, one chemical supply device 30 supplies the chemical to three processing units 1 .

As shown in FIG. 4 , the chemical liquid supply device 30 includes a supply tank 31 , a circulation pipe 32 , a circulation pump 33 , a circulation filter 34 and a circulation heater 35 .

The supply tank 31 stores the chemical liquid. The circulation pipe 32 is a tubular member. A circulation path through which the chemical liquid circulates is formed in the circulation pipe 32 . The circulation pipe 32 has an upstream end 32a and a downstream end 32b. The circulation pipe 32 communicates with the supply tank 31 . Specifically, the upstream end 32 a and the downstream end 32 b of the circulation pipe 32 communicate with the supply tank 31 .

The circulation pump 33 sends the chemical solution in the supply tank 31 to the circulation pipe 32 . When the circulation pump 33 operates, the chemical liquid in the supply tank 31 is sent to the upstream end 32 a of the circulation pipe 32 . The chemical solution sent to the upstream end 32a is transported through the circulation pipe 32 and discharged to the supply tank 31 from the downstream end 32b. As the circulation pump 33 continues to operate, the chemical continues to flow in the circulation pipe 32 from the upstream end 32a toward the downstream end 32b. As a result, the chemical circulates through the circulation pipe 32 .

The circulation filter 34 removes foreign matter such as particles from the chemical solution circulating through the circulation pipe 32 . The circulation heater 35 adjusts the temperature of the chemical by heating the chemical. The circulation heater 35 maintains the temperature of the chemical solution at a constant temperature (eg, 60° C.) higher than room temperature, for example. The temperature of the chemical liquid circulating in the circulation pipe 32 is kept constant by the circulation heater 35 .

A circulation pump 33 , a circulation filter 34 , and a circulation heater 35 are installed in the circulation pipe 32 .

A supply tank 31 , a circulation pump 33 , a circulation filter 34 , and a circulation heater 35 are installed inside the chemical solution cabinet 5 .

A pressure device may be provided instead of the circulation pump 33 . The pressurizing device sends out the chemical liquid in the supply tank 31 to the circulation pipe 32 by increasing the pressure in the supply tank 31 .

The chemical liquid supply device 30 further includes a plurality of supply mechanisms 40 . In this embodiment, three supply mechanisms 40 are provided.

Each of the multiple supply mechanisms 40 communicates with the circulation pipe 32 . A chemical liquid circulating in the circulation pipe 32 is supplied to each of the plurality of supply mechanisms 40 .

A plurality of supply mechanisms 40 correspond to a plurality of processing units 1 . The supply mechanism 40 supplies the chemical liquid to the corresponding processing unit 1 . The chemical liquid supplied to the processing unit 1 is discharged from the chemical liquid nozzle 21 .

The chemical supply device 30 further has a recovery tank 51 , a recovery pipe 52 , a recovery pump 53 and a recovery filter 54 .

The recovery tank 51 communicates with each of the multiple supply mechanisms 40 . The recovery tank 51 stores the chemical liquid that has passed through each of the plurality of supply mechanisms 40 without being discharged from the chemical liquid nozzle 21 .

The recovery pipe 52 is a tubular member. The recovery pipe 52 guides the chemical solution in the recovery tank 51 to the supply tank 31 . The recovery pipe 52 includes an upstream end 52a and a downstream end 52b. The upstream end 52 a communicates with the recovery tank 51 . The downstream end 52 b communicates with the supply tank 31 .

A recovery pump 53 is installed in the recovery pipe 52 . The recovery pump 53 pressure-feeds the chemical solution in the recovery tank 51 to the supply tank 31 through the recovery pipe 52 . A recovery filter 54 is installed in the recovery pipe 52 . The recovery filter 54 removes foreign matter from the chemical liquid flowing through the recovery pipe 52 .

Next, the supply mechanism 40 will be described with reference to FIG. FIG. 5 is a schematic diagram showing the configuration of the supply mechanism 40. As shown in FIG.

As shown in FIG. 5 , the supply mechanism 40 has a liquid supply pipe 41 , a branch portion 42 , a supply pipe 43 and a return pipe 44 . The liquid-sending pipe 41 , the supply pipe 43 , and the return pipe 44 communicate with each other via the branch portion 42 .

The liquid-sending pipe 41 is a tubular member. The liquid-sending pipe 41 guides the chemical solution circulating in the circulation pipe 32 to the outside of the circulation pipe 32 . The liquid-sending pipe 41 includes an upstream end 41a and a downstream end 41b. The upstream end 41 a communicates with the circulation pipe 32 .

The supply pipe 43 is a tubular member. The supply pipe 43 guides the chemical solution guided by the liquid supply pipe 41 to the chemical solution nozzle 21 . The supply pipe 43 includes an upstream end 43a and a downstream end 43b. The upstream end portion 43 a communicates with the downstream end portion 41 b of the liquid feeding pipe 41 via the branch portion 42 . The downstream end 43 b communicates with the chemical nozzle 21 .

The return pipe 44 is a tubular member. The return pipe 44 guides the processing liquid guided by the liquid-sending pipe 41 along a path different from that of the supply pipe 43 . In this embodiment, the return pipe 44 guides the chemical solution to the recovery tank 51 . Return line 44 includes an upstream end 44a and a downstream end 44b. The upstream end portion 44 a communicates with each of the downstream end portion 41 b of the liquid supply pipe 41 and the upstream end portion 43 a of the supply pipe 43 via the branch portion 42 . The downstream end portion 44 b communicates with the recovery tank 51 .

The supply mechanism 40 further has a flow meter 45 , an interposed member 46 and an adjustment valve 47 .

The flow meter 45 detects the flow rate of the chemical liquid flowing through the liquid sending pipe 41 . A flow meter 45 is installed in the liquid feeding pipe 41 . The flow rate of the chemical liquid, in detail, indicates the amount of the chemical liquid per unit time flowing through a predetermined position in the liquid-sending pipe 41 .

The interposed member 46 is arranged at the branch portion 42 . The interposed member 46 is a hollow member. The interposed member 46 is interposed between the liquid feed pipe 41 , the supply pipe 43 and the return pipe 44 . The liquid-sending pipe 41 , the supply pipe 43 , and the return pipe 44 are communicated with each other via an interposed member 46 .

A regulating valve 47 is installed in the return line 44 . The adjustment valve 47 can change the degree of opening. The degree of opening indicates the extent to which the adjustment valve 47 is open. As the opening degree of the adjustment valve 47 decreases, the opening degree of the adjustment valve 47 decreases.

The adjustment valve 47 includes a drive source such as a motor, and changes the opening by power of the drive source. The control unit 3 shown in FIG. 1 controls the opening degree of the adjustment valve 47 by operating the drive source.

Next, the flow of the chemical solution in the chemical solution supply device 30 will be described with reference to FIGS. 4 and 5. FIG.

As shown in FIGS. 4 and 5 , when the chemical liquid circulating in the circulation pipe 32 flows from the circulation pipe 32 into the liquid-sending pipe 41 , the liquid-sending pipe 41 guides it to the branch portion 42 . The chemical liquid supplied from the branch portion 42 to the supply pipe 43 is discharged from the chemical liquid nozzle 21 . The chemical liquid supplied from the branch portion 42 to the return pipe 44 is discharged from the return pipe 44 to the recovery tank 51 . The chemical liquid discharged to the recovery tank 51 is supplied to the supply tank 31 through the recovery pipe 52 . The chemical liquid supplied to the supply tank 31 circulates through the circulation pipe 32 .

Next, the interposing member 46 will be described with reference to FIG. 6 is a cut end view of the interposed member 46. FIG.

As shown in FIG. 6, the interposed member 46 has a first member 46a, a second member 46b, and a third member 46c. The first member 46a, the second member 46b, and the third member 46c are hollow members and communicate with each other. A space where the first member 46a, the second member 46b, and the third member 46c communicate with each other constitutes the branch portion 42. As shown in FIG.

The first member 46a and the third member 46c protrude from the branch portion 42 in opposite directions. The second member 46b protrudes from the branch portion 42 in a direction perpendicular to each of the first member 46a and the third member 46c.

The first member 46a has a first opening 4A. The first opening 4A communicates the inside and the outside of the first member 46a. A downstream end 41b of the liquid feeding pipe 41 is connected to the first opening 4A.

The second member 46b has a second opening 4B. The second opening 4B communicates the inside and the outside of the second member 46b. An upstream end 43a of the supply pipe 43 is connected to the second opening 4B.

The third member 46c has a third opening 4C. The third opening 4C communicates the inside and the outside of the third member 46c. An upstream end 44a of the return pipe 44 is connected to the third opening 4C.

The chemical liquid flowing through the liquid-sending pipe 41 is supplied to the inside of the interposing member 46 through the first opening 4A. The chemical solution inside the interposed member 46 is supplied to the supply pipe 43 through the second opening 4B. The chemical solution inside the interposition member 46 is supplied to the return pipe 44 through the third opening 4C.

The chemical liquid flow path has a branch portion 42, a first flow path R1, a second flow path R2, and a third flow path R3. The branch portion 42 is a branch point of the liquid sending pipe 41 , the supply pipe 43 and the return pipe 44 . A first flow path R<b>1 indicates a flow path of the chemical liquid located on the liquid feeding pipe 41 side with respect to the branch portion 42 . The first flow path R1 is located between the branch portion 42 and the upstream end portion 41a (see FIG. 5) of the liquid feeding pipe 41. As shown in FIG. A second flow path R<b>2 indicates a flow path of the chemical liquid located on the supply pipe 43 side with respect to the branch portion 42 . The second flow path R2 is positioned between the branch portion 42 and the downstream end portion 43b of the supply pipe 43. As shown in FIG. A third flow path R<b>3 indicates a flow path for the chemical solution located on the return pipe 44 side with respect to the branch portion 42 . The third flow path R3 is located between the branch portion 42 and the downstream end portion 44b of the return pipe 44. As shown in FIG.

The supply mechanism 40 further has a throttle portion 46d. The narrowed portion 46d is arranged in the first flow path R1. The narrowed portion 46d functions as an orifice that narrows the flow path area of the first flow path R1. The flow channel area is the cross-sectional area of the chemical flow channel perpendicular to the direction in which the chemical flows.

In this embodiment, the narrowed portion 46d is formed in the first member 46a of the interposed member 46. As shown in FIG. The narrowed portion 46 d faces the branch portion 42 . The throttle portion 46 d ejects the chemical solution toward the branch portion 42 . In this embodiment, the narrowed portion 46 d is positioned near the branch portion 42 . Therefore, the chemical liquid flows into the branching portion 42 immediately after being ejected from the throttle portion 46d.

FIG. 6 shows a first direction Q1, a second direction Q2 and a third direction Q3.

A first direction Q1 indicates a direction from the branch portion 42 toward the first flow path R1. A second direction Q2 indicates a direction from the branch portion 42 toward the second flow path R2. A third direction Q3 indicates a direction from the branch portion 42 toward the third flow path R3.

FIG. 6 further shows the first angle θ1 and the second angle θ2. A first angle θ1 indicates an angle formed by the first direction Q1 and the third direction Q3. Specifically, the first angle θ1 indicates the smaller angle of the angles formed by the first direction Q1 and the third direction Q3. A second angle θ2 indicates an angle formed by the first direction Q1 and the second direction Q2. Specifically, the second angle θ2 indicates the smaller angle of the angles formed by the first direction Q1 and the second direction Q2.

The first angle θ1 is greater than the second angle θ2 (first angle θ1>second angle θ2). That is, the third flow path R3 is less curved with respect to the first flow path R1 than the second flow path R2. Therefore, the chemical liquid flowing from the first flow path R1 to the branch portion 42 is mainly guided to the third flow path R3. In other words, the throttle portion 46d ejects the chemical liquid toward the third flow path R3.

In this embodiment, the first angle θ1 is 180 degrees and the second angle θ2 is 90 degrees.

The pressure of the chemical will be described with reference to FIG. FIG. 7 is a schematic diagram showing the pressure of the chemical solution.

FIG. 7 shows a first pressure P1, a second pressure P2 and a third pressure P3. The first pressure P1 indicates the pressure of the chemical solution located upstream of the narrowed portion 46d in the first flow path R1. A second pressure P2 indicates the pressure of the chemical solution located at the branch portion 42 . The third pressure P3 indicates the pressure of the chemical liquid positioned in the second flow path R2.

FIG. 7 further shows the first movement direction X1 and the first movement speed V1. The first moving direction X1 indicates the moving direction of the chemical liquid flowing upstream of the narrowed portion 46d in the first flow path R1. The first moving speed V1 indicates the moving speed of the chemical liquid flowing upstream of the narrowed portion 46d in the first flow path R1.

FIG. 7 further shows a second movement direction X2 and a second movement speed V2. The second movement direction X2 indicates the movement direction of the chemical liquid when it flows from the first flow path R1 into the branch portion 42. As shown in FIG. The second movement direction X2 is the direction opposite to the first direction Q1 shown in FIG. The second moving speed V2 indicates the moving speed of the chemical when the chemical flows into the branch portion 42 from the first flow path R1.

In the present embodiment, when the chemical liquid ejected from the narrowed portion 46d flows into the branch portion 42 from the first flow path R1, it moves in the second moving direction X2 at the second moving speed V2.

As shown in FIG. 7, the channel area of the constricted portion 46d is smaller than the channel area upstream of the constricted portion 46d. Therefore, according to Bernoulli's theorem, in the constricted portion 46d, the moving speed of the chemical solution increases and the pressure of the chemical solution decreases compared to the upstream portion of the constricted portion 46d. As a result, the chemical solution accelerated and decompressed by the throttle portion 46d is ejected from the throttle portion 46d.

Since the chemical liquid, which is accelerated and decompressed by the narrowed portion 46d, is ejected from the narrowed portion 46d, the second moving speed V2 becomes higher than the first moving speed V1 (second moving speed V2>first moving speed V1). Also, the second pressure P2 becomes lower than the first pressure P1 (second pressure P2<first pressure P1).

The second pressure P2 is changed by changing the opening degree of the adjustment valve 47 shown in FIG. As the opening degree of the adjustment valve 47 decreases, the area of the third flow path R3 where the adjustment valve 47 is positioned decreases. As a result, the amount of the chemical solution passing through the adjustment valve 47 per unit time decreases, so the second pressure P2 increases.

In addition, the change of the opening degree of the adjustment valve 47 is performed by the control section 3 shown in FIG.

FIG. 7 shows a first diameter D1, a second diameter D2, a third diameter D3, a fourth diameter D4 and a fifth diameter D5. The first diameter D1 indicates the diameter of the portion of the first flow path R1 located upstream of the narrowed portion 46d. A second diameter D2 indicates the diameter of the throttle portion 46d. A third diameter D3 indicates the diameter of a portion of the first flow path R1 located downstream of the narrowed portion 46d. A fourth diameter D4 indicates the diameter of the upstream portion of the third flow path R3. The upstream portion of the third flow path R3 indicates the vicinity of the branch portion 42 in the third flow path R3. A fifth diameter D5 indicates the diameter of the upstream portion of the second flow path R2. The upstream portion of the second flow path R2 indicates the vicinity of the branch portion 42 in the second flow path R2.

The first diameter D1 is larger than the second diameter D2 (first diameter D1>second diameter D2). The third diameter D3 is larger than the second diameter D2 (third diameter D3>second diameter D2). The fourth diameter D4 is greater than or equal to the third diameter D3 (fourth diameter D4≧third diameter D3). The fourth diameter D4 is greater than or equal to the fifth diameter D5 (fourth diameter D4≧fifth diameter D5). Note that the size relationship between the fourth diameter D4 and the fifth diameter D5 is not particularly limited. The fourth diameter D4 may be smaller than the fifth diameter D5.

Next, the relationship between the opening degree of the adjustment valve 47 and the discharge amount of the chemical solution from the chemical solution nozzle 21 will be described with reference to FIGS. 7 to 9. FIG. FIG. 8 is a schematic diagram showing a state in which the chemical liquid is being discharged from the chemical liquid nozzle 21. As shown in FIG.

FIG. 9 is a first graph G1 showing the relationship between the opening degree of the adjustment valve 47 and the discharge amount of the chemical solution from the chemical solution nozzle 21. As shown in FIG. In the first graph G<b>1 , the horizontal axis indicates the opening degree of the adjustment valve 47 . In the first graph G<b>1 , the vertical axis indicates the discharge amount of the chemical solution from the chemical solution nozzle 21 . The ejection amount of the chemical liquid indicates, in detail, the ejection amount of the chemical liquid per unit time.

As shown in FIGS. 7 to 9, the control unit 3 adjusts the opening degree of the adjustment valve 47 to make the second pressure P2 higher than the third pressure P3, so that the second pressure P2 and the third pressure Due to the pressure difference from P3 (second pressure P2>third pressure P3), a suction force F1 is generated. The suction force F1 indicates a force for sucking the chemical liquid supplied from the first flow path R1 to the branch portion 42 to the second flow path R2. The smaller the opening of the adjustment valve 47, the larger the suction force F1.

In this embodiment, as shown in FIG. 6, the first angle θ1 is larger than the second angle θ2 (θ1>θ2). Therefore, in a state where the suction force F1 is not generated, the chemical liquid flowing from the first flow path R1 to the branch portion 42 is mainly guided to the third flow path R3. However, due to the suction force F1 being generated, the chemical liquid that is about to flow from the branch portion 42 to the third flow path R3 is drawn into the second flow path R2. The chemical liquid drawn into the second flow path R2 is supplied to the chemical liquid nozzle 21 . As a result, the chemical liquid is discharged from the chemical liquid nozzle 21 .

When the opening degree of the adjustment valve 47 is the minimum opening degree J0, the adjustment valve 47 is not closed and is open. In this case, the regulating valve 47 is slightly open. In this case, the chemical liquid supplied from the first flow path R1 to the branch portion 42 is mainly supplied to the chemical liquid nozzle 21 via the second flow path R2. As a result, the chemical liquid is discharged from the chemical liquid nozzle 21 . Further, in this case, the discharge amount of the chemical liquid from the chemical liquid nozzle 21 becomes the maximum discharge amount H. As shown in FIG. Also, in this case, a small amount of chemical solution is supplied to the recovery tank 51 or no chemical solution is supplied to the recovery tank 51 .

Note that the adjustment valve 47 may be closed when the opening degree of the adjustment valve 47 is the minimum opening degree J0. In this case, all of the chemical liquid supplied to the branch portion 42 from the first flow path R1 is supplied to the chemical liquid nozzle 21 via the second flow path R2. In this case, no chemical solution is supplied to the recovery tank 51 .

When the opening degree of the adjustment valve 47 is equal to or greater than the predetermined opening degree J1, the suction force F1 that can draw the chemical liquid into the second flow path R2 is not generated. Therefore, all of the chemical liquid supplied to the branch portion 42 from the first flow path R1 is supplied to the recovery tank 51 via the third flow path R3. As a result, the chemical solution is not discharged from the chemical solution nozzle 21 .

The predetermined degree of opening J1 indicates the minimum value of the degree of opening of the adjustment valve 47 when the liquid medicine is not discharged from the liquid medicine nozzle 21 .

When the opening degree of the adjustment valve 47 is larger than the minimum opening degree J0 and smaller than the predetermined opening degree J1, part of the chemical liquid supplied from the first flow path R1 to the branch portion 42 flows into the second flow path R2. Another portion of the chemical liquid supplied to the branching portion 42 flows to the third flow path R3. As a result, the chemical is supplied to the collection tank 51 while the chemical is discharged from the chemical nozzle 21 .

When the opening degree of the adjustment valve 47 is greater than the minimum opening degree J0 and less than the predetermined opening degree J1, the smaller the opening degree of the adjustment valve 47, the greater the amount of the chemical liquid discharged from the chemical liquid nozzle 21. In other words, in this case, the smaller the degree of opening of the adjustment valve 47, the smaller the amount of the chemical liquid supplied to the recovery tank 51. Therefore, by adjusting the opening degree of the adjustment valve 47, the discharge amount of the chemical solution from the chemical solution nozzle 21 can be adjusted.

Next, referring to FIGS. 7, 10 and 11, the relationship between the degree of opening of the adjustment valve 47 and the liquid retention end position Z will be described. The stagnant end position Z of the chemical liquid indicates the end position of the chemical liquid stagnating in the second flow path R2 on the side of the chemical liquid nozzle 21 .

FIG. 10 is a schematic diagram showing a state in which ejection of the chemical solution from the chemical solution nozzle 21 is stopped. FIG. 11 is a second graph G2 showing the relationship between the degree of opening of the adjustment valve 47 and the liquid retention end position Z. As shown in FIG. In the second graph G2, the horizontal axis indicates the opening degree of the adjustment valve 47, and the vertical axis indicates the retention end position Z of the liquid chemical.

As shown in FIGS. 7, 10 and 11, the control unit 3 adjusts the opening degree of the adjustment valve 47 to make the second pressure P2 lower than the third pressure P3. Due to the pressure difference from the third pressure P3 (second pressure P2<third pressure P3), a drawing force F2 is generated. The drawing force F2 indicates the force that draws the chemical liquid in the second flow path R2 into the branching portion 42 . As the opening degree of the adjustment valve 47 increases, the drawing force F2 increases.

Suckback occurs due to the generation of the pulling force F2. Suck back indicates that all or part of the chemical liquid in the second flow path R2 is drawn into the branch portion 42 by the drawing force F2. As a result, the ejection of the chemical solution from the chemical solution nozzle 21 is stopped.

The chemical liquid that has flowed from the second flow path R2 to the branch portion 42 due to suckback is involved in the flow X of the chemical liquid that is ejected from the throttle portion 46d, and is supplied to the third flow path R3 (aspirate effect). Then, the chemical liquid supplied to the third flow path R3 is supplied to the recovery tank 51. As shown in FIG.

In this embodiment, when the opening degree of the adjustment valve 47 is equal to or greater than the predetermined opening degree J1, a pulling force F2 is generated. As a result, the ejection of the chemical solution from the chemical solution nozzle 21 is stopped.

When the opening degree of the adjusting valve 47 is equal to or greater than the predetermined opening degree J1, if the opening degree of the adjusting valve 47 is fixed at a constant value, the stagnant end position Z of the liquid chemical is held at a constant position. In this case, the drawing force F2 and the weight of the chemical liquid in the second flow path R2 are balanced, so that the stagnant end position Z of the chemical liquid is held at a constant position. As a result, the liquid medicine in the second flow path R2 is supported by the drawing force F2, so that the liquid medicine in the second flow path R2 is suppressed from dripping down from the liquid medicine nozzle 21 .

When the opening of the regulating valve 47 is fixed at a constant value equal to or greater than the predetermined opening J1, the higher the fixed opening of the regulating valve 47, the higher the retention end position Z is held.

The higher the staying end position Z is, the closer the staying end position Z is to the branch portion 42 . The lower the staying end position Z is, the closer the staying end position Z is to the chemical liquid nozzle 21 .

As described above with reference to FIGS. 7 to 11, the controller 3 sets the opening degree of the adjustment valve 47 to either the first opening degree or the second opening degree. Switchable.

The first opening indicates an opening smaller than the predetermined opening J1. In this case, all or part of the chemical solution guided by the liquid supply pipe 41 is supplied to the supply pipe 43 . As a result, the chemical liquid is discharged from the chemical liquid nozzle 21 .

The second degree of opening indicates the degree of opening equal to or greater than the predetermined degree of opening J1. In this case, all or part of the chemical solution in the supply pipe 43 is supplied to the return pipe 44 by the aspirate effect. Also, in this case, the drawing force F2 acts on the chemical liquid in the supply pipe 43 . Therefore, by fixing the opening of the adjustment valve 47 to a constant value equal to or greater than the predetermined opening J1, the control unit 3 can draw in the chemical liquid in the supply pipe 43 even when the substrate processing apparatus 100 is not in use. Force F2 can continue to be applied. As a result, it is possible to prevent the chemical solution from dripping from the chemical solution nozzle 21 when the substrate processing apparatus 100 is not in use.

A state in which the substrate processing apparatus 100 is not in use indicates a state in which the substrate processing apparatus 100 is not processing substrates W. FIG. A state in which the substrate processing apparatus 100 is being used indicates a state in which the substrate processing apparatus 100 is processing the substrates W. FIG.

Further, when the opening degree of the adjustment valve 47 is the first opening degree, the chemical liquid is discharged from the chemical liquid nozzle 21 . When the opening degree of the adjustment valve 47 is the second opening degree, the chemical liquid is not discharged from the chemical liquid nozzle 21 . Therefore, it is possible to control whether or not to discharge the chemical liquid from the chemical liquid nozzle 21 without providing a valve upstream of the chemical liquid nozzle 21 . As a result, it is possible to suppress the generation of particles due to the opening and closing operation of the valve upstream of the chemical liquid nozzle 21, so that the particles in the chemical liquid discharged from the chemical liquid nozzle 21 can be reduced. A liquid supply pipe 41 and a supply pipe 43 are shown upstream of the chemical liquid nozzle 21 .

When the substrate processing apparatus 100 is not in use after being used, if the chemical solution does not stay in the supply pipe 43, the inside of the supply pipe 43 cools and comes into contact with the air, causing the inside of the supply pipe 43 to leak. Condensation may occur. When the use of the substrate processing apparatus 100 is resumed after dew condensation occurs in the supply pipe 43, the water generated by the dew condensation is mixed with the chemical liquid as an impurity, which may cause a problem. However, in this embodiment, when the opening degree of the adjusting valve 47 is equal to or greater than the predetermined opening degree J1, if the opening degree of the adjusting valve 47 is fixed at a constant value, the position of the stagnant end portion of the chemical in the supply pipe 43 Z is held at a constant position. Therefore, the chemical liquid can be retained in the supply pipe 43 when the substrate processing apparatus 100 is not in use. As a result, it is possible to suppress the occurrence of dew condensation in the supply pipe 43, so that it is possible to suppress the occurrence of problems after the substrate processing apparatus 100 is resumed to be used.

Further, by causing the chemical solution to stay in the supply pipe 43 when the substrate processing apparatus 100 is not in use, the chemical solution can be quickly discharged from the chemical solution nozzle 21 after the substrate processing apparatus 100 is resumed to be used. In addition, by changing the end position Z of the liquid chemical in the supply pipe 43, the timing at which the chemical liquid nozzle 21 starts discharging the liquid chemical can be adjusted.

The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 11). However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the scope of the invention (eg, (1) to (7)). Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. In order to facilitate understanding, the drawings mainly show each component schematically, and the number of each component shown in the figure may differ from the actual number for convenience of drawing preparation. Also, each component shown in the above embodiment is an example and is not particularly limited, and various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

(1) FIG. 12 is a diagram showing a modification of the supply mechanism 40. As shown in FIG. As shown in FIG. 12, the modified example of the supply mechanism 40 differs from the substrate processing apparatus 100 of the present embodiment in that a flow meter 45 is provided in the supply pipe 43 .

(2) In this embodiment, the chemical liquid is stored in the supply tank 31 . However, the invention is not so limited. The rinse liquid may be stored in the supply tank 31 . 5 and 12, the rinse liquid may flow through the liquid feed pipe 41, the supply pipe 43, and the return pipe 44, and the chemical liquid nozzle 21 may be the rinse liquid nozzle 16. FIG. In this case, the rinse liquid is two examples of the treatment liquid of the present invention. Also, the rinse liquid nozzle 16 is two examples of the nozzle of the present invention.

Moreover, the processing liquid of the present invention is not limited to the chemical liquid and the rinse liquid, and may be any liquid that is used to process the substrate W in the substrate processing apparatus 100 .

(3) If the substrate processing apparatus 100 functions without the flow meter 45 shown in FIGS. 5 and 12, the flow meter 45 may not be provided.

(4) If the second movement speed V2 (see FIG. 7) of the chemical solution that is sufficiently fast enough to produce the aspirate effect can be ensured without providing the throttle portion 46d shown in FIG. It does not have to be provided. As a result, the configuration of the substrate processing apparatus 100 can be simplified.

It should be noted that when the throttle portion 46d is provided as in the present embodiment and the modified example of the present embodiment, even if the first moving speed V1 is insufficient to produce the aspirate effect, the throttle portion 46d allows the second moving speed V2 of the chemical liquid to be faster than the first moving speed V1. Therefore, an aspirate effect can be effectively produced.

(5) In the present embodiment and the modified example of the present embodiment, a first opening/closing bubble that opens and closes the first flow path R1 may be provided in the liquid sending pipe 41 . In this case, for example, the first opening/closing valve is closed when the substrate processing apparatus 100 is not in use, and the first opening/closing valve is opened when the substrate processing apparatus 100 is in use. Also, a second opening/closing valve that opens and closes the second flow path R2 may be provided in the supply pipe 43 . In this case, for example, the second opening/closing valve is closed when the substrate processing apparatus 100 is not in use, and the second opening/closing valve is opened when the substrate processing apparatus 100 is in use. However, as in the present embodiment and the modified example of the present embodiment, the absence of the first opening/closing valve and the second opening/closing bubble is advantageous in that particles can be effectively suppressed.

(6) As shown in FIGS. 4, 5 and 12, in this embodiment and the modification of this embodiment, the chemical liquid discharged from the return pipe 44 is supplied through the recovery tank 51 and the recovery pipe 52. It is supplied to tank 31 . However, the invention is not so limited. The return pipe 44 may directly communicate with the recovery tank 51 , and the chemical liquid discharged from the return pipe 44 may be supplied to the recovery tank 51 . Alternatively, the return pipe 44 may directly communicate with the circulation pipe 32 , and the chemical liquid discharged from the return pipe 44 may be supplied to the circulation pipe 32 . In this case, the condition for returning the chemical in the return pipe 44 to the circulation pipe 32 is that the pressure of the chemical in the circulation pipe 32 is lower than the pressure of the chemical in the return pipe 44 .

(7) In this embodiment and the modification of this embodiment, the processing unit 1 may further include a facing member 23 (see FIG. 12). The opposing member (blocking plate) 23 can be arranged to face the upper surface of the substrate W. As shown in FIG. The dimension of the surface of the facing member 23 facing the upper surface of the substrate W is larger than the dimension of the upper surface of the substrate W, for example. The chemical nozzle 21 faces the upper surface of the substrate W with a gap from the central portion of the facing member 23 .

INDUSTRIAL APPLICABILITY The present invention can be used in the fields of substrate processing apparatuses and substrate processing methods.

3 control unit 21 chemical nozzle (nozzle)
32 Circulation pipe 41 Liquid feed pipe 42 Branching portion 43 Supply pipe 44 Return pipe 46d Throttle portion 47 Adjustment valve 100 Substrate processing apparatus D3 Third diameter (diameter of the upstream portion of the third flow path)
D4 fourth diameter (diameter of the portion of the first flow path located downstream of the restrictor)
J1 Predetermined degree of opening Q1 First direction Q2 Second direction Q3 Third direction R1 First channel R2 Second channel R3 Third channel W Substrate Z Retention end position θ1 First angle θ2 Second angle

Claims (9)

A substrate processing apparatus for processing a substrate by supplying a processing liquid to the substrate from a nozzle,
a liquid feeding pipe that guides the processing liquid;
a supply pipe that guides the processing liquid guided by the liquid supply pipe to the nozzle;
a return pipe that guides the processing liquid guided by the liquid supply pipe along a path different from that of the supply pipe;
a regulating valve provided in the return pipe;
a control unit that controls the adjustment valve,
The control unit adjusts the flow rate of the processing liquid supplied to the supply pipe by adjusting the opening degree of the adjustment valve when the opening degree of the adjustment valve is smaller than a predetermined opening degree,
The substrate processing apparatus, wherein the control unit stops the supply of the processing liquid to the supply pipe by setting the opening degree of the adjustment valve to the predetermined opening degree or more. The flow path for the treatment liquid is
a branching portion that is a branching point of the liquid feeding pipe, the supply pipe, and the return pipe;
a first flow path located on the side of the liquid sending pipe with respect to the branch;
a second flow path positioned on the supply pipe side with respect to the branching portion;
a third flow path located on the return pipe side with respect to the branch,
the first angle is greater than the second angle,
The first angle is an angle formed by a first direction from the branch portion toward the first flow channel and a third direction from the branch portion toward the third flow channel,
2. The substrate processing apparatus according to claim 1, wherein said second angle is an angle between said first direction and a second direction from said branch portion toward said second flow path. 3. The substrate processing apparatus according to claim 2, further comprising a narrowed portion provided in said first flow path. 4. The substrate processing apparatus according to claim 3, wherein the diameter of the upstream portion of said third flow path is equal to or greater than the diameter of a portion of said first flow path located downstream of said constricted portion. When the opening of the adjustment valve is equal to or greater than the predetermined opening, if the opening of the adjustment valve is fixed at a constant value, the stagnant end position of the processing liquid in the supply pipe is kept at a constant position. 5. A substrate processing apparatus according to any one of claims 1 to 4, held. 2. When the opening of said adjustment valve is fixed at a constant value equal to or greater than said predetermined opening, the higher the fixed opening of said adjustment valve, the higher said retention end position is held. 6. The substrate processing apparatus according to 5. further comprising a circulation pipe through which the treatment liquid circulates;
7. The substrate processing apparatus according to claim 1, wherein said processing liquid flowing through said circulation pipe is supplied to said liquid-sending pipe. 8. The substrate processing apparatus according to claim 7, wherein said processing liquid guided by said return pipe is supplied to said circulation pipe. A substrate processing method for processing a substrate by supplying a processing liquid to the substrate from a nozzle,
A step of changing the opening degree of an adjustment valve provided in the flow path of the processing liquid,
The flow path for the treatment liquid is
a liquid feeding pipe that guides the processing liquid;
a supply pipe that guides the processing liquid guided by the liquid supply pipe to the nozzle;
and a return pipe that guides the processing liquid guided by the liquid supply pipe along a path different from that of the supply pipe,
The adjustment valve is provided in the return pipe,
In the step of changing the opening degree of the adjustment valve, when the opening degree of the adjustment valve is smaller than a predetermined opening degree, the processing liquid supplied to the supply pipe is reduced by adjusting the opening degree of the adjustment valve. adjust the flow rate,
The substrate processing method, wherein in the step of changing the opening degree of the adjustment valve, the supply of the processing liquid to the supply pipe is stopped by setting the opening degree of the adjustment valve to the predetermined opening degree or more.

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