JP6916633B2 - Processing liquid supply equipment, substrate processing equipment, and processing liquid supply method - Google Patents

Description

The present invention relates to a processing liquid supply device that supplies a processing liquid to a processing unit that processes a substrate, a substrate processing device provided with the processing liquid supply device, and a treatment liquid supply method. The substrates to be processed include, for example, semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, optical magnetic disk substrates, and photomasks. Substrates such as substrates, ceramic substrates, and solar cell substrates are included.

The liquid processing apparatus described in Patent Document 1 below is provided with a plurality of processing units for processing a substrate using a processing liquid supplied from a liquid supply mechanism. The liquid supply mechanism has a liquid supply source for supplying the temperature-controlled processing liquid and a circulation flow path for circulating the temperature-controlled treatment liquid supplied from the liquid supply source.

Japanese Unexamined Patent Publication No. 2011-35135

In the liquid supply device of Patent Document 1, the processing liquid flowing in the circulation flow path dissipates heat to the outside through the circulation flow path. Therefore, the temperature of the processing liquid flowing in the circulation flow path drops while going from the liquid supply source to the processing unit. The degree of temperature drop of the treatment liquid due to heat dissipation depends on the flow rate of the treatment liquid in the circulation flow path.
Here, in a liquid supply device provided with a plurality of processing units, a plurality of circulation channels may be provided. A group in which a plurality of processing units are stacked is called a processing unit (processing tower). In such a liquid supply device, a circulation flow path is provided corresponding to each processing unit. In such a liquid supply device, it is preferable to connect a plurality of circulation flow paths to a common liquid supply source instead of providing one liquid supply source for each circulation flow path. In a configuration in which a plurality of circulation channels are connected to a common liquid supply source, the treatment liquid is sent from the liquid supply source to each circulation pipe at the same pressure.

The resistance received by the processing liquid flowing in the circulation flow path differs depending on the length of the circulation flow path and the parts interposed in the circulation flow path. Therefore, even if the treatment liquid is sent out to the circulation flow path at the same pressure, the flow rate of the treatment liquid in each circulation flow path is not always constant between the circulation flow paths. In this case, the degree of temperature decrease of the treatment liquid in each circulation flow path is not constant, and the temperature of the treatment liquid supplied to the treatment unit may differ depending on the circulation flow path. Therefore, the state of the substrate (degree of processing) may differ depending on which processing unit processed the substrate.

Therefore, one object of the present invention is to supply a treatment liquid capable of reducing the temperature difference of the treatment liquid between the circulation pipes in a configuration in which the treatment liquid supplied from the treatment liquid supply source circulates in a plurality of circulation pipes. The present invention provides an apparatus, a substrate processing apparatus, and a processing liquid supply method.

The present invention is a treatment liquid supply device that supplies a treatment liquid to a plurality of treatment units, and is provided corresponding to each of the treatment liquid supply source for supplying the heated or cooled treatment liquid and the plurality of the treatment units. A plurality of circulation pipes that circulate the treatment liquid supplied from the treatment liquid supply source, and the treatment liquid that is branched and connected to each of the circulation pipes to supply the treatment liquid to the corresponding processing unit. The temperature of the processing liquid connected to each of the circulation pipes and the flow rate adjusting valve for adjusting the flow rate of the processing liquid in the circulation pipes. Provided is a processing liquid supply device including a temperature detection unit for detecting the above.

According to this configuration, the treatment liquid supply source supplies a heated or cooled (temperature-adjusted) treatment liquid, and the treatment liquid supplied from the treatment liquid supply source circulates in a plurality of circulation pipes. The processing liquid that circulates in each circulation pipe is supplied to the corresponding processing unit via the supply pipe that is branched and connected to each circulation pipe.
By adjusting the opening degree of the flow rate adjusting valve, the flow rate of the processing liquid in the circulation pipe is adjusted. The degree of temperature change of the treatment liquid due to heat exchange (heat dissipation or endothermic) around the circulation pipe depends on the flow rate of the treatment liquid in the circulation flow path. As a result, the temperature detected by the temperature detection unit fluctuates. Therefore, it is possible to adjust the opening degree of each flow rate adjusting valve so that the difference in the temperature of the processing liquid between the circulation pipes is reduced. In this case, the processing liquid in which the temperature difference between the circulation pipes is reduced is supplied from each circulation pipe to the processing unit via the supply pipe. As a result, the temperature difference between the processing units of the processing liquid can be reduced.

In one embodiment of the present invention, the processing liquid supply device adjusts the opening degree of the flow rate adjusting valve so that the difference in the detection temperature detected by each of the temperature detection units between the circulation pipes is reduced. It also includes an opening adjustment unit to be used.
According to this configuration, the opening degree adjusting unit adjusts the opening degree of the pressure adjusting valve so that the difference in the detected temperature is reduced. Therefore, the temperature difference of the treatment liquid between the circulation pipes can be surely reduced.

In one embodiment of the present invention, the treatment liquid supply device further includes a target temperature setting unit that sets a target temperature in all the circulation pipes. The opening degree adjusting unit adjusts the opening degree of the flow rate adjusting valve so that the detected temperature detected by each of the temperature detecting units matches the target temperature.
According to this configuration, the target temperature setting unit sets the target temperature for all the circulation pipes. The opening degree adjusting unit adjusts the opening degree of the flow rate adjusting valve so that each detected temperature matches the target temperature. Therefore, the difference in temperature of the treatment liquid between the circulation pipes can be further reduced.

In one embodiment of the present invention, the temperature detection unit is interposed in the circulation pipe on the downstream side of the branch position of the supply pipe in the corresponding circulation pipe.
According to this configuration, the temperature detection unit is interposed in the circulation pipe on the downstream side of the branch position of the supply pipe in the circulation pipe. Therefore, the temperature detection unit can detect the temperature of the processing liquid after heat is dissipated or absorbed while moving from the processing liquid supply source to the branch position. Therefore, the temperature detection unit can reliably detect the difference in the temperature of the processing liquid supplied to the processing unit between the circulation pipes. Therefore, the temperature difference between the circulation pipes can be further reduced.

In one embodiment of the present invention, the flow rate adjusting valve is interposed in the circulation pipe on the downstream side of the branch position of the supply pipe in the corresponding circulation pipe.
Here, in the circulation pipe, the processing liquid on the upstream side flows into the portion where the flow rate adjusting valve is interposed. Therefore, the flow rate adjusting valve stably fluctuates the flow rate in the circulation pipe from the upstream side of the flow rate adjusting valve as compared with the flow rate in the circulation pipe on the downstream side of the flow rate adjusting valve by adjusting the opening degree. Can be made to.

Therefore, if the flow rate adjusting valve is configured to be interposed in the circulation pipe on the downstream side of the branch position of the supply pipe in the corresponding circulation pipe, the flow rate of the processing liquid flowing from the circulation pipe to the supply pipe can be stabilized. ..
In one embodiment of the present invention, a pressure detection unit interposed in each of the circulation pipes to detect the pressure in the circulation pipe is further included.

According to this configuration, each circulation pipe is provided with a pressure detection unit that detects the pressure in the circulation pipe. Here, there is a correlation between the pressure in the circulation pipe and the flow rate of the treatment liquid in the circulation pipe. Therefore, if the opening degree of the flow rate adjusting valve is adjusted while checking the pressure of each circulation pipe, it is easy to adjust the flow rate of the processing liquid in the circulation pipe to an appropriate range.
In one embodiment of the present invention, the pressure detection unit is interposed in the circulation pipe on the upstream side of the branch position of the supply pipe in the corresponding circulation pipe.

Here, the flow rate of the treatment liquid in the circulation pipe tends to fluctuate on the downstream side of the branch position as compared with the upstream side of the branch position due to a change in the supply state of the treatment liquid to the supply pipe.
If the pressure detection unit is installed in the circulation pipe on the upstream side of the branch position of the supply pipe in the circulation pipe, the change in the supply state of the treatment liquid to the supply pipe is the pressure of the treatment liquid in the circulation pipe. It is possible to reduce the influence on the detection of. That is, the pressure detection unit can stably detect the pressure of the processing liquid in the circulation pipe. Therefore, it becomes easier to check the pressure of the treatment liquid in each circulation pipe, and it becomes easier to further adjust the flow rate of the treatment liquid in the circulation pipe to an appropriate range.

In one embodiment of the present invention, the processing unit has a plurality of processing units for processing the substrate. Then, the supply pipe is branched from the corresponding circulation pipe, and has a plurality of branch pipes that supply the processing liquid to each of the processing units.
According to this configuration, the supply pipe is branched from the corresponding circulation pipe, and has a plurality of branch pipes that supply the processing liquid to each processing unit of the corresponding processing unit. Therefore, the number of circulation pipes can be reduced as compared with the configuration in which one circulation pipe is provided in each processing unit.

In one embodiment of the present invention, there is provided a substrate processing apparatus including the processing liquid supply apparatus and a plurality of the processing units for processing the substrate. According to this configuration, the same effect as described above can be obtained.
In one embodiment of the present invention, there is a treatment liquid supply method for supplying the treatment liquid to a plurality of treatment units, and the treatment liquid supply source is provided by a plurality of circulation pipes provided corresponding to each of the plurality of treatment units. A circulation step of circulating the heated or cooled treatment liquid supplied from the above, a temperature detection step of detecting the temperature of the treatment liquid flowing through each of the circulation pipes in the circulation step, and a detection detected in the temperature detection step. Provided is a processing liquid supply method including an opening degree adjusting step of adjusting the opening degree of a flow rate adjusting valve interposed in each of the circulating pipes so that a difference in temperature between the circulation pipes is reduced.

According to this method, in the circulation step, the heated or cooled (temperature-adjusted) treatment liquid is supplied from the treatment liquid supply source to the plurality of circulation pipes and circulates in the plurality of circulation pipes.
In the opening adjustment step, the difference in the flow rate of the treatment liquid between the circulation pipes is adjusted by adjusting the opening of the corresponding flow rate adjustment valve so that the difference in the detected temperature of the treatment liquid between the circulation pipes is reduced. Can be reliably reduced. As a result, the difference in temperature of the treatment liquid between the circulation pipes is reduced.

In one embodiment of the present invention, the treatment liquid supply method further includes a target temperature setting step of setting a target temperature for all the circulation pipes. The opening degree adjusting step includes a step of adjusting the opening degree of the flow rate adjusting valve interposed in each of the circulation pipes so that the detected temperature corresponding to each of the circulation pipes matches the target temperature.
According to this method, in the target temperature setting step, the target temperature is set for all the circulation pipes. In the opening degree adjusting step, the opening degree of the flow rate adjusting valve is adjusted so that each detected temperature matches the target temperature. Therefore, the difference in temperature of the treatment liquid between the circulation pipes can be further reduced.

In one embodiment of the present invention, the plurality of circulation pipes have different pipe lengths from each other. The opening degree adjusting step includes a sequential adjusting step of adjusting the opening degree in order from the flow rate adjusting valve corresponding to the circulation pipe having a long pipe length.
Here, in the circulation pipe, the longer the pipe length, the larger the rate at which the temperature of the treatment liquid changes when the flow rate in the circulation pipe changes. Therefore, when a treatment liquid having the same flow rate as the flow rate at which the temperature of the treatment liquid in the circulation pipe having a relatively long pipe length becomes appropriate is circulated in the circulation pipe having a relatively short pipe length, the pipe length is relatively long. The temperature of the treatment liquid in the short circulation pipe tends to be an appropriate temperature.

In the sequential adjustment step, the flow rate is adjusted in order from the circulation pipe having the longest pipe length of the circulation pipe. Therefore, it is possible to easily find a flow rate at which the temperature of the treatment liquid in the total circulation pipe becomes an appropriate temperature. Therefore, the temperature difference of the treatment liquid between the circulation pipes can be reduced in a short time.

FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic side view of the substrate processing apparatus. FIG. 3 is a schematic view showing the configuration of a processing liquid supply device provided in the substrate processing device. FIG. 4 is a schematic view showing the configuration around the processing unit and the corresponding circulation pipe. FIG. 5 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus. FIG. 6 is a flow chart for explaining an example of the treatment liquid supply by the treatment liquid supply device. FIG. 7 is a graph showing the difference between the processing units in the ratio of the change in temperature to the change in the flow rate of the processing liquid. FIG. 8 is a schematic view showing a configuration around a processing unit and a corresponding circulation pipe in the substrate processing apparatus according to the second embodiment. FIG. 9 is a flow chart for explaining an example of the treatment liquid supply by the treatment liquid supply device according to the second embodiment. FIG. 10 is a flow chart for explaining the details of the feedback control of the processing liquid supply by the processing liquid supply device according to the second embodiment (S14 of FIG. 9).

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
<First Embodiment>
FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus 1 according to the first embodiment of the present invention. FIG. 2 is a schematic vertical sectional view of the substrate processing apparatus 1.
The substrate processing device 1 is a single-wafer type device that processes substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a disk-shaped substrate. The substrate processing apparatus 1 includes a plurality of (four in this embodiment) processing towers 2A to 2D (processing units) that process the substrate W with a processing liquid such as a chemical solution or a rinsing solution. A plurality of processing towers 2A to 2D are collectively referred to as processing tower 2. The substrate processing device 1 is provided corresponding to the processing liquid supply device 3 for supplying the processing liquid to the plurality of processing towers 2A to 2D and the processing towers 2A to 2D, and supplies the processing liquid to the processing towers 2A to 2D. Further includes fluid units 4A-4D for accommodating piping for the purpose.

Each of the processing towers 2A to 2D includes a plurality of (for example, three) processing units 20 stacked one above the other (see FIG. 2). The processing unit 20 is a single-wafer type processing unit that processes the substrate W one by one. The plurality of processing units 20 have, for example, a similar configuration.
The substrate processing apparatus 1 transports the substrate W between the load port LP on which the carrier C accommodating a plurality of substrates W processed by the processing unit 20 is placed, and the load port LP and the processing unit 20. The robot IR and CR and the control device 7 for controlling the substrate processing device 1 are further included.

The substrate processing device 1 further includes a transport path 5 extending in the horizontal direction. The transport path 5 extends linearly from the transport robot IR toward the transport robot CR. The transfer robot IR transfers the substrate W between the carrier C and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 20.
The plurality of processing towers 2 are arranged symmetrically with the transport path 5 interposed therebetween. The plurality of processing towers 2 are arranged along the direction in which the transport path 5 extends (extension direction X) on both sides of the transport path 5. In the present embodiment, two processing towers 2 are arranged on both sides of the transport path 5.

Of the plurality of processing towers 2A to 2D, each of the two processing towers 2 on the side closer to the transfer robot IR is referred to as a first processing tower 2A and a second processing tower 2B. The first processing tower 2A and the second processing tower 2B face each other with the transport path 5 interposed therebetween. Of the plurality of processing towers 2A to 2D, each of the two processing towers 2 on the side farther from the transfer robot IR is referred to as a third processing tower 2C and a fourth processing tower 2D. The third processing tower 2C and the fourth processing tower 2D face each other with the transport path 5 interposed therebetween. The first processing tower 2A and the third processing tower 2C are arranged side by side in the extension direction X. The second processing tower 2B and the fourth processing tower 2D are arranged side by side in the extension direction X. Corresponding fluid units 4A to 4D are adjacent to each of the processing towers 2A to 2D from the extension direction X.

The treatment liquid supply device 3 includes a treatment liquid supply source R. The substrate processing device 1 is arranged on the side opposite to the transfer robot IR in the extension direction X, and includes a cabinet 6 for accommodating the processing liquid supply source R. The treatment liquid supply source R is arranged on both sides of the transport path 5 rather than the treatment towers 2C on one side of the treatment towers 2C and 2D arranged on both sides of the transport path 5. It is arranged in the cabinet 6 at a position close to the processing tower 2D on the other side of the 2D.

FIG. 3 is a schematic view showing the configuration of the processing liquid supply device 3 provided in the substrate processing device 1.
With reference to FIG. 3, the treatment liquid supply device 3 is branched and connected to a plurality of circulation pipes 22A to 22D for circulating the treatment liquid in the treatment liquid tank 21, and the corresponding treatment towers 22A to 22D. Further includes supply pipes 23A to 23D for supplying the treatment liquid to 2A to 2D. The treatment liquid supply source R includes a treatment liquid tank 21 for storing the treatment liquid, and a common pipe 24 for connecting the treatment liquid tank 21 and the upstream ends of the plurality of circulation pipes 22A to 22D. The plurality of circulation pipes 22A to 22D are branched from the downstream end of the common pipe 24. The circulation pipes 22A to 22D are collectively referred to as the circulation pipe 22. The supply pipes 23A to 23D are collectively referred to as the supply pipe 23.

The circulation pipes 22A to 22D are provided corresponding to each of the plurality of processing towers 2A to 2D. In the circulation pipes 22A to 22D, the portions where the supply pipes 23A to 23D are branched and connected are referred to as branch positions 26A to 26D. Branch positions 26A to 26D are collectively referred to as branch positions 26.
The treatment liquid supply device 3 is interposed in the circulation pipes 22A to 22D, and is interposed in the pressure gauges 27A to 27D for detecting the pressure in the circulation pipes 22A to 22D, and the circulation pipes 22A to 22D. Includes pressure adjusting valves 28A to 28D for adjusting the pressure of the treatment liquid in the pipes 22A to 22D. The treatment liquid supply device 3 is interposed in each circulation pipe 22A to 22D, and further includes thermometers 29A to 29D for detecting the temperature of the treatment liquid in the circulation pipes 22A to 22D. The pressure gauges 27A to 27D are collectively called the pressure gauge 27. The pressure adjusting valves 28A to 28D are collectively referred to as the pressure adjusting valve 28. The thermometers 29A to 29D are collectively referred to as a thermometer 29.

The pressure adjusting valves 28A to 28D are, for example, motor needle valves, but are not limited to these, and may be valves such as relief valves.
The pressure gauges 27A to 27D are an example of a pressure detection unit that detects the pressure of the processing liquid in the circulation pipes 22A to 22D. The thermometers 29A to 29D are an example of a temperature detection unit that detects the flow rate of the processing liquid in the circulation pipes 22A to 22D.

Since there is a correlation between the pressure and the flow rate, the flow rate of the treatment liquid in the circulation pipes 22A to 22D can be adjusted by adjusting the pressure in the circulation pipes 22A to 22D. That is, the pressure adjusting valves 28A to 28D are examples of flow rate adjusting valves that adjust the flow rate of the processing liquid in the circulation pipes 22A to 22D.
The pressure gauges 27A to 27D are interposed in the circulation pipes 22A to 22D on the upstream side of the branch positions 26A to 26D of the supply pipes 23A to 23D in the corresponding circulation pipes 22A to 22D. The pressure adjusting valves 28A to 28D are interposed in the corresponding circulation pipes 22A to 22D on the downstream side of the corresponding branch positions 26A to 26D. The thermometers 29A to 29D are interposed in the corresponding circulation pipes 22A to 22D on the downstream side of the corresponding branch positions 26A to 26D.

A pump 30, a filter 31, and a heating unit 32 are interposed in the common pipe 24 in this order from the upstream side. The pump 30 sends the processing liquid in the common pipe 24 to the downstream side. The filter 31 filters the processing liquid flowing through the common pipe 24. The heating unit 32 is a heater or the like that heats the processing liquid in the common pipe 24.
When the pump 30 sends the treatment liquid in the common pipe 24 to the downstream side, the treatment liquid in the treatment liquid tank 21 circulates in each of the circulation pipes 22A to 22D. At that time, the processing liquid in the processing liquid tank 21 is supplied to the circulation pipes 22A to 22D via the common pipe 24. Therefore, the treatment liquid in the treatment liquid tank 21 is heated by the heating unit 32 interposed in the common pipe 24. Therefore, the processing liquid supply source R supplies the heated (temperature-adjusted) processing liquid to the circulation pipes 22A to 22D. The heating unit 32 functions as a temperature adjusting unit for adjusting the temperature of the processing liquids supplied from the treatment liquid supply source R to the plurality of circulation pipes 22A to 22D.

The members of the treatment liquid supply device 3 related to the treatment towers 2A to 2D have substantially the same configuration in all the treatment towers 2A to 2D. Therefore, in the following, the member corresponding to the first processing tower 2A in the processing liquid supply device 3 will be mainly described. FIG. 4 is a schematic view showing the peripheral configuration of the first processing tower 2A and the corresponding circulation pipe 22A.
With reference to FIG. 4, each processing unit 20 of the first processing tower 2A rotates the substrate W around the vertical rotation axis A1 passing through the central portion of the substrate W while holding one substrate W in a horizontal posture. The spin chuck 40, the cup 41 surrounding the spin chuck 40, the first nozzle 42 and the second nozzle 43 for supplying the processing liquid to the substrate W, the spin chuck 40, the cup 41, the first nozzle 42 and the second nozzle 43. Includes a processing chamber 44 for accommodating.

The processing chamber 44 is formed with an entrance / exit (not shown) for carrying the substrate W into the processing chamber 44 and carrying out the substrate W from the processing chamber 44. The processing chamber 44 is provided with a shutter unit (not shown) that opens and closes the doorway.
The spin chuck 40 includes a plurality of chuck pins 45, a spin base 46, a rotating shaft 47 coupled to the center of the lower surface of the spin base 46, and an electric motor 48 that applies a rotational force to the rotating shaft 47. The rotation shaft 47 extends in the vertical direction along the rotation axis A1. A spin base 46 is coupled to the upper end of the rotating shaft 47.

The spin base 46 has a disk shape along the horizontal direction. A plurality of chuck pins 45 are arranged on the peripheral edge of the upper surface of the spin base 46 at intervals in the circumferential direction. The spin base 46 and the chuck pin 45 function as a substrate holding unit that holds the substrate W horizontally. By rotating the rotating shaft 47 by the electric motor 48, the substrate W is rotated around the rotating axis A1. The electric motor 48 functions as a substrate rotation unit that rotates the substrate W around the rotation axis A1.

In this embodiment, each of the first nozzle 42 and the second nozzle 43 is a fixed nozzle arranged so as to discharge the processing liquid toward the rotation center of the upper surface of the substrate W. A treatment liquid such as a chemical liquid stored in the treatment liquid tank 21 of the treatment liquid supply source R is supplied to the first nozzle 42 via the circulation pipe 22A and the supply pipe 23A. A treatment liquid such as a rinse liquid is supplied to the second nozzle 43 from a supply source 50 different from the treatment liquid supply source R via the pipe 51. The pipe 51 is provided with a valve 52 for switching whether or not the processing liquid is supplied to the second nozzle 43.

The chemical solution is, for example, hydrofluoric acid (hydrogen fluoride water: HF). The chemical solution is not limited to hydrofluoric acid, but is not limited to hydrofluoric acid, but is sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), aqueous ammonia, hydrogen peroxide solution, and organic acid (for example, quen). It may be a liquid containing at least one of an acid, hydrofluoric acid, etc.), an organic alkali (for example, TMAH: tetramethylammonium hydrochloride, etc.), a surfactant, and a corrosion inhibitor. Examples of the chemical solution in which these are mixed include SPM (hydrogen peroxide solution mixed solution), SC1 (hydrogen peroxide solution mixed solution), SC2 (hydrogen peroxide solution mixed solution) and the like.

The rinse solution is, for example, Deionized Water (DIW). The rinsing solution is not limited to DIW, and may be carbonated water, electrolytic ionized water, ozone water, hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm), and reduced water (hydrogen water). The rinse solution contains water.
Examples of the treatment liquid include a low surface tension liquid having a surface tension lower than that of water, in addition to the chemical liquid and the rinse liquid. The low surface tension liquid is for replacing the rinse liquid on the substrate W after the rinse liquid is supplied onto the substrate W. By replacing the rinse liquid on the substrate W with a low surface tension liquid and then removing the low surface tension liquid from the substrate W, the upper surface of the substrate W can be satisfactorily dried. When the upper surface of the substrate W is dried using a low surface tension liquid, it is on the substrate W as compared with the case where the substrate W is dried by removing the rinse liquid from the upper surface of the substrate W without using the low surface tension liquid. The surface tension acting on the pattern formed on the surface can be reduced.

As the low surface tension liquid, an organic solvent other than IPA that does not chemically react with the pattern formed on the upper surface of the substrate W and the substrate W (poor reactivity) can be used. More specifically, a liquid containing at least one of IPA, HFE (hydrofluoroether), methanol, ethanol, acetone and Trans-1,2 dichloroethylene can be used as the low surface tension liquid. Further, the low surface tension liquid does not have to consist of only a single component, and may be a liquid mixed with other components. For example, it may be a mixed solution of an IPA solution and pure water, or a mixed solution of an IPA solution and an HFE solution.

The supply pipe 23A is branched from the circulation pipe 22A, and has a plurality of branch pipes 33 to 35 that supply the processing liquid to each processing unit 20 of the processing tower 2A. The upstream ends of the branch pipes 33 to 35 are connected to the circulation pipe 22A at the corresponding branch positions 33a to 35a. The downstream ends of the branch pipes 33 to 35 are connected to the first nozzle 42 of the corresponding processing unit 20.

The branch position 26A of the supply pipe 23A in the circulation pipe 22A includes the branch positions 33a to 35a of the branch pipes 33 to 35. Therefore, the pressure gauge 27A is interposed in the circulation pipe 22A on the upstream side of the branch position 33a of the branch pipe 33 on the most upstream side in the circulation pipe 22A. The pressure adjusting valve 28A and the thermometer 29A are interposed in the circulation pipe 22A on the downstream side of the branch position 35a of the branch pipe 35 on the most downstream side in the circulation pipe 22A.

A supply flow meter 36, a supply flow rate adjusting valve 37, and a supply valve 38 are interposed in each of the plurality of branch pipes 33 to 35 in this order from the upstream side. Each supply flow meter 36 detects the flow rate of the processing liquid flowing in the corresponding branch pipes 33 to 35 of the supply pipe 23A. Each supply flow rate adjusting valve 37 adjusts the flow rate of the processing liquid in the corresponding branch pipes 33 to 35 of the supply pipe 23A. Each supply valve 38 switches whether or not the processing liquid is supplied to the corresponding branch pipes 33 to 35 of the supply pipe 23A. The supply flow rate adjusting valve 37 is, for example, a motor needle valve. The supply valve 38 is, for example, a relief valve.

The circulation pipe 22A has an upstream first pipe 60 having an upstream end of the circulation pipe 22A and housed in the cabinet 6, and a downstream first pipe 60 having a downstream end of the circulation pipe 22A and housed in the cabinet 6. 61 and a second pipe 62 housed in the fluid unit 4A. The pressure adjusting valve 28A and the thermometer 29A are interposed in the second pipe 62 and are arranged in the fluid unit 4A.

The circulation pipe 22A is connected to the upstream side first pipe 60 and the second pipe 62, and extends between the cabinet 6 and the fluid unit 4A on the upstream side third pipe 63, and the downstream side first pipe 61 and second pipe. Further includes a downstream third pipe 64 connected to 62 and extending between the cabinet 6 and the fluid unit 4A. The upstream side third pipe 63 is also referred to as an upstream side relay pipe. The downstream side third pipe 64 is also referred to as a downstream side relay pipe.

The total length of the upstream side first pipe 60, the second pipe 62, the upstream side third pipe 63, the downstream side third pipe 64, and the downstream side first pipe 61 is referred to as the pipe length of the circulation pipe 22A.
With reference to FIG. 1, the pipe lengths of the circulation pipes 22A to 22D are different from each other depending on the relative positions of the processing tower 2 and the processing liquid tank 21. Specifically, the pipe length of each circulation pipe 22A to 22D is longer as the distance between the treatment liquid supply source R and the corresponding treatment towers 2A to 2D is longer. More specifically, among the plurality of processing towers 2A to 2D, the circulation pipe 22A corresponding to the processing tower 2A farthest from the processing liquid supply source R has the longest pipe length. Next, the circulation pipe 22B corresponding to the processing tower 2B is long, and the circulation pipe 22C is long next to the circulation pipe 22B corresponding to the processing tower 2C. The length of the circulation pipe 22D corresponding to the processing tower 2D closest to the processing liquid supply source R is the shortest.

FIG. 5 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1. With reference to FIG. 5, the control device 7 includes a microcomputer, and controls a control target provided in the substrate processing device 1 according to a predetermined program. More specifically, the control device 7 includes a processor (CPU) 7A and a memory 7B in which a program is stored, and the processor 7A executes various controls for substrate processing by executing the program. It is configured as follows. In particular, the control device 7 controls the operations of the transfer robot IR, CR, the electric motor 48, the pressure gauges 27A to 27D, the thermometers 29A to 29D, the flow meter 36, and the valves 37, 38, 52.

FIG. 6 is a flow chart for explaining an example of the treatment liquid supply by the treatment liquid supply device 3.
In the processing liquid supply, first, a target value (target temperature T) of the temperature of the processing liquid flowing in each circulation pipe 22 is set (target temperature setting step: step S1). At this time, a common target temperature T is set for all the circulation pipes 22.
Then, the control device 7 activates the heating unit 32 and the pump 30 interposed in the common pipe 24. As a result, the heated treatment liquid is supplied from the treatment liquid supply source R to each circulation pipe 22, and starts to circulate in each circulation pipe 22 (circulation step: step S2).

Then, the control device 7 controls each thermometer 29 and detects the temperature of the corresponding circulation pipe 22 (temperature detection step: step S3). The temperature of the processing liquid detected by the thermometer 29 is called the detected temperature. The temperature detection step is performed after the start of the circulation step.
In parallel with the temperature detection step, each pressure gauge 27 detects the pressure in the corresponding circulation pipe 22. Thereby, the pressure in each circulation pipe 22 can be confirmed as appropriate.

The control device 7 may calculate the flow rate of the processing liquid in the circulation pipe 22 based on the detected pressure detected by each of the pressure gauges 27A to 27D. As a result, the flow rate of the processing liquid in the circulation pipe 22 is indirectly detected. The flow rate calculated based on the detected pressure detected by the pressure gauges 27A to 27D is referred to as a detected flow rate.
Then, an opening degree adjusting step of adjusting the opening degree of the pressure adjusting valve 28 interposed in each circulation pipe 22 is executed so that the difference in the detected temperature between the circulation pipes 22 is reduced.

Specifically, first, the detected temperature in all the circulation pipes 22 is within a predetermined range (described later) including the target temperature T by the operator of the substrate processing apparatus 1 (hereinafter, simply referred to as an operator). It is determined whether or not there is (temperature determination step: step S4). When the detected temperature of any of the circulation pipes 22 is outside the predetermined range (No in step S4), the operator adjusts the opening degree of the corresponding pressure adjusting valve 28 so that the detected temperature approaches the target temperature T. Change (opening change step: step S5). As a result, the difference in the flow rate between the circulation pipes 22 is reduced, and the difference in the temperature of the treatment liquid between the circulation pipes 22 is reduced.

Specifically, the opening degree of the pressure adjusting valve 28 may be changed by the operator operating the operation panel (not shown) of the control device 7, or the operator may operate the pressure adjusting valve 28. It may be done by direct operation.
Then, when the detected temperatures in all the circulation pipes 22 are within a predetermined range (Yes in step S4), the control device 7 presses the supply valve 38 without changing the opening degree of the pressure adjusting valve 28. open. As a result, the supply of the processing liquid from the branch pipes 33 to 35 to the substrate W is started (step S6). Even if the detected temperature in any of the circulation pipes 22 is outside the predetermined range of the target temperature T (No in step S4), after the opening degree of the pressure adjusting valve 28 is changed, the control device 7 Opens the supply valve 38. As a result, the supply of the processing liquid from the branch pipes 33 to 35 to the substrate W is started (step S6).

FIG. 7 is a graph showing the difference between the treatment towers 2 in the ratio of the change in the temperature of the treatment liquid to the change in the flow rate of the treatment liquid. In FIG. 7, the horizontal axis represents the flow rate of the processing liquid calculated from the detected pressure in the circulation pipe 22, and the vertical axis represents the detected temperature in the circulation pipe 22. FIG. 7 illustrates the ratio of the change in the temperature of the treatment liquid to the flow rate of the treatment liquid in each of the circulation pipes 22A to 22D.

In order to properly process the substrate W, the temperature t of the processing liquid in the circulation pipes 22A to 22D needs to be within a predetermined range. The predetermined range is, for example, a range between the first temperature t1 which is larger than the target temperature T by a predetermined amount Δt and the second temperature t2 which is smaller than the target temperature T by a predetermined amount Δt (t2 ≦ t). ≦ t1).
As shown in FIG. 7, the ratio of the change in the detected temperature to the change in the flow rate q of the treatment liquid is the largest in the circulation pipe 22A, then in the circulation pipe 22B, then in the circulation pipe 22C, and in the circulation pipe 22D. Is the smallest. That is, the longer the circulation pipes 22A to 22D (see also FIG. 1), the larger the ratio of the change in the detected temperature to the change in the flow rate q of the treatment liquid.

Therefore, the pipe length compares the treatment liquid having the same flow rate q as the flow rate q when the temperature of the treatment liquid in the circulation pipe 22 (for example, the circulation pipe 22A) having a relatively long pipe length is within a predetermined range. When the product is circulated in the short circulation pipe 22 (for example, the circulation pipe 22B), the temperature of the treatment liquid in the relatively short circulation pipe 22 (circulation pipe 22B) tends to be an appropriate temperature.
Specifically, if the flow rate q of the treatment liquid in the circulation pipe 22A is the first flow rate q1 or less and the second flow rate q2 or more (q2 ≦ q ≦ q1), the temperature of the treatment liquid in the circulation pipe 22A is predetermined. It is assumed that the temperature is within the range of (t2 ≦ t ≦ t1). Also in the circulation pipe 22B, if the flow rate q is the first flow rate q1 or less and the second flow rate q2 or more, the temperature of the treatment liquid is within a predetermined range. Similarly to the circulation pipe 22B, in the circulation pipe 22C and the circulation pipe 22D, if the flow rate q is the first flow rate q1 or less and the second flow rate q2 or more, the temperature of the treatment liquid is within a predetermined range. It becomes.

Therefore, in the opening degree adjusting step, it is preferable that the operator adjusts the opening degree in order from the pressure adjusting valve 28 corresponding to the circulation pipe 22 having a long pipe length (sequential adjustment step).
While the processing liquid supply device 3 executes the processing liquid supply, the substrate processing device 1 executes the substrate processing. In the substrate processing, the unprocessed substrate W is carried from the carrier C into the processing unit 20 by the transfer robots IR and CR and passed to the spin chuck 40. After that, the substrate W is held horizontally with an interval upward from the upper surface of the spin base 46 until it is carried out by the transfer robot CR (board holding step). The electric motor 48 rotates the spin base 46. As a result, the substrate W held horizontally by the chuck pin 45 rotates (the substrate rotation step).

Next, after the transfer robot CR is retracted to the outside of the processing unit 20, the chemical liquid treatment is executed. Specifically, when the supply valve 38 is opened, a supply step of supplying, for example, a chemical solution from the processing liquid supply device 3 to the first nozzle 42 is executed (step S6 in FIG. 6). As described above, the opening degree adjusting step (steps S4 and S5 in FIG. 6) is executed before the chemical solution is supplied from the first nozzle 42 to the substrate W.

Then, the chemical solution is discharged (supplied) from the first nozzle 42 toward the upper surface of the rotating substrate W. The supplied chemical solution is spread over the entire upper surface of the substrate W by centrifugal force. As a result, the upper surface of the substrate W is treated with the chemical solution.
After the chemical solution treatment for a certain period of time, the chemical solution on the substrate W is replaced with DIW, so that the DIW rinsing treatment for removing the chemical solution from the substrate W is executed. Specifically, the supply valve 38 is closed and the valve 52 is opened. As a result, for example, a rinse liquid is supplied (discharged) from the second nozzle 43 toward the upper surface of the substrate W. The DIW supplied on the substrate W is spread over the entire upper surface of the substrate W by centrifugal force. The chemical solution on the substrate W is washed away by this DIW.

After a certain period of rinsing treatment, a drying treatment is performed. Specifically, the electric motor 48 rotates the substrate W at a high rotation speed (for example, 3000 rpm) faster than the rotation speed of the substrate W in the chemical treatment and the rinse liquid treatment. As a result, a large centrifugal force acts on the rinse liquid on the upper surface of the substrate W, and the rinse liquid on the upper surface of the substrate W is shaken off around the substrate W. In this way, the rinse liquid is removed from the substrate W, and the substrate W dries. Then, when a predetermined time elapses after the high-speed rotation of the substrate W is started, the electric motor 48 stops the rotation of the substrate W by the spin base 46.

After that, the transfer robot CR enters the processing unit 20, scoops the processed substrate W from the spin chuck 40, and carries it out of the processing unit 20. The substrate W is passed from the transfer robot CR to the transfer robot IR, and is housed in the carrier C by the transfer robot IR. Such substrate processing is performed in each of the processing towers 2A to 2D.
According to the first embodiment, the temperature-adjusted treatment liquid supplied from the treatment liquid supply source R circulates in the plurality of circulation pipes 22. The processing liquid that circulates in each circulation pipe 22 is supplied to the corresponding processing tower 2 via the supply pipe 23 that is branched and connected to each circulation pipe 22.

The flow rate of the processing liquid in the circulation pipe 22 is adjusted by the operator adjusting the opening degree of the pressure adjusting valve 28. The degree of temperature change of the processing liquid due to heat exchange (heat dissipation or endothermic) with the periphery of the circulation pipe 22 depends on the flow rate of the treatment liquid in the circulation pipe 22. Therefore, when the flow rate of the processing liquid in the circulation pipe 22 is changed, the temperature detected by the thermometer 29 changes accordingly. Therefore, the operator can adjust the opening degree of each pressure adjusting valve 28 so that the difference in temperature of the processing liquid between the circulation pipes 22 is reduced. In this case, the processing liquid in which the temperature difference between the circulation pipes 22 is reduced is supplied from each circulation pipe 22 to the processing tower 2 via the supply pipe 23. As a result, the temperature difference between the treatment towers 2 of the treatment liquid can be reduced. As a result, the processing liquid in which the temperature difference between the circulation pipes 22 is reduced is supplied from each circulation pipe 22 to the processing tower 2 via the supply pipe 23. Therefore, the temperature difference between the treatment towers 2 of the treatment liquid can be reduced.

Further, even if a heater or the like is provided for each circulation pipe 22 to heat the treatment liquid, if the heated treatment liquid is supplied to each circulation pipe 22 from the treatment liquid supply source R, the processing between the circulation pipes 22 is performed. The difference in liquid temperature is reduced. Therefore, it is not necessary to provide a heater for each circulation pipe 22, so that the number of parts can be reduced.
Further, according to the first embodiment, by adjusting the flow rate in order from the circulation pipe 22 having the longest pipe length, the temperature t of the treatment liquid in the total circulation pipe 22 becomes an appropriate temperature (t2 ≦ t ≦ t1). The flow rate q can be easily found. Therefore, the temperature difference of the treatment liquid between the circulation pipes 22 can be reduced in a short time.

Further, according to the first embodiment, the thermometer 29 is interposed in the circulation pipe 22 on the downstream side of the branch position 26 of the supply pipe 23 in the circulation pipe 22. Therefore, the thermometer 29 can detect the temperature of the processing liquid after heat is dissipated or absorbed while moving from the processing liquid supply source R to the branch position 26. Therefore, it is possible to reliably detect the difference in the temperature of the processing liquid supplied to the thermometer 29 and the processing tower 2 between the circulation pipes 22. Therefore, the temperature difference between the circulation pipes 22 can be further reduced.

Here, in the circulation pipe 22, the processing liquid on the upstream side flows into the portion where the pressure adjusting valve 28 is interposed. Therefore, the pressure adjusting valve 28 adjusts the opening degree of the flow rate in the circulation pipe 22 more than the upstream side of the pressure adjusting valve 28 as compared with the flow rate in the circulation pipe 22 on the downstream side of the pressure adjusting valve 28. It can be changed stably by.
Therefore, as in the first embodiment, if the pressure adjusting valve 28 is interposed in the circulation pipe 22 on the downstream side of the branch position 26 of the supply pipe 23 in the corresponding circulation pipe 22, the circulation pipe 22 is used. The flow rate of the processing liquid flowing through the supply pipe 23 can be stabilized.

Further, according to the first embodiment, each circulation pipe 22 is provided with a pressure gauge 27 for detecting the pressure in the circulation pipe 22. As described above, there is a correlation between the pressure in the circulation pipe 22 and the flow rate of the treatment liquid in the circulation pipe 22. Therefore, if the opening degree of the pressure adjusting valve 28 is adjusted while checking the pressure of each circulation pipe 22, the flow rate of the processing liquid in the circulation pipe 22 can be easily adjusted within an appropriate range. When the flow rate of the treatment liquid in the circulation pipe 22 is changed, the temperature detected by the thermometer 29 changes accordingly. Therefore, if the flow rate of the treatment liquid in the circulation pipe 22 can be adjusted within an appropriate range, the circulation is performed. The temperature of the treatment liquid in the pipe 22 can be adjusted to an appropriate range (predetermined range: t2 ≦ t ≦ t1).

Further, the pressure gauge 27 and the thermometer 29 are often smaller and cheaper than general flowmeters. Therefore, the space saving and cost reduction of the processing liquid supply device 3 can be achieved as compared with the configuration in which the flow meter is interposed in the circulation pipe 22.
Here, the pressure of the treatment liquid in the circulation pipe 22 fluctuates on the downstream side of the branch position 26 as compared with the upstream side of the branch position 26 due to the change in the supply state of the treatment liquid to the supply pipe 23. Cheap.

If the pressure gauge 27 is interposed in the circulation pipe 22 on the upstream side of the branch position 26 of the supply pipe 23 in the circulation pipe 22, the change in the supply state of the processing liquid to the supply pipe 23 is the circulation pipe 22. It is possible to reduce the influence on the detection of the pressure of the processing liquid inside. That is, the pressure gauge 27 can stably detect the pressure of the processing liquid in the circulation pipe 22. Therefore, it becomes easier to check the pressure of the treatment liquid in each circulation pipe 22, and it becomes easier to further adjust the flow rate of the treatment liquid in the circulation pipe 22 within an appropriate range.

Further, according to the first embodiment, the supply pipe 23 has a plurality of branch pipes 33 to 35 that are branched from the corresponding circulation pipe 22 and supply the processing liquid to each processing unit 20 of the corresponding processing tower 2. ing. Therefore, the number of circulation pipes 22 can be reduced as compared with the configuration in which one circulation pipe 22 is provided in each processing unit 20.
Unlike the first embodiment, instead of the pressure gauge 27, a flow meter capable of detecting the flow rate is interposed in the circulation pipe 22 at the branch position 26 of the supply pipe 23 in the corresponding circulation pipe 22. May be good.

Unlike the first embodiment, when the target temperature T is set in the target temperature setting step S1, the target pressure corresponding to the target temperature T may be set. In this case, by changing the opening degree of the pressure adjusting valve 28 so that each detected pressure approaches the target pressure in the opening degree adjusting step, the processing liquid in each circulation pipe 22 is adjusted so that the detected temperature approaches the target temperature T. The temperature can be adjusted. Therefore, the temperature of the processing liquid in each circulation pipe 22 can be easily adjusted.

<Second Embodiment>
FIG. 8 is a schematic view showing the peripheral configurations of the processing tower 2A and the corresponding circulation pipe 22A in the substrate processing apparatus 1P according to the second embodiment. In FIG. 8, the same members as those described so far are designated by the same reference numerals, and the description thereof will be omitted. The difference between the substrate processing device 1P according to the second embodiment and the substrate processing device 1 (see FIG. 4) according to the first embodiment is that the processing liquid supply device 3P does not have the pressure gauges 27A to 27D, and , The control device 7 controls the pressure adjusting valves 28A to 28D.

FIG. 9 is a flow chart for explaining an example of the treatment liquid supply by the treatment liquid supply device 3P.
In the treatment liquid supply by the treatment liquid supply device 3P, first, the control device 7 sets a target value (target temperature T) of the temperature of the treatment liquid flowing in each circulation pipe 22 (target temperature setting step: step S11). At this time, a common target temperature T is set for all the circulation pipes 22. In this way, the control device 7 functions as a target temperature setting unit.

Then, the control device 7 activates the pump 30 interposed in the common pipe 24. As a result, the heated treatment liquid is supplied from the treatment liquid supply source R to each circulation pipe 22, and starts to circulate in each circulation pipe 22 (circulation step: step S12).
Then, the control device 7 controls each thermometer 29 to detect the temperature of the corresponding circulation pipe 22 (temperature detection step: step S13). The temperature detection step is performed after the start of the circulation step. Then, the control device 7 executes feedback control based on the detected temperature (step S14). The feedback control continues to be executed while the processing liquid in the processing liquid tank 21 is circulated by the circulation pipe 22.

FIG. 10 is a flow chart for explaining the details of the feedback control (S14 of FIG. 9) of the treatment liquid supply by the treatment liquid supply device 3P.
In the feedback control, first, the control device 7 determines whether or not the detected temperature in each circulation pipe 22 matches the target temperature T (temperature determination step: step T1).
When the detected temperature is different from the target temperature T (No in step T1), the opening degree of each pressure adjusting valve 28 is changed by the control device 7 (opening degree changing step: step T2). In the opening degree changing step, the control device 7 changes the opening degree of the pressure adjusting valve 28 so that the detected temperature approaches the target temperature T. As a result, the difference in temperature of the treatment liquid between the circulation pipes 22 is reduced. Then, the control device 7 again determines whether or not the detected temperature in each circulation pipe 22 matches the target temperature T (target value) (step T1).

If the detected temperature matches the target temperature T (Yes in step T1), the opening change step is not executed. Then, the control device 7 again determines whether or not the detected temperature in each circulation pipe 22 matches the target temperature T (target value) (step T1).
If the detected temperature matches the target temperature T in the temperature determination step again (Yes in step T1), the temperature determination step is executed again. If the detected temperature is different from the target temperature T in the temperature determination step again (No in step T1), the opening degree changing step is executed, and then the temperature determination step is executed.

In this way, the control device 7 adjusts the opening degree of the pressure adjusting valve 28 by repeating the temperature determination step and the opening degree changing step (opening degree adjusting step). In this way, the control device 7 functions as an opening degree adjusting unit that adjusts the opening degree of the corresponding pressure adjusting valve 28 so that the difference in the detected temperature between the circulation pipes 22 is reduced.
The opening degree adjusting step of the treatment liquid supply by the treatment liquid supply device 3P corresponds to the circulation pipe 22 having a long pipe length, similarly to the opening degree adjustment step of the treatment liquid supply by the treatment liquid supply device 3 according to the first embodiment. It is preferable to adjust the opening degree in order from the pressure adjusting valve 28 (sequential adjustment step).

In the treatment liquid supply by the treatment liquid supply device 3P, the feedback control (step S14 in FIG. 9) is started before the chemical liquid is supplied from the first nozzle 42.
The second embodiment has the same effect as that of the first embodiment.
Further, in the second embodiment, the control device 7 adjusts the opening degree of the pressure adjusting valve 28 to adjust the flow rate of the processing liquid in the circulation pipe 22. Since the degree of temperature change of the treatment liquid due to heat dissipation or endothermic depends on the flow rate of the treatment liquid in the circulation pipe 22, when the flow rate of the treatment liquid in the circulation pipe 22 is changed, the thermometer 29 causes the thermometer 29 to change accordingly. The temperature to be detected fluctuates. Therefore, the control device 7 can surely reduce the difference in temperature of the processing liquid between the circulation pipes 22 by adjusting the opening degree of each pressure adjusting valve 28. In this case, the processing liquid in which the temperature difference between the circulation pipes 22 is reduced is supplied from each circulation pipe 22 to the processing tower 2 via the supply pipe 23. As a result, the temperature difference between the treatment towers 2 of the treatment liquid can be reduced.

Further, in the second embodiment, the target temperature T is set in all the circulation pipes 22 by the control device 7 (target temperature setting unit). The control device 7 (opening adjustment unit) adjusts the opening degree of the pressure adjusting valve 28 so that each detected temperature coincides with the target temperature T. As a result, the temperature difference of the treatment liquid between the circulation pipes 22 can be further reduced.
The control device 7 keeps adjusting the opening degree of the pressure adjusting valve 28 so that each detected temperature matches the target temperature T, thereby maintaining a state in which the temperature difference of the processing liquid between the circulation pipes 22 is reduced. Can be done.

Here, when the supply state of the treatment liquid to the supply pipe 23 changes, the flow rate of the treatment liquid in the circulation pipe 22 changes, and the temperature of the treatment liquid in the circulation pipe 22 changes. Therefore, even if the detected temperature matches the target temperature T in the opening adjustment step, the detected temperature becomes the target temperature T in the middle of supplying the processing liquid due to a change in the supply state of the processing liquid to the supply pipe 23 or the like. It is possible that they will not match. Even in such a case, the temperature difference of the processing liquid between the circulation pipes 22 can be reduced by continuously adjusting the opening degree of the pressure adjusting valve 28 so as to match the target temperature T by the control device 7. Can be done.

The present invention is not limited to the embodiments described above, and can be implemented in still other embodiments.
For example, unlike the above-described embodiment, a heater for heating the processing liquid in the processing liquid tank 21 may be provided as a temperature adjusting unit. The treatment liquid in the treatment liquid tank 21 is heated by this heater. Therefore, the heated treatment liquid is supplied from the treatment liquid supply source R to the plurality of circulation pipes 22.

Further, unlike the above-described embodiment, the common pipe 24 may be provided with a cooler for cooling the treatment liquid. Further, unlike the above-described embodiment, a cooler for cooling the treatment liquid in the treatment liquid tank 21 may be provided. In these cases, the cooler functions as a temperature control unit, and the cooled treatment liquid is supplied from the treatment liquid supply source R to the plurality of circulation pipes 22.
Further, the treatment liquid whose temperature has been adjusted by the heater and the cooler may be supplied from the treatment liquid supply source R to the plurality of circulation pipes 22. Further, as the temperature control unit, a single unit having both functions of a heater and a cooler may be provided.

Further, in the above-described embodiment, it has been explained that each pressure gauge 27 is interposed in the circulation pipe 22 on the upstream side of the branch position 26 of the supply pipe 23 in the corresponding circulation pipe 22. However, unlike the above-described embodiment, the pressure gauge 27 may be interposed in the circulation pipe 22 on the downstream side of the branch position 26 of the supply pipe 23 in the circulation pipe 22. There may be a form in which the pressure gauge 27 is interposed in the circulation pipe 22 between the branch position 33a and the branch position 35a.

Further, in the above-described embodiment, it is explained that each pressure adjusting valve 28 and each thermometer 29 are interposed in the circulation pipe 22 on the downstream side of the branch position 26 of the supply pipe 23 in the corresponding circulation pipe 22. did. However, unlike the above-described embodiment, the pressure adjusting valve 28 may be interposed in the circulation pipe 22 on the upstream side of the branch position 26 of the supply pipe 23 in the circulation pipe 22. Further, the thermometer 29 may be interposed in the circulation pipe 22 on the upstream side of the branch position 26 of the supply pipe 23 in the circulation pipe 22. A pressure adjusting valve 28 or a thermometer 29 may be interposed in the circulation pipe 22 between the branch position 33a and the branch position 35a.

Further, the same configuration as that of the treatment liquid supply device 3 of the present embodiment may be applied to the treatment liquid supply device that supplies the treatment liquid to the second nozzle 43.
Further, in the above-described embodiment, the processing unit 20 has a first nozzle 42 and a second nozzle 43. However, the number of nozzles is not limited to two, and three or more nozzles may be provided. In this case, the same configuration as that of the treatment liquid supply device 3 of the present embodiment may be applied to the treatment liquid supply device that supplies the treatment liquid to each nozzle.

When the number of nozzles is three, a chemical solution such as hydrofluoric acid is supplied to the substrate W from the first nozzle 42, a rinse solution such as DIW is supplied to the substrate W from the second nozzle 43, and an organic solvent such as IPA is further supplied. (Low surface tension liquid) can be supplied to the substrate W from another nozzle. Thereby, in the above-mentioned substrate treatment, an organic solvent treatment in which DIW is replaced with IPA can be executed between the DIW rinsing treatment and the drying treatment.

In addition, various changes can be made within the scope of the claims.

1: Substrate processing device 1P: Substrate processing device 2: Processing tower (processing unit)
2A: 1st processing tower (processing unit)
2B: Second processing tower (processing unit)
2C: Third processing tower (processing unit)
2D: 4th processing tower (processing unit)
3: Treatment liquid supply device 3P: Treatment liquid supply device 7: Control device (opening adjustment unit, target temperature setting unit)
20: Processing unit 22: Circulation pipe 22A: Circulation pipe 22B: Circulation pipe 22C: Circulation pipe 22D: Circulation pipe 23: Supply pipe 23A: Supply pipe 23B: Supply pipe 23C: Supply pipe 23D: Supply pipe 26: Branch position 26A: Branch position 26B: Branch position 26C: Branch position 26D: Branch position 27: Pressure gauge (pressure detection unit)
27A: Pressure gauge (pressure detection unit)
27B: Pressure gauge (pressure detection unit)
27C: Pressure gauge (pressure detection unit)
27D: Pressure gauge (pressure detection unit)
28: Pressure adjustment valve (flow rate adjustment valve)
28A: Pressure adjustment valve (flow rate adjustment valve)
28B: Pressure adjustment valve (flow rate adjustment valve)
28C: Pressure adjustment valve (flow rate adjustment valve)
28D: Pressure adjustment valve (flow rate adjustment valve)
29: Thermometer (temperature detection unit)
29A: Thermometer (temperature detection unit)
29B: Thermometer (temperature detection unit)
29C: Thermometer (temperature detection unit)
29D: Thermometer (temperature detection unit)
33: Branch pipe 34: Branch pipe 35: Branch pipe T: Target temperature W: Substrate

Claims (13)

A processing liquid supply device that supplies processing liquid to a plurality of processing units.
A treatment liquid supply source that supplies a heated or cooled treatment liquid,
A plurality of circulation pipes provided corresponding to each of the plurality of the treatment units, and a plurality of circulation pipes for circulating the treatment liquid supplied from the treatment liquid supply source, respectively.
A supply pipe that is branched and connected to each of the circulation pipes and supplies the treatment liquid to the corresponding processing unit.
A flow rate adjustment valve that is interposed in each of the circulation pipes and adjusts the flow rate of the treatment liquid in the circulation pipe.
Interposed in each of said circulation pipe, seen including a temperature detecting unit for detecting the temperature of the treatment liquid flowing in the circulation pipe,
The circulation pipe is a treatment liquid supply device that circulates the treatment liquid supplied from the treatment liquid supply source regardless of the supply state of the treatment liquid to the corresponding supply pipe. The treatment liquid supply source is single,
As the difference between the circulation pipe detection temperature detected by each of the temperature detection unit is reduced, further look including the opening adjustment unit for adjusting the opening of the flow regulating valve,
The processing liquid according to claim 1, wherein the opening degree adjusting unit adjusts the opening degree in order from the flow rate adjusting valve corresponding to the circulation pipe in which the ratio of the change in the temperature of the processing liquid to the change in the flow rate of the processing liquid is large. Supply device. It further includes a target temperature setting unit that sets a target temperature for all the circulation pipes.
The processing liquid supply device according to claim 2, wherein the opening degree adjusting unit adjusts the opening degree of the flow rate adjusting valve so that the detected temperature detected by each temperature detecting unit matches the target temperature. The treatment liquid supply device according to any one of claims 1 to 3, wherein the temperature detection unit is interposed in the circulation pipe on the downstream side of the branch position of the supply pipe in the corresponding circulation pipe. .. The treatment liquid supply device according to any one of claims 1 to 4, wherein the flow rate adjusting valve is interposed in the circulation pipe on the downstream side of the branch position of the supply pipe in the corresponding circulation pipe. .. The treatment liquid supply device according to any one of claims 1 to 5, further comprising a pressure detection unit that is interposed in each of the circulation pipes and detects the pressure in the circulation pipe. The processing liquid supply device according to claim 6, wherein the pressure detection unit is interposed in the circulation pipe on the upstream side of the branch position of the supply pipe in the corresponding circulation pipe. The processing unit has a plurality of processing units for accommodating the substrate, and the processing unit has a plurality of processing units.
The treatment liquid supply according to any one of claims 1 to 7, wherein the supply pipe is branched from the corresponding circulation pipe and has a plurality of branch pipes for supplying the treatment liquid to each of the treatment units. Device. The treatment liquid supply device according to any one of claims 1 to 8.
A substrate processing apparatus including the plurality of processing units for processing a substrate. It is a processing liquid supply method that supplies a processing liquid to a plurality of processing units.
A circulation step of circulating the heated or cooled treatment liquid supplied from the treatment liquid supply source by a plurality of circulation pipes provided corresponding to each of the plurality of treatment units.
In the circulation step, a temperature detection step of detecting the temperature of the processing liquid flowing through each of the circulation pipes, and a temperature detection step.
Including an opening adjustment step of adjusting the opening degree of the flow rate adjusting valve interposed in each of the circulation pipes so that the difference between the detection temperatures detected in the temperature detection step between the circulation pipes is reduced. fruit,
The circulation step is a method of supplying a treatment liquid, which circulates the treatment liquid supplied from the treatment liquid supply source regardless of the supply state of the treatment liquid to the corresponding treatment unit . The treatment liquid supply source is single,
The treatment liquid according to claim 10, wherein in the opening degree adjusting step, the opening degree is adjusted in order from the flow rate adjustment valve corresponding to the circulation pipe having a large ratio of the change in the temperature of the treatment liquid to the change in the flow rate of the treatment liquid. Supply method. It further includes a target temperature setting step of setting a target temperature for all the circulation pipes.
The claim includes a step of adjusting the opening degree of the flow rate adjusting valve interposed in each of the circulation pipes so that the detection temperature corresponding to each of the circulation pipes matches the target temperature. process liquid supply method according to claim 10 or 11. The plurality of circulation pipes have different pipe lengths and have different pipe lengths.
The treatment liquid according to any one of claims 10 to 12, wherein the opening degree adjusting step includes a sequential adjusting step of adjusting the opening degree in order from the flow rate adjusting valve corresponding to the circulation pipe having a long pipe length. Supply method.

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