CN117133691B - Environment detection method, detection device and cleaning equipment for wafer box after cleaning - Google Patents
Environment detection method, detection device and cleaning equipment for wafer box after cleaning Download PDFInfo
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- CN117133691B CN117133691B CN202311388391.4A CN202311388391A CN117133691B CN 117133691 B CN117133691 B CN 117133691B CN 202311388391 A CN202311388391 A CN 202311388391A CN 117133691 B CN117133691 B CN 117133691B
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- 238000001514 detection method Methods 0.000 title claims abstract description 125
- 238000004140 cleaning Methods 0.000 title claims abstract description 62
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 25
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims description 27
- 238000001035 drying Methods 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 7
- 230000002159 abnormal effect Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 description 9
- 230000007613 environmental effect Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a method, a device and equipment for detecting the environment after cleaning a wafer box, wherein the method for detecting the environment after cleaning the wafer box comprises the following steps: s100, feeding the wafer box to a feeding unit; s200, the mechanical arm grabs the wafer box from the feeding unit and cleans the wafer box in the cleaning unit; s300, introducing nitrogen into the wafer box and simultaneously detecting the environment in the wafer box; s400, judging whether the wafer box is qualified or not. The step S300 specifically includes: step S301, moving the wafer box to a detection station; step S302, the air charging hole on the detection station is communicated with the inside of the wafer box through a first air hole on the wafer box, and the air exhausting hole on the detection station is communicated with the inside of the wafer box through a second air hole on the wafer box; and step S303, introducing nitrogen for a preset time into the wafer box on the detection station through the air charging hole, and detecting the environment in the wafer box through the environment detection piece to obtain a detection result. The detection method provided by the invention saves time and reduces the use cost.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a method and device for detecting environment after cleaning a wafer box and cleaning equipment.
Background
With the continuous development of semiconductor process technology, the requirements on the cleanliness of the environment in the wafer process and the storage process are higher and higher, the cleanliness of the wafer needs to be controlled, and the cleanliness of the wafer depends on the environment in the wafer box to a great extent, so that the wafer storage box needs to be cleaned to ensure the cleanliness.
At present, two detection modes of the wafer box exist, wherein one detection mode is to detect the internal environment of the wafer box before use, and detection needs to be carried out on a special detection machine, so that the use cost is increased while time is consumed; the other detection mode is that the wafer box is placed on the detection equipment, and the cover body and the box body of the wafer box are separated through corresponding parts, so that the detection equipment can detect the environment condition in the box body of the wafer box, after the wafer box is detected, the box body and the cover body of the wafer box are assembled by corresponding parts, and then the assembled wafer box is subjected to turnover blanking.
Disclosure of Invention
Aiming at the technical problems, the invention provides a method, a device and equipment for detecting the environment after cleaning a wafer box, which save time and reduce use cost, and the detection method is simpler.
The invention adopts the following technical scheme:
the method for detecting the environment of the wafer box after cleaning comprises the following steps:
s100, feeding the wafer box to a feeding unit of wafer box cleaning equipment;
s200, the wafer box is grabbed from the feeding unit by the mechanical arm and is cleaned in the cleaning unit;
s300, introducing nitrogen into the cleaned wafer box, and simultaneously detecting the environment in the wafer box to obtain a detection result;
s400, comparing the detection result with a preset standard value, judging whether the wafer box is qualified or not, if the wafer box is qualified, blanking, and if the wafer box is unqualified, performing the next processing;
the step S300 specifically includes:
step 301, moving the wafer box to a detection station of a blanking unit;
step S302, the air charging hole on the detection station is communicated with the inside of the wafer box through the first air hole on the wafer box, and the air exhausting hole on the detection station is communicated with the inside of the wafer box through the second air hole on the wafer box;
and step S303, introducing nitrogen for a preset time into the wafer box on the detection station through the air charging hole, and detecting the environment in the wafer box through the environment detection piece to obtain a detection result.
In a preferred embodiment, the detection result is a particle number detection result and/or a temperature and humidity detection result in the wafer cassette.
In a preferred embodiment, in step S400, if the cleaned wafer cassette is qualified, the wafer cassette is transported from the inspection station on the blanking unit to the blanking station or temporarily stored in the first buffer station.
In a more preferred embodiment, the qualified cassette is transported to the blanking station while a carrier for carrying cassette movements is located at the inspection station; when the bracket for carrying the movement of the wafer box is positioned at the blanking station, the qualified wafer box is temporarily stored to the first cache station.
In a preferred embodiment, in step S400, if the result of detecting the number of particles in the wafer cassette is not acceptable, the unacceptable wafer cassette is moved to the cleaning unit to be cleaned again or temporarily stored in the second buffer station to wait for entering the cleaning unit to be cleaned; if the temperature and humidity detection result in the wafer box is not qualified, continuously filling nitrogen into the unqualified wafer box until the temperature and humidity detection is qualified or the wafer box is transported to the blanking station for blanking after abnormal alarming.
The invention also adopts the following technical scheme:
the environment detection device after wafer box cleaning adopts the environment detection method after wafer box cleaning, and the device comprises the following steps:
unloading station and detection station, be equipped with at least one and aerify hole and at least one bleed hole on the detection station, be equipped with first gas pocket and second gas pocket on the wafer box, aerify the hole with first gas pocket is connected, bleed hole one end with the second gas pocket is connected, the device still includes environment detection spare, environment detection spare pass through the conveying pipeline with the other end of bleed hole is connected.
In a preferred embodiment, the environmental sensing element comprises a temperature and humidity sensor and/or a particle sensor.
In a more preferred embodiment, the particle sensor and/or the temperature and humidity sensor are/is connected to the other end of the air suction hole through the conveying pipeline.
In a preferred embodiment, an electric cylinder is arranged below the blanking station and the detecting station, a jacking cylinder is arranged on the electric cylinder, a bracket is arranged on the jacking cylinder, and the bracket is movably arranged between the blanking station and the detecting station.
The invention also adopts the following technical scheme:
the wafer box cleaning equipment comprises a feeding unit, a cleaning unit, a drying unit, a discharging unit and a manipulator; the blanking unit comprises the environment detection device after the wafer box is cleaned; the wafer box cleaning equipment further comprises a plurality of caching stations for caching the wafer boxes, wherein each caching station at least comprises a first caching station and a second caching station, and the first caching station and the second caching station are arranged on one side of the detection station.
Compared with the prior art, the invention has the following advantages:
according to the method for detecting the environment after the wafer box is cleaned, the wafer box is placed on the detection station of the blanking unit through the manipulator after the wafer box is cleaned, nitrogen is introduced into the wafer box for a preset time through the air charging hole of the detection station and the first air charging hole of the wafer box, then the nitrogen in the wafer box is pumped out through the air pumping hole of the detection station and the second air charging hole of the wafer box, the nitrogen flowing out of the wafer box is detected through the environment detection piece to obtain a detection result, if the wafer box is qualified, the wafer box is subjected to blanking treatment, and if the wafer box is unqualified, the next treatment is performed, namely the wafer box can be detected in time after being cleaned, and the wafer box after being cleaned is not required to be transported to other detection equipment for detection, so that the process of transporting the wafer box to the detection equipment after being cleaned is reduced, the possibility that air particles enter the wafer box in the transportation process is reduced, the detection efficiency after the wafer box is improved, and the detection cost and the time are saved on the one hand; on the other hand, the wafer box after cleaning can be directly detected, and the cleaning degree of the cleaning unit on the wafer box and the detection accuracy of the environment detection piece on the wafer box can be better ensured; in addition, nitrogen is directly introduced into the wafer box through the air filling hole on the detection station and the first air hole on the wafer box, and enters the environment detection piece along the second air hole and the air extracting hole, so that the box body and the cover body of the wafer box do not need to be opened, and correspondingly, after the wafer box is detected, the box body and the cover body of the wafer box also need to be assembled again.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a partial schematic view of a wafer cassette cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is another partial schematic view of a wafer cassette cleaning apparatus according to an embodiment of the present invention;
FIG. 3 is a perspective view of an environment detection device according to an embodiment of the present invention;
FIG. 4 is a top view of an environmental detection device according to an embodiment of the present invention;
FIG. 5 is a side view of an environmental detection device according to an embodiment of the present invention;
FIG. 6 is a schematic view of a wafer cassette;
fig. 7 is a flowchart of a method for detecting an environment after cleaning a wafer cassette according to an embodiment of the invention.
Wherein,
100. a wafer cassette; 101. a first air hole; 102. a second air hole;
1. a feeding unit; 2. a frame; 3. wafer cassette cleaning equipment; 5. a blanking unit; 51. a blanking station; 52. detecting a station; 521. an air filling hole; 522. an air suction hole; 53. an electric cylinder; 54. jacking the air cylinder; 55. a bracket; 56. a first cache station; 57. a second cache station;
6. an environment detection member; 61. a first delivery line; 62. a second delivery line; 63. a particle sensor; 64. and a temperature and humidity sensor.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. The description of these embodiments is provided to assist understanding of the present invention, but is not intended to limit the present invention.
Fig. 1 and 2 are partial schematic views of a wafer cassette cleaning apparatus, and a wafer cassette cleaning apparatus 3 includes a loading unit 1, a frame 2, a cleaning unit, a drying unit, a discharging unit 5, an environmental detecting member 6, and a robot. The feeding unit 1 is used for feeding the wafer box 100, the cleaning unit can clean the wafer box 100, the drying unit can dry the cleaned wafer box 100, and the discharging unit 5 discharges the wafer box 100 after drying. In this embodiment, the feeding unit 1, the cleaning unit, the drying unit and the discharging unit 5 may have a plurality of stations, which form a plurality of stations, and are matched with each other, so that the cleaning and drying efficiency of the wafer storage box can be improved.
Further, referring to fig. 3 to 6, the present embodiment provides an environment detection device after cleaning a wafer cassette, and the blanking unit 5 includes the environment detection device. When the environment inside the wafer box is detected, the wafer box 100 is firstly loaded onto the loading unit 1, then the wafer box 100 is grabbed from the loading unit 1, cleaned in the cleaning unit and dried in the drying unit, then the cleaned and dried wafer box 100 is placed on the environment detection device to detect the environment inside the wafer box 100, and the wafer box is processed in the next step according to the environment detection result of the wafer box.
The environment detection device comprises a blanking station 51 and a detection station 52. The detecting station 52 is used for placing the wafer box after cleaning and drying so as to detect the wafer box; the blanking station 51 is used for placing the wafer cassette after being detected by the detecting station 52, and waiting for other processing steps.
Specifically, the inspection station 52 is provided with at least one air filling hole 521 and at least one air exhausting hole 522, and the wafer box 100 is provided with a first air hole 101 and a second air hole 102. The air charging hole 521 is connected with the first air hole 101, one end of the air extracting hole 522 is connected with the second air hole 102, and the environment detecting member 6 is connected with the other end of the air extracting hole 522 through a conveying pipeline, so that air can enter the wafer box 100 from the air charging hole 521 and the first air hole 101, and then the air in the wafer box 100 enters the environment detecting member 6 from the air extracting hole 522, the second air hole 102 and the conveying pipeline, so that the environment detecting member 6 detects the environment condition in the wafer box 100. In the present embodiment, the number of the air charge holes 521 and the first air holes 101 is three, and the number of the air suction holes 522 and the second air holes 102 is one. In the present embodiment, the gas input into the wafer cassette 100 is nitrogen, and may be other inert gases in other embodiments.
The environmental sensing member 6 includes a temperature and humidity sensor and/or a particle sensor. In this embodiment, the environment detecting member 6 includes a particle sensor 63 for detecting the number of air particles in the wafer cassette and a temperature and humidity sensor 64 for detecting the temperature and humidity of the wafer cassette, and in other embodiments, only the particle sensor may be provided. Further, the particle sensor 63 and the temperature and humidity sensor 64 of the present embodiment are connected through the other end of the conveying pipeline and the air suction hole 522, specifically, the wafer box 100, the particle sensor 63 and the temperature and humidity sensor 64 are sequentially connected through the conveying pipeline, that is, the particle sensor 63 is directly connected with the wafer box 100, the temperature and humidity sensor 64 is not disposed between the particle sensor 63 and the wafer box 100, and the influence on the detection result of the subsequent particle sensor when the temperature and humidity in the wafer box 100 are unqualified can be prevented.
More specifically, the transfer line includes a first transfer line 61 and a second transfer line 62, the particle sensor 63 is connected to the other end of the suction hole 522 through the first transfer line 61, and the temperature and humidity sensor 64 is connected to the particle sensor 63 through the second transfer line 62. In this embodiment, the environmental detecting member 6 is disposed below the detecting station 52 to reduce the space occupied by the detecting station 52 in the horizontal direction.
An electric cylinder 53 is arranged below the blanking station 51 and the detecting station 52, a jacking air cylinder 54 is arranged on the electric cylinder 53, a bracket 55 is arranged on the jacking air cylinder 54, and the bracket 55 is movably arranged between the blanking station 51 and the detecting station 52. The wafer cassette 100 may be moved from the blanking station 51 to the inspection station 52 or from the inspection station 52 to the blanking station 51 by the cooperation of the electric cylinder 53, the jacking cylinder 54 and the bracket 55.
Referring to fig. 2, the wafer cassette cleaning apparatus 3 further includes a plurality of buffer stations for buffering the wafer cassettes 100, where the buffer stations are disposed on one side of the detecting station 52, and specifically disposed above the detecting station 52, so as to save space. Further, the buffer station comprises a plurality of first buffer stations 56 and second buffer stations 57, the first buffer stations 56 and the second buffer stations 57 are arranged above the detection stations 52, and the arrangement of the first buffer stations 56 and the second buffer stations 57 is beneficial to the device to process more wafer boxes, so that the working efficiency is improved.
Referring to fig. 7, the present embodiment further provides a method for detecting an environment after cleaning a wafer cassette, including the following steps:
s100, feeding the wafer cassette 100 to a feeding unit 1 of wafer cassette cleaning equipment 3;
s200, the manipulator grabs the wafer box 100 from the feeding unit 1 to the cleaning unit for cleaning;
s300, introducing nitrogen into the cleaned wafer box 100, and simultaneously detecting the environment in the wafer box 100 to obtain a detection result;
s400, comparing the detection result with a preset standard value, judging whether the wafer box 100 is qualified, if the wafer box 100 is qualified, blanking, and if the wafer box 100 is unqualified, performing the next processing.
The step S300 specifically includes: step S301, moving the wafer box 100 to a detection station 52 of the blanking unit 5; step S302, the air filling hole 521 on the detection station 52 is communicated with the interior of the wafer box through the first air hole 101 on the wafer box 100, and the air pumping hole 522 on the detection station 52 is communicated with the interior of the wafer box through the second air hole 102 on the wafer box 100; in step S303, nitrogen is introduced into the wafer box 100 on the detection station 52 for a preset time through the air-filling hole 521, and the environment in the wafer box 100 is detected by the environment detection member 6, so as to obtain a detection result.
Specifically, the detection results are the detection results of the number of particles in the wafer box and the temperature and humidity detection results.
If the cleaned wafer cassette 100 is qualified, the wafer cassette 100 is transported from the inspection station 52 on the blanking unit 5 to the blanking station 51 or temporarily stored in the first buffer station 56 to wait for blanking.
Further, when the carrier 55 for carrying the movement of the wafer cassette 100 is located at the inspection station 52, the qualified wafer cassette is transported to the blanking station 51; when the carrier 55 for carrying the cassette movement is located at the blanking station 51, the qualified cassette is temporarily stored in the first buffer station 56 to wait for blanking.
The failure of the wafer cassette after cleaning is classified into two cases, one is that the particle number detection result in the wafer cassette 100 is failed, and the other is that the temperature and humidity detection result in the wafer cassette 100 is failed. Specifically, if the detection result of the particle number in the wafer cassette 100 is not qualified, the unqualified wafer cassette is re-cleaned by the moving cleaning unit or temporarily stored in the second buffer station 57 to wait for entering the cleaning unit for cleaning, and the cleaned wafer cassette is conveyed to the drying unit for drying and re-detection until the detection is qualified; if the temperature and humidity detection result in the wafer box 100 is not qualified, the unqualified wafer box is continuously filled with nitrogen until the temperature and humidity detection is qualified or the wafer box is transported to the blanking station 51 for blanking after abnormal alarm. The wafer box 100 can be timely detected through the environment detection piece 6 after being cleaned, so that the detection efficiency of the wafer box after being cleaned is improved, and a large amount of detection cost and time are saved while the operation is convenient.
After the wafer box 100 of the embodiment is cleaned, the wafer box 100 is placed on the detection station 52 by a manipulator, three first air holes 101 on the wafer box 100 are correspondingly connected with three air holes 521 on the detection station 52, one second air hole 102 of the wafer box 100 is correspondingly connected with one air suction hole 522 of the detection station 52, nitrogen is filled into the wafer box 100, the nitrogen slowly flows out along the other end of the air suction hole 522 after being filled into the wafer box 100, then the nitrogen enters the particle sensor 63 through the first conveying pipeline 61, the particle sensor 63 senses the flow of the air and starts detection, and the detection result is transmitted to a computer through the communication module, and is compared with a preset standard value to judge whether the wafer box 100 is qualified or not. In this embodiment, when detecting the internal environment of the wafer box, the cover body of the wafer box 100 is not required to be opened, but nitrogen is directly introduced into the wafer box 100 through the air filling hole 521 and the first air hole 101, and then enters the environment detecting member 6 through the second air hole 102 and the air extracting hole 522, so that the environment detecting member 6 detects the environment in the wafer box 100, and the detecting method is simpler and the operation is more convenient. If the wafer box 100 is qualified and the bracket 55 is located at the detection station 52, the lifting cylinder 54 drives the bracket 55 to lift the wafer box 100 upwards, then the electric cylinder 53 drives the wafer box 100 to translate to the position above the blanking station 51, the lifting cylinder 54 is reset, the wafer box 100 falls on the blanking station 51, and at the moment, the wafer box 100 can be taken away by the overhead travelling crane. If the cassette is acceptable and the carrier 55 is located at the blanking station 51, the acceptable cassette is temporarily stored in the first buffer station 56 by the robot. If the detection result of the particle number in the wafer box is not qualified, the unqualified wafer box is also translated to the blanking station 51 and is taken to the cleaning unit by the crown block to be cleaned again or is temporarily stored on the second buffer station 57 through the manipulator to wait for entering the cleaning unit to be cleaned again; if the temperature and humidity detection result in the wafer box 100 is not qualified, the unqualified wafer box 100 is continuously filled with nitrogen until the temperature and humidity detection is qualified or the wafer box is transported to the blanking station 51 for blanking after abnormal alarm, and the wafer box with unqualified temperature and humidity can be distinguished from the qualified wafer box in an abnormal alarm mode.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-described embodiments are provided for illustrating the technical concept and features of the present invention, and are intended to be preferred embodiments for those skilled in the art to understand the present invention and implement the same according to the present invention, not to limit the scope of the present invention. All equivalent changes or modifications made according to the principles of the present invention should be construed to be included within the scope of the present invention.
Claims (9)
1. The method for detecting the environment of the wafer box after cleaning is characterized by comprising the following steps:
s100, feeding the wafer box to a feeding unit of wafer box cleaning equipment;
s200, the wafer box is grabbed from the feeding unit by the mechanical arm and is cleaned in the cleaning unit;
s300, introducing nitrogen into the cleaned wafer box, and simultaneously detecting the environment in the wafer box to obtain a detection result;
s400, comparing the detection result with a preset standard value, judging whether the wafer box is qualified or not, if the wafer box is qualified, blanking, and if the wafer box is unqualified, performing the next processing;
the step S300 specifically includes:
step 301, moving the wafer box to a detection station of a blanking unit;
step S302, the air charging hole on the detection station is communicated with the inside of the wafer box through the first air hole on the wafer box, and the air exhausting hole on the detection station is communicated with the inside of the wafer box through the second air hole on the wafer box;
step S303, introducing nitrogen for a preset time into the wafer box on the detection station through the air charging hole, and detecting the environment in the wafer box through an environment detection piece to obtain a detection result, wherein the detection result comprises a particle number detection result in the wafer box;
in step S400, if the cleaned wafer box is qualified, the wafer box is moved from the detection station to the blanking station of the blanking unit through the cooperation of the electric cylinder, the jacking cylinder and the bracket, or is temporarily stored to the first buffer station by the manipulator; when a bracket for carrying the movement of the wafer box is positioned at the blanking station, the qualified wafer box is temporarily stored to a first cache station;
in step S400, if the detection result of the number of particles in the wafer cassette is not qualified, the unqualified wafer cassette is moved to the cleaning unit to be cleaned again or temporarily stored on the second buffer station by the manipulator to wait for entering the cleaning unit to be cleaned;
the feeding unit is adjacent to the discharging unit and located on the same side of the frame.
2. The method of claim 1, wherein the detection result further comprises a temperature and humidity detection result.
3. The post-cleaning environment inspection method of claim 1, wherein the qualified wafer cassette is transported to the blanking station while a carrier for carrying the wafer cassette movement is at the inspection station.
4. The method according to claim 2, wherein if the temperature and humidity detection result in the wafer cassette is not acceptable, the unacceptable wafer cassette is continuously filled with nitrogen until the temperature and humidity detection is acceptable or the wafer cassette is transported to the blanking station for blanking after an abnormal alarm.
5. A post-cleaning environment detection apparatus for a wafer cassette, wherein the post-cleaning environment detection method for a wafer cassette according to any one of claims 1 to 4 is employed, the apparatus comprising:
unloading station and detection station, be equipped with at least one and aerify hole and at least one bleed hole on the detection station, be equipped with first gas pocket and second gas pocket on the wafer box, aerify the hole with first gas pocket is connected, bleed hole one end with the second gas pocket is connected, the device still includes environment detection spare, environment detection spare pass through the conveying pipeline with the other end of bleed hole is connected.
6. The post-wafer cassette cleaning environment detection device of claim 5, wherein the environment detection element comprises a temperature and humidity sensor and/or a particle sensor.
7. The apparatus according to claim 6, wherein the particle sensor and/or the temperature and humidity sensor are/is connected to the other end of the gas pumping hole via the transport line.
8. The post-cleaning environment detection device for wafer cassettes as defined in claim 5, wherein an electric cylinder is arranged below the blanking station and the detection station, a jacking cylinder is arranged on the electric cylinder, a bracket is arranged on the jacking cylinder, and the bracket is movably arranged between the blanking station and the detection station.
9. The wafer box cleaning equipment is characterized by comprising a feeding unit, a cleaning unit, a drying unit, a discharging unit and a manipulator; the blanking unit comprises the environment detection device after cleaning the wafer box according to any one of claims 5-8;
the wafer box cleaning equipment further comprises a plurality of caching stations used for caching the wafer box, the caching stations at least comprise a first caching station and a second caching station, the first caching station and the second caching station are arranged on one side of the detection station, the cleaning units and the drying units are multiple, and the feeding units are adjacent to the discharging units and located on the same side of the frame.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM276318U (en) * | 2005-03-29 | 2005-09-21 | Fortrend Taiwan Scient Corp | Wafer cassette inspection machine |
| CN204809199U (en) * | 2015-07-31 | 2015-11-25 | 中芯国际集成电路制造(北京)有限公司 | Wafer box transports system |
| CN207602534U (en) * | 2017-10-26 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette bogey |
| CN109530374A (en) * | 2018-11-21 | 2019-03-29 | 上海超硅半导体有限公司 | A kind of wafer cassette cleaning method |
| CN109712906A (en) * | 2017-10-25 | 2019-05-03 | 长鑫存储技术有限公司 | Wafer storage device and semiconductor production equipment with cleaning function |
| CN216679261U (en) * | 2021-12-17 | 2022-06-07 | 苏州芯矽电子科技有限公司 | Automatic cleaning equipment for semiconductor wafer box |
| TW202312393A (en) * | 2021-08-06 | 2023-03-16 | 大陸商徐州鑫晶半導體科技有限公司 | Wafer pod cleaning device and control method thereof |
-
2023
- 2023-10-25 CN CN202311388391.4A patent/CN117133691B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM276318U (en) * | 2005-03-29 | 2005-09-21 | Fortrend Taiwan Scient Corp | Wafer cassette inspection machine |
| CN204809199U (en) * | 2015-07-31 | 2015-11-25 | 中芯国际集成电路制造(北京)有限公司 | Wafer box transports system |
| CN109712906A (en) * | 2017-10-25 | 2019-05-03 | 长鑫存储技术有限公司 | Wafer storage device and semiconductor production equipment with cleaning function |
| CN207602534U (en) * | 2017-10-26 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette bogey |
| CN109530374A (en) * | 2018-11-21 | 2019-03-29 | 上海超硅半导体有限公司 | A kind of wafer cassette cleaning method |
| TW202312393A (en) * | 2021-08-06 | 2023-03-16 | 大陸商徐州鑫晶半導體科技有限公司 | Wafer pod cleaning device and control method thereof |
| CN216679261U (en) * | 2021-12-17 | 2022-06-07 | 苏州芯矽电子科技有限公司 | Automatic cleaning equipment for semiconductor wafer box |
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| CN117133691A (en) | 2023-11-28 |
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