CN216679261U

CN216679261U - Automatic cleaning equipment for semiconductor wafer box

Info

Publication number: CN216679261U
Application number: CN202123184231.7U
Authority: CN
Inventors: 张少阳; 高翔鹰
Original assignee: Suzhou Core Silicon Electronics Technology Co ltd
Current assignee: Suzhou Core Silicon Electronics Technology Co ltd
Priority date: 2021-12-17
Filing date: 2021-12-17
Publication date: 2022-06-07
Anticipated expiration: 2031-12-17

Abstract

The utility model discloses automatic cleaning equipment for a semiconductor wafer box, which comprises an equipment body, wherein a feeding hole and a discharging hole are formed in the equipment body, a cleaning mechanism and a drying mechanism are sequentially arranged between the feeding hole and the discharging hole, the cleaning mechanism comprises a tank washing area and a spraying area, the tank washing area is close to the feeding hole, and the spraying area comprises a cold water spraying area and a hot water spraying area; the drying mechanism is arranged at one end close to the hot water spraying area, the drying mechanism at least comprises an infrared drying area, and an infrared generator is arranged at the top of the infrared drying area; the frame is further provided with a transmission mechanism, the transmission mechanism is in circular transmission motion on the frame, and the transmission mechanism comprises a synchronous manipulator and a transmission line. This scheme will be washed the groove and spray and combine together to utilize infrared ray and nitrogen gas segmentation to dry, ensure the wafer box clean and dry after the cleanness, no particulate matter and moisture are remained.

Description

Automatic cleaning equipment for semiconductor wafer box

Technical Field

The utility model relates to the field of semiconductors, in particular to automatic cleaning equipment for a semiconductor wafer box.

Background

In the production process of semiconductor wafers, a wafer box is generally used for conveying, in order to protect the environment and reduce the cost, the wafer box is usually required to be reused, but after the semiconductor wafers are conveyed, a large amount of particles such as various metal film layer residues, silicon wafers or powder and the like are usually remained in the wafer box, because the semiconductor wafer products are precise, a groove body for preventing the semiconductor wafers is required to be cleaned before the wafer box is reused, meanwhile, in order not to influence the quality of the semiconductor wafer products, the wafer box after being cleaned is required to be dried, the wafer box is cleaned by a traditional cleaning mode that a water storage tank is used for soaking the groove for cleaning and then the wafer box is cleaned by a drying or blowing drying mode, but because the space of the groove body in the wafer box is narrow, the mode can not clean the particles in the groove body of the wafer box and the common drying mode can not completely dry the water in the groove body, it is difficult to meet the cleanliness requirement of the wafer cassette for repeated use.

SUMMERY OF THE UTILITY MODEL

The novel purpose is to solve the problems in the prior art and provide automatic cleaning equipment for a semiconductor wafer box.

The purpose of the utility model is realized by the following technical scheme:

the automatic cleaning equipment for the semiconductor wafer box comprises a machine body, wherein a feeding hole and a discharging hole are formed in the machine body, a cleaning mechanism and a drying mechanism are sequentially arranged between the feeding hole and the discharging hole, the cleaning mechanism comprises a tank washing area and a spraying area, the tank washing area is close to the feeding hole, and the spraying area comprises a cold water spraying area and a hot water spraying area; the drying mechanism is arranged at one end close to the hot water spraying area, the drying mechanism at least comprises an infrared drying area, and an infrared generator is arranged at the top of the infrared drying area; the machine frame is further provided with a transmission mechanism, the transmission mechanism conducts circulating transmission movement on the machine frame, and the transmission mechanism comprises a synchronous mechanical arm and a transmission line.

Preferably, the washing tank is arranged in the washing tank area in a way of ascending and descending.

Preferably, a blower is further arranged in the infrared drying area.

Preferably, the drying mechanism further comprises a nitrogen drying area, and the nitrogen drying area is arranged between the infrared drying area and the discharge hole of the rack.

Preferably, the synchronous robot is translatably suspended from the sump wash zone.

Preferably, the transmission line comprises a conveying belt arranged in the spraying area, and the conveying belt comprises a conveying chain arranged at the bottoms of the inner walls of the two sides of the spraying area in parallel and a carrying platform arranged on the conveying chain and used for conveying the wafer box.

Preferably, the transmission line further comprises two rows of roller lines which are arranged at the bottoms of the inner walls on the two sides of the infrared drying area and the nitrogen drying area in parallel.

Preferably, the top and the bottom of the spraying area are provided with spray heads at intervals, and the water spraying angle of the spray heads is adjustable.

Preferably, the height of a water spray opening of the spray head arranged at the bottom of the spraying area is lower than that of the bottom of the carrier, and the bottom of the carrier is hollow.

Preferably, the height of the upper surface of the carrier is consistent with the height of the top of the roller line.

The technical scheme of the utility model has the following beneficial effects:

1. according to the scheme, the groove washing and the spraying are combined, the wafer box washing agent is filled in the washing groove of the groove washing area, the particles in the wafer box are ensured to be soaked and washed cleanly, and in addition, the wafer box after being washed can be kept dry by utilizing infrared rays and nitrogen for segmented drying;

2. according to the scheme, the spraying area is divided into the cold water spraying area and the hot water spraying area, the hot water spraying area is arranged at one end close to the drying mechanism, the temperature of the wafer box can be increased before the wafer box is dried, the drying time of the wafer box is shortened, and the drying time, energy consumption and cost are reduced;

3. the transmission mechanism in the scheme comprises a synchronous mechanical arm and a transmission line, the transmission line further comprises a conveying belt and a roller line, different transmission mechanisms are used according to different working modes of the tank washing area, the spraying area and the drying mechanism, and the functions of the cleaning mechanism, the drying mechanism and the transmission mechanism can be exerted more flexibly and to a greater degree.

Drawings

FIG. 1: is a perspective view of the automatic cleaning equipment for semiconductor wafer box of the utility model;

FIG. 2: the front view of the automatic cleaning equipment for the semiconductor wafer box is shown;

FIG. 3: is a cross-sectional view A-A of FIG. 3 of the present invention;

FIG. 4: is a top view of the automatic cleaning apparatus for a semiconductor wafer cassette of the present invention.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.

The automatic cleaning equipment for the semiconductor wafer box disclosed by the utility model is explained with reference to the attached drawings as follows:

as shown in fig. 1-4, the automatic cleaning device for semiconductor wafer cassettes comprises a frame 1, wherein the frame 1 is provided with a feeding port 2 and a discharging port 3, wherein "front" and "front" in the following description represent one end close to the feeding port 2, and "rear" represent one end close to the discharging port 3, a cleaning mechanism 4 and a drying mechanism 5 are sequentially arranged between the feeding port 2 and the discharging port 3, the frame is further provided with a transmission mechanism 6, the transmission mechanism 6 performs a circulating transmission motion on the frame, the transmission mechanism 6 transmits a wafer cassette from the feeding port 2 to the cleaning mechanism 4 and the drying mechanism 5, and sends the wafer cassette from the discharging port 3, in addition, the transmission mechanism 6 is further provided with an external transmission line, the external transmission line connects the discharging port 3 and the feeding port 2, so as to realize the circulating transmission, the transmission mechanism 6 comprises a synchronous manipulator 61 and a transmission line, the transmission line includes a conveyor belt 62 and a roller line 63.

Specifically, the cleaning mechanism 4 includes a tank cleaning area 41 and a spraying area 42, the tank cleaning area 41 is close to the feed port 2, the spraying area 42 is disposed at the rear end of the tank cleaning area 41, so that the inlet of the spraying area 42 is connected with the outlet of the tank cleaning area 41, a cleaning tank 411 is disposed in the tank cleaning area 41 and can be lifted up and down, a wafer box cleaning agent is filled in the cleaning tank 411, the cleaning tank 411 moves up and down under the driving of an air cylinder, the synchronous manipulator 61 is hung in the tank cleaning area 41 in a translation manner, specifically, the wafer box is fixed by the grabbing of the synchronous manipulator 61 and is conveyed to the upper side of the cleaning tank 411 from the feed port 2, the air cylinder drives the cleaning tank 411 to move up, so that the wafer box is completely soaked in the wafer box cleaning agent, and when the wafer box is completely soaked and needs to leave the tank cleaning area 41, the air cylinder drives the cleaning tank 411 to descend, the wafer cassette leaves the cleaning tank 411, and specifically, according to different cleaning requirements, a plurality of cleaning tanks 411 may be provided, and each cleaning tank 411 may contain different wafer cassette cleaning agents or clean water according to the precision or functional requirements of each cleaning soaking.

Specifically, as shown in fig. 3 and 4, the spraying area 42 includes a cold water spraying area 42 and a hot water spraying area 42, in this embodiment, the spraying area 42 has three total sections, wherein the cold water spraying area 42 has two sections, the hot water spraying area has one section, and the cold water spraying area 42 is disposed at the front end of the hot water spraying area 42, in other embodiments, the length of the spraying area 42 can be adjusted as required, and the last section or several sections of the spraying area 42 is/are the hot water spraying area 42, when the hot water spraying area 42 has multiple sections, the water temperature of each section of the hot water spraying area 42 can be gradually increased in a stepwise manner from front to back, the top and the bottom of the spraying area 42 are respectively provided with spray heads 421 at equal intervals, the spray heads 421 are connected with an external water path through water pipes, the conveying belt 62 passes through the spraying area 42 and conveys the wafer cassette to the spraying area 42, specifically, the conveying belt 62 includes a conveying chain arranged at the bottom of the inner wall on both sides of the spraying area 42 in parallel and a stage 621 arranged on the conveying chain and used for conveying the wafer box, the stage 621 rotates along with the conveying chain in a circulating manner, when the wafer box is immersed and leaves the cleaning tank 411, the synchronous manipulator 61 places the wafer box on the stage 621, the wafer box pushes the stage 621 to move from front to back in the spraying area 42 through the conveying chain, the water spraying angle of the spray head 421 is adjustable, when the wafer box is sprayed, the water spraying port of the spray head 421 aligns with the wafer box placed on the stage 621, further, the height of the water spraying port of the spray head 421 arranged at the bottom of the spraying area 42 is lower than the height of the bottom of the stage 621, the bottom 621 of the stage is hollowed out, and simultaneously, by adjusting the spraying angle of the spray head 421, the spray head can spray water to the wafer box at each angle up, down, left and right, the wafer box is convenient to clean in all directions.

As shown in fig. 2 and 4, the automatic semiconductor wafer box cleaning device further includes a drying mechanism 5, the drying mechanism 5 is disposed at an end close to the hot water spraying area 42, specifically, the drying mechanism 5 is disposed at an outlet of the rear end of the hot water spraying area 42, the hot water spraying can increase the temperature of the wafer box and shorten the drying time, the drying mechanism 5 at least includes an infrared drying area 51, the infrared drying area 51 is disposed at the top of the infrared drying area 51 and is provided with an infrared generator 511, specifically, in order to shorten the drying time, a blower may be disposed in the infrared drying area 51, and the blower is used for drying the residual moisture in the wafer box while drying the infrared rays.

Specifically, the drying mechanism 5 further comprises a nitrogen drying area 52, the nitrogen drying area 52 is arranged between the infrared drying area 51 and the discharge hole 3 of the rack, a nitrogen gas path for outputting nitrogen gas and an air draft device for exhausting waste gas are connected in the nitrogen drying area 52, valves capable of controlling opening and closing are further arranged at an inlet and an outlet of the nitrogen drying area 52, and when a wafer cassette enters the nitrogen drying area 52, the valves at the inlet and the outlet of the nitrogen drying area 52 are closed, and the nitrogen gas path is opened; after the wafer box is dried, the nitrogen gas path is closed, the valve at the outlet of the nitrogen drying area 52 is opened, and the wafer box is sent out.

Specifically, in order to prevent the carrier 621 from shielding the wafer box and make the accumulated water at the bottom of the wafer box difficult to dry, two rows of roller lines 63 are arranged in parallel at the bottoms of the inner walls at the two sides of the infrared drying area 51 and the nitrogen drying area 52, so as to facilitate the overall drying of the wafer box, the height of the upper surface of the carrier 621 is consistent with the height of the top of the roller lines 63, when the carrier 621 outputs the wafer box to the outlet of the spraying area 42, the wafer box is transmitted from the carrier 621 to the roller lines 63, specifically, the two ends of the wafer box are respectively contacted with the rollers arranged on the two rows of roller lines 63 at the bottoms of the inner walls at the two sides of the infrared drying area 51 and are transmitted through the roller lines 63, so that the wafer box enters the drying mechanism 5.

The utility model has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the utility model.

Claims

1. Semiconductor wafer box self-cleaning equipment, including the frame, its characterized in that: the machine frame is provided with a feeding hole and a discharging hole, a cleaning mechanism and a drying mechanism are sequentially arranged between the feeding hole and the discharging hole, the cleaning mechanism comprises a tank washing area and a spraying area, the tank washing area is close to the feeding hole, and the spraying area comprises a cold water spraying area and a hot water spraying area; the drying mechanism is arranged at one end close to the hot water spraying area, the drying mechanism at least comprises an infrared drying area, and an infrared generator is arranged at the top of the infrared drying area; the machine frame is further provided with a transmission mechanism, the transmission mechanism conducts circulating transmission movement on the machine frame, and the transmission mechanism comprises a synchronous mechanical arm and a transmission line.

2. The automatic cleaning equipment for semiconductor wafer cassettes of claim 1, wherein: the washing tank is arranged in the tank washing area and can lift up and down.

3. The automatic cleaning equipment for semiconductor wafer cassettes of claim 1, wherein: and a blower is also arranged in the infrared drying area.

4. The automatic cleaning equipment for semiconductor wafer cassettes of claim 1, wherein: the drying mechanism further comprises a nitrogen drying area, and the nitrogen drying area is arranged between the infrared drying area and the discharge hole.

5. The automatic cleaning equipment for semiconductor wafer cassettes of claim 1, wherein: the synchronous robot is translatably suspended from the tank wash zone.

6. The automatic cleaning equipment for semiconductor wafer cassettes of claim 1, wherein: the conveying line comprises a conveying belt arranged in the spraying area, and the conveying belt comprises conveying chains arranged at the bottoms of the inner walls of the two sides of the spraying area in parallel and a carrying platform arranged on the conveying chains and used for conveying the wafer boxes.

7. The automatic cleaning equipment for semiconductor wafer cassettes as claimed in claim 6, wherein: the transmission line also comprises roller lines which are arranged at the bottoms of the inner walls at the two sides of the infrared drying area and the nitrogen drying area in parallel.

8. The automatic cleaning apparatus for semiconductor wafer cassettes according to claim 7, wherein: the top and the bottom of the spraying area are provided with spray heads at intervals, and the water spraying angle of the spray heads is adjustable.

9. The automatic cleaning apparatus for semiconductor wafer cassettes of claim 8, wherein: the height of a water spray opening of a spray head arranged at the bottom of the spraying area is lower than that of the bottom of the carrier, and the bottom of the carrier is hollow.

10. The automatic cleaning apparatus for semiconductor wafer cassettes according to claim 7, wherein: the height of the upper surface of the carrier is consistent with the height of the top of the roller line.