CN111029272A - Wafer soaking device capable of overturning wafers at large angles - Google Patents
Wafer soaking device capable of overturning wafers at large angles Download PDFInfo
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- CN111029272A CN111029272A CN201811177337.4A CN201811177337A CN111029272A CN 111029272 A CN111029272 A CN 111029272A CN 201811177337 A CN201811177337 A CN 201811177337A CN 111029272 A CN111029272 A CN 111029272A
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- connecting rod
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- storage tank
- liquid storage
- lifting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
Abstract
The invention relates to a wafer soaking device capable of turning over at a large angle.A liquid storage tank and an electric actuator are respectively arranged on a bottom plate, a wafer box is positioned in the liquid storage tank, the lower part in the liquid storage tank is filled with chemical liquid for soaking wafers, and the wall of the upper groove is provided with a wafer conveying window for a manipulator to convey the wafers into the wafer box; one end of the lifting connecting rod is connected with the output end of the electric actuator through the lifting frame, and the other end of the lifting connecting rod is inserted into the liquid storage tank and hinged with the wafer box; the slope cylinder is installed on the crane, and the slope connecting rod is embedded in the lift connecting rod, and one end links to each other with the output of slope cylinder, and the other end is articulated with the spool box through middle link assembly. According to the invention, the wafer is placed into the wafer box in the liquid storage tank through the manipulator, and a plurality of wafers can be soaked simultaneously; the inclined connecting rod is embedded in the lifting connecting rod, the movement is stable, the wafer box can be overturned at a large angle, and the requirements of high efficiency and safety for soaking wafers in the wet processing process are met.
Description
Technical Field
The invention belongs to the field of wafer wet processing in the semiconductor industry, and particularly relates to a large-angle overturning wafer soaking device.
Background
At present, a wafer is often required to be soaked by chemical liquid for a wafer wet processing process in the semiconductor industry; the existing wafer soaking method generally adopts the way that the whole box of wafers is put into a chemical liquid tank for soaking at the same time, and the whole box is taken out after the preset time is reached to carry out the next process treatment. However, each wafer is processed sequentially in the next process, which causes different waiting time for each wafer in the whole box, and may affect the quality of the final chip. It is an inevitable problem how to achieve uniformity of the soaking time per wafer.
The invention discloses a wafer soaking device with publication number CN103811374A, which is disclosed on 21/5/2014, and meets the requirement of wafer soaking. However, in the device, the lifting connecting rod and the inclined connecting rod are arranged side by side, and the two connecting rods can adopt parallel design when being designed, but in practice, due to the machining error of the upper surface of the upper cover, the axes of the two holes are not parallel in machining, or the axes of the two holes are not in the central plane of the unit, so that the axes of the two connecting rods after being assembled are not parallel, and further movement blockage is caused, the work is not smooth, and the device is blocked. Secondly, the wafer box in the device can only be backwards turned by 25 degrees, and the wafer is easy to slide out when being oscillated during lifting. Furthermore, the device adopts the mode of barrel wall indirect heating, and the heating plate parcel is on the lateral wall of reservoir, and the heat of heating plate passes through heat-conduction's mode and transmits chemical liquid, and then makes chemical liquid heat-up, and the rate of heating of this kind of heating mode is slow.
Disclosure of Invention
In order to solve the above problems of the existing soaking equipment, the invention aims to provide a wafer soaking device capable of overturning wafers at a large angle.
The purpose of the invention is realized by the following technical scheme:
the invention comprises a wafer box, a liquid storage tank, a bottom plate, an electric actuator, an inclined connecting rod, an inclined cylinder, a lifting connecting rod and a wafer conveying window, wherein the liquid storage tank and the electric actuator are respectively arranged on the bottom plate; one end of the lifting connecting rod is connected with the output end of the electric actuator through the lifting frame, and the other end of the lifting connecting rod is inserted into the liquid storage tank and hinged with the wafer box; the inclined cylinder is arranged on the lifting frame, the inclined connecting rod is embedded in the lifting connecting rod, one end of the inclined connecting rod is connected with the output end of the inclined cylinder, and the other end of the inclined connecting rod is hinged with the wafer box through a middle connecting rod assembly; the electric actuator drives the lifting connecting rod, the inclined air cylinder and the inclined connecting rod to synchronously lift through the lifting frame, so as to drive the wafer box to rise to a height corresponding to the wafer conveying window to take/place wafers, or to enable the wafer box to descend to be immersed below chemical liquid to soak the wafers, and the inclined air cylinder drives the wafer box to turn over through the inclined connecting rod and the middle connecting rod assembly;
wherein: the lifting connecting rod is of an internal hollow structure, and the inclined connecting rod and the lifting connecting rod are coaxially arranged;
the middle connecting rod assembly comprises a middle connecting rod A and a middle connecting rod B, the middle connecting rod A is hinged to the wafer box, one end of the middle connecting rod B is connected with the other end of the inclined connecting rod, and the other end of the middle connecting rod B is hinged to the middle connecting rod A;
the middle connecting rod A is U-shaped, and two ends of the U-shaped opening are respectively hinged to the sheet box; the middle connecting rod B is L-shaped, one side of the L-shape is fixedly connected with the other end of the inclined connecting rod, and the other side of the L-shape is hinged with the middle of the U-shaped bottom of the middle connecting rod A;
the top of the liquid storage tank is provided with a lifting cylinder, and the output end of the lifting cylinder is connected with a baffle for opening and closing the sheet conveying window;
an air blowing pipe connected with an air source is arranged on the film transfer window;
a heating wire for directly heating the chemical liquid is arranged in the liquid storage tank;
a maintenance window is formed in the liquid storage tank;
the top surface of the liquid storage tank is provided with a liquid adding port, and the bottom surface of the liquid storage tank and the bottom plate are provided with liquid discharging ports;
and a temperature sensor for sensing the temperature of the chemical liquid and a liquid level sensor for sensing the liquid level of the chemical liquid are arranged in the liquid storage tank.
The invention has the advantages and positive effects that:
1. the inclined connecting rod is embedded in the lifting connecting rod, the movement is stable, the phenomena of movement blockage, unsmoothness and blockage caused by processing errors are avoided, and the requirements of high efficiency and safety for soaking wafers in the wet processing process are met.
2. The wafer box can be overturned and inclined at a large angle (90-120 degrees), a wafer can be in a vertical state, the wafer can not slide out of the wafer box during lifting, and metal chips can be prevented from being adhered back.
3. According to the invention, the heating wire is arranged in the liquid storage tank, and the chemical liquid is directly heated, so that the heating rate is high; and because the heating wire is arranged in the liquid storage tank, the shape of the liquid storage tank is not limited.
Drawings
FIG. 1 is a front view of the overall structure of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic view of the structure of the lifting connecting rod and the inclined connecting rod hinged with the wafer box through the middle connecting rod component;
wherein: the device comprises a wafer 1, a wafer box 2, a liquid storage tank 3, a bottom plate 4, a support 5, an electric actuator 6, an ultrasonic generator 7, a maintenance window 8, an inclined connecting rod 9, an inclined cylinder 10, a lifting connecting rod 11, a sheet conveying window 12, an upper blowing pipe 13, a lower blowing pipe 14, a heating wire 15, a middle connecting rod A16, a middle connecting rod B17, a lifting cylinder 18, a lifting frame 19, a liquid filling opening 20, a liquid discharging opening 21, a baffle 22 and a stop lever 23.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 3, the invention comprises a sheet box 2, a liquid storage tank 3, a bottom plate 4, a bracket 5, an electric actuator 6, an ultrasonic generator 7, an inclined connecting rod 9, an inclined cylinder 10, a lifting connecting rod 11, a sheet conveying window 12, a heating wire 15, a middle connecting rod assembly, a lifting cylinder 18, a lifting frame 19 and a baffle plate 22, wherein the liquid storage tank 3 is fixed on the bottom plate 4 and is a closed cuboid or cube; the electric actuator 6 is fixed on the bottom plate 4 through a bracket 5 and is positioned at one side of the liquid storage tank 3. The wafer box 2 is positioned in the liquid storage tank 3, and a plurality of wafers 1 can be loaded in the wafer box 2. One end of the lifting connecting rod 11 is connected with the output end of the electric actuator 6 through the lifting frame 19, and the other end of the lifting connecting rod is inserted into the liquid storage tank 3 and hinged with the wafer box 2; the inclined cylinder 10 is installed on the lifting frame 19, the inclined connecting rod 9 is embedded in the lifting connecting rod 11 and can be coaxially arranged with the lifting connecting rod 11, one end of the inclined connecting rod 9 is connected with the output end of the inclined cylinder 10, and the other end of the inclined connecting rod is hinged with the wafer box 2 through the middle connecting rod assembly.
The middle connecting rod component comprises a middle connecting rod A16 and a middle connecting rod B17, the middle connecting rod A16 is U-shaped, and two ends of the U-shaped opening are respectively hinged to the film box 2; the middle connecting rod B17 is L-shaped, one side of the L-shape is fixedly connected with the other end of the inclined connecting rod 9, and the other side is hinged with the middle of the U-shaped bottom of the middle connecting rod A16.
The upper tank wall of the liquid storage tank 3 is respectively provided with a chip transmission window 12 and a maintenance window 8, in the embodiment, the two sides of the opposite side of the electric actuator 6 are respectively provided with the chip transmission window 12 and the maintenance window 8 for the manipulator to send the wafer 1 into the chip box 2 in the four side surfaces of the cuboid or cube liquid storage tank 3. The edge of the top of one side of the liquid storage tank 3, which is provided with the sheet transmission window 12, is provided with a lifting cylinder 15, and the output end of the lifting cylinder 15 is connected with a baffle 22 for opening and closing the sheet transmission window 12. The lower part of the liquid storage tank 3 is filled with chemical liquid for soaking the wafer 1, and the bottom surface of the lower part is provided with a heating wire 15 for directly heating the chemical liquid. The top surface of the liquid storage tank 3 is provided with a liquid adding port 20, and the bottom surface of the liquid storage tank 3 and the bottom plate 4 are provided with a liquid discharging port 21, so that the injection and the discharge of the chemical liquid are realized. The electric actuator 6 drives the lifting connecting rod 11, the inclined cylinder 10 and the inclined connecting rod 9 to synchronously lift through the lifting frame 19, further drives the wafer box 2 to rise to a height corresponding to the wafer conveying window 12 to take/place the wafer 1, or enables the wafer box 2 to descend and immerse below the chemical liquid to immerse the wafer 1, and the inclined cylinder 10 drives the wafer box 2 to overturn through the inclined connecting rod 9 and the middle connecting rod assembly. The sheet box 2 of the present invention can be turned backwards by a large angle (less than or equal to 120 °) when immersed in a chemical liquid; when the pure photoresist removing process is carried out, the wafer box 2 can be inclined backwards by 90 degrees, and when the wafer box is used for the I-ff (gold peeling) process, in order to prevent metal chips from being adhered backwards, the wafer box 2 can be inclined backwards by 120 degrees, the wafer 1 can be in a vertical state and supported by the stop rod 23 on the wafer box 2, and the wafer 1 cannot slide out during lifting. An ultrasonic generator 7 is arranged at the lower part of the liquid storage tank 3 which contains the chemical liquid. A temperature sensor for sensing the temperature of the chemical liquid and a liquid level sensor for sensing the liquid level height of the chemical liquid are also arranged in the liquid storage tank 3, and the temperature of the chemical liquid is monitored by the temperature sensors so as to control the working or stopping of the heating wire 15; the liquid level sensor is used for monitoring the height of the chemical liquid in the liquid storage tank 3, and automatic liquid adding and discharging can be realized.
The sheet-conveying window 12 is provided with an air blowing pipe connected with an air source, the air blowing pipe is divided into an upper air blowing pipe 13 and a lower air blowing pipe 14, and the two air blowing pipes are respectively communicated with the air source. The gas source may be nitrogen.
The working principle of the invention is as follows:
the chemical in the reservoir 3 may be heated during the process. The manipulator can continuously send the wafer 1 into the wafer box 2 according to a preset time interval until the wafer box 2 is full; the cassette 2 may oscillate with a small amplitude below the chemical level in a back-tilted state to speed up processing efficiency and uniformity. After the soaking time of any wafer 1 reaches the designated time, the wafer 1 will be taken out by the robot.
When the wafer 1 needs to be taken and delivered, the wafer box 2 is lifted to the corresponding position, then the inclined air cylinder 10 is lifted to keep the horizontal state of the wafer box 2, and after the baffle 22 of the wafer transfer window 12 is driven by the lifting air cylinder 18 to be opened, the manipulator can take and deliver the wafer. After the wafer is placed, the inclined cylinder 10 retracts to enable the wafer box 2 to incline backwards by a large angle (90-120 degrees), and then the lifting connecting rod 11 is driven by the electric actuator 6 to slowly descend until the wafer box 2 and the wafer are immersed below the liquid level. When the designated soaking time is reached, the wafer can be taken out by taking the reverse action. In the process of taking out the wafer, the upper and lower gas blowing pipes 13 and 14 start to blow out nitrogen to form a gas brush, and chemical liquid covering the surface of the wafer is blown off.
Claims (10)
1. A wafer soaking device capable of overturning wafers in a large angle comprises a wafer box, a liquid storage tank, a bottom plate, an electric actuator, an inclined connecting rod, an inclined air cylinder, a lifting connecting rod and a wafer conveying window, wherein the liquid storage tank and the electric actuator are respectively installed on the bottom plate; the method is characterized in that: one end of the lifting connecting rod (11) is connected with the output end of the electric actuator (6) through a lifting frame (19), and the other end of the lifting connecting rod is inserted into the liquid storage tank (3) and hinged with the wafer box (2); the inclined cylinder (10) is installed on the lifting frame (19), the inclined connecting rod (9) is embedded in the lifting connecting rod (11), one end of the inclined connecting rod is connected with the output end of the inclined cylinder (10), and the other end of the inclined connecting rod is hinged with the wafer box (2) through a middle connecting rod assembly; electric actuator (6) drive lift connecting rod (11), slope cylinder (10) and slope connecting rod (9) through crane (19) and go up and down in step, and then drive film box (2) rise to with pass the corresponding height of film window (12) and get/put wafer (1), or make film box (2) descend and dip into below the chemical liquid and soak wafer (1), slope cylinder (10) drive film box (2) upset through slope connecting rod (9), middle connecting rod subassembly.
2. The large angle flip wafer immersion device of claim 1, wherein: the lifting connecting rod (11) is of an internal hollow structure, and the inclined connecting rod (9) and the lifting connecting rod (11) are coaxially arranged.
3. The large angle flip wafer immersion device of claim 1, wherein: the middle connecting rod assembly comprises a middle connecting rod A (16) and a middle connecting rod B (17), the middle connecting rod A (16) is hinged to the wafer box (2), one end of the middle connecting rod B (17) is connected with the other end of the inclined connecting rod (9), and the other end of the middle connecting rod B (17) is hinged to the middle connecting rod A (16).
4. The large angle flip wafer immersion device of claim 3, wherein: the middle connecting rod A (16) is U-shaped, and two ends of the U-shaped opening are respectively hinged to the sheet box (2); the middle connecting rod B (17) is L-shaped, one side of the L-shape is fixedly connected with the other end of the inclined connecting rod (9), and the other side of the L-shape is hinged with the middle of the U-shaped bottom of the middle connecting rod A (16).
5. The large angle flip wafer immersion device of claim 1, wherein: and a lifting cylinder (17) is installed at the top of the liquid storage tank (3), and the output end of the lifting cylinder (17) is connected with a baffle (22) for opening and closing the sheet transmission window (12).
6. The large angle flip wafer immersion device of claim 1, wherein: and an air blowing pipe connected with an air source is arranged on the sheet conveying window (12).
7. The large angle flip wafer immersion device of claim 1, wherein: and a heating wire (15) for directly heating the chemical liquid is arranged in the liquid storage tank (3).
8. The large angle flip wafer immersion device of claim 1, wherein: and a maintenance window (8) is formed in the liquid storage tank (3).
9. The large angle flip wafer immersion device of claim 1, wherein: the top surface of the liquid storage tank (3) is provided with a liquid adding port (20), and the bottom surface of the liquid storage tank (3) and the bottom plate (4) are provided with a liquid discharging port (21).
10. The large angle flip wafer immersion device of claim 1, wherein: and a temperature sensor for sensing the temperature of the chemical liquid and a liquid level sensor for sensing the liquid level height of the chemical liquid are arranged in the liquid storage tank (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811177337.4A CN111029272A (en) | 2018-10-10 | 2018-10-10 | Wafer soaking device capable of overturning wafers at large angles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811177337.4A CN111029272A (en) | 2018-10-10 | 2018-10-10 | Wafer soaking device capable of overturning wafers at large angles |
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| CN111029272A true CN111029272A (en) | 2020-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811177337.4A Pending CN111029272A (en) | 2018-10-10 | 2018-10-10 | Wafer soaking device capable of overturning wafers at large angles |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112547414A (en) * | 2020-12-17 | 2021-03-26 | 盛亚明 | Steel processing system for reinforced concrete building |
| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
| CN115274514A (en) * | 2022-09-29 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Semiconductor soaking device |
| CN115295470A (en) * | 2022-10-08 | 2022-11-04 | 四川上特科技有限公司 | Wafer transfer device and corrosion method |
-
2018
- 2018-10-10 CN CN201811177337.4A patent/CN111029272A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112547414A (en) * | 2020-12-17 | 2021-03-26 | 盛亚明 | Steel processing system for reinforced concrete building |
| CN112547414B (en) * | 2020-12-17 | 2021-12-28 | 安徽九源建筑工程有限公司 | Steel processing system for reinforced concrete building |
| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
| CN115274514A (en) * | 2022-09-29 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Semiconductor soaking device |
| CN115295470A (en) * | 2022-10-08 | 2022-11-04 | 四川上特科技有限公司 | Wafer transfer device and corrosion method |
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