TW202104663A - Chemical deposition equipment and method for continuous production piece by piece in horizontal and inclined manner wherein a circuit board to be deposited metals thereon is moved in an oblique configuration - Google Patents

Abstract

A chemical deposition equipment and method for continuous production piece by piece in a horizontal and inclined manner is provided. A carrier is used to support a circuit board in an upright manner. The carrier sends the circuit board into a deposition reaction tank in an oblique configuration for performing chemical deposition. The oblique configuration is referred as an oblique angle exists between the position of the carrier and its advancing direction. The oblique angle is 74 to 81 degrees. The carrier is driven by a moving mechanism to move from an initial position in the deposition reaction tank to a final position. Multiple jet modules are disposed at an inner wall of the deposition reaction tank. The jet modules continuously spray a reaction liquid on a surface of the circuit board in the oblique configuration when the carrier is moved. During an indwelling time of the circuit board in the deposition reaction tank, an operation of depositing metals on the circuit board is accomplished. The invention uses an upright and oblique configuration to move the circuit board, in conjunction with the reaction liquid to spray onto the surface of the circuit board and an inner wall of a hole, metal can be effectively disposed on the surface of the circuit board and the inner wall of the hole and avoid bubbles remaining in them. In addition, the invention can be applied in various chemical deposition operations, such as depositing nickel, gold, copper, tin, silver, and etc.

Description

Chemical deposition equipment and method for continuous production piece by piece in a horizontal oblique manner

The present invention relates to the technical field of a chemical deposition method for circuit boards, in particular to a chemical deposition equipment and method for continuous production piece by piece in a horizontal and inclined manner.

In the conventional chemical nickel-gold manufacturing process, a single hanging basket is used to group a plurality of circuit boards into a group, and the circuit boards are sequentially ascended, descended and moved to various chemical solution tanks or various tank chambers for related operations to meet The demand for mass production. The specific process is loading → cleaning → washing → micro-etching → washing → pickling → washing → pre-soaking → activation → washing → post-dipping → washing → chemical nickel precipitation → washing → chemical depositing gold → washing → pickling → washing → baking Dry → unload. Due to the large workshop space required by the above method, harmful gases are easily dispersed during the process, which affects the health of the operator, the tank body is large in size and the demand for the reaction liquid in the tank is also large. In addition, a large amount of waste liquid treatment after production is also a cost burden.

In order to solve the above-mentioned problems, the inventor previously designed a set of chemical deposition methods and equipment using a carrier to continuously produce piece by piece, which are used in the metal deposition process of the above-mentioned production process, thereby reducing the size of the deposition reaction tank and reducing The use of reaction liquid and simultaneous reduction of waste liquid treatment costs, and can maintain a high-efficiency production mode, increase output, reduce manufacturers' production costs and increase profits. However, the inventor is not complacent about this, and hopes to provide another chemical deposition equipment and method on a vertical continuous production structure.

The main purpose of the present invention is to provide a chemical deposition equipment and method for continuous production piece by piece in a horizontal and inclined manner. In the chemical deposition production operation, the circuit board is still carried by the carrier and adopts a vertical piece-by-piece continuous production mode in the deposition reaction tank. Move, but the carrier is in an oblique configuration, that is, the position of the carrier and the moving direction have an oblique angle, and the reaction liquid continuously sprayed by multiple jet modules in the deposition reaction tank can improve production efficiency and maintain production quality .

The secondary purpose of the present invention is to provide a chemical deposition equipment and method for continuous production piece by piece in a horizontal and inclined manner, which can be widely used in chemical deposition of nickel, chemical deposition of gold, chemical deposition of copper, chemical deposition of tin, or chemical deposition of silver, etc. operation.

To achieve the above objective, the present invention provides a chemical deposition method for continuous production piece by piece in a horizontal oblique manner. The steps include: using a carrier to support the circuit board in an upright manner; using the carrier to place the circuit board in an oblique configuration Enter the deposition reaction tank for chemical deposition reaction, wherein the oblique configuration means that the position of the carrier has an oblique angle with the advancing direction, and the oblique angle is 74 to 81 degrees; the carrier is driven by the moving mechanism from the deposition reaction tank The initial position of the deposition reaction tank is moved to the final position, and the inner wall of the deposition reaction tank is provided with a plurality of jet modules. The jet modules continuously spray the reaction liquid on the inclined surface of the circuit board during the movement of the carrier, and use the circuit board to The residence time in the deposition reaction tank completes the operation of metal deposition on the circuit board.

Furthermore, the chemical deposition equipment continuously produced piece by piece in a horizontal and inclined manner of the present invention includes: a deposition reaction tank, a plurality of carriers, and a moving mechanism. In the deposition reaction tank, a plurality of jet flow modules are respectively installed in two relatively long groove walls, and the jet flow modules can continuously spray the reaction liquid. The moving mechanism is installed on the outer wall of the deposition reaction tank and includes a motor, a transmission assembly and two chain groups. Two groups of the chain group are respectively arranged on the outer side of the long groove wall. The chain group is provided with a plurality of receiving parts. The motor drives the two chain groups to move synchronously via the transmission assembly. The carrier includes a cross bar and two racks, the two racks are symmetrically fixed to the cross bar, the two racks have an opening on the other side, the opening for the circuit board to be put in, the carrier is in an oblique configuration The two sides of the crossbar are erected in two oppositely positioned receiving parts, and the oblique configuration means that the position of the carrier has an oblique angle with the advancing direction, and the oblique angle is 74 to 81 degrees.

In an embodiment of the present invention, a plurality of the jet flow modules are arranged on two long groove walls opposite to each other in the deposition reaction tank, and are distributed in a staggered manner.

In the embodiment of the present invention, the spray direction of the plurality of spray modules is perpendicular to the moving direction of the carrier.

In the embodiment of the present invention, the carrier further includes a plurality of connecting rods and a holding rod, the connecting rod is transversely coupled between the two supporting frames, the holding rod is coupled to the bottommost position of the two supporting frames, the Both ends of the holding rod are provided with vertical holding pieces, and the distance between the two holding pieces is exactly the width of the maximum size of the circuit board to prevent the circuit board from sliding out toward both sides.

In the embodiment of the present invention, the deposition reaction tank is additionally equipped with a reaction liquid supply and circulation device, and the reaction liquid supply and circulation device is connected with the jet module and controls the operation timing.

In the embodiment of the present invention, it further includes a steering placement mechanism, the steering placement mechanism includes a boom unit, a steering cantilever unit, and a lifting unit. The lifting unit is installed on the deposition reaction tank, and the lifting unit is responsible for driving the The steering cantilever unit is raised and lowered, the steering cantilever unit has a cantilever, one end of the cantilever has a steering mechanism and the boom unit is installed, both ends of the boom unit are provided with hooks, and the steering cantilever unit can drive the boom unit to rotate To switch the position of the hook.

In the embodiment of the present invention, it further includes an upper plate mechanism, the upper plate mechanism is located on the side of the temporary storage machine, the upper plate mechanism is located in the descending path of the boom unit of the steering placement mechanism, and the upper plate mechanism is responsible for The carrier is adjusted to the inclined configuration, and then the boom unit is used to lift the carrier.

In an embodiment of the present invention, the upper plate mechanism includes a first position adjusting member, a second position adjusting member, a first pushing group, and a second pushing group. The first position adjusting member has a first initial groove and a first A positioning groove, the second position adjusting member has a second initial groove and a second positioning groove, the distance from the first initial groove to the first positioning groove is not equal to the second initial groove to the second The distance of the positioning groove; the first pushing group is installed on the first position adjusting member, which can drive the first push rod to move from the first initial groove to the first positioning groove, and the second pushing group is installed on the The second position adjusting member can drive the second push rod to move from the second initial groove to the second positioning groove.

The chemical deposition equipment and method for continuous production piece by piece in a horizontally inclined manner of the present invention utilizes the carrier to carry a circuit board to move in a chemical deposition tank in an inclined form, and cooperate with several jet modules located in the chemical deposition tank The continuously sprayed reaction liquid, the water flow generated can not only take away the surface of the circuit board, or the bubbles that may remain in the through or blind holes on the circuit board, but also effectively improve the replacement efficiency of the aforementioned reaction liquids, thereby improving The uniformity of the deposition thickness on the surface of the circuit board, through holes or blind holes is improved. This can improve production efficiency and maintain production quality.

The following describes the embodiments of the present invention in more detail with the drawings and component symbols, so that those who are familiar with the art can implement it after studying this specification.

First, an explanation will be given of the equipment developed in the deposition process of the present invention. In this example, this equipment is used in the electroless nickel-gold deposition process. The circuit boards to be processed by the equipment are moved horizontally and progressively in the pre-processing equipment and post-processing equipment. Since the pre-processing equipment and post-processing equipment are similar to conventional ones, they will not be described in detail. The design spirit of the present invention is that the circuit board is vertically inclined and continuously moved piece by piece to complete the circuit board deposition operation.

As shown in FIG. 1A, a schematic diagram of the structure of the deposition process equipment developed by the present invention. The deposition process equipment includes a temporary storage machine 10, an upper plate mechanism 11, a steering placement mechanism 12, a chemical nickel precipitation tank 13, a plurality of water tanks 14, a chemical precipitation tank 15, a recovery water washing tank 16, and a lower plate mechanism arranged in series. 17 and output mechanism 18. A plurality of carriers A, and the carrier A is responsible for carrying a circuit board for related chemical deposition operations. In addition, it also includes a first transfer mechanism 191, a second transfer mechanism 192, and a recovery transfer mechanism 193, which are responsible for moving the carrier A to the relevant work slot. In this figure, the transfer and transfer related institutions are not drawn, and are only represented by schematic squares. As shown in FIG. 1B, the circuit board B is operating in each slot. In addition, for the convenience of description, the upper board mechanism 11 and the lower board mechanism 17 are only shown in squares in the figure. For a clearer structure, please refer to FIG. 1A. After the circuit boards are pre-processed, such as cleaning tanks, micro-etching tanks, pickling tanks, pre-dipping tanks, activation tanks, and post-dipping tanks, they will be sent to the temporary storage machine 10 in a horizontal state. The purpose of the temporary storage machine 10 is to temporarily stack the temporary storage when there is a problem in the subsequent manufacturing process, and the front process circuit board is still being sent continuously. Afterwards, the upper plate mechanism 11 is adjusted from the horizontal state to the vertical and oblique configuration. The oblique configuration cannot be clearly seen in this drawing, and will be described in detail later. The position is changed by the turning and placing mechanism 12 and sent into the chemical nickel bath 13. Afterwards, the circuit board B in the electroless nickel bath 13, several water baths 14, the electroless gold bath 15, and the recovery water washing bath 16 are all upright and inclined. The carrier A is adjusted back to its original state via the lower plate mechanism 17. Finally, the deposited circuit board B will be transported to the post-processing equipment by the output mechanism 18 in a horizontal state.

As shown in FIG. 2, it is a flow chart of the operation of the deposition process equipment developed by the present invention. In the pre-treatment process, cleaning, micro-etching, pickling, pre-dipping, activation and post-dipping are performed, so that the bare copper surface of the circuit board is formed with a very thin layer of chemical palladium metal and sent to the temporary storage Machine 10 places. Please refer to Figure 1A, Figure 1B and Figure 2. The steps of this equipment operation method are as follows:

Step 201: After the circuit board is pre-processed by the horizontal deposition, the circuit board B is transferred to the upper board mechanism 11 through the temporary storage machine 10 in a horizontal to upright manner.

Step 202: The board loading mechanism 11 sends the circuit board B into the carrier A, and then adjusts the carrier A to an oblique configuration;

Step 203: Turn to the placement mechanism 12 to change the position of the carrier A, and then send the carrier A into the electroless nickel bath 13 to perform subsequent chemical deposition operations.

Step 204: The carrier A carries the circuit board B in the electroless nickel bath 13 and is moved in an oblique configuration; the so-called oblique configuration: refers to the position of the carrier A and the forward direction having an oblique angle, and the oblique angle is 74 ~81 degrees. Then the carrier A gradually moves from the leftmost initial position of the electroless nickel bath 13 to the rightmost final position. The time it stays will cause a layer of nickel to be deposited on the copper surface of the circuit board B.

Step 205: The first transfer mechanism 191 lifts the carrier A out of the chemical nickel precipitation tank 13, moves to the right and then descends and moves into the washing tank 14. The circuit board cleaning operation is performed in the water washing tank 14. Referring to FIG. 1A, the washing tank 14 includes a plurality of tanks, with a plurality of washing chambers 141 on the left and a drip chamber 142 on the right. The first transfer mechanism 191 can choose to hoist one or more carriers A at a time, rise and move laterally, and then descend, so that the carrier A enters the washing chamber 141 of the washing tank 14, and then repeats the movement in sequence, and finally reaches the drop. Inside the dry room 142. Wherein, the groove shape of the washing tank 14 can be matched with the inclined shape of the carrier A, and both front and rear are inclined wall design, thereby reducing the amount of water used and reducing the cost of water.

Step 206: The first transfer mechanism 191 moves the carrier A in the washing tank 14 into the chemical immersion gold tank 15, and then the carrier A is moved in the chemical immersion gold tank 15; it gradually moves from the initial position on the left To the rightmost final position, the dwell time will cause a layer of gold to be deposited on the nickel surface of the circuit board. During this movement, the vehicle A still maintains an oblique configuration.

Step 207: The second transfer mechanism 192 lifts and moves the carrier A out of the chemical gold bath 15, and then moves laterally, descends, and enters the recovery water washing tank 16; to clean and recover the chemical gold liquid from the surface of the circuit board, and recover the water for washing The groove 16 also includes a plurality of grooves. In addition, the 16-tank type of the washing tank can also be matched with the inclined type of the carrier A. The front and rear are inclined wall design, which can reduce the amount of water used and reduce the cost of water.

Step 208: The carrier A is moved from the second transfer mechanism 192 to the lower plate mechanism 17, and the lower plate mechanism 17 adjusts the carrier A from the inclined position back to the original state, and then sends it to the output mechanism 18;

Step 209: The output mechanism 18 changes the circuit board B from an upright shape to a horizontal shape and moves to the next level one by one before cleaning and drying. Afterwards, it will be washed and dried in the post-processing equipment. The emptied carrier A will be moved to the upper board mechanism 11 via the recycling transfer mechanism 193 to accept the next circuit board to be processed.

As shown in Figure 1A, the recycling and transfer mechanism 193 will perform the turning operation of the carrier A at the appropriate position (the rotating arrow in the figure), so that the original opening on the carrier A for the circuit board to enter is turned from the right position to The left position is to cooperate with the subsequent boarding mechanism 11 to enter the boarding operation.

With the deposition process equipment and operation method developed by the present invention, the overall equipment size can be greatly reduced, the equipment operating cost is reduced, the area of the plant to be installed is reduced, and the equipment investment amount can be reduced overall. In addition, the production process can also reduce water consumption, chemical reaction liquid usage and electricity consumption, reduce production costs, and make products more competitive in the market. In addition, the equipment can be more effectively enclosed, reducing the leakage of harmful gases during production, thereby providing a safer working environment. Because it can be connected to the front and back processes, and the circuit boards can be automatically loaded and unloaded at the same time, each production line can save at least 6 people.

Among the above-mentioned equipment, the present invention designs a chemical deposition method and equipment for continuous production piece by piece in a horizontal and inclined manner, so that it can be applied to the deposition operation of the electroless nickel bath 13 and the electroless gold bath 15.

As shown in FIG. 3, the flow chart of the chemical deposition method for continuous production piece by piece in a horizontal and inclined manner of the present invention. The steps include:

In step 301, use a carrier to carry at least one circuit board upright;

In step 302, the carrier carrying circuit board enters the deposition reaction tank in an oblique configuration for chemical deposition reaction, wherein the oblique configuration means that the position of the carrier has an oblique angle with the advancing direction, and the oblique angle is 74 to 81 degrees;

In step 303, the moving mechanism drives the carrier to move from the initial position of the deposition reaction tank to the final position. The inner wall of the deposition reaction tank is provided with a plurality of jet modules, and the jet modules continue to spray on the surface of the circuit board during the movement of the carrier The reaction solution uses the indwelling time of the circuit board in the deposition reaction tank to complete the operation of metal deposition on the circuit board.

In the above method, the present invention uses a carrier to carry the circuit board to move in the deposition reaction tank, and cooperates with the reaction liquid continuously sprayed by several jet modules located in the deposition reaction tank, and the generated water flow can not only effectively take the circuit away from the circuit. The air bubbles remaining on the surface of the board or in the through holes or blind holes on the circuit board effectively improve the replacement efficiency of the reaction liquid on the surface of the circuit board, through holes and blind holes, thereby improving the surface of the circuit board, through holes or blind holes. The uniformity of the deposition thickness can improve production efficiency and maintain production quality.

In the above-mentioned chemical deposition method of the present invention for continuous production in a horizontally inclined manner, many specific equipment can be designed to achieve this purpose. This embodiment illustrates one of the equipment: as shown in FIG. 4, it is the horizontally inclined manner of the present invention one by one. A three-dimensional view of the chemical deposition equipment for continuous production of wafers. The present invention includes: a deposition reaction tank 40, a moving mechanism 50 and a plurality of carriers 60.

The deposition reaction tank 40 is a rectangular tank body with an upward opening, which is composed of two long groove walls 41 and two short groove walls 42. A plurality of jet modules 43 are additionally provided on the inner walls of the two long groove walls 41, and each jet module 43 has at least one nozzle. In this embodiment, there are multiple nozzles arranged longitudinally. The outside of the tank is additionally provided with a reaction liquid supply and circulation device 44 connected to the jet flow module 43 via a pipeline to maintain its operation and control the flow rate. The spray direction of the spray module 43 is perpendicular to the moving direction of the carrier 60. As shown in FIG. 7, a plurality of jet modules 43 are distributed in a staggered manner in the two long groove walls 41, because if they are arranged face to face, the jet flow effect will be affected.

The moving mechanism 50 is responsible for driving the carrier 60 to move in the deposition reaction tank 40. The movement method is to move from the initial position on the leftmost side of the deposition reaction tank 40 to the final position on the rightmost side. The moving mechanism 50 includes a motor 51, a transmission assembly 52 and two chain groups 53. Two groups of the chain groups 53 are respectively arranged outside the long groove wall 41, and the chain group 53 is additionally provided with a plurality of receiving members 531. As shown in FIG. 5A, the receiving member 531 has a groove 5311 inclined upward. The groove 5311 is used to receive the carrier 60. The groove shape of the groove 5311 is a trumpet shape that gradually shrinks from top to bottom, so that the carrier 60 can be easily slid into the groove 5311 under different oblique angles. The motor 51 drives the two chain groups 53 to move synchronously via the transmission assembly 52. The transmission assembly 52 can be a variety of transmission structures, and the present invention only provides an explanation of one of them, and it does not limit the use of this structure only. The transmission set 52 includes two sets of sprocket sets 521 and a transmission chain 522. Each sprocket set 521 has a shaft and both ends are connected with sprocket wheels. Two sets of sprocket sets 521 are respectively installed on the short groove wall 42 and engage and support two sets of chain sets 53. The transmission chain 522 is engaged with the small sprocket of one of the sprocket sets 521 and the motor 51. In the figure, the transmission chain 522 is represented by a schematic line. In this way, when the motor 51 operates, the two chain groups 53 can be moved synchronously through the transmission assembly 52.

As shown in FIG. 6, the carrier 60 includes a cross bar 61 and two supports 62. The two supports 62 are symmetrically fixed to the cross bar 61. The supports 62 are partially bent in a hook shape. 62 has an opening 63 on the other side, and the opening 63 can be inserted into the circuit board. In actual operation, the carrier 60 is erected on both sides of the cross bar 61 in the grooves 5311 of the two receiving members 531 at corresponding positions. The carrier 60 is placed in the deposition reaction tank 40 in an oblique configuration. The oblique configuration means that the position of the carrier 60 has an oblique angle θ with its advancing direction. As shown in FIG. 4, the oblique angle θ is 74 to 81 degrees. In addition, the carrier 60 further includes a plurality of connecting rods 64 which are horizontally coupled between the two supporting frames 62 to maintain the overall rigidity. In addition, the carrier 60 also includes a holding rod 65 which is combined with the bottommost position of the two supporting frames 62. The holding rod 65 is provided with holding pieces 651 at both ends of the holding rod 65. The distance between the two holding pieces 651 is exactly the width of the maximum size of the circuit board to prevent the circuit board from sliding out to both sides.

In addition, since the inclined angle θ of the carrier 6 is 74 to 81 degrees, the inclined angle of the groove 5311 of the receiving member 531 must be matched. However, if the inclined angle of the groove 531 is fixed, when the carrier 6 is inclined When the setting angle is changed, it is necessary to replace a different receiving member 531 or the entire chain group 53 to be replaced, which is very troublesome. Therefore, the receiving member 531 of the present invention has another different design. As shown in FIG. 5B and FIG. 5C, the groove 5311 has a neck groove 5312 with the smallest size in the middle, and the groove 5311 faces the groove with the neck groove 5312 as the demarcation point. The depth and the groove entrance gradually increase. As shown in Fig. 5B, the groove depth is inclined to the right to increase the groove size, and the groove entrance is inclined to the left to increase the groove size. As shown in FIG. 5C, the cross bar 61 of the carrier 60 can easily enter the groove 5311 within the range of angle θ1~θ2, where the angle θ1=81 degrees and θ2=74 degrees.

Then I will explain the actual operation method:

As shown in FIG. 7, it is a schematic diagram of the actual operation of the present invention. In the figure, only a part of the number of carriers 60 is drawn. In fact, the arrangement should be densely arranged as in the deposition reaction tank 40. However, for ease of description, the left and right are spaced arrangement representations, and some areas are omitted and not shown. The carrier 60 is installed in the deposition reaction tank 40 in an oblique configuration. The two sides of the cross bar 61 are respectively located at the two receiving members 531 corresponding to the chain set 53. The position of the carrier 60 and its advancing direction have an oblique angle θ, and the oblique angle θ is 74 to 81 degrees. In this way, when the moving mechanism 50 is activated, the two chain groups 53 will move synchronously and drive the carrier 60 from the initial position of the deposition reaction tank 40 to the final position, that is, the drawing surface moves from the left to the right. During the movement, the spray device 43 will continue to spray the reaction liquid, so that the reaction liquid in the deposition reaction tank 40 flows in a specific direction. This water flow can not only be effectively taken away from the surface of the circuit board B or the circuit board B The remaining air bubbles in the holes or blind holes, and the continuous flow can effectively replace the reaction liquid, and improve the replacement efficiency of the reaction liquid on the surface of the circuit board, through holes and blind holes, so the deposition on the surface of the circuit board, through holes or blind holes Good thickness uniformity. In addition, the staggered spray modules 43 can also achieve the same deposition effect on both sides of the circuit board B.

The chemical deposition equipment for continuous production piece by piece in a horizontal and inclined manner of the present invention utilizes a mechanism to place the carrier 60 in the deposition reaction tank 40 in an inclined manner. As shown in the process equipment of FIG. 1A, this pre-operation is performed by the boarding mechanism 11 and the steering placement mechanism 12 of the register 10. The upper board mechanism 11 is responsible for adjusting the carrier A (that is, the carrier 60) to an inclined configuration. The turning and placing mechanism 12 is responsible for rotating and moving the adjusted carrier into the electroless nickel precipitation tank 13 (that is, the deposition reaction tank 40).

For the purpose of explanation, the subsequent mechanisms are described with the temporary storage machine 10A, the upper board mechanism 11A, and the steering placement mechanism 12A. As shown in Fig. 8, it is a perspective view of the register 10A and the upper board mechanism 11A. The temporary storage machine 10A is provided with a conveying mechanism 101 and a lifting mechanism 102. The conveying mechanism 101 has a plurality of rollers, which are responsible for allowing the circuit board B to be sent out horizontally. The flipping mechanism 102 is located at the last roller position. The flipping mechanism 102 includes a hook 1021 and a conveyor chain group 1022. The conveyor chain group 1022 is responsible for driving the hook 1021 from the horizontal state in the drawing to the vertical state on the right side in the drawing, thereby turning the circuit board B from the horizontal to the vertical state. In fact, the conveyor chain group 1022 is in an inclined state, so that the circuit board B can enter the carrier 60.

The upper board mechanism 11A is installed on the right side of the temporary storage machine 10A, and is located near the lift board mechanism 102. When the circuit board B is fed into the carrier 60, the upper board mechanism 11A adjusts the carrier 60 to be inclined.

The upper plate mechanism 11A includes a first position adjusting member 111, a second position adjusting member 112, a first pushing group 113 and a second pushing group 114. The first position adjusting member 111 has a first initial groove 1111 and a first positioning groove 1112. The second position adjusting member 112 has a second initial groove 1121 and a second positioning groove 1122. The distance from the first initial groove 1111 to the first positioning groove 1112 is not equal to the distance from the second initial groove 1121 to the second positioning groove 1122. The first pushing group 113 is installed on the first position adjusting member 111 and can drive the first pushing rod 1131 to move from the first initial groove 1111 to the first positioning groove 1112. The second pushing group 114 is installed on the second position adjusting member 112 and can drive the second push rod 1141 to move from the second initial groove 1121 to the second positioning groove 1122. The first pushing group 113 and the second pushing group 114 can be pneumatic cylinders or other power devices.

As shown in Figure 9, it is a partial enlarged schematic diagram of the actual operation of the upper board mechanism. The two ends of the cross bar 61 of the carrier 60 are respectively located in the first initial groove 1111 and the second initial groove 1121. The pre-operation process is: the circuit board B is sent to the far right by the conveying mechanism 101, the circuit board B enters the hook 1021, and the conveying chain group 1022 is used to actuate the circuit board B from a horizontal state to an upright and descending In the process, the circuit board B enters the socket 62 of the carrier 60, as shown in FIG. 8. After that, the upper board mechanism 11A is actuated. The first pushing group 113 and the second pushing group 114 act synchronously. Because the moving distances of the first push rod 1131 and the second push rod 1141 are not the same, the two ends of the cross rod 61 move the first positioning groove 1112 and the first positioning groove 1112 and the second push rod 1141 respectively. In the two positioning grooves 1122, the carrier 60 is in an inclined state, as shown by the imaginary line on the rightmost side in the figure.

As shown in FIG. 10, the steering placement mechanism 12A is installed at the leftmost position of the deposition reaction tank 40, and is responsible for raising, rotating, lowering the carrier 60 in the inclined state of the upper plate mechanism 11, and sending it into the deposition reaction tank 40 . The steering placement mechanism 12A includes a boom unit 121, a steering cantilever unit 122 and a lifting unit 123. The lifting unit 123 is erected on the outer wall of the long tank wall 41 of the deposition reaction tank 40 and is located near the initial position. The lifting unit 123 is responsible for driving the steering cantilever unit 122 installed here to lift. The steering cantilever unit 122 has a cantilever. The end of the cantilever has a steering mechanism 1221 and is combined with the boom unit 121. Both ends of the boom unit 121 are provided with a set of hooks 1211, and the hooks 1211 are responsible for hooking the carrier. 60 of the crossbar 61.

The operation of the steering placement mechanism 12A is: the lifting unit 123 lowers the steering cantilever unit 122 to the lowest position, and when the upper plate mechanism 11A sends the carrier 60 to a predetermined position in an inclined state, the lifting unit 123 drives the steering cantilever unit 122 Ascend, the carrier 60 is lifted by the hook 1211 of the boom unit 121. When ascending to the highest point, the rotating mechanism 1221 operates, and the boom unit 121 rotates 180 degrees, so that the carrier 60 rotates and turns in synchronization. In other words, the position of the opening 63 of the carrier 60 also turns from facing the upper plate mechanism 11A to face the deposition reaction tank 40. Then the lifting unit 123 lowers the steering boom unit 122 again. Let the carrier 60 enter the deposition reaction tank 40 in an inclined form. In actual production operation, when the steering cantilever unit 122 descends to the lowest point, the two sides of the cantilever unit 121 are respectively: the carrier 60 is moved in by the upper plate mechanism 11, or the carrier 60 is sent into the deposition reaction tank 40. Only in this way can continuous production be carried out.

In summary, the present invention uses the carrier 60 to carry the circuit board and moves in the deposition reaction tank 40 in an oblique manner, and cooperates with the reaction liquid continuously sprayed by the multiple jet modules 43 located in the deposition reaction tank 40. The water flow can not only effectively take away the surface of the circuit board, or the air bubbles remaining in the through holes or blind holes on the circuit board, but also effectively improve the replacement efficiency of the reaction liquid in the circuit board surface, through holes and blind holes, so that the surface of the circuit board , The thickness of the deposition in the through hole or the blind hole is more uniform, which can also improve the production efficiency and maintain the production quality, which meets the patent application requirements.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to restrict the present invention in any form. Therefore, any modification or change related to the present invention is made under the same creative spirit. , Should still be included in the scope of the present invention's intended protection.

10: temporary storage machine 11: Board mechanism 12: Steering placement mechanism 13: Chemical nickel bath 14: sink 141: Washing Room 142: Drip Room 15: Chemical immersion gold tank 16: Recycling washing tank 17: Lower board mechanism 18: output mechanism 191: The first transfer mechanism 192: The second transfer mechanism 193: Recycling transfer mechanism A: Vehicle B: Circuit board θ: oblique angle θ1: Angle θ2: Angle 201~209: Steps 301~303: steps 40: deposition reaction tank 41: Long groove wall 42: Short groove wall 43: Jet module 44: Reaction liquid supply circulation device 50: mobile agency 51: Motor 52: Transmission components 521: Sprocket 522: drive chain 53: chain group 531: Acceptance 5311: Groove 5312: neck groove 60: Vehicle 61: Crossbar 62: Shelf 63: opening 64: connecting rod 65: keep the rod 651: keep piece 10A: Temporary storage machine 101: Conveying mechanism 102: Lifting board mechanism 1021: hook 1022: Conveyor chain 11A: Board mechanism 111: The first position adjustment piece 1111: The first initial groove 1112: The first positioning groove 112: The second position adjustment piece 1121: Second initial groove 1122: Second positioning groove 113: The first push group 1131: first putt 114: The second push group 1141: second putt 12A: Steering placement mechanism 121: boom unit 1211: hook 122: Steering cantilever unit 1221: Steering mechanism 123: Lifting unit

FIG. 1A is a schematic diagram of the structure of the deposition process equipment developed by the present invention. 1B is a schematic side view of the moving state of the circuit board in the deposition process equipment of the present invention. Figure 2 is a flow chart of the operation of the deposition process equipment developed by the present invention. Fig. 3 is a flow chart of the chemical deposition method for inclined continuous production of the present invention. Figure 4 is a schematic diagram of a chemical deposition tank for continuous production in an inclined manner according to the invention. Fig. 5A is a partial enlarged view of the chain assembly of the present invention. Fig. 5B is a top view of the receiving member of the present invention. Fig. 5C is a diagram showing different states of the cross bar of the carrier of the present invention placed on a single receiving member. Fig. 6 is a three-dimensional enlarged view of the carrier of the present invention. Fig. 7 is a schematic diagram of the actual operation of the present invention. Fig. 8 is a perspective view of the temporary storage machine and the boarding mechanism of the present invention. Fig. 9 is a schematic diagram of the upper board mechanism of the present invention pushing the carrier to move. Fig. 10 is a three-dimensional schematic diagram of the steering placement mechanism and the deposition reaction tank of the present invention.

40: deposition reaction tank

41: Long groove wall

42: Short groove wall

43: Jet module

44: Reaction liquid supply circulation device

50: mobile agency

51: Motor

52: Transmission components

521: Sprocket

522: drive chain

53: chain group

531: Acceptance

60: Vehicle

θ: oblique angle

Claims (13)

A chemical deposition method for continuous production piece by piece in a horizontal oblique manner, and its steps include: Use a carrier to carry at least one circuit board upright; The carrier carrying the circuit board enters the deposition reaction tank in an oblique configuration for chemical deposition reaction. The oblique configuration means that the position of the carrier has an oblique angle with the advancing direction, and the oblique angle is 74 to 81 degrees; The moving mechanism drives the carrier to move from the initial position of the deposition reaction tank to the final position. The inner wall of the deposition reaction tank is provided with a plurality of jet modules, and the jet modules continue to the surface of the circuit board during the movement of the carrier. The reaction liquid is sprayed out, and the indwelling time of the circuit board in the deposition reaction tank is used to complete the operation of metal deposition on the circuit board. As described in the first item of the scope of patent application, in the chemical deposition method of continuous production piece by piece in a horizontal oblique manner, a plurality of the jet modules are arranged on two opposite long groove walls of the deposition reaction tank and are distributed in a staggered manner. As described in the first item of the scope of patent application, the chemical deposition method for continuous production piece by piece in a horizontal and inclined manner, wherein the spray direction of a plurality of the spray modules is perpendicular to the moving direction of the carrier. As described in the first item of the scope of patent application, the chemical deposition method of continuous production piece by piece in a horizontal oblique manner, wherein the chain group of the moving mechanism is respectively installed outside the two long groove walls, and the chain group is provided with a plurality of receiving parts; The top of the carrier is provided with a cross bar, the two ends of the cross bar are respectively located in the two receiving parts at opposite positions, and the carrier is moved in the inclined configuration. A chemical deposition equipment that is continuously produced piece by piece in a horizontal and inclined manner, including: In a deposition reaction tank, a plurality of jet flow modules are respectively installed in the two opposite long groove walls, and the jet flow modules can continuously spray the reaction liquid; A moving mechanism is installed on the outer wall of the deposition reaction tank and includes a motor, a transmission assembly and two groups of chains. The two groups of chain groups are respectively arranged outside the wall of the long groove. The chain group is provided with a plurality of receiving parts, and the motor passes through The transmission assembly drives the two chain groups to move synchronously; A plurality of carriers, including a cross bar and two supports, the two supports are symmetrically fixed to the cross bar, the two supports have an opening on the other side, the opening for the circuit board to put in, the carrier is inclined In the configuration form, the two ends of the crossbar are erected in the two corresponding receiving parts. The oblique configuration means that the position of the carrier has an oblique angle with the advancing direction, and the oblique angle is 74-81 degrees. As described in the fifth item of the scope of patent application, the chemical deposition equipment is continuously produced piece by piece in a horizontal and inclined manner, wherein the carrier further includes a plurality of connecting rods and a holding rod, and the connecting rod is horizontally combined between the two supporting frames , The holding rod is combined with the bottommost position of the two supporting frames, and both ends of the holding rod are provided with holding pieces, and the distance between the two holding pieces is exactly the width of the maximum size of the circuit board to prevent the circuit board from facing Slide out on both sides. As described in item 5 of the scope of patent application, the chemical deposition equipment is continuously produced piece by piece in a horizontal inclined manner, wherein the deposition reaction tank is additionally equipped with a reaction liquid supply and circulation device, and the reaction liquid supply and circulation device is connected to the jet module through a pipeline. Connect and control the timing of operation. As described in item 5 of the scope of patent application, the chemical deposition equipment that is continuously produced piece by piece in a horizontal and inclined manner further includes a steering placement mechanism that includes a boom unit, a steering cantilever unit, and a lifting unit, and the lifting unit is erected In the deposition reaction tank, the elevating unit is responsible for driving the steering cantilever unit installed thereon up and down, the steering cantilever unit has a cantilever, one end of the cantilever has a steering mechanism and the crane unit is installed, and both ends of the crane unit are provided with There is a hook, and the steering cantilever unit can drive the boom unit to rotate to switch the position of the hook. As described in item 8 of the scope of patent application, the chemical deposition equipment that is continuously produced piece by piece in a horizontal and inclined manner further includes an upper plate mechanism located on the side of the temporary storage machine, and the upper plate mechanism is located in the turning position In the descending path of the boom unit of the mechanism, the upper plate mechanism is responsible for adjusting the carrier to the inclined configuration, and then the boom unit is used to lift the carrier. As described in item 9 of the scope of patent application, the chemical deposition equipment is continuously produced piece by piece in a horizontal and inclined manner, wherein the upper plate mechanism includes a first position adjustment member, a second position adjustment member, a first pushing group and a second pushing group , The first position adjusting member has a first initial groove and a first positioning groove, the second position adjusting member has a second initial groove and a second positioning groove, and the first initial groove reaches the first positioning groove The distance of the groove is not equal to the distance from the second initial groove to the second positioning groove; the first pushing group is installed on the first position adjusting member and can drive the first push rod to move from the first initial groove To the first positioning groove, the second pushing group is installed on the second position adjusting member, and can drive the second push rod to move from the second initial groove to the second positioning groove. As described in the fifth item of the scope of patent application, the chemical deposition equipment is continuously produced piece by piece in a horizontally inclined manner, wherein the receiving member has an upwardly inclined groove, and the groove is used to receive the carrier. As described in item 11 of the scope of patent application, the chemical deposition equipment is continuously produced piece by piece in a horizontal inclined manner, wherein the groove shape of the groove is a trumpet shape that gradually shrinks from top to bottom. As described in item 11 of the scope of patent application, the chemical deposition equipment is continuously produced piece by piece in a horizontal and inclined manner, wherein the groove has a neck groove with the smallest size, and the groove has the size of the neck groove as the dividing point. The groove depth or groove entrance gradually increases.

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