TWI661753B - Chemical deposition method and equipment for continuous production using carrier slab - Google Patents

Abstract

A chemical deposition method and apparatus for continuously producing a carrier piece by using a carrier, wherein the method is to carry at least one circuit board in an upright manner by using a carrier; then the carrier is moved into a deposition reaction tank by the carrier. a chemical deposition reaction, wherein the deposition reaction tank is sequentially provided with an initial position, a plurality of relay positions, and a final position; the moving mechanism drives the carrier sequentially from the initial position, the plurality of relay positions, and moves to the final Positioning, using the circuit board in the deposition reaction tank for a predetermined time, to complete the deposition of metal in the deposition reaction tank on the circuit board; the invention is designed to use a piece-by-chip circuit board to progressively move to complete metal deposition on the circuit The related work of the board can be expanded to apply to various chemical deposition operations such as depositing nickel, depositing gold, depositing copper, depositing germanium, depositing silver, and the like.

Description

Chemical deposition method and equipment for continuous production using carrier slab

The invention relates to the technical field of a chemical deposition method of a circuit board, in particular to a chemical deposition method and equipment for continuous production of a piece by piece.

In the conventional chemical nickel gold process, a plurality of circuit boards are grouped by a single hanging basket, and the circuit boards are sequentially raised, lowered, and moved to various chemical solution tanks or various tanks to perform related operations to meet the requirements. The need for mass production. The specific process is feeding→cleaning→water washing→micro-etching→water washing→acid washing→water washing→pre-dip→activation→water washing→chemical nickel deposition→water washing→chemical immersion gold→water washing→drying→cutting. The production equipment used, as shown in FIG. 1 , the multiple reaction tank chambers are arranged in a straight line to form a production line, including: cleaning tank 101 and several water washing tanks 102, micro-etching tanks 103 and several water washing tanks 104, pickling The tank 105 and the number of water washing tanks 106, the prepreg tank 107, the exchange tank 108, the activation tank 109, the number of chemical nickel sink tanks 110 and the number of water washing tanks 111, the number of chemical gold sink tanks 112 and the number of water washing tanks 113, and finally to the drying tank 114. The production operation mode is to insert a plurality of pieces (for example, 20 to 60 pieces) of circuit boards into a basket 115 in a vertical manner. In this embodiment, two gantry cranes 116 and 117 are used to drive the basket 115. Vertically moving up and down in the aforementioned reaction tank chamber. When the gondola 115 is sequentially moved by the gantry crane 116 to the exchange slot 108, it will be moved by the gantry crane 117 to the subsequent reaction tank indoor operation.

In the foregoing production equipment, the plurality of circuit boards of each set of the hanging baskets 115 need to be lowered into the respective tanks, and after the relevant operations are completed, they are raised, and then moved to the next tank chamber. Due to the large volume, the load is extremely heavy, and one cannot Moving, requires a large mechanism to operate the space, so the machine has a high vertical height (up to 4 meters) and a twist of 2 meters (if the operator's operating platform, the twist can reach 4 meters). Although the entire production line can be designed with a casing closed, the huge production line cannot be effectively closed. If the production line has a small fault, it must be opened by operating the window to eliminate the harmful gas in the process, which affects the operator. health.

Furthermore, each of the troughs must accommodate the vertical placement of the basket and allow the liquid to completely immerse the circuit board. The relatively required capacity is relatively large, and the liquid required for each tank can be up to 500 liters, so various reaction tanks in the process. The demand for liquid is large, and the size of the tank is also high. In addition, a large amount of waste liquid treatment after production is also a cost burden.

In the latter part of the process, because the basket is still moved by the vertical multi-chip circuit board, in the drying operation after washing, it is easy to leave the surface water on the surface of the circuit board after drying, which affects the quality of the circuit board, so the circuit board is still A further post-processing is required, that is, each board is transported horizontally separately for washing, drying, drying, etc., and additional production costs are added. There are many shortcomings in the above-mentioned conventional methods, which are in great need of improvement.

Therefore, the inventors thought about whether it is possible to analyze and improve the conventional process, and expect a better and innovative way to analyze the conventional process, which can be divided into three major parts: pre-processing, deposition process, and post-processing, pre-processing. Including: cleaning → washing → micro-etching → washing → pickling → washing. The deposition process includes: prepreg→activation→water washing→chemical nickel deposition→water washing→chemical immersion gold→water washing. Post-treatment includes: washing → drying. To this end, the inventors thought about changing the production mode in which the hanging basket was used to hang a large number of circuit boards at one time. The present invention adopts a mode of moving piece by piece mobile production, in which the boards are horizontally sliced in the pre-processing and post-processing operations. Progressive movement, in the deposition process, the board includes horizontal piece by piece progressive movement and upright piece by piece progressive movement. There are related equipments for both pre-treatment and post-treatment. However, there is no related equipment for the improved deposition process of the present invention, because the deposition reaction takes a long time, for example, 20 to 30 minutes for depositing nickel, and the deposition gold is required. For more than 10 minutes, if the horizontal progressive movement is used, the required tank length will be very large, the amount of chemical reaction liquid is also very large, and the cost is too high to be imported into production. Therefore, the present invention develops a set of applications for the deposition process. The carrier adopts a chemical deposition apparatus and method for continuous production piece by piece, and uses the vertical type progressive moving piece by piece to make the process of the invention run smoothly.

The main object of the present invention is to provide a chemical deposition method and apparatus, mainly in a chemical deposition production operation, in which a carrier-carrying circuit board is moved in a deposition tank by a vertical piece-by-piece production mode, and moves from an initial position to a final position. Time, the completion of the deposition of metal in the deposition tank on the circuit board.

A secondary object of the present invention is to provide a chemical deposition method and apparatus for producing a sheet by using a carrier, which can be widely applied to operations such as chemical deposition of nickel, chemical deposition of gold, chemical deposition of copper, chemical deposition of tantalum or chemical deposition of silver. .

To achieve the above object, the present invention provides a method of chemical deposition using a carrier by piece, the steps comprising: using a carrier to carry at least one circuit board upright; the carrier moves the circuit board into a deposition reaction a chemical deposition reaction is performed in the tank, wherein the deposition reaction tank is sequentially provided with an initial position, a plurality of relay positions, and a final position; the moving mechanism drives the vehicle sequentially from the initial position, a plurality of the relay positions, Moving to the final position, the circuit board is used in the deposition reaction tank for a predetermined time to complete the deposition of metal in the deposition reaction tank on the circuit board.

Furthermore, the present invention utilizes a chemical deposition apparatus produced by a carrier piece by piece, comprising: a deposition reaction tank, a plurality of carriers, a moving mechanism, and two sets of shifting mechanisms, the deposition reaction tanks being disposed on the top surfaces of the two tank walls. a row of opposite racks, the rack is composed of a plurality of one-way helical teeth; the carrier comprises a cross bar and two brackets, the two brackets are symmetrically fixed to the cross bar, the two bearings The shelf has an opening on the other side, and the opening is placed in the circuit board, the carrier is erected on two sides of the crossbar in opposite positions; the moving mechanism is mounted on the deposition reaction tank The outer wall is responsible for driving the two sets of shifting mechanisms to synchronously generate a reciprocating movement, and moving only one distance of the one-way helical teeth at a time; each set of the dialing mechanism includes a plurality of dial members that can be rotated, and two of the crossbars The side position has a corresponding one of the dialing members. When the moving mechanism drives the toggle mechanism to move forward, the dialing member pushes the crossbar to slowly rise to the highest point along the inclined surface of the one-way helical tooth. After dropping the next one of the one-way helical teeth, when the movement When configured to drive the toggle mechanism moves backward, the toggle member can be rotated to release contact with the cross bar.

The invention relates to a chemical deposition method and a device for continuously producing one by one by using a carrier. Different from the previous production mode of using a basket type to carry 20 to 60 pieces of circuit boards at a time, the method mainly adopts a piece-by-chip circuit board to carry out progressive movement. In the chemical deposition operation, in the pre-dip and activation operations, the board adopts the progressive movement of the board level by piece, and in the subsequent chemical deposition reaction, the vertical type-by-piece progressive movement is adopted. This design not only greatly reduces the size of the overall equipment, but also reduces the cost of equipment, speeds up production, and maintains a good production quality.

In addition, the present invention uses a carrier to continuously produce a chemical deposition device piece by piece, which uses the carrier to carry a circuit board to move piece by piece in a chemical deposition tank, and the carrier moves to the original one-way helical tooth and then falls to The vibration generated by the one-stage one-way helical tooth can separate the air bubbles attached to the surface of the circuit board due to the deposition reaction. The vibration of the present invention is up to several times or more, and the bubble adhesion can be effectively eliminated, and the vibration is continuously vibrated. It can increase the contact between the reaction solution and the circuit board, increase the deposition rate, thereby maintaining the production quality, and satisfying the purpose of using the carrier to be produced piece by piece.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

First, an explanation will be given of the apparatus developed in the deposition process of the present invention. This equipment is used in the chemical nickel-palladium-gold deposition process, which is installed between the pre-processing and post-processing equipment on the board that is moving horizontally and progressively. The design spirit of the present invention is to adopt a mode of moving production by piece to complete the circuit board deposition operation.

As shown in FIG. 2A, the deposition process apparatus of the present invention comprises a pre-dip tank 20 arranged in series, an activation tank 21, a turning mechanism 22, a chemical nickel sink tank 23, a plurality of water tanks 24, a chemical gold sink tank 25, and recycling. The washing tank 26 and the conveying mechanism 27. A plurality of carriers A, which are responsible for carrying a circuit board for related chemical deposition operations. Also included is a first transfer mechanism 281, a second transfer mechanism 282, and a recycle cycle transfer mechanism 283 that is responsible for moving the carrier A into the associated work slot. In the figure, the mobile related mechanisms are not shown, and are only indicated by schematic squares. 2B and FIG. 2C, the state in which the circuit board B is operated in each of the slots, wherein the prepreg 20 and the activation tank 21 are horizontally progressively moved, and then the inversion mechanism 22 is in a horizontal state. Adjust to vertical. Thereafter, the chemical nickel sinking tank 23, the number of water tanks 24, the chemical gold sinking tank 25, and the recovery water washing tank 26 are all in a vertical state, and finally the deposited circuit board B is again conveyed by the conveying mechanism 27 to the post-processing apparatus in a horizontal state.

As shown in FIG. 3, it is a flow chart of the operation of the deposition process equipment developed by the present invention. Please refer to FIG. 2A and FIG. 2B, the steps of the device operation method are as follows:

Step 301: The chip-by-chip board B enters the prepreg tank 20 in a horizontal manner by using a transport roller, and performs pre-dip processing before the reaction.

Step 302: The circuit board B is sequentially introduced into the activation tank 21 by using a conveying roller in a horizontal manner, so that the surface of the beryllium copper on the circuit board is first replaced with a layer of extremely thin palladium metal.

Step 303: The circuit board B is moved to the reversing mechanism 22, and the circuit board B is sent into the carrier A through the rotating clamping unit 221 of the inverting mechanism 22; the mechanism is used to change the circuit board B that has been horizontally moved to be vertical. For subsequent chemical deposition operations.

Step 304: The carrier A carrying circuit board B enters the chemical nickel sinking groove 23, and moves from the initial position on the left side to the plurality of relay positions in the middle, and finally to the final position on the rightmost side, and the time of staying makes the circuit board B A layer of nickel is deposited on the copper surface. The movement mode in the slot adopts a progressive mode, that is, only moves a small distance at a time, and has to be moved a plurality of times to move from the initial position to the final position.

Step 305: The carrier A is lifted up and out of the chemical nickel sink 23 by the first transfer mechanism 281, moved to the right by a distance, and then moved into the water washing tank 24. The circuit board is cleaned in the washing tank 24. Referring to Figure 2A, the water wash tank 24 includes a plurality of tanks, a plurality of water wash chambers 241 on the left side and a drip chamber 242 on the right side. In the actual operation mode, the first transfer mechanism 281 hoists five carriers A at a time, and then moves down only after moving the distance of one of the chambers, so that the carrier A enters the first working chamber of the washing tank 24. Then, the movement is repeated in sequence. In this embodiment, the first transfer mechanism 281 needs to operate the carrier A five times to enter the chemical sinking tank 25.

Step 306: The carrier A in the water washing tank 24 is moved into the chemical immersion gold tank 25 by the first transfer mechanism 281, and moves from the left initial position to the intermediate relay positions, and finally to the right final position. The residence time will cause a layer of gold to deposit on the copper surface of the board. The moving mode adopts the progressive mode, that is, only moves a small distance at a time, and has to be moved a plurality of times to move from the initial position to the final position.

Step 307: The carrier A is moved up and out of the chemical immersion tank 25 by the second transfer mechanism 282, moved to the right by a distance, and then moved into the recovery washing tank 26 to clean and recover the reaction gold liquid brought out from the surface of the circuit board, and recovered. The water wash tank 26 also includes a plurality of slots. The second transfer mechanism 282 is also operated in the same manner as the first transfer mechanism 281 described above.

Step 308: The carrier A is finally moved closer to the transport mechanism 27 by the second transfer mechanism 282, so that the circuit board B is changed from vertical to horizontal and moved to the next operation piece by piece. The post-processing equipment is then washed and dried. The emptied carrier A is moved to the chemical immersion nickel tank 23 via the recovery cycle transfer mechanism 283 for the next processing.

The deposition process equipment and operation method developed by the invention can greatly reduce the size of the overall equipment, reduce the cost of equipment, and reduce the factory area required for installation, thereby reducing the investment amount of the equipment as a whole. In addition, the production process can also reduce water consumption, chemical reaction liquid usage and electricity consumption, reduce production costs, and make products more competitive in the market. In addition, the equipment can be more effectively closed, reducing the leakage of harmful gases in production, thereby providing a safer working environment.

In the above device, the chemical nickel sinking tank 23 and the chemical gold sinking tank 25 are chemical deposition methods which are continuously produced piece by piece by means of a carrier, and are different from the production mode of carrying a basket of 20 to 60 pieces of circuit boards at a time. To this end, the present invention has devised a chemical deposition apparatus and method for continuously producing a carrier piece by piece, which can be applied to the deposition operation of the chemical nickel sink 23 and the chemical gold sink 25 .

As shown in Fig. 4, the present invention uses a flow chart of a chemical deposition method in which a carrier is produced piece by piece. The steps include: in step 401, using the carrier to carry at least one circuit board in a vertical position; as in step 402, the carrier moves the circuit board into a deposition reaction tank for chemical deposition reaction, and the deposition reaction tank is sequentially Providing an initial position, a plurality of relay positions, and a final position; and in step 403, the moving mechanism drives the carrier to sequentially move from the initial position, the plurality of relay positions, to the final position, and utilize the The circuit board waits for the time in the deposition reaction tank to complete the deposition of metal in the deposition reaction tank on the circuit board.

In addition, when the moving mechanism drives the carrier to move to two adjacent positions, the bottommost point of the previous stage position moves to the highest point, and then vertically falls to the next level position, wherein the two adjacent positions include the initial position and A relay location, two adjacent relay locations, and the relay location to the final location. The purpose is to generate vibrations that eliminate bubbles that may adhere to the surface of the board that are generated by the deposition reaction. In addition, vibration can also increase the contact of the reaction solution with the circuit board and increase the deposition rate.

The above-mentioned chemical deposition method using the carrier-by-piece continuous production can design a plurality of specific devices to achieve the purpose. This embodiment describes one of the devices: as shown in FIG. 5 and FIG. 6, the carrier is used for the present invention. A perspective view and an exploded view of a continuously produced chemical deposition apparatus. The invention comprises a deposition reaction tank 40, a plurality of carriers 50, a moving mechanism 60 and two sets of shifting mechanisms 70.

The deposition reaction tank 40 is a rectangular parallel-shaped groove body, and a row of oppositely positioned racks 42 are disposed on the top surfaces of the two groove walls 41 on the long sides, and the rack 42 is composed of a plurality of one-way helical teeth. 421 is composed.

As shown in FIG. 6, the carrier 50 includes a crossbar 51 and two brackets 52. The two brackets 52 are symmetrically fixed to the crossbar 51. The bracket 52 is partially bent and has a hook shape. 52 has an opening 53 on the other side that can be placed in the circuit board. In actual operation, the carrier 50 is mounted on the two unidirectional helical teeth 421 opposite to each other by the two sides of the crossbar 51 (see FIG. 5). The carrier 50 further includes a plurality of connecting rods 54 that are laterally coupled between the two brackets 52 to maintain overall rigidity. In addition, the carrier 50 further includes a holding rod 55 coupled to the bottommost position of the two brackets 52. Each of the holding rods 55 is provided with a vertical retaining piece 551 at each end. The distance between the two holding pieces 551 is exactly the width of the largest dimension of the board.

The moving mechanism 60 is mounted on the outer wall of the deposition reaction tank 40, and is responsible for driving the two sets of the dialing mechanism 70 to synchronously generate reciprocating movement, and only one distance of the one-way helical teeth 421 is moved at a time. The moving mechanism 60 includes a rail frame 61, a frame 62, and a first power member 63. The rail frame 61 is looped and fixed to the outer wall of the deposition reaction tank 40, that is, fixed to the groove wall 41 on both sides. Two sets of rails 611 are fixed on the rail frame 61, and the two sets of rails 611 are respectively located at the outer edges of the long sides of the deposition reaction tank 40. The frame 62 is a rectangular frame having a size larger than the size of the deposition reaction tank 40, and is assembled to be placed around the periphery of the deposition reaction tank 40. Referring to FIG. 8 together, a plurality of guide wheels 621 are disposed at the bottom of the frame 62, and the guide wheels 621 can run on the track 611. The first power member 63 is fixed to the rail frame 61, and a retractable actuating lever 631 is further coupled with the frame 62. In the embodiment, the first power member 63 is a pneumatic cylinder, a hydraulic cylinder, an electric telescopic rod, and the like. One of the institutions. When the first power member 63 is actuated, the actuating lever 631 is extended or retracted, thereby driving the frame 62 to generate linear reciprocating movement.

Two sets of toggle mechanisms 70 are located on the outer walls of the two long sides of the frame 62, respectively. Each of the dialing mechanisms 70 includes a plurality of dialing members 71, a linking piece 72, and a second power unit 73. Each of the dialing members 71 has an upper pivoting point 711 and a lower pivoting point 712. The point 711 is pivotally connected to the outer wall of the frame 62. The lower pivot point 712 is pivotally connected to the linkage piece 72. The linkage piece 72 is driven by the second power piece 73 to generate a reciprocating motion. In the embodiment, the second power member 73 is one of a pneumatic cylinder, a hydraulic cylinder, an electric telescopic rod, and the like. As shown in FIG. 5, the two ends of the crossbar 51 of the carrier 50 extend outside the deposition reaction tank 40, and a toggle member 71 corresponds to each. The toggle member 71 is driven by the moving mechanism 60, and the crossbar 51 of the carrier 50 is pushed by the toggle member 71 each time, so that the crossbar 51 is unidirectionally inclined from the one-way oblique tooth 421 where it is located. The teeth 421 move.

Then make a description of the actual action:

As shown in FIG. 9, for convenience of explanation, only an enlarged view of the left front half of the apparatus is provided, and not all of the plurality of carriers 50 are placed in the deposition reaction tank 40. At the beginning of the operation, as described in the previous paragraph, the circuit board is first placed in the carrier 52 of the carrier 50, and the carrier 50 is placed in the deposition reaction tank 40, and the crossbar 51 is left and right. The segments are located on opposite one-way helical teeth 421, and the two opposite sliders 71 are opposite the ends of the crossbar 51. In the present embodiment, the leftmost one-way helical tooth 421 is the initial position of the carrier 50 in the deposition reaction tank 40. Subsequent teeth are relay positions.

As shown in Fig. 10, the first power member 63 of the moving mechanism 60 is actuated, and the actuating lever 631 is extended to cause the frame 62 to translate in the right direction. The toggle member 71 pivotally connected to the frame 62 is pushed to the right. The crossbar 51 is moved to the highest point along the lowest point of the one-way helical tooth 421.

As shown in FIG. 11, the crossbar 51 is dropped by the first-stage one-way helical teeth 421 to the one-way helical teeth 421 of the next stage. The second power member 73 is actuated to move the linkage piece 72 to the right. Due to the pivotal relationship, the tip end of the dial member 71 is largely shifted to the left, so that the highest position of the top surface of the dial member 71 is lower than the maximum position. The lowest position of the one-way helical tooth 421.

As shown in FIG. 12, the actuating lever 631 of the first power member 63 is retracted, and the strap 62 is returned to the home position. In this process, the dial 71 is in a state of being shifted to the left, so that it does not come into contact with the crossbar 51 when moving.

After the frame 62 is retracted to the initial position, the second power member 73 is again actuated to return the link piece 72 to the original position, and the state of FIG. 9 is presented, waiting for another carrier 50 to be placed in the deposition reaction tank 40. .

In summary, the present invention utilizes a chemical deposition apparatus in which a carrier is produced piece by piece, and uses the reciprocating motion generated by the moving mechanism 60 to cause the carrier 50 placed in the deposition reaction tank 40 to move one unidirectional helical gear at a time. The distance of 421, thereby gradually completing the operation of depositing metal on the circuit board by the initial position, a plurality of the relay positions, moving to the final position, and the like in the process. In addition, the vibration generated by the carrier 50 falling to the next-stage one-way helical teeth 421 can separate the bubbles adhering to the surface of the circuit board due to the deposition reaction, and the vibration can be effectively eliminated by up to several times or more. In the case of bubble adhesion, the constant vibration can also increase the contact between the reaction liquid and the circuit board, increase the deposition rate, thereby maintaining the production quality, and satisfying the purpose of using the carrier to be produced piece by piece.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, so that any modifications or changes to the present invention made under the same creative spirit are made. All should still be included in the scope of the invention as intended.

101‧‧‧cleaning tank

102‧‧‧Washing tank

103‧‧‧micro-etching slot

104‧‧‧Washing tank

105‧‧‧ Pickling tank

106‧‧‧Washing tank

107‧‧‧Prepreg tank

108‧‧‧ exchange slot

109‧‧‧Energy tank

110‧‧‧Chemical nickel sink

111‧‧‧Washing tank

112‧‧‧Chemical sinking gold trough

113‧‧‧Washing tank

114‧‧‧Dry tank

115‧‧‧hanging

116‧‧‧ gantry crane

117‧‧‧ gantry crane

20‧‧‧Prepreg tank

21‧‧‧Activity tank

22‧‧‧ flip mechanism

23‧‧‧Chemical nickel sink

24‧‧‧Washing tank

25‧‧‧Chemical sinking gold trough

26‧‧‧Recycled washing tank

27‧‧‧Transportation agencies

A‧‧‧ Vehicles

B‧‧‧Board

281‧‧‧First transfer mechanism

282‧‧‧Second transfer mechanism

283‧‧‧Recycling cycle transfer mechanism

40‧‧‧Sedimentation reaction tank

41‧‧‧ slot wall

42‧‧‧ rack

421‧‧‧One-way helical teeth

50‧‧‧ Vehicles

51‧‧‧cross bar

52‧‧‧ Shelf

53‧‧‧ openings

54‧‧‧ Connecting rod

55‧‧‧

551‧‧‧ Keeping the film

60‧‧‧Mobile agencies

61‧‧‧Track frame

611‧‧‧ Track

62‧‧‧Frame

621‧‧‧guide wheel

63‧‧‧First power piece

631‧‧‧Action rod

70‧‧‧Toggle mechanism

71‧‧‧WD parts

711‧‧‧Stop joint

712‧‧‧ lower pivot joint

72‧‧‧ linkage film

73‧‧‧second power piece

Figure 1 is a schematic view of a conventional chemical nickel gold process equipment. 2A is a schematic view of a deposition process apparatus developed by the present invention. 2B is a side elevational view showing the state of movement of the circuit board in the deposition process apparatus of the present invention. 2C is a top plan view showing the moving state of the circuit board in the deposition process apparatus of the present invention. 3 is a flow chart showing the operation of the deposition process equipment developed by the present invention. 4 is a flow chart of a chemical deposition method for continuously producing a carrier sheet by using a carrier. Figure 5 is a perspective view of a chemical deposition apparatus for continuous production using a carrier slab. Figure 6 is an exploded view of a chemical deposition apparatus for continuous production using a carrier slab. Figure 7 is a perspective enlarged view of the carrier of the present invention. Figure 8 is a partially enlarged perspective view of the moving mechanism and the dialing mechanism of the present invention. Figure 9 is a partially enlarged view (I) of the actual operation of the present invention. Figure 10 is a partial enlarged view (2) of the actual operation of the present invention. Figure 11 is a partial enlarged view (3) of the actual operation of the present invention. Figure 12 is a partial enlarged view (4) of the actual operation of the present invention.

Claims (9)

A chemical deposition method for continuously producing a carrier piece by using a carrier, the method comprising: using a carrier to carry at least one circuit board in an upright manner; the carrier moves the circuit board into a deposition reaction tank for chemical deposition reaction, An initial position, a plurality of relay positions, and a final position are sequentially disposed in the deposition reaction tank; the moving mechanism drives the vehicle to sequentially move from the initial position, the plurality of relay positions, to the final position, wherein the When the moving mechanism drives the carrier to move to two adjacent positions, the bottommost point of the previous stage position is moved to the highest point, and then vertically dropped to the next level position, wherein the two adjacent positions include the initial position and the Resetting the relay position, the two adjacent relay positions, and the relay position and the final position, using the circuit board in the deposition reaction tank for a predetermined time, completing deposition of metal in the deposition reaction tank on the circuit board Homework. A chemical deposition method for continuously producing a carrier slab according to claim 1, wherein the deposition reaction tank is provided with a row of oppositely positioned racks on the top surfaces of the two groove walls, the rack is a plurality of one-way helical teeth, the top of the carrier has a cross bar, and the two ends of the cross bar are respectively located in two of the one-way helical teeth at opposite positions, and the positions of the plurality of the one-way helical teeth are included The initial position of the deposition reaction tank, a plurality of the relay positions, and the final position. A chemical deposition apparatus continuously produced by using a carrier slab, comprising: a deposition reaction tank, wherein each of the two opposite groove walls is provided with a row of oppositely positioned racks, wherein the rack is composed of a plurality of unidirectional helical teeth The plurality of carriers include a crossbar and two brackets, the two brackets are symmetrically fixed to the crossbar, and the two brackets have openings on the other side, and the openings are for inserting into the circuit board, The carrier is erected on both sides of the crossbar in two opposite one-way helical teeth; a moving mechanism is installed on the outer wall of the deposition reaction tank, and is responsible for driving the two sets of shifting mechanisms to synchronously generate reciprocating movement, and moving only one distance of the one-way helical teeth at a time; two sets of dialing mechanisms, each set of the shifting The mechanism comprises a plurality of slidable members, wherein the two sides of the cross bar respectively have a corresponding one of the sliding members, and when the moving mechanism drives the urging mechanism to move forward, the urging member pushes The crossbar slowly rises to the highest point along the inclined surface of the one-way helical tooth, and falls into the one-way helical tooth of the next stage. When the moving mechanism drives the toggle mechanism to move backward, the dial can be Rotate to release the state of contact with the crossbar. A chemical deposition apparatus for continuously producing a carrier piece as described in claim 3, wherein the carrier further comprises a plurality of connecting rods which are laterally coupled between the two supports to maintain Overall rigidity. A chemical deposition apparatus for continuously producing a carrier piece as described in claim 3, wherein the carrier further comprises a holding rod coupled to a bottommost position of the two frames, the holding rod Each of the two ends is provided with a vertical retaining piece, and the distance between the two holding pieces is exactly the width of the largest dimension of the circuit board. The chemical deposition apparatus for continuously producing a carrier piece according to the third aspect of the patent application, wherein the moving mechanism comprises a rail frame, a frame and a first power component, wherein the rail frame is provided with two sets of rails respectively fixed In the outer wall of the deposition reaction tank, the frame is sleeved on the periphery of the deposition reaction tank, and a plurality of guide wheels are arranged at the bottom to operate the rail. The first power component is connected with the frame and the rail frame, and is responsible for driving the frame. Linear reciprocating movement. The chemical deposition apparatus for continuously producing a carrier piece according to the sixth aspect of the patent application, wherein the first power component is one of a pneumatic cylinder, a hydraulic cylinder, an electric telescopic rod and the like. A chemical deposition apparatus for continuously producing a carrier slab according to claim 6, wherein two of the slidable mechanisms are respectively mounted on outer walls of both sides of the frame, and the plucking mechanism further comprises a linking piece, a second power component, each of the dialing members has an upper pivot joint and a lower pivot joint, wherein the upper pivot joint is pivotally connected to the frame, and the lower pivot joint is pivotally connected to the linkage piece, and the linkage piece is subjected to The second power member is driven to generate a reciprocating motion. A chemical deposition apparatus for continuously producing a carrier piece as described in claim 8 of the patent application, wherein the second power member is one of a pneumatic cylinder, a hydraulic cylinder, an electric telescopic rod, and the like.