CN109778151B - Chemical deposition method and equipment for continuous wafer-by- wafer production using a carrier - Google Patents

Abstract

A chemical deposition method and equipment for continuous production using a carrier, wherein the method uses a carrier to carry at least one circuit board in an upright manner; then the carrier moves the circuit board into a deposition reaction tank for chemical deposition reaction, wherein the deposition reaction tank is provided with an initial position, multiple relay positions, and a final position in sequence; a moving mechanism drives the carrier to move from the initial position, multiple relay positions, to the final position in sequence, and the circuit board is allowed to wait in the deposition reaction tank for a predetermined time to complete the operation of metal deposition on the circuit board in the deposition reaction tank; the present invention is designed to use the circuit boards to be moved piece by piece in a progressive manner to complete the related operations of metal deposition on the circuit board, and can be expanded to various chemical deposition operations, such as deposition of nickel, deposition of gold, deposition of copper, deposition of tin, deposition of silver, etc.

Description

Chemical deposition method and equipment for continuous wafer-by- wafer production using a carrier

technical field

The present invention relates to the technical field of chemical deposition methods for circuit boards, in particular to a chemical deposition method and equipment for continuous production chip by chip.

Background technique

In the conventional electroless nickel-gold process, a single hanging basket is used to group multiple circuit boards into a group, and the circuit boards are sequentially raised, lowered, and moved to each chemical solution tank or various tank chambers for related operations to meet the needs of Need for mass production. The specific process is feeding→cleaning→water washing→micro-etching→water washing→pickling→water washing→predip→activation→water washing→chemical nickel precipitation→water washing→chemical precipitation gold→water washing→drying→cutting. The used production equipment, as shown in FIG. 1 , a plurality of reaction tank chambers are arranged in a straight line to form a production line, including: a cleaning tank 101 and a plurality of washing tanks 102, a micro-etching tank 103 and a plurality of washing tanks 104, Pickling tank 105 and multiple water washing tanks 106, pre-soak tank 107, exchange position tank 108, activation tank 109, multiple chemical nickel immersion tanks 110 and multiple washing tanks 111, multiple chemical immersion gold tanks 112 and multiple washing tanks Tank 113, and finally to drying tank 114. The production operation method is to put multiple (for example, 20 to 60) circuit boards into a group and insert them into the hanging basket 115 vertically. In this embodiment, two gantry cranes 116 and 117 are used to drive the hanging basket 115. Vertically lift and move in sequence in the aforementioned reaction chamber. After the gondola 115 is sequentially moved by the gantry crane 116 to the exchange position tank 108 , the gantry crane 117 will take over and move it to the subsequent reaction tank for operation.

In the above-mentioned production equipment, the multiple circuit boards of each group of hanging baskets 115 need to be lowered into each tank chamber, and then lifted up after completing the relevant operations, and then moved to the next tank chamber. It cannot be moved and requires a large space for the action of the mechanism. Therefore, the longitudinal height of the machine is high (up to 4 meters) and the width is up to 2 meters (if the operator's action platform is included, the width can be up to 4 meters). Although the entire production line can be designed to be enclosed by a casing, the huge production line cannot be effectively closed. If a small fault occurs in the production line, the operation window must be opened to eliminate it. During the process, it is easy for harmful gases in the process to escape, affecting the operator's safety. healthy.

In addition, each tank chamber must accommodate the hanging basket vertically, and allow the liquid to completely soak the circuit board. The required capacity is relatively large. Basically, the liquid required for each tank can reach 500 liters. Therefore, various reactions in the process are required. The demand for tank liquid is large, and the size of the tank body is large and the cost is high. In addition, the disposal of a large amount of waste liquid after production is also a cost burden.

In the back-end process, because the hanging basket that accommodates vertical multi-piece circuit boards is still used to move, in the drying operation after washing, it is easy to leave water stains on the surface of the circuit board after drying, which affects the quality of the circuit board. Therefore, the circuit board It is still necessary to perform post-processing again, that is, to transport each circuit board horizontally separately, and perform operations such as water washing, drying, drying, etc., which increases additional production costs. In conclusion, there are many shortcomings in the conventional methods mentioned above, which need to be improved.

Therefore, the inventor considers whether the conventional process can be analyzed and improved, and expects to propose a better and innovative way to analyze the conventional process, which can be divided into three major parts: pre-processing, deposition process, and post-processing, pre-processing Including: cleaning→water washing→micro-etching→water washing→pickling→water washing. The deposition process includes: pre-dip→activation→water washing→chemical precipitation of nickel→water washing→chemical precipitation gold→water washing. Post-processing includes: washing → drying. For this reason, the inventors of the present invention have considered changing the conventional production mode of hanging a large number of circuit boards in a hanging basket. The present invention adopts the moving production mode one by one. In the pre-processing and post-processing operations, the circuit boards are horizontally sliced one by one. Progressive movement, in the deposition process, the circuit board includes horizontal progressive movement and vertical progressive movement. Relevant equipment can be used in both pre-treatment and post-treatment, but no relevant equipment can be used in the improved deposition process of the present invention, because the deposition reaction takes a long time, such as 20-30 minutes for nickel deposition, and 20 to 30 minutes for deposition of gold. For more than 10 minutes, if the horizontal progressive movement is adopted, the required length and size of the tank body will be very large, and the required amount of chemical reaction solution will be very large, and the cost is too high to be introduced into production. Therefore, the present invention develops a set of applications for the deposition process. The carrier adopts the chemical deposition equipment and method of continuous production one by one, and adopts the vertical type of progressive movement one by one, so that the process of the present invention can run smoothly.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a chemical deposition method and equipment. Mainly in the chemical deposition production operation, the carrier is carried by the circuit board to move in the deposition tank in a vertical chip-by-chip production mode, and the circuit board moves from the initial position to the final position. During the residence time, the metal deposition operation in the deposition reaction tank is completed on the circuit board.

The secondary purpose of the present invention is to provide a kind of chemical deposition method and equipment for producing piece by piece using a carrier, which can be widely used in chemical deposition of nickel, chemical deposition of gold, chemical deposition of copper, chemical deposition of tantalum, chemical deposition of silver, etc. Operation.

In order to achieve the above object, the present invention provides a method for chemical deposition produced one by one using a carrier. The steps include: using a carrier to carry at least one circuit board upright; The chemical deposition reaction is carried out in the reaction tank, and the deposition reaction tank is sequentially provided with an initial position, a plurality of relay positions, and a final position; the carrier is driven by the moving mechanism to sequentially move from the initial position, the plurality of relay positions , move to the final position, and use the circuit board to stay in the deposition reaction tank for a predetermined time to complete the operation of depositing the metal in the deposition reaction tank on the circuit board.

Furthermore, the present invention uses a carrier-by-piece production of chemical deposition equipment, including: a deposition reaction tank, a plurality of carriers, a moving mechanism and two sets of toggle mechanisms, and the deposition reaction tank is provided on the top surfaces of the two tank walls. There is a row of opposite racks, the rack is composed of a plurality of unidirectional helical teeth; the carrier includes a crossbar and two bearing brackets, the two bearing brackets are symmetrically fixed to the horizontal bar, the two bearing brackets There is an opening on the other side of the frame, through which the circuit board is placed, and the carrier is erected in the two opposite one-way helical teeth on both sides of the cross bar; the moving mechanism is installed in the deposition reaction tank The outer wall is responsible for driving the two sets of toggle mechanisms to synchronously reciprocate, and only move one distance of the one-way helical tooth at a time; There is a corresponding toggle member at the side position. When the moving mechanism drives the toggle mechanism to move forward, the toggle member will push the crossbar to slowly rise to the highest point along the slope of the one-way helical tooth. Afterwards, it is dropped into the one-way helical tooth of the next level, and when the moving mechanism drives the toggle mechanism to move backward, the toggle member can be rotated to release the state of being in contact with the cross bar.

The invention is a chemical deposition method and equipment for continuous production piece by piece using a carrier, which is different from the previous production mode that uses a hanging basket type to carry 20 to 60 pieces of circuit boards at a time. For chemical deposition operations, in the pre-dip and activation operations, the circuit board is moved horizontally and gradually, and in the subsequent chemical deposition reaction, it is moved vertically one by one. This design can not only greatly reduce the size of the overall equipment, but also reduce the cost of the equipment, the production speed is fast, and the production quality can be maintained.

In addition, the present invention uses the carrier to continuously produce the chemical deposition equipment piece by piece, which uses the carrier to carry the circuit board to move piece by piece in the chemical deposition tank. The vibration generated by the secondary one-way helical teeth can separate the air bubbles attached to the surface of the circuit board due to the deposition reaction. The vibration of the present invention can effectively eliminate the adhesion of air bubbles for more than 10 times. In addition, the continuous vibration It can also increase the contact between the reaction liquid and the circuit board, and increase the deposition rate, thereby maintaining the production quality, and meeting the purpose of using a carrier to produce piece by piece.

The embodiments of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying the description.

Description of drawings

FIG. 1 is a schematic diagram of a conventional electroless nickel-gold process equipment.

FIG. 2A is a schematic diagram of the deposition process equipment developed by the present invention.

2B is a schematic side view of the circuit board in a moving state in the deposition process equipment of the present invention.

FIG. 2C is a schematic top view of the moving state of the circuit board in the deposition process equipment of the present invention.

FIG. 3 is a flow chart of the operation of the deposition process equipment developed in the present invention.

FIG. 4 is a flow chart of the chemical deposition method for continuous wafer-by- wafer production using a carrier according to the present invention.

FIG. 5 is a perspective view of the chemical deposition equipment for continuous wafer-by- wafer production using a carrier according to the present invention.

FIG. 6 is an exploded view of the chemical deposition equipment for continuous wafer-by- wafer production using a carrier according to the present invention.

FIG. 7 is an enlarged perspective view of the carrier of the present invention.

8 is a partial enlarged perspective view of the moving mechanism and the toggle mechanism of the present invention.

FIG. 9 is a partial enlarged view (1) of the actual operation of the present invention.

FIG. 10 is a partial enlarged view (2) of the actual operation of the present invention.

FIG. 11 is a partial enlarged view (3) of the actual operation of the present invention.

FIG. 12 is a partial enlarged view (4) of the actual operation of the present invention.

Description of reference numbers:

cleaning tank 101

Wash tank 102

Micro-etch tank 103

Wash tank 104

Pickling tank 105

Wash tank 106

Presoak tank 107

swap slot 108

activation tank 109

Electroless Nickel Bath 110

Wash tank 111

Chemical Immersion Gold Tank 112

Wash tank 113

drying tank 114

Gondola 115

Gantry crane 116

Gantry crane 117

Pre-soak tank 20

activation tank 21

Flip Mechanism 22

Electroless nickel bath 23

Wash tank 24

Chemical Immersion Gold Tank 25

Recycled Wash Tank 26

Conveyor 27

Vehicle A

circuit board B

The first transfer mechanism 281

Second transfer mechanism 282

Recycling transfer mechanism 283

Deposition reaction tank 40

groove wall 41

Rack 42

One-way helical 421

Vehicle 50

Crossbar 51

Bracket 52

opening 53

connecting rod 54

Holder 55

Hold Sheet 551

Mobile Mechanism 60

Rail rack 61

Orbit 611

frame 62

Guide wheel 621

The first power piece 63

Actuator 631

toggle mechanism 70

toggle 71

Upper pivot point 711

Lower pivot point 712

Link 72

Second power piece 73

Detailed ways

First, the equipment developed in the deposition process of the present invention will be described. This equipment is used in the electroless nickel-palladium-gold deposition process. The equipment is installed between the pre-processing and post-processing equipment where the circuit boards are progressively moved horizontally. The design spirit of the present invention is to adopt the mode of moving production one by one to complete the circuit board deposition operation.

As shown in FIG. 2A , the deposition process equipment of the present invention includes a pre-soak tank 20 , an activation tank 21 , a turning mechanism 22 , an electroless nickel immersion tank 23 , a plurality of water washing tanks 24 , an electroless gold immersion tank 25 , a recovery tank 25 , and a The water washing tank 26 and the conveying mechanism 27 are provided. A plurality of carriers A, the carrier A is responsible for carrying a circuit board for related chemical deposition operations. It also includes a first transfer mechanism 281, a second transfer mechanism 282, and a recovery cycle transfer mechanism 283. Such transfer mechanisms are responsible for moving the carrier A to the relevant working tank. The movement-related mechanisms are not shown in this figure, and are only represented by schematic blocks. Please also refer to FIG. 2B and FIG. 2C , which are the state of the circuit board B in each tank chamber, wherein the prepreg tank 20 and the activation tank 21 move horizontally and progressively, and then the turning mechanism 22 will be in a horizontal state. Adjust to vertical state. Afterwards, the electroless nickel immersion tank 23, the plurality of water washing tanks 24, the chemical immersion gold tank 25, and the recovery water washing tank 26 are all vertical, and finally the circuit board B after the deposition is completed will be transported to the post-processing equipment by the conveying mechanism 27 in a horizontal state. middle.

As shown in FIG. 3 , it is a flow chart of the operation of the deposition process equipment developed in the present invention. Please refer to FIG. 2A and FIG. 2B together. The steps of the device operating method are as follows:

Step 301 : the circuit boards B one by one enter the prepreg tank 20 in a horizontal manner using conveying rollers in sequence, and perform prepreg treatment before the reaction.

Step 302 : The circuit boards B are sequentially entered into the activation tank 21 in a horizontal manner by means of conveying rollers one by one, so that the bare copper surface of the circuit board is first replaced with a layer of ultra-thin palladium metal.

Step 303: The circuit board B is moved to the turning mechanism 22, and the circuit board B is sent into the carrier A through the rotating clamping unit 221 of the turning mechanism 22; this mechanism is used to change the horizontal moving circuit board B to vertical formula for subsequent chemical deposition operations.

Step 304: The carrier A carries the circuit board B into the electroless nickel tank 23, moves from the initial position on the left to the multiple relay positions in the middle, and finally reaches the final position on the far right. A layer of nickel is deposited on the copper surface. The movement method in the groove adopts a progressive type, that is, it only moves a small distance at a time, and it needs to move several times to move from the initial position to the final position.

Step 305 : The first transfer mechanism 281 lifts and moves the carrier A out of the chemical nickel deposition tank 23 , moves a distance to the right, and then descends and moves it into the water washing tank 24 . The cleaning operation of the circuit board is performed in the water washing tank 24 . Referring to FIG. 2A , the water washing tank 24 includes a plurality of tanks, with a plurality of water washing chambers 241 on the left side and a drip drying chamber 242 on the right side. In the actual operation mode, the first transfer mechanism 281 will lift 5 carriers A at a time, and then move down by only one tank room after rising, so that the carriers A enter the first working room of the washing tank 24 . , and then repeat the movement in sequence. In this embodiment, the first transfer mechanism 281 needs to actuate the carrier A five times before entering the chemical immersion gold tank 25 .

Step 306: The first transfer mechanism 281 moves the carrier A in the washing tank 24 into the chemical immersion tank 25, from the initial position on the left to the middle relay positions, and finally to the final position on the right, so The dwell time causes a layer of gold to deposit on the copper surface of the board. The movement method is progressive, that is, only a small distance is moved at a time, and multiple movements are required to move from the initial position to the final position.

Step 307: The second transfer mechanism 282 lifts the carrier A out of the chemical immersion gold tank 25, moves a distance to the right, and then descends and moves it into the recovery water washing tank 26, so as to clean and recover the reaction gold liquid brought out from the surface of the circuit board, and recover it. The water wash tank 26 also includes a plurality of tanks. The operation mode of the second transfer mechanism 282 is also the same as that of the aforementioned first transfer mechanism 281 .

Step 308 : The carrier A is finally moved closer to the conveying mechanism 27 by the second transfer mechanism 282 , so that the circuit board B is moved from a vertical shape to a horizontal shape one by one to the next operation. After that, washing and drying operations will be carried out in the post-processing equipment. The emptied carrier A will be moved to the electroless nickel immersion tank 23 through the recovery cycle transfer mechanism 283 for the next treatment.

The deposition process equipment and operation method developed by the present invention can greatly reduce the overall equipment size, reduce the equipment cost, reduce the required installation area of the factory, and reduce the equipment investment amount as a whole. In addition, the water consumption, chemical reaction liquid consumption and electricity consumption can be reduced in the production process, the production cost can be reduced, and the product can be more competitive in the market. In addition, the equipment can be closed more effectively, reducing the leakage of harmful gases during production, thereby providing a safer working environment.

In the above-mentioned equipment, the electroless nickel immersion tank 23 and the electroless gold immersion tank 25 are chemical deposition methods in which the carrier is continuously produced one by one, which is different from the previous production mode of using a hanging basket to carry 20 to 60 pieces of circuit boards at a time. Therefore, the present invention designs a chemical deposition equipment and method for continuous production one by one using a carrier, so that it can be applied to the deposition operations of the chemical nickel immersion tank 23 and the chemical gold immersion tank 25 .

As shown in FIG. 4 , the present invention is a flow chart of the chemical deposition method for wafer-by- wafer production using a carrier. Its steps include:

In step 401, at least one circuit board is vertically supported by a carrier;

In step 402, the carrier moves the circuit board into a deposition reaction tank for chemical deposition reaction, and the deposition reaction tank is sequentially provided with an initial position, a plurality of relay positions, and a final position;

In step 403, the carrier is pushed by the moving mechanism to move from the initial position, the plurality of relay positions to the final position in sequence, and the circuit board is used to wait in the deposition reaction tank for time during the process to complete the deposition The operation of depositing metal on the circuit board in the reaction tank.

In addition, when the moving mechanism drives the carrier to move to two adjacent positions, it moves from the lowest point of the previous position to the highest point, and then falls vertically to the next position. The position and the relay position, two adjacent relay positions, and the relay position to the final position. The purpose of this is to generate vibrations and eliminate air bubbles that may adhere to the surface of the circuit board, which are generated by the deposition reaction. In addition, vibration can also increase the contact between the reaction solution and the circuit board, increasing the deposition rate.

The above-mentioned chemical deposition method using the carrier-by-piece continuous production can be designed with many specific equipment to achieve this purpose. Perspective and exploded view of a chemical deposition facility for continuous wafer production. The present invention includes: a deposition reaction tank 40 , a plurality of carriers 50 , a moving mechanism 60 and two sets of toggle mechanisms 70 .

The deposition reaction tank 40 is a rectangular tank body with an upward opening, and a row of oppositely positioned racks 42 are respectively provided on the top surfaces of the two tank walls 41 on the long side. The racks 42 are composed of a plurality of unidirectional helical teeth 421 is formed.

As shown in FIG. 6 , the carrier 50 includes a cross bar 51 and two support frames 52 . The two support frames 52 are symmetrically fixed to the cross bar 51 , and the support frame 52 is partially bent into a hook shape. 52 has an opening 53 on the other side, and the opening 53 can accommodate the circuit board. In actual operation, the carrier 50 is erected on the two opposite one-way helical teeth 421 on both sides of the cross bar 51 (as shown in FIG. 5 ). The carrier 50 further includes a plurality of connecting rods 54, and the connecting rods 54 are transversely coupled between the two support frames 52 to maintain the overall rigidity. In addition, the carrier 50 further includes a holding rod 55 , the holding rod 55 is combined with the bottommost position of the two supporting frames 52 , and the two ends of the holding rod 55 are provided with vertical holding pieces 551 respectively. The distance between the two holding pieces 551 is exactly the width of the largest dimension of the circuit board.

The moving mechanism 60 is installed on the outer wall of the deposition reaction tank 40 , and is responsible for driving the two sets of toggle mechanisms 70 to synchronously reciprocate and move only one distance of the one-way helical tooth 421 each time. The moving mechanism 60 includes a rail frame 61 , a frame 62 and a first power member 63 . The rail frame 61 is annularly arranged and fixed on the outer wall of the deposition reaction tank 40 , that is, fixed on the tank walls 41 on both sides. Two sets of rails 611 are fixed on the rail frame 61 , and the positions of the two sets of rails 611 are respectively located at the outer walls of the long sides of the deposition reaction tank 40 . The frame 62 is a rectangular frame, the size is larger than the size of the deposition reaction tank 40 , and the assembled state is sleeved on the periphery of the deposition reaction tank 40 . Please also refer to FIG. 8 , the bottom of the frame 62 is provided with a plurality of guide wheels 621 , and the guide wheels 621 can run on the rail 611 . The first power member 63 is fixed to the rail frame 61, and a telescopic actuating rod 631 is further provided to combine with the frame 62. In this embodiment, the first power member 63 is a pneumatic cylinder, a hydraulic cylinder, and an electric telescopic rod. one of these institutions. When the first power member 63 is actuated, the actuating rod 631 extends or retracts, thereby driving the frame 62 to perform linear reciprocating movement.

Two sets of toggle mechanisms 70 are located on the outer walls of the two long sides of the frame 62 respectively. Each set of the toggle mechanism 70 includes a plurality of toggle elements 71 , a link piece 72 , and a second power element 73 . Each toggle element 71 has an upper pivot point 711 and a lower pivot point 712 . The upper pivot point 711 Installed and pivoted on the outer wall of the frame 62 , the lower pivot point 712 is installed and pivoted on the link piece 72 , and the link piece 72 is driven by the second power member 73 to generate reciprocating motion. In this embodiment, the second power member 73 is one of a mechanism such as a pneumatic cylinder, an oil hydraulic cylinder, and an electric telescopic rod. As shown in FIG. 5 , the two ends of the transverse rod 51 of the carrier 50 extend out of the deposition reaction tank 40 , and there are respectively a toggle member 71 corresponding thereto. The toggle member 71 is driven by the moving mechanism 60, and each time the toggle member 71 is used to push the cross bar 51 of the carrier 50, so that the cross bar 51 moves from the one-way helical tooth 421 where it is located to the single-stage one-step back. Move toward the helical tooth 421 .

Next, the actual operation method is explained:

As shown in FIG. 9 , for the convenience of explanation, only an enlarged view of the structure of the front left half of the apparatus is provided, and not all of the multiple carriers 50 are placed in the deposition reaction tank 40 . At the beginning of the operation, as described in the previous paragraph, the circuit board will be put into the support frame 52 of the carrier 50 , and the carrier 50 will be put into the deposition reaction tank 40 . The segments are located on the opposite one-way helical teeth 421 , and the two opposite positions of the toggle members 71 correspond to the two ends of the cross bar 51 . In this embodiment, the leftmost one-way helical tooth 421 is the initial position of the carrier 50 in the deposition reaction tank 40 . The subsequent teeth are the relay positions.

As shown in FIG. 10 , the first power member 63 of the moving mechanism 60 is actuated, and the actuating rod 631 is extended, so that the frame 62 translates to the right direction. The toggle member 71 pivotally connected to the frame 62 is driven to toggle to the right. The cross bar 51 is moved along the lowest point of the one-way helical tooth 421 to the highest point.

As shown in FIG. 11 , after the cross bar 51 is dropped from the one-way helical teeth 421 of the first stage to the one-way helical teeth 421 of the next stage. The second power member 73 is actuated to move the link piece 72 to the right. Due to the pivotal connection, the top of the toggle member 71 will be greatly shifted to the left, so that the highest position of the top surface of the toggle member 71 is lower at the lowest position of the one-way helical tooth 421 .

As shown in FIG. 12 , the actuating rod 631 of the first power member 63 is retracted, and the frame 62 is retracted to the starting position. During this process, the toggle member 71 is shifted to the left, so it does not come into contact with the cross bar 51 when moving.

After the frame 62 returns to the initial position, the second power member 73 is actuated again to make the link piece 72 return to the original position, and the state as shown in FIG. 9 can be presented, waiting for another carrier 50 to be put into the deposition reaction tank within 40.

To sum up the above, the present invention uses the chemical deposition equipment produced by the carrier piece by piece, and uses the reciprocating motion generated by the moving mechanism 60 to make the carrier 50 placed in the deposition reaction tank 40 move one unidirectional helical tooth at a time. The distance of 421, thereby gradually moving from the initial position, the multiple relay positions, to the final position, and the time left in the process, the metal deposition operation on the circuit board can be completed. In addition, the vibration generated each time the carrier 50 is dropped to the next-level one-way helical teeth 421 can separate the air bubbles attached to the surface of the circuit board due to the deposition reaction. Eliminate the adhesion of bubbles, and in addition, continuous vibration can also increase the contact between the reaction liquid and the circuit board, increase the deposition rate, thereby maintaining the production quality, and meeting the purpose of using the carrier to produce piece by piece.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change of the present invention should be made under the same creative spirit. , all should still be included in the intended protection scope of the present invention.

Claims (9)

1. a kind of chemical deposition method that utilizes the carrier to pick piece by piece continuous production, its step comprises: Using a carrier to carry at least one circuit board upright; The carrier moves the circuit board into a deposition reaction tank for chemical deposition reaction, and the deposition reaction tank is sequentially provided with an initial position, a plurality of relay positions, and a final position; The carrier is driven by the moving mechanism to move from the initial position, a plurality of relay positions to the final position in sequence, and the circuit board is left in the deposition reaction tank for a predetermined time to complete the metal deposition in the deposition reaction tank work on the circuit board; When the moving mechanism drives the carrier to move to two adjacent positions, it moves from the lowest point of the previous position to the highest point, and then falls vertically to the next position. The two adjacent positions include the initial position from the initial position The position and the relay position, the two adjacent relay positions, and the relay position and the final position. 2. The chemical deposition method using a carrier for continuous production one by one according to claim 1, wherein the deposition reaction tank is respectively provided with a row of opposite racks on the top surfaces of the two tank walls, and the racks are composed of multiple racks. It is composed of two one-way helical teeth, the top of the carrier has a cross bar, the two ends of the cross bar are respectively located in the two one-way helical teeth at opposite positions, and the positions of the plurality of the one-way bevel teeth include the the initial position of the deposition reaction tank, a plurality of the relay positions, and the final position. 3. A chemical deposition equipment for continuous production of wafer-by- wafer using a carrier, comprising: a deposition reaction tank, a row of oppositely positioned racks are respectively provided on the top surfaces of the two opposite tank walls, and the racks are composed of a plurality of unidirectional helical teeth; A plurality of carriers, including a cross bar and two support brackets, the two support brackets are symmetrically fixed to the cross bar, the two support brackets have openings on the other side, the openings are used to put the circuit board, and the carriers are The two sides of the cross bar are erected in the two opposite one-way helical teeth; A moving mechanism, installed on the outer wall of the deposition reaction tank, is responsible for driving two sets of toggle mechanisms to synchronously reciprocate, and only moves one distance of the one-way helical tooth at a time; Two sets of toggle mechanisms, each set of toggle mechanisms includes a plurality of toggle members that can be rotated, and one of the toggle members on both sides of the crossbar corresponds to it. When the moving mechanism drives the toggle When the mechanism moves forward, the toggle will push the crossbar to slowly rise to the highest point along the inclined surface of the one-way helical tooth, and then drop into the one-way helical tooth of the next level. When the moving mechanism drives the one-way helical tooth When the toggle mechanism moves backward, the toggle member can be rotated to release the state of being in contact with the crossbar. 4. The chemical deposition equipment of claim 3, wherein the carrier further comprises a plurality of connecting rods, and the connecting rods are laterally combined between the two supporting frames to maintain the overall rigidity. 5. The chemical deposition equipment for continuous wafer-by-chip production using a carrier according to claim 3, wherein the carrier further comprises a holding rod, the holding rod is combined with the bottommost position of the two supporting frames, and the holding rod is two Each end is provided with a vertical holding piece, and the distance between the two holding pieces is exactly the width of the largest dimension of the circuit board. 6. The chemical deposition equipment of claim 3, wherein the moving mechanism comprises a rail frame, a frame and a first power element, and the rail frame is provided with two sets of rails respectively fixed on the The outer walls on both sides of the deposition reaction tank, the frame is sleeved on the periphery of the deposition reaction tank, and a plurality of guide wheels are arranged at the bottom to run on the track. The first power member is connected with the frame and the track frame, and is responsible for driving The frame produces a linear reciprocating movement. 7 . The chemical deposition equipment of claim 6 , wherein the first power member is one of a pneumatic cylinder, an oil hydraulic cylinder, and an electric telescopic rod. 8. The chemical deposition equipment of claim 6, wherein the two toggle mechanisms are respectively installed on the outer walls of both sides of the frame, and the toggle mechanism further comprises an interlocking piece, a No. Two power elements, each of the toggle elements has an upper pivot point and a lower pivot point, the upper pivot point is pivotally connected to the frame, the lower pivot point is pivotally connected to the link piece, and the link piece receives the first pivot point. The two power elements are driven to generate reciprocating motion. 9 . The chemical deposition equipment of claim 8 , wherein the second power member is one of a pneumatic cylinder, an oil hydraulic cylinder, and an electric telescopic rod.

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