CN103046097B - Wafer processing device - Google Patents
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- CN103046097B CN103046097B CN201210594479.7A CN201210594479A CN103046097B CN 103046097 B CN103046097 B CN 103046097B CN 201210594479 A CN201210594479 A CN 201210594479A CN 103046097 B CN103046097 B CN 103046097B
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Abstract
The invention discloses a kind of wafer processing device, it is characterised in that including: treatment trough, described treatment trough is provided with sealable cavity volume, and described cavity volume is used for holding treatment fluid to process wafer；Capturing lowering or hoisting gear, described crawl lowering or hoisting gear is arranged on described treatment trough side, for being transported in the cavity volume of handled groove by wafer.The wafer processing device that the present invention uses, by capturing lowering or hoisting gear and the automatic operating being implemented in combination with series of processes for the treatment of trough, is greatly improved work efficiency, saves cost of labor, improve production qualification rate.
Description
Technical field
The present invention relates to a kind of wafer processing device, particularly to a kind of self-action wafer processing device.
Background technology
In wafer production process, need to carry out moistening, electroplate, the PROCESS FOR TREATMENT such as etching.Crystal column surface can form blind hole.Gas is easily stored in the blind hole of crystal column surface.If be directly placed in electroplate liquid by the wafer with blind hole, then in blind hole, the gas of remaining can stop electroplate liquid to enter in blind hole.Owing to blind hole size is less, and electroplate liquid surface tension is big, also results in electroplate liquid and is difficult to enter in blind hole.Cannot electroplate in the blind hole of wafer, then can have a strong impact on wafer electroplating quality.Therefore, for improving electroplating quality, need to carry out wafer evacuation to remove the gas in blind hole, and make fountain solution enter in blind hole.Fountain solution in blind hole contributes to electroplate liquid material and enters in blind hole, improves wafer electroplating quality.
And in prior art, the series of processes of wafer processing device all needs manual operation, on the one hand can reduce production efficiency, improve production cost, on the other hand also can cause the damage of wafer because manual operation is improper, drop low production yield.Simultaneously as manual operation causes wafer processing device requisite space big, space availability ratio is low.Another drawback manually-operated is that labor intensity is big, and efficiency is low, it is impossible to meet the needs of large-scale production.Manual operation also results in worker exposure's electroplate liquid and to endanger workman healthy.
Summary of the invention
The invention aims to overcome deficiency of the prior art, it is provided that a kind of wafer processing device easy to use.
For realizing object above, the present invention is achieved through the following technical solutions:
Wafer processing device, it is characterised in that including:
Treatment trough, described treatment trough is provided with sealable cavity volume, and described cavity volume is used for holding treatment fluid to process wafer；
Capturing lowering or hoisting gear, described crawl lowering or hoisting gear is arranged on described treatment trough side, for being transported in the cavity volume of described treatment trough by wafer.
Preferably, described wafer processing device also includes the wafer storage groove for storing wafer.
Preferably, described crawl lowering or hoisting gear includes grabbing device and lowering or hoisting gear；Described grabbing device is connected with lowering or hoisting gear, is used for capturing described wafer storage groove；Described lowering or hoisting gear is liftably arranged, and is used for driving described grabbing device to carry out elevating movement.
Preferably, described lowering or hoisting gear includes:
Fixing substrate；
Lifting drive, described elevator drive machine is arranged on fixing substrate, is used for providing lifting driving force；
First actuating device, described first actuating device is used for transmitting lifting driving force；
Described lifting drive is connected by the first drive with described grabbing device, and lifting drive is lifted by the first actuator drives grabbing device.
Preferably, described lowering or hoisting gear also includes the guider for guiding when grabbing device lifts；Described guider is connected with fixing substrate and grabbing device.
Preferably, described guider includes that guide rail and slide block, described slide block are arranged on guide rail and can be along lifting rail；Described guide rails assembling is on fixing substrate, and described slide block is connected with grabbing device and the first actuating device connects.
Preferably, described number is two, and slide block is two；Arranging a slide block on each guide rail, two slide blocks are all connected with lifting base；Lifting base and the first actuating device connect.
Preferably, described lowering or hoisting gear also includes sensing stopping means, and described sensing stopping means is arranged on described fixing substrate, is used for sensing described grabbing device and whether arrives appointment position, and arrives specific bit at grabbing device and postpone and send the signal of telecommunication.
Preferably, described lifting drive is motor.
Preferably, described first actuating device be in transmission band, driving-chain, travelling gear, feed screw nut any one.
Preferably, described grabbing device includes two handgrips, and said two handgrip can be arranged with moving towards or be moved away from；Said two handgrip clamps described wafer storage groove when moving towards.
Preferably, described grabbing device also includes capturing driving means, and described crawl driving means is connected with handgrip at least one described, drives at least one handgrip to move back and forth.
Preferably, described crawl driving means is the first cylinder；Described first cylinder is provided with first piston bar；At least one described handgrip is connected with the first piston bar of described first cylinder.
Preferably, at least one handgrip described is provided with holding tank, and described holding tank is towards another handgrip.
Preferably, the sidewall of described holding tank is provided with the first guiding surface；Described wafer storage groove is provided with the second guiding surface；Described first guiding surface is corresponding with described second guiding surface.
Preferably, described treatment trough includes cell body and groove lid；Described cell body is provided with cavity volume；Described groove lid is arranged on described cell body upper end cover residence and states cavity volume and can arrange movably relative to described cell body；Described groove lid opens described cavity volume after moving.
Preferably, described groove lid can move relative to cell body and turning be arranged on cell body.
Preferably, described treatment trough also includes that guider, described guider are provided with the gathering sill for limiting groove lid moving direction；Described groove cover back-end is limited moving rail slash by gathering sill and is arranged.
Preferably, described groove cover back-end is provided with guide post, and described guide post one end is connected with groove lid, and the other end is positioned at described gathering sill and can arrange movably along gathering sill.
Preferably, the described guide post other end is provided with clutch shaft bearing, in described clutch shaft bearing is arranged at described gathering sill and rollably can arrange along described gathering sill.
Preferably, also include that groove lid driving means, described groove lid driving means are connected by the second drive with described groove lid, drive described groove lid to move along the track limited relative to described cell body.
Preferably, the driving force of described groove lid driving means output rectilinear direction, linear driving force can be converted to promote described groove cover rim curvilinear path to arrange movably by described second actuating device.
Preferably, described driving means is connected with described groove lid by connecting rod；Described connecting rod one end is rotatably installed on cell body, and the other end is connected with described groove lid front end；Described driving means is connected between described connecting rod two ends, drives described link rotatable.
Preferably, the described connecting rod other end is rotatably coupled with described groove lid front end.
Preferably, described groove lid front end is provided with the cylindrical bar protruding from groove lid；Described connecting rod is rotatably coupled by the second bearing with described cylindrical bar.
Preferably, described gathering sill restriction groove lid moves and arranges to cell body side turningly.
Preferably, described gathering sill includes horizontal guide slot and is vertically directed groove, described in be vertically directed groove and be perpendicular to described process cell body opening surface and stretch downwards；Described horizontal guide slot is connected by arcuate groove with being vertically directed groove.
Preferably, described groove lid driving means is the second cylinder.
Preferably, described wafer storage groove is provided with crawl handle, and described crawl handle top is provided with card-bit part, and described card-bit part highlights described crawl handle top in the horizontal direction.
Preferably, described crawl handle is provided with the second guiding surface.
Wafer processing device in the present invention, by capturing lowering or hoisting gear and the automatic operating being implemented in combination with series of processes for the treatment of trough, is greatly improved work efficiency, saves cost of labor, improve production qualification rate.Capture lowering or hoisting gear and coordinate running by grabbing device and lowering or hoisting gear, avoid the wafer caused during wafer transports because manual operation is improper to damage, improve production efficiency and produce qualification rate, also eliminating worker exposure's electroplate liquid in manual operation simultaneously and endanger the probability that workman is healthy；Wherein, grabbing device relatively manual operation is more stable, improves production stability；Lowering or hoisting gear, can be converted to vertical space by the horizontal space shared by manual operation, reduce production and application space, substantially increase the space availability ratio of process units.Treatment trough uses driver to promote connecting rod to drive groove cover rim to process cell body circumference and opens or close, instead of the manual operation of high intensity, improve work efficiency and produce qualification rate, simultaneously after groove lid fully opens, it is placed in parallel in the external side for the treatment of trough with treatment tank wall, reduce the vertical space taken because groove lid opens, substantially increase the space availability ratio of process units.
Accompanying drawing explanation
Fig. 1 is the wafer processing device perspective view of the present invention.
Fig. 2 is the crawl lowering or hoisting gear perspective view in the present invention.
Fig. 3 is the lowering or hoisting gear perspective view in the present invention.
Fig. 4 is the grabbing device open configuration perspective view in the present invention.
Fig. 5 is the grabbing device closure state perspective view in the present invention.
Fig. 6 is the grabbing device handgrip perspective view in the present invention.
Fig. 7 is the treatment trough closure state perspective view in the present invention.
Fig. 8 is the treatment trough closure state schematic side view in the present invention.
Fig. 9 is the treatment trough open mode perspective view in the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings the present invention is described in detail:
As it is shown in figure 1, wafer processing device, including capturing lowering or hoisting gear 2 and treatment trough 3；Treatment trough 3 is provided with sealable cavity volume 311, and described cavity volume is used for holding treatment fluid to process wafer；Capture lowering or hoisting gear 2 and be arranged on the side for the treatment of trough 3, internal for wafer being transported to cavity volume 311.
As it is shown in figure 1, wafer processing device also includes wafer storage groove 1, for storing wafer, it is achieved wafer carries out batch processing.
As in figure 2 it is shown, be the crawl lowering or hoisting gear 2 of wafer processing device, including lowering or hoisting gear 21 and grabbing device 22；Grabbing device 22 is connected with lowering or hoisting gear 21, and lowering or hoisting gear 21 does liftable and arranges, and drives grabbing device 22 to move up and down.
As it is shown on figure 3, be the lowering or hoisting gear 21 of wafer processing device, including fixing substrate the 218, first actuating device 212 and lifting drive 211；Lifting drive 211 is arranged on fixing substrate 218, is used for providing lifting driving force；Lifting drive 211 is in transmission connection by the first actuating device 212 with grabbing device 22, is used for driving grabbing device to move up and down.Wherein, driving means 211 is motor, and the first actuating device 212 is transmission band, and transmission band one end is connected with motor, and the other end is connected with the fixed pulley 214 being arranged on fixing substrate 218, drives transmission V belt translation by motor.First actuating device also can be selected for driving-chain, travelling gear or feed screw nut and plays gearing.
As it is shown on figure 3, lowering or hoisting gear 21 also includes guider, including guide rail 215 and slide block 219, slide block 219 is arranged on guide rail 215 and can lift along guide rail 215；Described guide rail 215 is installed on fixing substrate 218, slide block 219 be connected with grabbing device 22 and and the first actuating device 212 connect.Its middle guide 215 quantity is two, it is symmetricly set on fixing substrate 218, a slide block 219 it is provided with on each guide rail 215, and two slide block 219 be all connected with lifting base 213, lifting base 213 is connected with the first actuating device 212 by fixture 216, when lifting drive 211 drives the first actuating device 212 to lift transmission, lifting base 213 is followed the first actuating device 212 and is moved up and down together.
As it is shown on figure 3, lowering or hoisting gear 21 also includes sensing stopping means 217, sensing stopping means 217 is arranged on fixing substrate 218, and is in the lower section of lifting base 213, is used for sensing whether lifting base 213 arrives appointment position.Wherein, sensing stopping means 217 is laser range sensor, its Laser emission mouth is concordant with treatment trough 3 edge of opening level, during lifting base 213 moves up and down, measure the vertical distance of lifting base 213 and treatment trough 3 edge of opening in real time, when lifting base 213 liters be down to specific bit put time, send the signal of telecommunication to the control centre of wafer processing device, lifting drive 211 is made to stop driving, thus avoid lifting base 213 to collide with other devices in lifting process, or getaway 215.
As shown in Figure 4, for the grabbing device 22 of wafer processing device, including two handgrips 224, two handgrips 224 can move towards or be moved away from, and clamps wafer storage groove 1 when moving towards.
As shown in Figure 4, grabbing device 22 also includes capturing driving means 222；Capture driving means 222 to be connected with handgrip 224, it is provided that the opening and closing driving force of handgrip 224.
As shown in Figure 4, Figure 5, capturing driving means 222 is the first double-acting cylinder, and is provided with two-way ram bar 223, and two-way ram bar 223 is at least connected with a handgrip 224, is moved towards by the flexible drive handgrip 224 of piston rod 223 or is moved away from.
As it is shown on figure 3, the first double-acting cylinder is fixed in upper arm 221, upper arm 221 is connected with lifting base 213, thus realizes grabbing device 22 and follow lowering or hoisting gear 21 and move up and down.
As shown in Fig. 4, Fig. 6, handgrip 224 is provided with holding tank, and the holding tank of two handgrips 224 is oppositely arranged, and handgrip 224 is provided with the first guiding surface 2241 at holding tank sidewall；Wafer storage groove 1 is provided with second guiding surface 111 corresponding with the first guiding surface 2241, it is ensured that handgrip 224 stablizes grasping silicon wafer storage tank 1 when Guan Bi.
As shown in Fig. 7, Fig. 9, for the treatment trough 3 of wafer processing device, treatment trough 3 includes cell body 31 and groove lid 32；Cell body 31 is provided with cavity volume 311；Groove lid 32 is arranged on cell body 31 upper end and covers cavity volume 311 and can arrange movably relative to cell body 31；Groove lid 32 opens cavity volume 311 after moving；Wherein, groove lid 32 does movement in a curve relative to processing cell body 31, and when fully opening cavity volume 311, groove lid 32 and cell body 31 sidewall are placed in parallel outside cell body 31.
As shown in Fig. 7, Fig. 9, treatment trough 3 also includes that guider 34, guider 34 are provided with the gathering sill 341 for limiting groove lid 32 moving direction；Described groove lid 32 rear end is moved along gathering sill 341.Groove lid 32 rear end is provided with guide post 322, and guide post 322 one end is connected with groove lid 32, and the other end is positioned at gathering sill 341 and can move along gathering sill.Guide post 322 other end is provided with clutch shaft bearing 352, and clutch shaft bearing 352 is arranged in gathering sill 341, and can roll along gathering sill 341.Wherein, clutch shaft bearing 352 is rolling bearing.Gathering sill 341 includes horizontal guide slot 3411, arcuate groove 3413 and is vertically directed groove 3412.Horizontal guide slot 3411 is connected by arcuate groove 3413 with being vertically directed groove 3412.It is vertically directed groove 3412 be perpendicular to cell body 31 cavity volume 311 opening place plane and stretch downwards.
As shown in Figure 8, treatment trough 3 also includes that groove lid driving means 35, groove lid driving means 35 are connected by the second drive with groove lid 32, and driver slot lid 32 moves along the track limited relative to cell body 31.Groove lid driving means 35 exports the driving force F of rectilinear direction, and linear driving force F can be converted to the driving force promoting groove lid 32 to move along curvilinear path by the second actuating device.Wherein, groove lid driving means 35 is the second double-acting cylinder.
As shown in Figure 7, Figure 8, the second actuating device is connecting rod 33, and groove lid driving means 35 is connected with groove lid 32 by connecting rod 33；Connecting rod 33 one end is rotatably installed on cell body 31, and the other end is connected with groove lid 32 front end；Groove lid driving means 35 is connected between 33 connecting rod ends A, B, and drive link 33 rotates.Groove lid 32 front end is provided with the cylindrical bar 321 protruding from groove lid, and connecting rod 33 is rotatably coupled by the second bearing 331 with cylindrical bar 321；Cell body 31 lateral wall is provided with bearing spider 333, and connecting rod 33 is rotatably coupled by the 3rd bearing 332 with cell body 31.Wherein, the second bearing 331 and the 3rd bearing 332 are rolling bearing.
As shown in Figure 8, Figure 9, when groove lid driving means 35 exports the driving force F of rectilinear direction, linear driving force F can be converted to promote groove lid 32 driving force that the track of gathering sill 341 moves along guider 34 by the second actuating device.Groove lid 32, in the moving process of cell body side, is limited by gathering sill 341 and overturns.During until the cavity volume 311 that groove lid 32 moves to cell body 31 fully opens, groove lid 32 turns over and the most parallel with being vertically directed groove 3412 after turning 90 degrees is positioned at cell body 31 side.
As shown in Figure 5, wafer storage groove 1 is provided with crawl handle 11, the top capturing handle 11 is provided with card-bit part 12, card-bit part 12 is prominent in the horizontal direction captures handle 11 top, when handgrip 224 Guan Bi catches crawl handle 11, card-bit part 12 edge held up by handgrip 224 top, it is to avoid handgrip 224 produces relative slip with capturing between handle 11.Wherein, capture handle 11 and be provided with the second guiding surface 111.
Pending wafer is placed in wafer storage groove 1, by above the treatment trough 3 that the transmission belt of automatic production line is transferred in wafer processing device, by the crawl handle 11 on the handgrip 224 grasping silicon wafer storage tank 1 of grabbing device 22, handgrip 224 is respectively equipped with the first corresponding guiding surface 2241 and the second guiding surface 111 with capturing on handle 11, make handgrip 224 when grasping silicon wafer storage tank 1, can steady closure, it is ensured that the stability of wafer.After grabbing device 22 grasping silicon wafer storing unit 1, grabbing device 22 is driven to do descending motion by lowering or hoisting gear 21, and sense whether wafer storage groove drops to process bottom the cavity volume 311 of cell body 31 by sensing stopping means 217, if arriving, sensing stopping means 217 sends the signal of telecommunication to treatment trough control centre, order lifting drive stops driving, and thus avoids wafer storage groove 1 and collides with other devices during declining and cause damage；After wafer storage groove 1 is down to safely bottom cavity volume 311, handgrip 224 opens disengaging and captures handle 11, and lowering or hoisting gear 21 drives grabbing device 22 to rise to wafer processing device top.After grabbing device 22 rises to wafer processing device top, groove lid driving means 35 drive link 33 for the treatment of trough 3 inwardly rotates, and makes the groove lid 32 being placed in parallel with cell body 31 sidewall move along gathering sill 341 circumference, the opening of Guan Bi cavity volume 311, encapsulation process cell body 31, and start wafer is processed；After treating wafer-process, groove lid driving means 35 drive link 33 is turned out, thus drive groove lid 32 to move along gathering sill 341 circumference, finally open cavity volume 311 opening, and make groove lid 32 and cell body 31 sidewall be placed in parallel in outside cell body 31, save the vertical space taken when groove lid 32 is opened, improve the space availability ratio of wafer processing device；Simultaneously, connecting rod is equipped with rolling bearing with the junction of groove lid 32, the junction of cell body 31 and groove lid 32 with gathering sill 341 so that groove lid 32 resistance during opening Guan Bi reduces, and moves more unobstructed, improve work efficiency, extend the service life for the treatment of trough 3.After cavity volume 311 fully opens, lowering or hoisting gear 21 drives grabbing device 22 to decline and grasping silicon wafer storage tank 1 again, the wafer being disposed is lifted out cavity volume 311, and is transmitted to next process by the transmission belt of automatic production line.A working cycle to this wafer processing device completes, and automatically into the subsequent work cycle.
Embodiment in the present invention is only used for that the present invention will be described, is not intended that the restriction to right, those skilled in that art it is contemplated that other replacements being substantially equal to, all in scope.
Claims (26)
1. wafer processing device, it is characterised in that including:
Treatment trough, described treatment trough is provided with sealable cavity volume, and described cavity volume is used for holding treatment fluid to process wafer；
Capturing lowering or hoisting gear, described crawl lowering or hoisting gear is arranged on described treatment trough side, for being transported in the cavity volume of described treatment trough by wafer；
Wafer storage groove；Described wafer storage groove is used for storing wafer；Described wafer storage groove is provided with crawl handle, and described crawl handle top is provided with card-bit part, and described card-bit part highlights described crawl handle top in the horizontal direction；
Described crawl lowering or hoisting gear includes grabbing device and lowering or hoisting gear；Described grabbing device is connected with lowering or hoisting gear, is used for capturing described wafer storage groove；Described lowering or hoisting gear is liftably arranged, and is used for driving described grabbing device to carry out elevating movement；
Described grabbing device includes two handgrips, and said two handgrip can be arranged with moving towards or be moved away from；Said two handgrip clamps the crawl handle of described wafer storage groove when moving towards.
Wafer processing device the most according to claim 1, it is characterised in that described lowering or hoisting gear includes:
Fixing substrate；
Lifting drive, described elevator drive machine is arranged on fixing substrate, is used for providing lifting driving force；
First actuating device, described first actuating device is used for transmitting lifting driving force；
Described lifting drive is connected by the first drive with described grabbing device, and lifting drive is lifted by the first actuator drives grabbing device.
Wafer processing device the most according to claim 2, it is characterised in that described lowering or hoisting gear also includes the guider for guiding when grabbing device lifts；Described guider is connected with fixing substrate and grabbing device.
Wafer processing device the most according to claim 3, it is characterised in that described guider includes that guide rail and slide block, described slide block are arranged on guide rail and can be along lifting rail；Described guide rails assembling is on fixing substrate, and described slide block is connected with grabbing device and the first actuating device connects.
Wafer processing device the most according to claim 4, it is characterised in that described number is two, slide block is two；Arranging a slide block on each guide rail, two slide blocks are all connected with lifting base；Lifting base and the first actuating device connect.
Wafer processing device the most according to claim 2, it is characterized in that, described lowering or hoisting gear also includes sensing stopping means, described sensing stopping means is arranged on described fixing substrate, whether arrive appointment position for sensing described grabbing device, and arrive specific bit at described grabbing device and postpone and send the signal of telecommunication.
Wafer processing device the most according to claim 2, it is characterised in that described lifting drive is motor.
Wafer processing device the most according to claim 2, it is characterised in that described first actuating device be in transmission band, driving-chain, travelling gear, feed screw nut any one.
Wafer processing device the most according to claim 1, it is characterised in that described grabbing device also includes capturing driving means, and described crawl driving means is connected with handgrip at least one described, drives at least one described handgrip to move back and forth.
Wafer processing device the most according to claim 9, it is characterised in that described crawl driving means is the first cylinder；Described first cylinder is provided with first piston bar；At least one described handgrip is connected with the first piston bar of described first cylinder.
11. wafer processing devices according to claim 9, it is characterised in that at least one described handgrip is provided with holding tank, and described holding tank is towards another handgrip.
12. wafer processing devices according to claim 11, it is characterised in that the sidewall of described holding tank is provided with the first guiding surface；Described wafer storage groove is provided with the second guiding surface；Described first guiding surface is corresponding with described second guiding surface.
13. wafer processing devices according to claim 1, it is characterised in that described treatment trough includes cell body and groove lid；Described cell body is provided with cavity volume；Described groove lid is arranged on described cell body upper end cover residence and states cavity volume and can arrange movably relative to described cell body；Described groove lid opens described cavity volume after moving.
14. wafer processing devices according to claim 13, it is characterised in that described groove lid can move relative to cell body and turning be arranged on cell body.
15. wafer processing devices according to claim 14, it is characterised in that described treatment trough also includes that guider, described guider are provided with the gathering sill for limiting groove lid moving direction；Described groove cover back-end is limited moving rail slash by gathering sill and is arranged.
16. wafer processing devices according to claim 15, it is characterised in that described groove cover back-end is provided with guide post, described guide post one end is connected with groove lid, and the other end is positioned at described gathering sill and can arrange movably along gathering sill.
17. wafer processing devices according to claim 16, it is characterised in that the described guide post other end is provided with clutch shaft bearing, described clutch shaft bearing is arranged in described gathering sill and rollably can arrange along described gathering sill.
18. wafer processing devices according to claim 14, it is characterised in that also include that groove lid driving means, described groove lid driving means are connected by the second drive with described groove lid, drive described groove lid to move along the track limited relative to described cell body.
19. wafer processing devices according to claim 18, it is characterised in that the driving force of described groove lid driving means output rectilinear direction, linear driving force can be converted to promote described groove cover rim curvilinear path to arrange movably by described second actuating device.
20. wafer processing devices according to claim 19, it is characterised in that described driving means is connected with described groove lid by connecting rod；Described connecting rod one end is rotatably installed on cell body, and the other end is connected with described groove lid front end；Described driving means is connected between described connecting rod two ends, drives described link rotatable.
21. wafer processing devices according to claim 20, it is characterised in that the described connecting rod other end is rotatably coupled with described groove lid front end.
22. wafer processing devices according to claim 21, it is characterised in that described groove lid front end is provided with the cylindrical bar protruding from groove lid；Described connecting rod is rotatably coupled by the second bearing with described cylindrical bar.
23. wafer processing devices according to claim 19, it is characterised in that also include that gathering sill, described gathering sill restriction groove lid move and arrange to cell body side turningly.
24. wafer processing devices according to claim 23, it is characterised in that described gathering sill includes horizontal guide slot and is vertically directed groove, described in be vertically directed groove and be perpendicular to described process cell body opening surface and stretch downwards；Described horizontal guide slot is connected by arcuate groove with being vertically directed groove.
25. wafer processing devices according to claim 18, it is characterised in that described groove lid driving means is the second cylinder.
26. wafer processing devices according to claim 1, it is characterised in that described crawl handle is provided with the second guiding surface.
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| CN106783710B (en) * | 2016-12-31 | 2024-01-12 | 上海新阳半导体材料股份有限公司 | Wafer transfer device |
| CN107699927B (en) * | 2017-09-26 | 2019-08-09 | 宿迁锦瑞电子科技有限公司 | A kind of automobile audio signal wire plug lift plating apparatus |
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| CN109877724B (en) * | 2019-02-27 | 2022-02-25 | 武汉新芯集成电路制造有限公司 | Wafer taking-out device |
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| CN110164797A (en) * | 2019-05-27 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer dehydration device and equipment |
| CN112981506A (en) * | 2021-02-09 | 2021-06-18 | 苏州晶洲装备科技有限公司 | Electrochemical deposition equipment |
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