JPH0776798A - Work dissipation preventive mechanism of chip work transfer device - Google Patents

Work dissipation preventive mechanism of chip work transfer device

Info

Publication number
JPH0776798A
JPH0776798A JP22609693A JP22609693A JPH0776798A JP H0776798 A JPH0776798 A JP H0776798A JP 22609693 A JP22609693 A JP 22609693A JP 22609693 A JP22609693 A JP 22609693A JP H0776798 A JPH0776798 A JP H0776798A
Authority
JP
Japan
Prior art keywords
work
barrel
chip
dissipation
drying cage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22609693A
Other languages
Japanese (ja)
Other versions
JP3256351B2 (en
Inventor
Tadashi Kiyokawa
忠 清川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kiyokawa Plating Industries Co Ltd
Original Assignee
Kiyokawa Plating Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kiyokawa Plating Industries Co Ltd filed Critical Kiyokawa Plating Industries Co Ltd
Priority to JP22609693A priority Critical patent/JP3256351B2/en
Publication of JPH0776798A publication Critical patent/JPH0776798A/en
Application granted granted Critical
Publication of JP3256351B2 publication Critical patent/JP3256351B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To provide the work dissipation preventive mechanism capable of preventing the dissipation of the chip works generated at the time of transferring the microworks, such as chip resistors, from an electroplating barrel to a drying cage. CONSTITUTION:The lower mouth part of a funnel body 2 for guiding the chip works dropping underwater from the barrel A to the drying cage B is provided with a flange 12a stuck with a gasket 12b on the rear surface. A drying cage placing section 13 is provided with a stage 13a supported by spring members 13b. The rising of the stage 13a is stopped at a prescribed level position by pawl members 21 fixed to the upper part of a water tank 2 when the drying cage placing section 13 rises from the water tank 2 and arrives at the uppermost position. As a result, the lower mouth part of the funnel body and the mouth part of the drying cage come into close and tight contact with each other in the water where the works are liable to splash and, therefore, the dissipation of the works outside the drying cage is completely prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、チップワーク移替え装
置の改良、詳しくは、チップ抵抗器等の微小なワークを
例えば電気めっきバレルから乾燥かごへ移替える際に発
生するチップワークの散逸を防止することができるワー
ク散逸防止機構を備えたチップワーク移替え装置に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a chip work transfer device, and more particularly, to a chip work dissipation generated when transferring a minute work such as a chip resistor from an electroplating barrel to a dry basket. The present invention relates to a chip work transfer device having a work dissipation prevention mechanism that can prevent the work.

【0002】[0002]

【従来の技術】チップ抵抗器など微小なワークのめっき
処理には、バレルめっき法が採用される。チップワーク
を多数個、セラミック球や鋼球等(ダミー)と共に円筒
状容器(バレル)に投入し、このバレル毎にめっき各処
理を行なうという方法である。バレルを用いることでめ
っき処理する際の微小ワークの取扱いが頗る容易になる
わけであるが、ただ、ワークを洗浄した後の乾燥処理時
には、必ずワーク及びダミーをバレルから乾燥処理専用
のかごへ移替える作業を行なわねばならない。バレルは
絶縁性の合成樹脂で作られており、これを余り長く高温
に曝すわけにはいかないからである。
2. Description of the Related Art Barrel plating is used for plating minute works such as chip resistors. In this method, a large number of chip works are placed in a cylindrical container (barrel) together with ceramic balls, steel balls, etc. (dummy), and each plating process is performed for each barrel. The use of the barrel makes it very easy to handle small workpieces during plating.However, when drying after cleaning the workpieces, be sure to move the workpieces and dummy from the barrel to the basket for drying. You have to do a replacement. The barrel is made of insulating synthetic resin and cannot be exposed to high temperatures for too long.

【0003】現在、めっき処理のオートメーション化に
より、チップワークの移替え作業を自動的に行なう移替
え装置が開発されている。この移替え装置は、ワーク及
びダミーを、水中において、バレルから自由落下させ、
下方にセットした乾燥かごへ移替えるというものであ
り、空気中では濡れたワーク及びダミーがバレル内壁に
付着してスムーズな移替えができなくなるため、移替え
作業全体を水中で行なうようにしている。
At present, a transfer device for automatically transferring a chip work has been developed by automating a plating process. This transfer device allows the workpiece and dummy to fall freely from the barrel in water,
It is to transfer to the dry basket set below.Since wet work and dummy adhere to the inner wall of the barrel in the air and smooth transfer cannot be performed, the entire transfer work is performed underwater. .

【0004】この水中移替えによって、チップワーク移
替え作業の能率は確かに向上した。しかし、従来の移替
え装置には、この水中移替え方式を採用したことに伴
い、次のような新たな問題が生じたのである。
This underwater transfer certainly improved the efficiency of the chip work transfer work. However, the following new problems have arisen in the conventional transfer device due to the adoption of this underwater transfer method.

【0005】即ち、図1に示すように、ワーク及びダミ
ーが乾燥かごBへ水中落下するのに伴い発生する水流C
が、逆にチップワークを煽り、一旦乾燥かごB内に落ち
たチップワークをも乾燥かごB外へ飛散させてしまうと
いう散乱の問題である。チップワークとダミーの大きさ
が同程度である場合は、この落下水流による影響も少な
い。しかし、バレル内の攪拌効果を主目的とするセラミ
ック製ダミーなどでは直径が1cmに及ぶものもあり、
この攪拌用セラミック製ダミーを、例えばチップ抵抗器
(0.5mm 程度)等のバレルめっき処理に用いる場合で
は、上記水流により乾燥かごから噴き出て散逸してしま
うチップワークはもはや看過できる量ではなくなり、大
量生産を進めていくためにも、このチップワーク散逸の
問題を早急に解決する必要があった。
That is, as shown in FIG. 1, a water flow C generated as a work and a dummy fall into the dry basket B underwater.
However, on the contrary, there is a scattering problem in which the chipwork is fueled and the chipwork once dropped inside the dry basket B is scattered outside the dry basket B. When the size of the tip work and the size of the dummy are about the same, the influence of this falling water flow is small. However, some ceramic dummies whose main purpose is the stirring effect in the barrel have a diameter of 1 cm,
When this agitating ceramic dummy is used for barrel plating of chip resistors (about 0.5 mm, etc.), the amount of chipwork spouted out of the dry basket due to the water flow is no longer overlookable, In order to proceed with mass production, it was necessary to urgently solve the problem of chip work dissipation.

【0006】[0006]

【解決すべき技術的課題】本発明は、従来の移替え装置
に上記のような問題があったことに鑑みて為されたもの
であり、チップワーク及びダミーの水中移替え作業時に
発生するチップワーク散逸を防止することのできる移替
え装置のワーク散逸防止機構を提供することを技術的課
題とするものである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the conventional transfer device, and a chip generated during a submerged transfer work of a chip work and a dummy. It is a technical object to provide a work dissipation prevention mechanism of a transfer device capable of preventing work dissipation.

【0007】[0007]

【課題解決のために採用した手段】本発明は、バレルを
着脱自在に軸支するバレル軸支部と;前記バレルから落
下するチップワーク及びダミーを下方に設置せる乾燥か
ごへと案内する漏斗体と;前記乾燥かごを着脱自在に載
置する乾燥かご載置部と;がそれぞれ設けてあり、水槽
に対して昇降運動を行なう昇降フレームを含むチップワ
ーク移替え装置において、前記漏斗体の下口部には下面
にパッキンを貼設したフランジを、前記乾燥かご載置部
上にはバネ体にて支持される載置台を各々設け、昇降フ
レームが水槽から上昇し上昇最高位置に到達したとき、
前記水槽上部に固定された爪部材が、前記載置台を係止
して前記バネ体の付勢力に抗し当該載置台の上昇を所定
レベル位置に制止するという技術的手段を採用した。
DISCLOSURE OF THE INVENTION The present invention is directed to a barrel shaft supporting portion for detachably supporting a barrel; and a funnel body for guiding a chip work falling from the barrel and a dummy to a drying basket installed below. A bottom part of the funnel body in a chipwork transfer device including: a drying basket mounting part for detachably mounting the drying basket; and a lifting frame for performing a lifting motion with respect to a water tank. A flange with a packing attached to the lower surface is provided on each of the dry basket placement parts, and a loading platform supported by a spring body is provided on the dry basket placement part.When the lifting frame rises from the water tank and reaches the maximum rising position,
A technical means is adopted in which the claw member fixed to the upper part of the water tank locks the mounting table to resist the urging force of the spring body and stop the rising of the mounting table at a predetermined level position.

【0008】[0008]

【実施例】以下、本発明を添付図面に示す実施例に基づ
いて説明する。なお、図1は水中移替え時に発生するワ
ーク散逸の様子を表す概略説明図、図2、図3は本実施
例ワーク散逸防止機構を備えた移替え装置の構成および
作動順序を説明する概略正面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in the accompanying drawings. Note that FIG. 1 is a schematic explanatory view showing a state of work dissipation that occurs at the time of underwater transfer, and FIGS. 2 and 3 are schematic front views for explaining the configuration and operation sequence of a transfer device having a work dissipation prevention mechanism of this embodiment. It is a figure.

【0009】図中、符号1で指示するものは、本実施例
チップワーク移替え装置の昇降フレームである。ほぼ箱
型を為すこの昇降フレーム1には、上方から順に、バレ
ルAを着脱自在に軸支するバレル軸支部11・11と、軸支
されたバレルAより水中落下するワーク及びダミーを下
方の乾燥かごBへと案内する漏斗体12と、乾燥かごBを
着脱自在に載置する乾燥かご載置部13とがそれぞれ設け
てある。そして、この昇降フレーム1は、その最上部に
おいて、図示しないモータにより上下動する駆動チェー
ン14・14に固定されており、この駆動チェーン14・14の
駆動によって、昇降フレーム1は水槽2内へ浸漬され、
或いは水槽2内から引き上げられる。
In the figure, what is designated by reference numeral 1 is an elevating frame of the chip work transfer device of this embodiment. In this elevating frame 1 having a substantially box shape, in order from above, a barrel shaft supporting portion 11 and 11 for detachably supporting the barrel A, and a work and a dummy that fall underwater from the supported barrel A are dried below. A funnel body 12 for guiding to the car B and a dry car mounting portion 13 for detachably mounting the dry car B are respectively provided. The elevating frame 1 is fixed at its uppermost portion to drive chains 14 and 14 that move up and down by a motor (not shown), and the elevating frame 1 is immersed in the water tank 2 by driving the drive chains 14 and 14. Is
Alternatively, it is pulled up from the water tank 2.

【0010】以上の構成は、従来のチップワーク移替え
装置と変わるところはない。本発明ワーク散逸防止機構
は、以下のように構成されている。
The above construction is no different from the conventional chip work transfer device. The work dissipation prevention mechanism of the present invention is configured as follows.

【0011】図中、符号12aで指示するものは、前記漏
斗体12の下口部分に設けた環状フランジであり、このフ
ランジ12aの下面にはゴム製パッキン12bが貼設してあ
る。また、符号13aで指示するものは、前記乾燥かご載
置部13の上に突設された4本のスプリングバネ体13b・
13b・13b・13bにて支持された載置台であり、この載
置台13aには、乾燥かごBの着脱を容易にするためのガ
イド板13cが設置してある。本実施装置にあっては、乾
燥かごBを、載置台13aを介して乾燥かご載置部13にセ
ットするように構成しているのである。また、符号21・
21で指示するものは、水槽2の上縁に固定された爪部材
であり、この爪部材21・21は、前記載置台13aをその縁
部において係止するように設けてある。
In the figure, what is indicated by reference numeral 12a is an annular flange provided at the lower opening portion of the funnel body 12, and a rubber packing 12b is attached to the lower surface of this flange 12a. Further, what is indicated by the reference numeral 13a is four spring spring bodies 13b, which are provided so as to project on the dry basket placing portion 13.
It is a mounting table supported by 13b, 13b and 13b, and the mounting table 13a is provided with a guide plate 13c for facilitating attachment and detachment of the dry basket B. In the present embodiment, the dry car B is set on the dry car mounting portion 13 via the mounting table 13a. Also, reference numeral 21
What is designated by 21 is a claw member fixed to the upper edge of the water tank 2, and these claw members 21, 21 are provided so as to lock the mounting table 13a at the edge thereof.

【0012】本実施例ワーク散逸防止機構は、以上のよ
うな至極シンプルな構成を採っており、上述した昇降フ
レーム1の昇降運動を巧みに利用して略完全にワーク散
逸を防止することができる。図2、図3を参照しながら
本実施例ワーク散逸防止機構の作動順序を説明する。
The work dissipation prevention mechanism of this embodiment adopts the extremely simple construction as described above, and can effectively prevent the work dissipation by skillfully utilizing the elevating motion of the elevating frame 1 described above. . The operation sequence of the workpiece dissipation prevention mechanism of this embodiment will be described with reference to FIGS.

【0013】図2は、昇降フレーム1が上昇最高位置に
まで上昇し停止した状態を図示している。このとき、前
記爪部材21・21は、バネ体13b・13b・13b・13bを押
し縮めつつ載置台13aを係止している。昇降フレーム1
と共に上昇移動してきた載置台13aが、フレーム上昇最
高位置付近で爪部材21・21と当接することによってその
上昇が制止されるのに対し、昇降フレーム1の方は、し
ばらくの間、なおも上昇し続けるため、バネ体13bが押
し縮められるのである。
FIG. 2 shows a state in which the elevating frame 1 is raised to the highest rising position and stopped. At this time, the claw members 21, 21 lock the mounting table 13a while compressing the spring bodies 13b, 13b, 13b, 13b. Lifting frame 1
While the mounting table 13a that has moved upward together with the claw members 21 and 21 abuts near the frame rising maximum position, the lifting is stopped, whereas the lifting frame 1 is still raised for a while. Therefore, the spring body 13b is compressed in order to continue.

【0014】この状態において、バレルAと、乾燥かご
Bとがそれぞれセットされる。爪部材21・21の係止によ
りバネ体13bが押し縮められているため、載置台13aと
フランジ12aとの間隔は拡大している。従って、乾燥か
ごBの載置台13aへのセットは頗る簡単に行なうことが
できる。そして、バレルAと乾燥かごBとがセットされ
た後、水中移替えを行なうべく昇降フレーム1が降下を
開始する。
In this state, the barrel A and the dry basket B are set respectively. Since the spring body 13b is compressed by the engagement of the claw members 21, 21, the distance between the mounting table 13a and the flange 12a is enlarged. Therefore, the setting of the dry basket B on the mounting table 13a can be performed very easily. Then, after the barrel A and the dry basket B are set, the elevating frame 1 starts descending to perform the underwater transfer.

【0015】昇降フレーム1の水槽内2への浸漬が開始
されても、しばらくの間は、爪部材21・21は載置台13a
を係止し続ける。圧縮されていたバネ体13bが、載置台
13aを上方へ付勢しながら、伸長していくからである。
このバネ体13bが伸長することにより、載置台13aとフ
ランジ12aとの間隔は狭くなっていくわけであるが、載
置台13aには乾燥かごBがセットしてあり、この乾燥か
ごBの口部がフランジ12aに、パッキン12bを介して、
当接し更に密着したところで、バネ体13bの伸長が止ま
る。バネ体13bの伸長が停止したこの時点から、載置台
13aは、これまで当接していた爪部材21・21と離別し、
昇降フレーム1と共に水槽2へ降下していくのである。
Even if the immersion of the elevating frame 1 into the water tank 2 is started, the claw members 21, 21 remain on the mounting table 13a for a while.
Continue to lock. The compressed spring body 13b is used as a mounting table.
This is because it is extended while urging 13a upward.
As the spring body 13b extends, the distance between the mounting table 13a and the flange 12a becomes narrower, but the dry basket B is set on the mounting table 13a, and the mouth of the dry basket B is set. To the flange 12a via the packing 12b,
The extension of the spring body 13b stops at the point of contact and further close contact. From this time when the extension of the spring body 13b stops, the mounting table
13a is separated from the claw members 21, 21 which have been in contact with each other until now,
It descends to the water tank 2 together with the lifting frame 1.

【0016】図3は昇降フレーム1が最低位置にまで降
下し停止した状態を図示している。この状態で、バレル
軸支部11・11に軸支したバレルAを、図示しないバレル
モータにより所定の角度、回転せしめ、チップワーク及
びダミーを水中落下させるのである。本実施例装置にお
いても、ワーク及びダミーの落下によって散逸水流は発
生する。しかし、本実施例装置の場合、バネ体13bの付
勢力により乾燥かごBと漏斗体12とは隙間なく密着して
いるので、チップワークが水流に煽られても、上方に向
かって開いた形状を為す漏斗体12の内側に飛散するだけ
であり、この飛散ワークも、いずれ漏斗体12内壁に沿っ
て、自然に乾燥かごBへ落下して納まるのである。
FIG. 3 shows a state in which the elevating frame 1 is lowered to the lowest position and stopped. In this state, the barrel A rotatably supported by the barrel shaft support 11, 11 is rotated by a barrel motor (not shown) at a predetermined angle to drop the chip work and the dummy underwater. Also in the apparatus of this embodiment, the dissipated water flow is generated by the dropping of the work and the dummy. However, in the case of the apparatus of this embodiment, the dry basket B and the funnel body 12 are in close contact with each other due to the urging force of the spring body 13b, so that even if the tip work is agitated by the water flow, the shape opened upwards. It only scatters inside the funnel body 12 that makes up, and this scattered work will eventually fall along the inner wall of the funnel body 12 into the dry basket B and be settled.

【0017】また、ワーク及びダミーの移替えが終了し
た後、昇降フレーム1は上昇移動を開始する。この際、
たとえ乾燥かごB内において昇降フレーム1の上昇移動
に伴う水流が生じたとしても、乾燥かごBと漏斗体12と
は密着したままなので、チップワークが乾燥かごB外に
飛散し散逸することはない。
After the transfer of the work and the dummy is completed, the elevating frame 1 starts to move upward. On this occasion,
Even if a water flow occurs due to the ascending / descending movement of the elevating frame 1 in the dry basket B, the dry basket B and the funnel body 12 remain in close contact with each other, so that the tip work is not scattered outside the dry basket B and scattered. .

【0018】[0018]

【本発明の効果】以上、実施例をもって説明したとお
り、本発明チップワーク散逸防止機構を備えた移替え装
置は、例えば大径ダミーの水中落下や昇降フレームの上
昇移動等に伴う水流によりワークが飛散しやすい水中に
おいては、漏斗体の下口部と乾燥かご口とが隙間なく密
着するので、乾燥かご外へのワーク散逸を防止すること
ができ、また、水流の影響が無く、バレル及び乾燥かご
の着脱交換の必要がある空気中においては、漏斗体の下
口部と乾燥かご口との密着が自動的に解かれるので、乾
燥かごの交換作業を頗る簡単に行なうことができる。
As described above with reference to the embodiments, in the transfer device provided with the chip work dissipation prevention mechanism of the present invention, for example, the work is caused by the water flow caused by the large-diameter dummy being dropped in water or the lifting frame being moved upward. In water that easily scatters, the bottom of the funnel and the mouth of the dry basket are in close contact with each other without any gaps, so it is possible to prevent the work from being scattered out of the dry basket. In the air where it is necessary to attach / detach and replace the car, the close contact between the lower part of the funnel body and the dry car port is automatically released, so that the dry car can be replaced easily.

【0019】さらに、本発明チップワーク散逸防止機構
にあっては、上記のような漏斗体の下口部と乾燥かご口
との密着、離脱動作を、昇降フレームの昇降動力を巧み
に利用することにより行なっている。したがって、機構
の複雑化を伴うことなく至極シンプルに装置を構成する
ことができるため、本装置を安価に提供することが可能
となり、産業上の利用価値は頗る高いものがある。
Further, in the chip work dissipation prevention mechanism of the present invention, the above-mentioned close contact and separation operation between the lower opening portion of the funnel body and the dry basket opening is skillfully utilized by the lifting power of the lifting frame. It is done by. Therefore, since the device can be configured extremely simply without complicating the mechanism, the device can be provided at low cost, and its industrial utility value is extremely high.

【図面の簡単な説明】[Brief description of drawings]

【図1】水中移替え時に発生するワーク散逸の様子を表
す概略説明図である。
FIG. 1 is a schematic explanatory view showing how a work is dissipated during an underwater transfer.

【図2】本実施例ワーク散逸防止機構を備えた移替え装
置の構成および作動順序を説明する概略正面図である。
FIG. 2 is a schematic front view illustrating the configuration and operation sequence of a transfer device having a work dissipation prevention mechanism according to the present embodiment.

【図3】本実施例ワーク散逸防止機構を備えた移替え装
置の構成および作動順序を説明する概略正面図である。
FIG. 3 is a schematic front view illustrating the configuration and operation sequence of a transfer device having a work dissipation prevention mechanism according to the present embodiment.

【符号の説明】[Explanation of symbols]

A バレル B 乾燥かご 1 昇降フレーム 11 バレル軸支部 12 漏斗体 12a フランジ 12b パッキン 13 乾燥かご載置部 13a 載置台 13b バネ体 2 水槽 21 爪部材 A Barrel B Dry basket 1 Lifting frame 11 Barrel shaft support 12 Funnel body 12a Flange 12b Packing 13 Dry basket placement part 13a Placement stand 13b Spring body 2 Water tank 21 Claw member

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 バレルAを着脱自在に軸支するバレル軸
支部11と;前記バレルAから落下するチップワークおよ
びダミーを下方に設置せる乾燥かごBへと案内する漏斗
体12と;前記乾燥かごBを着脱自在に載置する乾燥かご
載置部13と;がそれぞれ設けてあり水槽2に対して昇降
運動を行なう昇降フレーム1を含むチップワーク移替え
装置において、 前記漏斗体12の下口部には下面にパッキン12bを貼設し
たフランジ12aを、前記乾燥かご載置部13上にはバネ体
13b・13b…にて支持される載置台13aを各々設け、昇
降フレーム1が水槽2から上昇し上昇最高位置に到達し
たとき、前記水槽2上部に固定された爪部材21が、前記
載置台13aを係止して前記バネ体13b・13b…の付勢力
に抗し当該載置台13aの上昇を所定レベル位置に制止す
ることを特徴とするチップワーク移替え装置におけるワ
ーク散逸防止機構。
1. A barrel shaft support portion 11 for detachably supporting a barrel A; a funnel body 12 for guiding a chip work falling from the barrel A and a dummy to a dry basket B on which a dummy is installed; and the dry basket. In a chipwork transfer device including a lifting frame 1 for lifting and lowering a water tank 2, each of which is provided with a dry basket loading part 13 for detachably mounting B, and a lower opening part of the funnel body 12. A flange 12a having a packing 12b attached to the lower surface thereof, and a spring body on the dry basket placement portion 13
The mounting bases 13a supported by 13b, 13b ... , And prevents the rising of the mounting table 13a at a predetermined level position against the biasing force of the spring bodies 13b, 13b ...
JP22609693A 1993-09-10 1993-09-10 Work dissipation prevention mechanism in chip work transfer equipment Expired - Lifetime JP3256351B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22609693A JP3256351B2 (en) 1993-09-10 1993-09-10 Work dissipation prevention mechanism in chip work transfer equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22609693A JP3256351B2 (en) 1993-09-10 1993-09-10 Work dissipation prevention mechanism in chip work transfer equipment

Publications (2)

Publication Number Publication Date
JPH0776798A true JPH0776798A (en) 1995-03-20
JP3256351B2 JP3256351B2 (en) 2002-02-12

Family

ID=16839765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22609693A Expired - Lifetime JP3256351B2 (en) 1993-09-10 1993-09-10 Work dissipation prevention mechanism in chip work transfer equipment

Country Status (1)

Country Link
JP (1) JP3256351B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103046097A (en) * 2012-12-31 2013-04-17 上海新阳半导体材料股份有限公司 Wafer processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103046097A (en) * 2012-12-31 2013-04-17 上海新阳半导体材料股份有限公司 Wafer processing device
CN103046097B (en) * 2012-12-31 2016-08-03 上海新阳半导体材料股份有限公司 Wafer processing device

Also Published As

Publication number Publication date
JP3256351B2 (en) 2002-02-12

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