CN110034052A - Wafer cleaning slot shakes mechanism repeatedly - Google Patents
Wafer cleaning slot shakes mechanism repeatedly Download PDFInfo
- Publication number
- CN110034052A CN110034052A CN201910331256.3A CN201910331256A CN110034052A CN 110034052 A CN110034052 A CN 110034052A CN 201910331256 A CN201910331256 A CN 201910331256A CN 110034052 A CN110034052 A CN 110034052A
- Authority
- CN
- China
- Prior art keywords
- outer cover
- hyoplastron
- plate
- wafer cleaning
- wire bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
In order to solve the outside splash when shaking of the cleaning agent in wafer cleaning slot in the prior art, it is stained and corrodes the technical issues of shaking mechanism, the present invention provides wafer cleaning slots to shake mechanism, including outer cover, hyoplastron, servo motor, ball wire bar pair, two lines sliding rail and two groups of bearing blocks repeatedly；Outer cover is welded its internal chamber filled with nitrogen using PP plate；Ball wire bar pair, two lines sliding rail and two groups of bearing blocks are with inside outer cover, and hyoplastron is located at outside outer cover；Outer cover corresponds to and is provided with opening at hyoplastron, and one end of hyoplastron passes through to be open and extend to inside outer cover and be fixedly connected with the base.Outer cover protection shakes mechanism not by the pollution of cleaning solution, and the anti-soda acid function of entire mechanism can be realized by being filled with nitrogen in outer cover internal chamber.
Description
Technical field
The present invention relates to wafer cleaning equipment technical fields, particularly relate to wafer cleaning slot and shake mechanism repeatedly.
Background technique
The process of semiconductor product mainly includes wafer manufacture (preceding road) and encapsulation (rear road) test, with advanced envelope
There is the processing link between manufacturing and encapsulate between wafer, referred to as middle road in the infiltration of dress technology.In tri- processing link of Zhe
Most complicated is wafer manufacture and encapsulation.
Wafer production line is segmented into 7 independent production areas: diffusion, photoetching, etching, ion implanting, film growth,
Polishing, metallization.It is all placed with several wafer cleaning equipment in these production districts, it is clear during different process to meet
Wash requirement.Need to shake rinse bath in certain manufacturing process repeatedly, cleaning solution impacts crystal column surface, shells attachment rapidly
From to improve wafer cleaning effect and cleaning efficiency.Using chemicals as cleaning agent, rinse bath is shaking wafer cleaning repeatedly
The internal cleaning solution splash contained to rinse bath is caused to shake in mechanism, cleaning agent, which is stained and corrodes, shakes mechanism, reduces rolling
The service life and running precision of motivation structure.
Summary of the invention
It is not stained and is corroded by cleaning agent the technical problems to be solved by the present invention are: how to protect and shake mechanism.
In order to solve the above technical problems, technical scheme is as follows:
Wafer cleaning slot shakes mechanism, including hyoplastron, servo motor, ball wire bar pair, two lines sliding rail and two repeatedly
Group bearing block；The screw both end of the ball wire bar pair is inserted into respectively in the brearing bore of two groups of bearing blocks, the servo motor
Output shaft and the ball wire bar pair in screw rod be connected；Two linear slide rails are symmetrically set in the ball wire bar pair
Two sides；The side of the ball of the ball wire bar pair is installed with the base connecting with the sliding block on the linear slide rail
Seat；
Shaking mechanism repeatedly further includes the outer cover being welded using PP plate, and internal chamber is filled with nitrogen；The rolling
Ballscrew pair, two lines sliding rail and two groups of bearing blocks are with inside the outer cover, and the hyoplastron is located at outside the outer cover；Institute
It states outer cover and corresponds to and be provided with opening at the hyoplastron, one end of the hyoplastron passes through the opening and extends in the outer cover
Portion and the pedestal are connected；The corresponding opening is provided with the overhead gage for being bonded the outer cover inner wall under inside the outer cover
The top of baffle, the bottom of the overhead gage and the hyoplastron is connected, and the bottom of the top of the lower baffle plate and the hyoplastron is solid
Even.
In one embodiment, the hyoplastron be aluminum alloy material, outside be coated with Teflon coating.
In one embodiment, the bottom of the overhead gage and the top of the lower baffle plate are curved to the outer cover outside
Folding, and attach the surface with the hyoplastron.
In one embodiment, the linear slide rail has the optoelectronic switch of detection slider displacement position, on the pedestal
It is provided with the locating stop piece for triggering the optoelectronic switch；The bottom plate is installed with leading truck in the side of the linear slide rail, institute
It states and is provided with the adjustable erecting bed in position on leading truck, the optoelectronic switch is fixed on the top of the erecting bed.
Further, the leading truck be by be fixed in housing plate, be symmetrically positioned in the support plate of flat plate top,
And the integral structure of the connecting plate composition outside support plate is set to platen parallel；Being equipped with for the erecting bed is connected to institute
The snap-gauge on connecting plate is stated, the installation settings, which has in the erecting bed, is provided with elliptical aperture, passes through the ellipse with a bolt
Realize the fixation of erecting bed in the top that hole is connected to connecting plate.
In one embodiment, the servo motor is fixedly arranged at the top of the outer cover, and the outside of the servo motor is covered with
Seal casing.
Compared with prior art, the beneficial effects of the present invention are:
1. improving the stabilization of rinse bath upper and lower displacement using servo motor collocation precise ball screw pair and linear slide rail
Property, and effectively reduce noise；
It, can effectively and precisely 2. the present invention in reading position pulse in PLC, and is cooperated using servo motor with optoelectronic switch
It positions and can realize limit auto-alarm function and safe shutdown；
3. the present invention can regulate and control the speed and distance and positioning compensation value of rinse bath upper and lower displacement in PLC, realize
The accurate shaking of rinse bath；
4. the protection of the outer cover made of PP plate is fully welded of the invention shakes mechanism not by the pollution of cleaning solution, and in outer cover
Portion's chamber be filled with nitrogen, it can be achieved that entire mechanism anti-soda acid function；
5. the present invention is combined into the sealing plate that a block size is greater than housing opening using overhead gage and lower baffle plate, inside outer cover
Positive pressure of nitrogen sealing plate is overlayed on the inner wall of outer cover, gas leakage at housing opening can be prevented.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the structure chart that wafer cleaning slot shakes mechanism repeatedly disclosed in embodiment；
Fig. 2 is the structure chart that wafer cleaning slot disclosed in embodiment shakes mechanism (removal outer cover) repeatedly；
Fig. 3 is the structure chart that wafer cleaning slot disclosed in embodiment shakes mechanism (removal outer cover) repeatedly.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.
Embodiment
Wafer cleaning slot as illustrated in fig. 1 and 2 shakes mechanism repeatedly, including using PP plate is welded, internal chamber is filled
There is the outer cover of nitrogen, hyoplastron 20 and servo motor 30 outside outer cover, the ball wire bar pair inside outer cover 40, two
Linear slide rail 50 and two groups of bearing blocks 60.
Outer cover includes top plate 11, bottom plate 12, left plate 13, right side plate 14, front side board 15 and back side panel 16, servo motor 30
It is fixed on the top of top plate 11, two bearing blocks 60 are fixed on back side panel 16, and the screw both end of ball wire bar pair 40 is inserted respectively
In the brearing bore for entering two groups of bearing blocks 60, in the output shaft of servo motor 30 insertion outer cover and with the spiral shell in ball wire bar pair 40
Bar is connected；Two lines sliding rail 50 is fixed on back side panel 16, and is symmetrically set in the two sides of ball wire bar pair 40；Ball wire bar pair
The side of 40 ball is installed with the pedestal 70 connecting with the sliding block on linear slide rail 50.
It can be covered with seal casing in the outside of servo motor 30, to prevent in cleaning solution splash to servo motor 30.
Referring to Fig. 1, outer cover corresponds to and is provided with opening 17 at hyoplastron 20, and 20 1 ends of hyoplastron pass through opening 17 and extend to
It is connected inside outer cover with pedestal 70；The overhead gage 81 and lower baffle plate of fitting outer cover inner wall are provided with inside outer cover at corresponding opening 17
82, the bottom of overhead gage 81 and the top of lower baffle plate 82 attach the surface with hyoplastron 20 to outer cover bend external.Overhead gage
81 and lower baffle plate 82 be combined into the sealing plate that a block size is greater than housing opening 17, the positive pressure of nitrogen inside outer cover is by sealing plate pressure
It is attached on the inner wall of outer cover, gas leakage at housing opening 17 can be prevented.
Hyoplastron 20 is directly connect with rinse bath, so hyoplastron 20 uses aluminum alloy material, and in external cladding acid and alkali-resistance
Teflon coating.
Linear slide rail 50 has the optoelectronic switch 90 of detection slider displacement position, is provided with triggering optoelectronic switch on pedestal 70
90 locating stop piece 100；Bottom plate 12 is installed with leading truck 110 in the side of linear slide rail 50, is provided with position on leading truck 110
Adjustable erecting bed 130, optoelectronic switch 90 are fixed on the top of erecting bed 130.Rinse bath is shaken repeatedly in regular up and down
Shake, i.e. the distance of each uplink and downlink of rinse bath should be consistent, if the distance of rinse bath single uplink be greater than it is default away from
From locating stop piece 100 triggers optoelectronic switch 90, and equipment downtime is simultaneously alarmed.
It needs repeatedly to debug during mechanism practical set, and cleaning equipment can generate vibration in the process of running,
It is influenced for the ease of debugging and eliminating vibration bring, the mounting structure of optoelectronic switch 90 is as shown in Figure 3.Leading truck 110
Be by be fixed in housing plate 111, be symmetrically positioned in the support plate 112 at the top of plate 111, and parallel with plate 111 set
The integral structure that connecting plate 113 outside support plate 112 forms；Being equipped with for erecting bed 130 is connected on connecting plate 113
Snap-gauge 131, installation settings, which has in erecting bed 130, is provided with elliptical aperture, passes through elliptical aperture with a bolt and is connected to connecting plate 113
The fixation of top realization erecting bed 130.The shape of leading truck 110 can buffer the vibration of cleaning equipment.It is needed in optoelectronic switch 90
When fine tuning, need to only it looser a bolt.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
The limitation to the application the scope of the patents therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the concept of this application, various modifications and improvements can be made, these belong to the guarantor of the application
Protect range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (6)
1. wafer cleaning slot shakes mechanism, including hyoplastron (20), servo motor (30), ball wire bar pair (40), two lines repeatedly
Property sliding rail (50) and two groups of bearing blocks (60)；The screw both end of the ball wire bar pair (40) is inserted into two groups of bearing blocks (60) respectively
Brearing bore in, the screw rod in the output shaft of the servo motor (30) and the ball wire bar pair (40) is connected；Two institutes
State the two sides that linear slide rail (50) is symmetrically set in the ball wire bar pair (40)；The ball axis of the ball wire bar pair (40)
The side of set is installed with the pedestal (70) connecting with the sliding block on the linear slide rail (50), which is characterized in that
Shaking mechanism repeatedly further includes the outer cover being welded using PP plate, and internal chamber is filled with nitrogen；The ball wire
Bar pair (40), two lines sliding rail (50) and two groups of bearing blocks (60) are with inside the outer cover, and the hyoplastron (20) is located at institute
It states outside outer cover；The outer cover corresponds to be provided with opening (17) at the hyoplastron (20), and (20) ends of the hyoplastron pass through
The opening (17) simultaneously extends to connected with the pedestal (70) inside the outer cover；The corresponding opening inside the outer cover
(17) overhead gage (81) and lower baffle plate (82) for being bonded the outer cover inner wall, the bottom of the overhead gage (81) and institute are provided at
The top for stating hyoplastron (20) is connected, and the top of the lower baffle plate (82) and the bottom of the hyoplastron (20) are connected.
2. wafer cleaning slot according to claim 1 shakes mechanism repeatedly, which is characterized in that the hyoplastron (20) is aluminium conjunction
Golden material, outside be coated with Teflon coating.
3. wafer cleaning slot according to claim 1 shakes mechanism repeatedly, which is characterized in that the bottom of the overhead gage (81)
Portion and the top of the lower baffle plate (82) attach the surface with the hyoplastron (20) to the outer cover bend external.
4. wafer cleaning slot according to claim 1 shakes mechanism repeatedly, the linear slide rail (50) has detection sliding block
The optoelectronic switch (90) of displaced position is provided with the locating stop piece for triggering the optoelectronic switch (90) on the pedestal (70)
(100)；The outer side for covering in the linear slide rail (50) is installed with leading truck (110), is arranged on the leading truck (110)
There is the adjustable erecting bed in position (130), the optoelectronic switch (90) is fixed on the top of the erecting bed (130).
5. wafer cleaning slot according to claim 4 shakes mechanism repeatedly, which is characterized in that the leading truck (110) is
By the plate (111) being fixed in housing, the support plate (112) being symmetrically positioned at the top of plate (111), and with plate (111)
The integral structure of parallel connecting plate (113) composition external set on support plate (112)；The erecting bed (130) is equipped with card
The snap-gauge (131) on the connecting plate (113) is connect, the installation settings, which has in the erecting bed (130), is provided with elliptical aperture,
The fixation that the elliptical aperture is connected to top realization erecting bed (130) of connecting plate (113) is passed through with a bolt.
6. wafer cleaning slot according to claim 1 shakes mechanism repeatedly, which is characterized in that the servo motor (30) is solid
At the top of the outer cover, the outside of the servo motor (30) is covered with seal casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910331256.3A CN110034052A (en) | 2019-04-23 | 2019-04-23 | Wafer cleaning slot shakes mechanism repeatedly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910331256.3A CN110034052A (en) | 2019-04-23 | 2019-04-23 | Wafer cleaning slot shakes mechanism repeatedly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110034052A true CN110034052A (en) | 2019-07-19 |
Family
ID=67239938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910331256.3A Pending CN110034052A (en) | 2019-04-23 | 2019-04-23 | Wafer cleaning slot shakes mechanism repeatedly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110034052A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931401A (en) * | 2020-01-02 | 2020-03-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
| CN112691954A (en) * | 2020-12-24 | 2021-04-23 | 格力电工(南京)有限公司 | Enameled wire and enameled roller cleaning device and felt enamelling machine |
| CN112967996A (en) * | 2021-03-01 | 2021-06-15 | 昆山基侑电子科技有限公司 | Wafer cleaning and fixing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103046097A (en) * | 2012-12-31 | 2013-04-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN104865396A (en) * | 2015-05-23 | 2015-08-26 | 深圳德夏生物医学工程有限公司 | Multi-channel biochemical and specific protein analysis instrument provided with linearly-arranged lamp strips and linearly-arranged silicon photocells |
| CN107962127A (en) * | 2017-11-09 | 2018-04-27 | 苏州特精模具有限公司 | Punching press handling device |
| CN108057389A (en) * | 2017-11-27 | 2018-05-22 | 北京莱伯泰科仪器股份有限公司 | Automatical dosing instrument |
-
2019
- 2019-04-23 CN CN201910331256.3A patent/CN110034052A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103046097A (en) * | 2012-12-31 | 2013-04-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| CN104865396A (en) * | 2015-05-23 | 2015-08-26 | 深圳德夏生物医学工程有限公司 | Multi-channel biochemical and specific protein analysis instrument provided with linearly-arranged lamp strips and linearly-arranged silicon photocells |
| CN107962127A (en) * | 2017-11-09 | 2018-04-27 | 苏州特精模具有限公司 | Punching press handling device |
| CN108057389A (en) * | 2017-11-27 | 2018-05-22 | 北京莱伯泰科仪器股份有限公司 | Automatical dosing instrument |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931401A (en) * | 2020-01-02 | 2020-03-27 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box rotating device and wafer box rotating and lifting equipment |
| CN112691954A (en) * | 2020-12-24 | 2021-04-23 | 格力电工(南京)有限公司 | Enameled wire and enameled roller cleaning device and felt enamelling machine |
| CN112967996A (en) * | 2021-03-01 | 2021-06-15 | 昆山基侑电子科技有限公司 | Wafer cleaning and fixing device |
| CN112967996B (en) * | 2021-03-01 | 2024-01-05 | 昆山基侑电子科技有限公司 | Wafer cleaning and fixing device |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190719 |
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| RJ01 | Rejection of invention patent application after publication |