CN212062389U - Packaging tube for electronic element - Google Patents
Packaging tube for electronic element Download PDFInfo
- Publication number
- CN212062389U CN212062389U CN202020910167.2U CN202020910167U CN212062389U CN 212062389 U CN212062389 U CN 212062389U CN 202020910167 U CN202020910167 U CN 202020910167U CN 212062389 U CN212062389 U CN 212062389U
- Authority
- CN
- China
- Prior art keywords
- packaging
- pin
- fixedly connected
- packaging tube
- rubber pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000005538 encapsulation Methods 0.000 claims abstract description 20
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 238000005266 casting Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000007514 turning Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses an electronic component is with encapsulation pipe, including the encapsulation body, the last fixed surface of encapsulation body is connected with the support ring, the inside of encapsulation body is provided with the fixed network, the side surface fixedly connected with support frame of encapsulation body, the upper surface swing joint of support frame has the bracing piece, the inside fixedly connected with rubber pad of bracing piece, the inside swing joint of rubber pad has the pin, the one end that the rubber pad was kept away from to the pin is provided with the mounting hole, the inside fixedly connected with wire of mounting hole. The utility model discloses, through using the fixed network for electronic component's rigidity, thereby when making to use the colloid to seal up, can guarantee that electronic component's position is unmovable, make its packaging effect better, through using the bracing piece, make the position of pin not change, guaranteed among the packaging process, the pin position does not change, has guaranteed the relation of connection between pin and the electronic component simultaneously.
Description
Technical Field
The utility model relates to an electronic component technical field especially relates to an electronic component is with encapsulation pipe.
Background
The package is a package for connecting circuit pins on a silicon chip to external terminals by wires to connect with other devices, and the package form is a housing for mounting electronic components of a semiconductor integrated circuit. It not only plays the role of installing, fixing, sealing, protecting electronic elements and enhancing the electric heating performance, but also is connected to the pins of the packaging shell by the leads through the contacts on the electronic elements, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal electronic elements and the external circuit. Because the electronic components must be isolated from the outside to prevent the electric performance from being degraded due to the corrosion of the electronic component circuit by impurities in the air. On the other hand, the packaged electronic components are also more convenient to install and transport.
The encapsulation of electronic components is to avoid the impurity in the air to corrode electronic components, cause the decline of electrical properties to protect it, and the encapsulation utilizes plastic colloid to encapsulate mostly, thereby be convenient for seal the component, and the position of component in the colloid is unset, leads to the component motion, thereby makes some surfaces of component probably run out and glue the outside, or some component surface colloid protective layer is thinner, makes its guard action less good.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a packaging tube for an electronic element.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides an electronic component is with encapsulation pipe, includes the encapsulation body, the last fixed surface of encapsulation body is connected with the support ring, the inside of encapsulation body is provided with the fixed network, the side surface fixedly connected with support frame of encapsulation body, the upper surface swing joint of support frame has the bracing piece, the inside fixedly connected with rubber pad of bracing piece, the inside swing joint of rubber pad has the pin, the one end that the rubber pad was kept away from to the pin is provided with the mounting hole, the inside fixedly connected with wire of mounting hole, the one end fixedly connected with electronic component of pin is kept away from to the wire.
As a further description of the above technical solution:
the inside of the packaging pipe body is in a step shape, and the fixing net is movably connected with the step protrusion of the packaging pipe body.
As a further description of the above technical solution:
one end of the pin, which is far away from the rubber pad, extends to the inside of the packaging tube body, and the inside of the packaging tube body is filled with packaging colloid.
As a further description of the above technical solution:
the position of the support ring is located above the support frame, and the position of the electronic element is located inside the packaging pipe body.
As a further description of the above technical solution:
the surface of the fixed net is provided with a through hole, the fixed net is provided with a clamping groove, and the inside of the clamping groove is movably connected with the electronic element.
As a further description of the above technical solution:
and one end of the lead, which is far away from the pin, is connected with a joint on the electronic element.
As a further description of the above technical solution:
the packaging pipe body and the support ring are integrally processed in the casting and turning and milling processes, and the support rod is movably connected with the support frame through a bearing.
The utility model discloses following beneficial effect has:
1. compared with the prior art, the electronic element packaging tube has the advantages that the electronic element is fixed in position by the aid of the fixing net, so that when the electronic element is sealed by the colloid, the electronic element is prevented from moving, and the packaging effect is good.
2. Compared with the prior art, the packaging tube for the electronic element has the advantages that the position of the pin is not changed by using the supporting rod, the pin position is not changed in the packaging process, and meanwhile, the connection relation between the pin and the electronic element is guaranteed.
Drawings
Fig. 1 is a schematic view of an internal structure of a packaging tube for electronic components according to the present invention;
fig. 2 is a schematic view of an overall structure of a package tube for electronic components according to the present invention;
fig. 3 is a top view of a package tube for electronic components according to the present invention.
Illustration of the drawings:
1. packaging the tube body; 2. a support ring; 3. a support frame; 4. a support bar; 5. a rubber pad; 6. a pin; 7. mounting holes; 8. a wire; 9. an electronic component; 10. fixing the net; 11. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides a packaging tube for electronic components: comprises a packaging tube body 1 for packaging an electronic element 9, a support ring 2 is fixedly connected on the upper surface of the packaging tube body 1 for facilitating the placement of the packaging tube body 1, a fixing net 10 is arranged inside the packaging tube body 1, the electronic element 9 is fixed, the side surface of the packaging tube body 1 is fixedly connected with a support frame 3, the packaging tube body 1 is supported, the upper surface of the support frame 3 is movably connected with a support rod 4, a support pin 6, the inside of the support rod 4 is fixedly connected with a rubber pad 5, the pins 6 are clamped, the pins 6 are movably connected inside the rubber pad 5, so that the electronic element 9 can be conveniently connected with an external circuit, one end of each pin 6, which is far away from the rubber pad 5, is provided with a mounting hole 7, the lead 8 is used for connecting a lead 8, the lead 8 is fixedly connected inside the mounting hole 7, the pin 6 is connected with an electronic element 9, and one end, far away from the pin 6, of the lead 8 is fixedly connected with the electronic element 9.
The packaging tube body 1 is stepped, the fixing net 10 is movably connected with the stepped protrusion of the packaging tube body 1 so as to fix the position of the fixing net 10, one end of each pin 6, which is far away from the rubber pad 5, extends into the packaging tube body 1 so as to fix the bottom of each pin 6 into the colloid, the position of each pin 6 is fixed, the packaging tube body 1 is filled with the packaging colloid, the electronic element 9 is sealed and stored, the support ring 2 is positioned above the support frame 3 to package the packaging tube body 1 for hundreds of years, the electronic element 9 is positioned in the packaging tube body 1, the surface of the fixing net 10 is provided with through holes so as to facilitate the passing of the colloid and completely package the electronic element 9, the fixing net 10 is provided with clamping grooves 11, the electronic element 9 is installed, the inner parts of the clamping grooves 11 are movably connected with the electronic element 9 so as to fix the position of the electronic element 9, one ends, which are far away from the pins 6, of the, the function of the electronic element 9 is not lost, the electronic element can be connected with an external circuit, the packaging tube body 1 and the support ring 2 are integrally processed in the casting and turning and milling processes, and the support rod 4 is movably connected with the support frame 3 through a bearing, so that the pins 6 can be conveniently taken out of the inner part of the rubber pad 5.
The working principle is as follows: through placing encapsulation body 1 in the top of support frame 3, place fixed network 10 in the inside of encapsulation body 1, connect between pin 6, wire 8, the electronic component 9, then place electronic component 9 in draw-in groove 11 of fixed network 10, pass rubber pad 5 inside with pin 6 and fix, pour into the seal up colloid through the opening on upper portion, when the colloid is fixed, keep apart electronic component 9 and air, then the seal up is accomplished.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides an electronic component is with encapsulation pipe, includes encapsulation body (1), its characterized in that: the utility model discloses a packaging pipe, including encapsulation body (1), upper surface fixedly connected with support ring (2), the inside of encapsulation body (1) is provided with fixed network (10), the side surface fixedly connected with support frame (3) of encapsulation body (1), the upper surface swing joint of support frame (3) has bracing piece (4), the inside fixedly connected with rubber pad (5) of bracing piece (4), the inside swing joint of rubber pad (5) has pin (6), the one end that rubber pad (5) were kept away from in pin (6) is provided with mounting hole (7), the inside fixedly connected with wire (8) of mounting hole (7), the one end fixedly connected with electronic component (9) of pin (6) are kept away from in wire (8).
2. A packaging tube for electronic components as claimed in claim 1, wherein: the packaging tube body (1) is stepped inside, and the fixing net (10) is movably connected with the stepped protrusion of the packaging tube body (1).
3. A packaging tube for electronic components as claimed in claim 1, wherein: one end, far away from the rubber pad (5), of the pin (6) extends to the inside of the packaging pipe body (1), and the inside of the packaging pipe body (1) is filled with packaging colloid.
4. A packaging tube for electronic components as claimed in claim 1, wherein: the position of the support ring (2) is located above the support frame (3), and the position of the electronic element (9) is located inside the packaging pipe body (1).
5. A packaging tube for electronic components as claimed in claim 2, wherein: the surface of the fixing net (10) is provided with a through hole, the fixing net (10) is provided with a clamping groove (11), and the inside of the clamping groove (11) is movably connected with the electronic element (9).
6. A packaging tube for electronic components as claimed in claim 1, wherein: and one end of the lead (8) far away from the pin (6) is connected with a joint on the electronic element (9).
7. A packaging tube for electronic components as claimed in claim 1, wherein: the packaging pipe body (1) and the support ring (2) are integrally processed in the casting and turning and milling processes, and the support rod (4) is movably connected with the support frame (3) through a bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020910167.2U CN212062389U (en) | 2020-05-26 | 2020-05-26 | Packaging tube for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020910167.2U CN212062389U (en) | 2020-05-26 | 2020-05-26 | Packaging tube for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212062389U true CN212062389U (en) | 2020-12-01 |
Family
ID=73519773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020910167.2U Expired - Fee Related CN212062389U (en) | 2020-05-26 | 2020-05-26 | Packaging tube for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212062389U (en) |
-
2020
- 2020-05-26 CN CN202020910167.2U patent/CN212062389U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100200377B1 (en) | Electronic parts and its manufacturing method | |
| KR19980055817A (en) | Bottom lid semiconductor package and manufacturing method thereof | |
| CN212062389U (en) | Packaging tube for electronic element | |
| TW200425456A (en) | Multi-chip package with electrical interconnection | |
| CN115377013A (en) | Module sealing shell and high-voltage IGBT module | |
| CN209822618U (en) | Packaging structure without outer pin | |
| CN208240655U (en) | A kind of semiconductor package | |
| CN215342555U (en) | Low-thermal-resistance packaging structure of power MOS device | |
| CN111128941A (en) | IGBT module and packaging method thereof | |
| CN217544602U (en) | Surface-mounted chip packaging structure | |
| CN216288422U (en) | Pin exposed DFN1006 structure | |
| CN215301208U (en) | Plastic packaging structure of waterproof communication element | |
| CN209929272U (en) | COB seals glues and uses mounting fixture | |
| CN219892171U (en) | Packaging structure | |
| CN215008193U (en) | From microcontroller packaging structure who takes dustproof function | |
| CN220627786U (en) | Integrated circuit chip packaging structure | |
| CN218585962U (en) | Module sealing shell and high-voltage IGBT module | |
| JPS6223097Y2 (en) | ||
| CN216413069U (en) | SMD encapsulation lead frame of multicore piece | |
| CN211555852U (en) | Chip packaging structure | |
| CN219226880U (en) | Package structure for laser diode | |
| CN216250570U (en) | Heat dissipation dust-protection type contactor | |
| CN210778572U (en) | Semiconductor chip packaging support | |
| CN212907721U (en) | Wireless lead packaging structure based on LTCC circuit | |
| CN211088256U (en) | IGBT module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201201 |