CN216288422U

CN216288422U - Pin exposed DFN1006 structure

Info

Publication number: CN216288422U
Application number: CN202122275845.XU
Authority: CN
Inventors: 张猛; 梁令荣; 黄�俊; 程刚
Original assignee: Born Semiconductor Shenzhen Co ltd
Current assignee: Born Semiconductor Shenzhen Co ltd
Priority date: 2021-09-19
Filing date: 2021-09-19
Publication date: 2022-04-12
Anticipated expiration: 2031-09-19

Abstract

The utility model discloses a DFN1006 structure with exposed pins, which comprises black glue, wherein both ends of the black glue are fixedly connected with connecting ends, a chip is arranged on the outer surface of the front side of the black glue, one side of the chip is provided with pins, and both sides of the chip are fixedly connected with bonding wires. The frame, the pins, the connecting rods and the connecting ends are arranged, the frame is fixedly connected to the outside of the chip, the pins are in a shape that two ends of each pin protrude out and the middle of each pin is sunken, the frame is fixedly connected to the outside of the chip, the number of the four chips is more firm when the chip is used, the four chips and the frame are completely fixed through the pins for use, the connecting rods are connected to enable the frame to be connected, the connecting ends fix the black glue, and therefore the black glue fixing device is more convenient to use and simple to operate.

Description

Pin exposed DFN1006 structure

Technical Field

The utility model relates to the technical field of DFN1006 structures, in particular to a DFN1006 structure with exposed pins.

Background

The package for mounting semiconductor IC chip has the functions of holding, fixing, sealing, protecting chip and strengthening electrothermal performance, and is also the bridge for connecting the chip inside world and external circuit.

The DFN1006 structure in the prior art has the problems of mismatching of more pin leakage, incapability of reaching the standard of use effect and the like when in use, and has the problem of insufficient firmness after use, and further needs to be perfected.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, and provides a DFN1006 structure with exposed pins.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides a DFN1006 structure that pin exposes, includes the black glue, the equal fixedly connected with link in both ends of black glue, the front side outer surface of black glue is provided with the chip, one side of chip is provided with the pin, the equal fixedly connected with bonding wire in both sides of chip.

As a further description of the above technical solution: the pins are in a shape that two ends are protruded and the middle part is sunken.

As a further description of the above technical solution: the outer portion of the chip is fixedly connected with a frame, and the number of the chips is four.

As a further description of the above technical solution: the pins and the frame are in plug-in fit.

As a further description of the above technical solution: and a chip main body is clamped on one side of the pin.

As a further description of the above technical solution: the number of the frames is four, and the connecting rods are fixedly connected between the frames.

The utility model has the following beneficial effects:

1. compared with the prior art, the chip fixing frame is provided with the frame and the pins, the frame is fixedly connected to the outside of the chip, the chip fixing frame is firmer in use, and the chip and the frame are completely fixed through the pins for use.

2. Compared with the prior art, the frame is connected through the connecting rods and the connecting ends, the frame is connected, the black glue is fixed through the connecting ends, and the frame is more convenient to use and simple to operate.

Drawings

Fig. 1 is a top view of a DFN1006 structure with exposed leads according to the present invention;

fig. 2 is a side view of a chip body of a DFN1006 structure with exposed leads according to the present invention;

fig. 3 is a top view of a chip with a DFN1006 structure with exposed leads according to the present invention;

fig. 4 is a top view of a black matrix of a DFN1006 structure with exposed leads according to the present invention;

fig. 5 is a side view of a black glue of a DFN1006 structure with exposed leads according to the present invention.

Illustration of the drawings:

1. a frame; 2. a connecting rod; 3. a chip; 4. a pin; 5. a connecting end; 6. a chip body; 7. a bonding wire; 8. black glue.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, one embodiment of the present invention is provided: a DFN1006 structure with exposed pins comprises a black adhesive 8, wherein both ends of the black adhesive 8 are fixedly connected with connecting ends 5, the connecting ends 5 are used for fixing the black adhesive 8, the connecting ends 5 at both ends of the black adhesive 8 are more firmly fixed and more convenient to disassemble, a chip 3 is arranged on the outer surface of the front side of the black adhesive 8 and is connected with the black adhesive 8 through the chip 3, a pin 4 on one side of the chip 3 is fixed with a frame 1, the swinging problem can not occur when the DFN is convenient to use, one side of the chip 3 is provided with pins 4, the pins 4 are integrally connected with a plurality of frames 1, one side of each pin 4 is clamped with a chip main body 6, the chip main body 6 and the pins 4 are fixedly connected, the pins 4 and the frames 1 are in splicing fit, the DFN1006 structure is more convenient to take out and install and is simpler to use, the pins 4 are in a shape with two ends protruding out and middle parts sunken, bonding wires 7 are fixedly connected on both sides of the chip 3, the outside fixedly connected with frame 1 of chip 3, frame 1 carry out the monolithic stationary, and the quantity of chip 3 is four, and the quantity of frame 1 is four, uses and can wholly work together, and equal fixedly connected with connecting rod 2 between the frame 1, and connecting rod 2 carries out to connect frame 1 fixedly, can use in unison completely during the use.

The working principle is as follows: fix with frame 1 through carrying out the pin 4 with chip 3 one side when using, the problem of rocking can not appear when convenient to use to connect frame 1 fixedly through connecting rod 2, can use in unison completely during the use.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. A DFN1006 structure with exposed pins is characterized in that: the packaging structure is characterized by comprising a black adhesive (8), wherein connecting ends (5) are fixedly connected to two ends of the black adhesive (8), a chip (3) is arranged on the outer surface of the front side of the black adhesive (8), a pin (4) is arranged on one side of the chip (3), and bonding wires (7) are fixedly connected to two sides of the chip (3).

2. The pin-exposed DFN1006 structure of claim 1, wherein: the pins (4) are in a shape that two ends are protruded and the middle part is sunken.

3. The pin-exposed DFN1006 structure of claim 1, wherein: the outer portion of the chip (3) is fixedly connected with the frame (1), and the number of the chips (3) is four.

4. The pin-exposed DFN1006 structure of claim 1, wherein: the pins (4) are in plug-in fit with the frame (1).

5. The pin-exposed DFN1006 structure of claim 1, wherein: and a chip main body (6) is clamped on one side of the pin (4).

6. The pin-exposed DFN1006 structure of claim 3, wherein: the number of the frames (1) is four, and the connecting rods (2) are fixedly connected between the frames (1).