CN210778572U

CN210778572U - Semiconductor chip packaging support

Info

Publication number: CN210778572U
Application number: CN201921768692.9U
Authority: CN
Inventors: 朱道田; 黄明
Original assignee: Jiangsu Yunhonghui Electronic Technology Co ltd
Current assignee: Jiangsu Yunhonghui Electronic Technology Co ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-06-16
Anticipated expiration: 2029-10-21

Abstract

The utility model belongs to chip package support field especially is a semiconductor chip package support, including a support frame, the inboard of support frame is connected with the frame connecting block, the one end of frame connecting block is connected with chip positioning frame, chip positioning frame's inboard is provided with the rectangular channel, the inboard of rectangular channel runs through and is provided with the rectangular hole, chip positioning frame's one end is connected with the positioning frame connecting block, the inboard of positioning frame connecting block runs through and is provided with well locating hole, one side that chip positioning frame is close to the support frame is connected with limit lead frame, one side that chip positioning frame kept away from the support frame is provided with well lead frame, the outside of support frame is provided with the limit locating piece, the inboard of limit locating piece is run through and is provided with the limit locating hole, the inboard of limit lead frame is provided with limit lead groove, well lead frame. The utility model discloses, solved traditional encapsulation support, to the too much extravagant problem of metal material, reduced the step of bar cutting procedure in the packaging process simultaneously, improved production efficiency.

Description

Semiconductor chip packaging support

Technical Field

The utility model relates to a chip package support field specifically is a semiconductor chip package support.

Background

The IC is known in Chinese as an Integrated Circuit (IC), which is a semiconductor-based small electronic device consisting of fabricated transistors, resistors and capacitors. Integrated circuits are the cornerstone of most electronic devices and appliances. Integrated circuits are also known as chips or microchips.

C-package refers to the process of wire bonding circuit pins on a silicon die to external connections for connection to other devices. The package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. IC packages are widely available, such as ball-point arrays, surface mount packages, and the like.

An important component in the IC packaging process is a package support, and the quality of the design of the package support directly affects the final quality of the IC chip.

There are the following problems:

1. traditional encapsulation support adopts double row side by side more, often is provided with large tracts of land metal connecting plate between two rows of chip grooves, leads to when metal material is extravagant, has also reduced the efficiency of production.

2. The metal connecting plates are arranged between the chips, so that the process of the rib cutting process is increased, the lead is easily damaged, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a semiconductor chip encapsulates support has solved traditional encapsulation support, to the too much extravagant problem of metal material, has reduced the step of bar cutting procedure in the packaging process simultaneously, has improved production efficiency.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor chip packaging support, includes the support frame, the inboard of support frame is connected with the frame connecting block, the one end of frame connecting block is connected with chip positioning frame, chip positioning frame's inboard is provided with the rectangular channel, the inboard of rectangular channel runs through and is provided with the rectangular hole, chip positioning frame's one end is connected with the positioning frame connecting block, positioning frame connecting block's inboard runs through and is provided with well locating hole, one side that chip positioning frame is close to the support frame is connected with limit lead frame, one side that chip positioning frame kept away from the support frame is provided with well lead frame, the outside of support frame is provided with the limit locating piece, the inboard of limit locating piece runs through and is provided with the limit locating hole, the inboard of limit lead frame is provided with limit lead groove, the inboard of well lead frame is provided with well lead groove.

As a preferred technical scheme of the utility model, the shape of support frame is the rectangle, the inboard of support frame is through casting moulding and frame connecting block fixed connection.

As an optimized technical scheme of the utility model, the quantity of chip locating frame is fifteen groups, the shape of chip locating frame is the rectangle, the quantity and the shape of chip locating frame all can be according to actual demand, and actual chip size adjustment.

As a preferred technical scheme of the utility model, the equal fixed connection in both ends of the one end of locating frame connecting block and chip locating frame, the shape of well locating hole is circular.

As an optimized technical scheme of the utility model, the shape of limit locating hole is circular, the internal diameter size of well locating hole is the same with the internal diameter size of limit locating hole.

As a preferred technical scheme of the utility model, the length dimension size of well lead frame is about the twice of the length dimension size of limit lead frame, the inboard and chip positioning frame fixed connection of limit lead frame, well lead frame outside and chip positioning frame fixed connection.

As an optimized technical scheme of the utility model, the shape of limit locating piece is the rectangle, the quantity of limit locating piece is six groups.

As an optimal technical scheme of the utility model, the size of a dimension of limit lead wire groove and the size of a dimension looks adaptation of lead wire external diameter, the size of a dimension of well lead wire groove and the external diameter size looks adaptation of lead wire.

Compared with the prior art, the utility model provides a semiconductor chip packaging support possesses following beneficial effect:

1. this semiconductor chip packaging support through setting up limit lead frame, well lead frame, making adjacent two sets of chips pass through lead wire lug connection, has saved the connecting plate between adjacent two sets of chips, has practiced thrift metal material, is provided with the limit locating piece simultaneously, when guaranteeing support stability, makes original limit locating plate change into the limit locating piece, has practiced thrift metal resources equally, the saving manufacturing cost who changes mutually.

2. Through setting up well lead frame, make adjacent two sets of chips pass through lead wire lug connection, make the not walking reduction of bar cutting process bar cutting, increased production efficiency.

Drawings

FIG. 1 is a schematic view of the overall appearance of the present invention;

FIG. 2 is a schematic plan view of the structure A of the present invention;

fig. 3 is a schematic perspective view of the structure a of the present invention.

In the figure: 1. a support frame; 2. a frame connecting block; 3. a chip positioning frame; 4. a rectangular hole; 5. a positioning frame connecting block; 6. a middle positioning hole; 7. a side lead frame; 8. a middle lead frame; 9. edge positioning blocks; 10. edge positioning holes; 11. a rectangular groove; 12. a side lead groove; 13. and a middle lead groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-3, in this embodiment: a semiconductor chip packaging support comprises a support frame 1, wherein the inner side of the support frame 1 is connected with a frame connecting block 2, one end of the frame connecting block 2 is connected with a chip positioning frame 3, the inner side of the chip positioning frame 3 is provided with a rectangular groove 11, the inner side of the rectangular groove 11 is provided with a rectangular hole 4 in a penetrating manner, one end of the chip positioning frame 3 is connected with a positioning frame connecting block 5, the inner side of the positioning frame connecting block 5 is provided with a middle positioning hole 6 in a penetrating manner, one side, close to the support frame 1, of the chip positioning frame 3 is connected with a side lead frame 7, one side, far away from the support frame 1, of the chip positioning frame 3 is provided with a middle lead frame 8, the outer side of the support frame 1 is provided with a side positioning block 9, the inner side of the side positioning block 9 is provided with a side positioning hole 10 in a; through setting up limit lead frame 7, well lead frame 8, make adjacent two sets of chips pass through lead wire lug connection, the connecting plate between adjacent two sets of chips has been saved, metal material has been practiced thrift, be provided with limit locating piece 9 simultaneously, when guaranteeing support stability, make original limit locating piece change into limit locating piece 9, metal resources has been practiced thrift equally, the saving manufacturing cost of phase change, through setting up in lead frame 8, make adjacent two sets of chips pass through lead wire lug connection, make not walking of muscle cutting process muscle cutting reduce, and the production efficiency is increased.

In the embodiment, the support frame 1 is rectangular, and the inner side of the support frame 1 is fixedly connected with the frame connecting block 2 through casting molding, so that the framework is more stable; the number of the chip positioning frames 3 is fifteen, the shape of the chip positioning frames 3 is rectangular, and the number and the shape of the chip positioning frames 3 can be adjusted according to actual requirements and the size of an actual chip, so that the design of the bracket is firstly attached to the actual requirements; one end of the positioning frame connecting block 5 is fixedly connected with both ends of the chip positioning frame 3, and the middle positioning hole 6 is circular and used for positioning the bracket and preventing the bracket from sliding; the side positioning hole 10 is circular, and the size of the inner diameter of the middle positioning hole 6 is the same as that of the side positioning hole 10 and is matched with the size of the positioning needle; the length of the middle lead frame 8 is about twice of the length of the side lead frame 7, the inner side of the side lead frame 7 is fixedly connected with the chip positioning frame 3, and the outer side of the middle lead frame 8 is fixedly connected with the chip positioning frame 3, so that the lengths of pins of the chips after rib cutting are the same; the edge positioning blocks 9 are rectangular, and the number of the edge positioning blocks 9 is six, so that metal materials are saved while the positioning stability is ensured; the size of the side lead groove 12 is matched with the size of the outer diameter of the lead, the size of the middle lead groove 13 is matched with the size of the outer diameter of the lead, and the lead is matched to enable the lead to be placed in the groove.

The utility model discloses a theory of operation and use flow: the user puts into the encapsulation machine with this support, then put into rectangular channel 11 with the chip, put into limit lead wire groove 12 with the pin, in well lead wire groove 13, then with the mould pressfitting, the melting encapsulation can, set up limit lead wire frame 7, well lead wire frame 8, make adjacent two sets of chips pass through lead wire lug connection, connecting plate between adjacent two sets of chips has been saved, metal material has been practiced thrift, be provided with limit locating piece 9 simultaneously, when guaranteeing support stability, make original limit locating piece change into limit locating piece 9, metal resources have been practiced thrift equally, the saving manufacturing cost of phase change, through lead wire frame 8 in setting up, make adjacent two sets of chips pass through lead wire lug connection, make not walking reduction of bar cutting process bar cutting, and the production efficiency is increased.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip package support comprises a support frame (1), and is characterized in that: the inner side of the support frame (1) is connected with a frame connecting block (2), one end of the frame connecting block (2) is connected with a chip positioning frame (3), the inner side of the chip positioning frame (3) is provided with a rectangular groove (11), the inner side of the rectangular groove (11) is provided with a rectangular hole (4) in a penetrating manner, one end of the chip positioning frame (3) is connected with a positioning frame connecting block (5), the inner side of the positioning frame connecting block (5) is provided with a middle positioning hole (6) in a penetrating manner, one side of the chip positioning frame (3) close to the support frame (1) is connected with a side lead frame (7), one side of the chip positioning frame (3) far away from the support frame (1) is provided with a middle lead frame (8), the outer side of the support frame (1) is provided with a side positioning block (9), and the inner side of the side positioning block, the inner side of the side lead frame (7) is provided with a side lead groove (12), and the inner side of the middle lead frame (8) is provided with a middle lead groove (13).

2. The semiconductor chip package support of claim 1, wherein: the support frame (1) is rectangular, and the inner side of the support frame (1) is fixedly connected with the frame connecting block (2) through casting molding.

3. The semiconductor chip package support of claim 1, wherein: the number of the chip positioning frames (3) is fifteen, the chip positioning frames (3) are rectangular, and the number and the shape of the chip positioning frames (3) can be adjusted according to actual requirements and actual chip sizes.

4. The semiconductor chip package support of claim 1, wherein: one end of the positioning frame connecting block (5) is fixedly connected with the two ends of the chip positioning frame (3), and the middle positioning hole (6) is circular.

5. The semiconductor chip package support of claim 1, wherein: the side positioning holes (10) are circular, and the inner diameter of the middle positioning hole (6) is the same as that of the side positioning holes (10).

6. The semiconductor chip package support of claim 1, wherein: the length dimension of the middle lead frame (8) is about twice of the length dimension of the side lead frame (7), the inner side of the side lead frame (7) is fixedly connected with the chip positioning frame (3), and the outer side of the middle lead frame (8) is fixedly connected with the chip positioning frame (3).

7. The semiconductor chip package support of claim 1, wherein: the shape of the side positioning blocks (9) is rectangular, and the number of the side positioning blocks (9) is six.

8. The semiconductor chip package support of claim 1, wherein: the size of the side lead groove (12) is matched with the size of the outer diameter of a lead, and the size of the middle lead groove (13) is matched with the size of the outer diameter of the lead.