CN212542401U - Plastic package mold - Google Patents

Plastic package mold Download PDF

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Publication number
CN212542401U
CN212542401U CN202020460927.4U CN202020460927U CN212542401U CN 212542401 U CN212542401 U CN 212542401U CN 202020460927 U CN202020460927 U CN 202020460927U CN 212542401 U CN212542401 U CN 212542401U
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CN
China
Prior art keywords
mold
elastic layer
plastic package
mold part
plastic
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Active
Application number
CN202020460927.4U
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Chinese (zh)
Inventor
阳小芮
董美丹
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Shanghai Kaihong Electronic Co Ltd
Diodes Shanghai Co Ltd
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Diodes Shanghai Co Ltd
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Priority to CN202020460927.4U priority Critical patent/CN212542401U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Providing a plastic package mold, which comprises a first mold part and a second mold part which are matched with each other to form a cavity, wherein the first mold part is provided with a first area, and the surface of the first mold part in the first area is contacted with the surface of a chip; wherein the first mould part is provided with at least one first elastomeric layer on a surface within the first region. The plastic package mould sets up an elastic layer on the surface with the chip contact through two segmentation structures, so that the plastic package mould can satisfy the plastic envelope requirement of copper sheet welding process's packaging body.

Description

Plastic package mold
Technical Field
The utility model relates to a semiconductor package field especially relates to a lead frame and adopt packaging body of this lead frame.
Background
The packaged product is usually formed by mounting a chip on a lead frame and encapsulating the chip with a molding compound.
At present, in view of cost, efficiency, electrical parameters, heat dissipation, high frequency parameters, etc., there is a package body that replaces the conventional wire bonding process with a conductive sheet (or conductive layer), especially a copper sheet welding process, and the typical structure of the package body is shown in fig. 1.
As shown in fig. 1, the package 200 has a lead frame 210 and a chip 220, the lead frame 210 includes a base island 211 and a lead 212, and the chip 220 is disposed on the base island 211 of the lead frame 210. The chip 220 has a plurality of bonding pads (bonding pads 221 shown in fig. 2), each bonding pad is connected to a conductive sheet 240 through the solder layer 230, and further electrically connected to a corresponding lead 212 of the lead frame 210 through the conductive sheet 240. The whole package 200 is packaged into a device by the molding compound 250.
In the process of manufacturing the typical copper sheet soldered package shown in fig. 1, two steps of plastic molding are required. Specifically, the first step of molding is after the die 220 is mounted, and in the molding step, as shown in fig. 2, the molding compound 250 is required to fully expose the area of the die 220 including the pads 221 and the leads 212 that are required to be electrically connected to each of the pads 221. That is, in the first step of molding, the molding compound 250 needs to be formed to leave an area for filling the tin material layer 230 shown in fig. 1.
However, the currently used plastic package mold cannot meet the requirements of the plastic package step, and the plastic package mold can contact with the surface of the chip to cause damage in the using process, even directly resulting in scrapping of the device.
Therefore, a novel plastic package mold is needed to meet the plastic package requirement of the package body of the copper sheet welding process.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that solve current plastic envelope mould and can't be applicable to the plastic envelope requirement of the packaging body of copper sheet welding process, provide a new plastic envelope mould. The plastic package mould sets up an elastic layer on the surface with the chip contact through two segmentation structures, so that the plastic package mould can satisfy the plastic envelope requirement of copper sheet welding process's packaging body.
In order to solve the above problems, according to an aspect of the present invention, there is provided a plastic package mold comprising a first mold part and a second mold part which cooperate with each other to form a cavity; wherein the first mold portion has a first region, a surface of the first mold portion within the first region contacting a surface of a chip; wherein the first mould part is provided with at least one first elastomeric layer on a surface within the first region.
In some embodiments, the first mold portion further has a second region, a surface of the first mold portion within the second region contacting a surface of a lead of a leadframe; wherein the first mould part is provided with at least one second said resilient layer on a surface within the second region.
In some embodiments, the first elastic layer is formed as one piece with the second elastic layer. Alternatively, in some embodiments, the first elastic layer and the second elastic layer are independent of each other.
That is, the first elastic layer correspondingly contacting the chip surface and the second elastic layer correspondingly contacting the pin surface may be formed integrally or independently according to actual process requirements.
In some embodiments, the second resilient layer is secured to a surface of the first mold portion; alternatively, the second elastic layer is released from the surface of the first mold portion.
In the above embodiment, the first elastic layer is fixed to the surface of the first mold portion; alternatively, the first elastic layer is released from the surface of the first mold portion.
That is, the first elastic layer correspondingly contacting the surface of the chip and the second elastic layer correspondingly contacting the surface of the lead may be fixed to the surface of the first mold part, or may be separated from the surface of the first mold part; also, the two do not have to be fixed or disengaged at the same time.
In some embodiments, at least one of the first and second elastomeric layers has at least one locating feature on a surface thereof in contact with the first mold portion. That is, at least one positioning structure may be provided on a surface of the first elastic layer that is in contact with the first mold portion, at least one positioning structure may be provided on a surface of the second elastic layer that is in contact with the first mold portion, or at least one positioning structure may be provided on each of surfaces of the first elastic layer and the second elastic layer that are in contact with the first mold portion.
In some embodiments, the positioning structure comprises a protrusion and a recess engaged with the protrusion.
In some embodiments, the protrusion is disposed on a surface of one of the first elastic layer and the first mold portion, and the recess is disposed on a surface of the other of the first elastic layer and the first mold portion.
Similarly, in some embodiments, the second elastic layer and the protrusions are disposed on a surface of one of the second elastic layer and the first mold portion, and the recesses are disposed on a surface of the other of the second elastic layer and the first mold portion.
The utility model discloses in, through two segmentation structures, set up an elastic layer on the surface with the chip contact, so that the plastic envelope mould can satisfy the plastic envelope requirement of copper sheet welding process's packaging body. Meanwhile, the shape or the layer thickness of the elastic layer can be adjusted to meet the requirements of different process sizes. Furthermore, the plastic package mould can effectively avoid causing the problem of damage because of with chip surface contact in the use.
Drawings
Fig. 1 is a schematic view of an internal structure of a conventional package;
fig. 2 is a schematic structural view of the conventional package shown in fig. 1 during a packaging process;
fig. 3 is a front view of the plastic mold according to an embodiment of the present invention
Fig. 4A is a schematic view of an internal structure of the first mold part of the plastic mold shown in fig. 3; fig. 4B is a sectional view taken along line a-a' in fig. 4A, and fig. 4C is a partially enlarged view of fig. 4B.
Fig. 5 is a schematic structural view illustrating the first mold part mounted on a lead frame and a chip to be plastic-sealed.
Detailed Description
The following describes in detail a specific embodiment of the plastic package mold provided by the present invention with reference to the accompanying drawings.
As shown in fig. 3, the present invention provides a plastic mold 100, the plastic mold 100 includes a first mold part 110 and a second mold part 120 that cooperate with each other to form a cavity. Specifically, the first mold part 110 forms a specific structure on a surface 110A facing the second mold part 120 to accommodate a lead frame to be molded, and a molding compound is injected through an injection port disposed on the second mold part 120. In the plastic package mold 100 of the present invention, the first mold part 110 faces the surface 110A of the second mold part 120, the structure of the technical effect of the present invention is realized. The present invention is thus not intended to be limited to the internal structure of the second mold portion 120. The conventional plastic mold with injection port that can form the plastic mold at will in the field can be regarded as the second mold part 120 of the present invention.
Fig. 4A and 4B show the structure of the surface 110A of the first mold part 110 facing the second mold part 120 in fig. 3. It is understood that the surface 110A of the first mold part 110 is configured to face the chip to be molded and the lead frame when the molding is performed. As shown in fig. 4A and 4B, the first mold part 110 has a first region 111 and a second region 112, the surface of the first mold part 110 in the first region 111 is a surface for contacting a chip, and the surface of the first mold part 110 in the second region 112 is a surface for contacting a lead of a lead frame.
As shown in fig. 4A and 4B, the first mold part 1100 is provided with a first elastic layer 131 on a surface in the first region 111. It will be understood by those skilled in the art that the specific contour shape of the first elastic layer 131 and the number of layers of the first elastic layer 131 can be adjusted according to the lead frame and the chip in practical application, and are not limited to the structure shown in fig. 4A to 4C. The number of the first elastic layers 131 may be one or more according to actual needs.
Preferably, the first mold portion 100 is provided with a second elastic layer 132 on the surface in the second region 112. Similarly, it can be understood by those skilled in the art that the specific contour shape of the second elastic layer 132 and the number of layers of the second elastic layer 132 can be adjusted according to the lead frame and the chip in practical application, and is not limited to the structure shown in fig. 4A to 4C. In addition, the number of the second elastic layer 132 may be one or more according to actual needs.
In this embodiment, as shown in fig. 4A, the first elastic layer 131 and the second elastic layer 132 are independent from each other, that is, the first elastic layer 131 in the first region and the second elastic layer 132 in the second region are independent from each other and are discontinuous to form a whole. It will be understood by those skilled in the art that the first elastic layer 131 and the second elastic layer 132 may be formed integrally according to the actual shape of the specific lead frame and chip.
The first elastic layer 131 and the second elastic layer 132 may be fixed to the surface of the first mold part 110, or may be separated from the surface of the first mold part 110; also, both the first elastic layer 131 and the second elastic layer 132 do not have to be fixed at the same time or detached at the same time.
As a preferred aspect, at least one positioning structure 140 is disposed on a surface of at least one of the first elastic layer 131 and the second elastic layer 132 contacting the first mold part 110. That is, for example, as shown in fig. 4C, at least one positioning structure 140 may be provided on a surface of the first elastic layer 131 contacting the first mold part 110, and similarly, at least one positioning structure may be provided on a surface of the second elastic layer 132 contacting the first mold part 110. The first elastic layer 131 and the second elastic layer 132 may have at least one positioning structure 140 on the contact surface of the first mold part 110.
Further, it is understood that even though the first elastic layer 131 is fixed to the surface of the first mold part 110, a positioning structure 140 as shown in fig. 4C may be provided on the surface of the first elastic layer 131 contacting the first mold part 110. Similarly, even if the second elastic layer 132 is fixed to the surface of the first mold part 110, a positioning structure 140 as shown in fig. 4C may be provided on the surface of the second elastic layer 132 contacting the first mold part 110.
As shown in fig. 4C, the positioning structure 140 includes a protrusion 141 and a recess 142 matching with the protrusion 141. In this embodiment, the protrusion 141 is shaped like a needle and extends into the recess 142 to fit with the recess 142. As shown in fig. 4C, the protrusions 141 are disposed on the surface of the first elastic layer 131, and the recesses 142 are formed on the surface of the first mold part 110. It is understood that the positioning structure 140 can be formed when the protrusion 141 is disposed on the surface of the first mold part 110. Similarly, when the second elastic layer 132 has the positioning structure 140 shown in fig. 4C on the surface contacting the first mold part 110, similar to the case of the first elastic layer 131, protrusions may be disposed on the surface of the second elastic layer 132 and may also be disposed on the surface of the first mold part 110.
Therefore, in this embodiment, the plastic mold 100, particularly the internal structure of the first mold part 110, is specially configured, so that when the first mold part 110 of the plastic mold 100 of this embodiment is used for plastic molding, as shown in fig. 5, the first mold part 110 can completely attach to the surface of the chip 220 mounted on the base island 211 of the lead frame 210 and the surface of the pins 212 of the lead frame 210, and after the molding compound 250 is completed, the molding compound 250 can expose the region of the chip 220 including the plurality of pads 221 and the pins 212 that need to be electrically connected to each of the pads 221, as shown in fig. 2, so as to accurately leave the region for filling the tin material layer 230 shown in fig. 1.
The utility model discloses a plastic package mould 100 is through two segmentation structures (first mould portion 110 with first elastic layer 131), set up an elastic layer on the surface with the chip contact, so that the plastic package mould can satisfy the plastic envelope requirement of the packaging body of copper sheet welding process. Meanwhile, the shape or the layer thickness of the elastic layer can be adjusted to meet the requirements of different process sizes. Furthermore, the plastic package mould can effectively avoid causing the problem of damage because of with chip surface contact in the use.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims (11)

1. A plastic package mold comprises a first mold part and a second mold part which are mutually matched to form a cavity, and is characterized in that the first mold part is provided with a first area, and the surface of the first mold part in the first area is contacted with the surface of a chip; wherein the first mould part is provided with at least one first elastomeric layer on a surface within the first region.
2. A plastic package mold according to claim 1, wherein the first mold part further has a second region, and a surface of the first mold part in the second region contacts a surface of a lead frame; wherein the first mould part is provided with at least one second elastic layer on a surface within the second region.
3. A plastic package mold according to claim 2, wherein the first elastomeric layer is formed integrally with the second elastomeric layer.
4. A plastic package mold according to claim 2, wherein the first elastomeric layer and the second elastomeric layer are independent of each other.
5. A plastic package mold according to claim 2, wherein the second elastic layer is fixed to a surface of the first mold part; alternatively, the second elastic layer is released from the surface of the first mold portion.
6. A plastic package mold according to any one of claims 2 to 5, wherein the first elastic layer is fixed to a surface of the first mold part; alternatively, the first elastic layer is released from the surface of the first mold portion.
7. A plastic package mold according to claim 1, wherein the first elastic layer is fixed to a surface of the first mold part; alternatively, the first elastic layer is released from the surface of the first mold portion.
8. A plastic package mold according to claim 6, wherein at least one positioning structure is provided on a contact surface of the first mold part and at least one of the first elastic layer and the second elastic layer.
9. A plastic package mold as claimed in claim 8, wherein the positioning structure comprises a protrusion and a recess engaged with the protrusion.
10. A mold according to claim 9, wherein the protrusions are disposed on a surface of one of the first elastic layer and the first mold portion, and the recesses are disposed on a surface of the other of the first elastic layer and the first mold portion.
11. A plastic package mold according to claim 9, wherein the protrusions of the second elastic layer are disposed on a surface of one of the second elastic layer and the first mold portion, and the recesses are disposed on a surface of the other of the second elastic layer and the first mold portion.
CN202020460927.4U 2020-04-01 2020-04-01 Plastic package mold Active CN212542401U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020460927.4U CN212542401U (en) 2020-04-01 2020-04-01 Plastic package mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020460927.4U CN212542401U (en) 2020-04-01 2020-04-01 Plastic package mold

Publications (1)

Publication Number Publication Date
CN212542401U true CN212542401U (en) 2021-02-12

Family

ID=74523877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020460927.4U Active CN212542401U (en) 2020-04-01 2020-04-01 Plastic package mold

Country Status (1)

Country Link
CN (1) CN212542401U (en)

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