CN113496955A - Plastic package mold - Google Patents

Plastic package mold Download PDF

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Publication number
CN113496955A
CN113496955A CN202010250596.6A CN202010250596A CN113496955A CN 113496955 A CN113496955 A CN 113496955A CN 202010250596 A CN202010250596 A CN 202010250596A CN 113496955 A CN113496955 A CN 113496955A
Authority
CN
China
Prior art keywords
mold
elastic layer
plastic package
mold part
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010250596.6A
Other languages
Chinese (zh)
Inventor
阳小芮
董美丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIODES TECHNOLOGY (CHENGDU) CO LTD
Shanghai KaiHong Technology Co Ltd
Shanghai Kaihong Electronic Co Ltd
Diodes Shanghai Co Ltd
Original Assignee
DIODES TECHNOLOGY (CHENGDU) CO LTD
Shanghai KaiHong Technology Co Ltd
Diodes Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIODES TECHNOLOGY (CHENGDU) CO LTD, Shanghai KaiHong Technology Co Ltd, Diodes Shanghai Co Ltd filed Critical DIODES TECHNOLOGY (CHENGDU) CO LTD
Priority to CN202010250596.6A priority Critical patent/CN113496955A/en
Publication of CN113496955A publication Critical patent/CN113496955A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Providing a plastic package mold, which comprises a first mold part and a second mold part which are matched with each other to form a cavity, wherein the first mold part is provided with a first area, and the surface of the first mold part in the first area is contacted with the surface of a chip; wherein the first mould part is provided with at least one first elastomeric layer on a surface within the first region. According to the plastic package mold, the elastic layer is arranged on the surface in contact with the chip through the two-section structure, so that the plastic package mold can meet the plastic package requirement of a package body of a copper sheet welding process.

Description

Plastic package mold
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a lead frame and a packaging body adopting the lead frame.
Background
The packaged product is usually formed by mounting a chip on a lead frame and encapsulating the chip with a molding compound.
At present, in view of cost, efficiency, electrical parameters, heat dissipation, high frequency parameters, etc., there is a package body that replaces the conventional wire bonding process with a conductive sheet (or conductive layer), especially a copper sheet welding process, and the typical structure of the package body is shown in fig. 1.
As shown in fig. 1, the package 200 has a lead frame 210 and a chip 220, the lead frame 210 includes a base island 211 and a lead 212, and the chip 220 is disposed on the base island 211 of the lead frame 210. The chip 220 has a plurality of bonding pads (bonding pads 221 shown in fig. 2), each bonding pad is connected to a conductive sheet 240 through the solder layer 230, and further electrically connected to a corresponding lead 212 of the lead frame 210 through the conductive sheet 240. The whole package 200 is packaged into a device by the molding compound 250.
In the process of manufacturing the typical copper sheet soldered package shown in fig. 1, two steps of plastic molding are required. Specifically, the first step of molding is after the die 220 is mounted, and in the molding step, as shown in fig. 2, the molding compound 250 is required to fully expose the area of the die 220 including the pads 221 and the leads 212 that are required to be electrically connected to each of the pads 221. That is, in the first step of molding, the molding compound 250 needs to be formed to leave an area for filling the tin material layer 230 shown in fig. 1.
However, the currently used plastic package mold cannot meet the requirements of the plastic package step, and the plastic package mold can contact with the surface of the chip to cause damage in the using process, even directly resulting in scrapping of the device.
Therefore, a novel plastic package mold is needed to meet the plastic package requirement of the package body of the copper sheet welding process.
Disclosure of Invention
The invention aims to solve the technical problem that the existing plastic package mold cannot meet the plastic package requirement of a package body of a copper sheet welding process, and provides a novel plastic package mold. According to the plastic package mold, the elastic layer is arranged on the surface in contact with the chip through the two-section structure, so that the plastic package mold can meet the plastic package requirement of a package body of a copper sheet welding process.
In order to solve the above problems, according to an aspect of the present invention, there is provided a plastic mold, including a first mold part and a second mold part that cooperate with each other to form a cavity; wherein the first mold portion has a first region, a surface of the first mold portion within the first region contacting a surface of a chip; wherein the first mould part is provided with at least one first elastomeric layer on a surface within the first region.
In some embodiments, the first mold portion further has a second region, a surface of the first mold portion within the second region contacting a surface of a lead of a leadframe; wherein the first mould part is provided with at least one second said resilient layer on a surface within the second region.
In some embodiments, the first elastic layer is formed as one piece with the second elastic layer. Alternatively, in some embodiments, the first elastic layer and the second elastic layer are independent of each other.
That is, the first elastic layer correspondingly contacting the chip surface and the second elastic layer correspondingly contacting the pin surface may be formed integrally or independently according to actual process requirements.
In some embodiments, the second resilient layer is secured to a surface of the first mold portion; alternatively, the second elastic layer is released from the surface of the first mold portion.
In the above embodiment, the first elastic layer is fixed to the surface of the first mold portion; alternatively, the first elastic layer is released from the surface of the first mold portion.
That is, the first elastic layer correspondingly contacting the surface of the chip and the second elastic layer correspondingly contacting the surface of the lead may be fixed to the surface of the first mold part, or may be separated from the surface of the first mold part; also, the two do not have to be fixed or disengaged at the same time.
In some embodiments, at least one of the first and second elastomeric layers has at least one locating feature on a surface thereof in contact with the first mold portion. That is, at least one positioning structure may be provided on a surface of the first elastic layer that is in contact with the first mold portion, at least one positioning structure may be provided on a surface of the second elastic layer that is in contact with the first mold portion, or at least one positioning structure may be provided on each of surfaces of the first elastic layer and the second elastic layer that are in contact with the first mold portion.
In some embodiments, the positioning structure comprises a protrusion and a recess engaged with the protrusion.
In some embodiments, the protrusion is disposed on a surface of one of the first elastic layer and the first mold portion, and the recess is disposed on a surface of the other of the first elastic layer and the first mold portion.
Similarly, in some embodiments, the second elastic layer and the protrusions are disposed on a surface of one of the second elastic layer and the first mold portion, and the recesses are disposed on a surface of the other of the second elastic layer and the first mold portion.
In the invention, the elastic layer is arranged on the surface which is in contact with the chip through a two-section structure, so that the plastic package mold can meet the plastic package requirement of a package body of a copper sheet welding process. Meanwhile, the shape or the layer thickness of the elastic layer can be adjusted to meet the requirements of different process sizes. In addition, the plastic package mold can effectively avoid the problem of damage caused by contact with the surface of the chip in the using process.
Drawings
Fig. 1 is a schematic view of an internal structure of a conventional package;
fig. 2 is a schematic structural view of the conventional package shown in fig. 1 during a packaging process;
fig. 3 is a front view of the plastic mold according to an embodiment of the present invention
Fig. 4A is a schematic view of an internal structure of the first mold part of the plastic mold shown in fig. 3; fig. 4B is a sectional view taken along line a-a' in fig. 4A, and fig. 4C is a partially enlarged view of fig. 4B.
Fig. 5 is a schematic structural view illustrating the first mold part mounted on a lead frame and a chip to be plastic-sealed.
Detailed Description
The following describes in detail a specific embodiment of the plastic package mold provided by the present invention with reference to the accompanying drawings.
As shown in fig. 3, the present invention provides a plastic mold 100, wherein the plastic mold 100 includes a first mold part 110 and a second mold part 120 that cooperate with each other to form a cavity. Specifically, the first mold part 110 forms a specific structure on a surface 110A facing the second mold part 120 to accommodate a lead frame to be molded, and a molding compound is injected through an injection port disposed on the second mold part 120. In the plastic mold 100 of the present invention, the structure formed on the surface 110A of the first mold part 110 facing the second mold part 120 is a structure that achieves the technical effects of the present invention. The present invention is not intended to be limited to the internal structure of the second mold portion 120. Any mold part of a conventional plastic mold having an injection port, which can form a plastic mold, may be used as the second mold part 120 of the present invention.
Fig. 4A and 4B show the structure of the surface 110A of the first mold part 110 facing the second mold part 120 in fig. 3. It is understood that the surface 110A of the first mold part 110 is configured to face the chip to be molded and the lead frame when the molding is performed. As shown in fig. 4A and 4B, the first mold part 110 has a first region 111 and a second region 112, the surface of the first mold part 110 in the first region 111 is a surface for contacting a chip, and the surface of the first mold part 110 in the second region 112 is a surface for contacting a lead of a lead frame.
As shown in fig. 4A and 4B, the first mold part 1100 is provided with a first elastic layer 131 on a surface in the first region 111. It will be understood by those skilled in the art that the specific contour shape of the first elastic layer 131 and the number of layers of the first elastic layer 131 can be adjusted according to the lead frame and the chip in practical application, and are not limited to the structure shown in fig. 4A to 4C. The number of the first elastic layers 131 may be one or more according to actual needs.
Preferably, the first mold portion 100 is provided with a second elastic layer 132 on the surface in the second region 112. Similarly, it can be understood by those skilled in the art that the specific contour shape of the second elastic layer 132 and the number of layers of the second elastic layer 132 can be adjusted according to the lead frame and the chip in practical application, and is not limited to the structure shown in fig. 4A to 4C. In addition, the number of the second elastic layer 132 may be one or more according to actual needs.
In this embodiment, as shown in fig. 4A, the first elastic layer 131 and the second elastic layer 132 are independent from each other, that is, the first elastic layer 131 in the first region and the second elastic layer 132 in the second region are independent from each other and are discontinuous to form a whole. It will be understood by those skilled in the art that the first elastic layer 131 and the second elastic layer 132 may be formed integrally according to the actual shape of the specific lead frame and chip.
The first elastic layer 131 and the second elastic layer 132 may be fixed to the surface of the first mold part 110, or may be separated from the surface of the first mold part 110; also, both the first elastic layer 131 and the second elastic layer 132 do not have to be fixed at the same time or detached at the same time.
As a preferred aspect, at least one positioning structure 140 is disposed on a surface of at least one of the first elastic layer 131 and the second elastic layer 132 contacting the first mold part 110. That is, for example, as shown in fig. 4C, at least one positioning structure 140 may be provided on a surface of the first elastic layer 131 contacting the first mold part 110, and similarly, at least one positioning structure may be provided on a surface of the second elastic layer 132 contacting the first mold part 110. The first elastic layer 131 and the second elastic layer 132 may have at least one positioning structure 140 on the contact surface of the first mold part 110.
Further, it is understood that even though the first elastic layer 131 is fixed to the surface of the first mold part 110, a positioning structure 140 as shown in fig. 4C may be provided on the surface of the first elastic layer 131 contacting the first mold part 110. Similarly, even if the second elastic layer 132 is fixed to the surface of the first mold part 110, a positioning structure 140 as shown in fig. 4C may be provided on the surface of the second elastic layer 132 contacting the first mold part 110.
As shown in fig. 4C, the positioning structure 140 includes a protrusion 141 and a recess 142 matching with the protrusion 141. In this embodiment, the protrusion 141 is shaped like a needle and extends into the recess 142 to fit with the recess 142. As shown in fig. 4C, the protrusions 141 are disposed on the surface of the first elastic layer 131, and the recesses 142 are formed on the surface of the first mold part 110. It is understood that the positioning structure 140 can be formed when the protrusion 141 is disposed on the surface of the first mold part 110. Similarly, when the second elastic layer 132 has the positioning structure 140 shown in fig. 4C on the surface contacting the first mold part 110, similar to the case of the first elastic layer 131, protrusions may be disposed on the surface of the second elastic layer 132 and may also be disposed on the surface of the first mold part 110.
Therefore, in this embodiment, the plastic mold 100, particularly the internal structure of the first mold part 110, is specially configured, so that when the first mold part 110 of the plastic mold 100 of this embodiment is used for plastic molding, as shown in fig. 5, the first mold part 110 can completely attach to the surface of the chip 220 mounted on the base island 211 of the lead frame 210 and the surface of the pins 212 of the lead frame 210, and after the molding compound 250 is completed, the molding compound 250 can expose the region of the chip 220 including the plurality of pads 221 and the pins 212 that need to be electrically connected to each of the pads 221, as shown in fig. 2, so as to accurately leave the region for filling the tin material layer 230 shown in fig. 1.
The plastic package mold 100 of the present invention has a two-segment structure (the first mold part 110 and the first elastic layer 131) and an elastic layer is disposed on the surface contacting with the chip, so that the plastic package mold can meet the plastic package requirement of the package body of the copper sheet welding process. Meanwhile, the shape or the layer thickness of the elastic layer can be adjusted to meet the requirements of different process sizes. In addition, the plastic package mold can effectively avoid the problem of damage caused by contact with the surface of the chip in the using process.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. A plastic package mold comprises a first mold part and a second mold part which are mutually matched to form a cavity, and is characterized in that the first mold part is provided with a first area, and the surface of the first mold part in the first area is contacted with the surface of a chip; wherein the first mould part is provided with at least one first elastomeric layer on a surface within the first region.
2. A plastic package mold according to claim 1, wherein the first mold part further has a second region, and a surface of the first mold part in the second region contacts a surface of a lead frame; wherein the first mould part is provided with at least one second said resilient layer on a surface within the second region.
3. A plastic package mold according to claim 2, wherein the first elastomeric layer is formed integrally with the second elastomeric layer.
4. A plastic package mold according to claim 2, wherein the first elastomeric layer and the second elastomeric layer are independent of each other.
5. A plastic package mold according to claim 2, wherein the second elastic layer is fixed to a surface of the first mold part; alternatively, the second elastic layer is released from the surface of the first mold portion.
6. A plastic package mold according to any one of claims 1 to 5, wherein the first elastic layer is fixed to a surface of the first mold part; alternatively, the first elastic layer is released from the surface of the first mold portion.
7. A plastic package mold according to claim 6, wherein at least one positioning structure is provided on a contact surface of the first mold part and at least one of the first elastic layer and the second elastic layer.
8. A plastic package mold according to claim 7, wherein the positioning structure comprises a protrusion and a recess engaged with the protrusion.
9. A mold according to claim 8, wherein the protrusions are disposed on a surface of one of the first elastic layer and the first mold portion, and the recesses are disposed on a surface of the other of the first elastic layer and the first mold portion.
10. A plastic package mold according to claim 8, wherein the protrusions of the second elastic layer are disposed on a surface of one of the second elastic layer and the first mold portion, and the recesses are disposed on a surface of the other of the second elastic layer and the first mold portion.
CN202010250596.6A 2020-04-01 2020-04-01 Plastic package mold Pending CN113496955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010250596.6A CN113496955A (en) 2020-04-01 2020-04-01 Plastic package mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010250596.6A CN113496955A (en) 2020-04-01 2020-04-01 Plastic package mold

Publications (1)

Publication Number Publication Date
CN113496955A true CN113496955A (en) 2021-10-12

Family

ID=77993945

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010250596.6A Pending CN113496955A (en) 2020-04-01 2020-04-01 Plastic package mold

Country Status (1)

Country Link
CN (1) CN113496955A (en)

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