CN213401185U - Prevent bending deformation's lead frame and encapsulation tablet - Google Patents
Prevent bending deformation's lead frame and encapsulation tablet Download PDFInfo
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- CN213401185U CN213401185U CN202022682305.9U CN202022682305U CN213401185U CN 213401185 U CN213401185 U CN 213401185U CN 202022682305 U CN202022682305 U CN 202022682305U CN 213401185 U CN213401185 U CN 213401185U
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- frame
- boss
- conductive pin
- base island
- conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides a lead frame and a packaging material sheet which are prevented from bending and deforming, comprising a frame, wherein a first welding disk assembly, a second welding disk assembly and a third welding disk assembly are arranged in the frame; the first pad component comprises a first base island, two sides of the first base island are connected with the frame through a plurality of first conductive pins, the other side of the first base island is connected with the frame through a first reinforcing rib, and a first boss is fixed on the back of the first base island; the second pad assembly comprises a second base island, one end of the second base island is connected with the frame through a second conductive pin, one side of the second base island is connected with the frame through a second reinforcing rib, and a third boss is fixed on the back of the second base island; the third pad assembly includes a third conductive pin, one side of which is connected to the bezel. The utility model discloses can form good bending resistance performance, can effectively resist pressure in course of working such as routing to avoid the base island to take place deformation, the reliability of the product that obtains is high.
Description
Technical Field
The utility model relates to a lead frame specifically discloses a prevent lead frame and encapsulation tablet of buckling deformation.
Background
The lead frame is a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials to form an electrical circuit, plays a role of a bridge connected with an external lead and needs to be used in most semiconductor integrated blocks.
Different semiconductor device has different inner structure, and when structures such as field effect transistor, a certain electrode of chip need with one of them conductive pin between realize being connected through a plurality of conductive pin, owing to need carry out routing processing to many wires, the conductive pin who connects takes place buckling deformation easily at routing in-process, leads to its bottom to be covered by the plastic of overflow easily at the encapsulation in-process of moulding plastics to lead to this pin to lose the performance with external circuit intercommunication.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a lead frame and a packaging material sheet for preventing bending deformation, which can ensure structural stability during processes such as wire bonding, have good bending resistance, and can prevent pin failure of a finally obtained product.
In order to solve the prior art problem, the utility model discloses a lead frame for preventing bending deformation, which comprises a frame, wherein a first welding disk assembly, a second welding disk assembly and a third welding disk assembly which are not in contact with each other are arranged in the frame;
the first pad component comprises a first base island, two sides of the first base island are connected with the frame through a plurality of first conductive pins, the other side of the first base island is connected with the frame through a first reinforcing rib, a first boss is fixed on the back of the first base island, a second boss is fixed on the back of the first conductive pin, and a gap is formed between the first boss and the second boss;
the second pad component comprises a second base island, one end of the second base island is connected with the frame through a second conductive pin, one side of the second base island is connected with the frame through a second reinforcing rib, a third boss is fixed on the back of the second base island, a fourth boss is fixed on the back of the second conductive pin, and a gap is formed between the third boss and the fourth boss;
the third pad component comprises a third conductive pin, one side of the third conductive pin is connected with the frame, and a fifth boss is fixed on the back of the third conductive pin.
Furthermore, a positioning hole is arranged on the frame.
Furthermore, the first reinforcing rib and the second reinforcing rib are connected to two opposite sides in the frame, and the first conductive pin, the second conductive pin and the third conductive pin are connected to the other two sides in the frame.
Furthermore, the thicknesses of the first boss, the second boss, the third boss, the fourth boss and the fifth boss are all 0.03-0.05 mm.
Furthermore, the width of the first reinforcing rib and the width of the second reinforcing rib are both 0.12-0.18 mm.
Furthermore, a first narrowing rib is connected between the first conductive pin and the frame, the width of the first narrowing rib is smaller than that of the first conductive pin, a second narrowing rib is connected between the second conductive pin and the frame, the width of the second narrowing rib is smaller than that of the second conductive pin, a third narrowing rib is connected between the third conductive pin and the frame, and the width of the third narrowing rib is smaller than that of the third conductive pin.
Furthermore, the width of the first narrowing rib, the width of the second narrowing rib and the width of the third narrowing rib are 0.2-0.25 mm.
The utility model also discloses a prevent encapsulation tablet of bending deformation, including the lead frame of above arbitrary preventing bending deformation, still include chip and encapsulation colloid, the chip welds in the front of first base island, the front of second base island and the electrically conductive pin of third all is connected with the chip through the wire, first base island, the equal cladding of second base island and chip is in the encapsulation colloid, first boss, the second boss, the third boss, the equal protrusion in the bottom surface of encapsulation colloid of fourth boss and fifth boss, first electrically conductive pin, first strengthening rib, the electrically conductive pin of second, the lateral wall that encapsulation colloid was all run through to second strengthening rib and the electrically conductive pin of third.
The utility model has the advantages that: the utility model discloses a prevent lead frame and encapsulation tablet of buckling deformation, improve the stability of whole piece lead frame through setting up the strengthening rib between the island of large tracts of land and the frame, each conductive pin that sets up between cooperation island and the frame, can form good bending resistance, the pressure that produces when can effectively resisting the routing in the course of working such as routing, thereby avoid the island of large tracts of land to take place deformation, furthermore, each island all is provided with the boss with conductive pin's the back, when moulding plastics the encapsulation, can avoid plastic overflow to the bottom surface of boss and lead to it to lose the performance that communicates with external circuit, the reliability of finally obtained product is high.
Drawings
Fig. 1 is a schematic view of a three-dimensional structure of a middle lead frame according to the present invention.
Fig. 2 is a schematic view of the internal structure of the middle package material sheet according to the present invention.
Fig. 3 is a schematic perspective view of a single semiconductor product manufactured by using the present invention.
The reference signs are: the package structure comprises a frame 10, a positioning hole 11, a first pad assembly 20, a first base island 21, a first boss 211, a first conductive pin 22, a second boss 221, a first narrowing rib 222, a first reinforcing rib 23, a second pad assembly 30, a second base island 31, a third boss 311, a second conductive pin 32, a fourth boss 321, a second narrowing rib 322, a second reinforcing rib 33, a third pad assembly 40, a third conductive pin 41, a fifth boss 411, a third narrowing rib 412, a chip 50, a lead 51 and a package colloid 60.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 to 3.
The embodiment of the utility model discloses a lead frame of bending deformation prevention, including frame 10, be equipped with first bonding pad subassembly 20, second bonding pad subassembly 30 and third bonding pad subassembly 40 that do not contact each other in the frame 10, namely first bonding pad subassembly 20, second bonding pad subassembly 30 and third bonding pad subassembly 40 all are equipped with the interval between two liang, preferably, second bonding pad subassembly 30 and third bonding pad subassembly 40 all are located the same side of first bonding pad subassembly 20;
the first pad assembly 20 includes a first base island 21, two sides of the first base island 21 are fixedly connected to the frame 10 through a plurality of first conductive pins 22, preferably, two sides of the first base island 21 are connected to the inner side of the frame 10 through two first conductive pins 22, another side of the first base island 21 is fixedly connected to the frame 10 through at least one first reinforcing rib 23, namely, the first conductive pin 22 and the first reinforcing rib 23 are respectively located at different side ends of the first base island 21, the first conductive pin 22 and the first reinforcing rib 23 are of an integrally formed structure, a first boss 211 for preventing glue overflow is fixed on the back surface of the first base island 21, the area of the first boss 211 is smaller than that of the first base island 21, a second boss 221 for preventing glue overflow is fixed on the back surface of the first conductive pin 22, and a gap is formed between the first boss 211 and the second boss 221, so that the effect of realizing corresponding independent welding pins can be achieved;
the second pad assembly 30 includes a second elongated pad 31, one end of the second elongated pad 31 is connected to the frame 10 through a second conductive lead 32, one side of the second elongated pad 31 is fixedly connected to the frame 10 through at least one second stiffener 33, the second conductive lead 32 and the second stiffener 33 are respectively located at different sides of the second elongated pad 31, a third boss 311 for preventing glue overflow is fixed to the back of the second elongated pad 31, the area of the third boss 311 is smaller than that of the second elongated pad 31, a fourth boss 321 for preventing glue overflow is fixed to the back of the second conductive lead 32, and a space is formed between the third boss 311 and the fourth boss 321, so that a corresponding independent soldering lead effect can be achieved;
the third pad assembly 40 includes a third conductive pin 41, one side of the third conductive pin 41 is fixedly connected to the frame 10, a fifth boss 411 for preventing glue overflow is fixed to the back of the third conductive pin 41, and an integrated structure or a welded structure is formed between each boss and the base island or the conductive pin.
The front and back sides are referred to as two sides of the lead frame, and the areas of the first base island 21 and the second base island 31 are larger than the area of each conductive pin.
In the application process, the chip 50 is welded on the front surface of the first base island 21, other electrodes of the chip 50 are connected with the front surface of the second base island 31 and the front surface of the third conductive pin 41 through the leads 51, in the process of welding the leads 51, one ends of a plurality of leads 51 can be welded on the second base island 31, and as each pad can be stressed in the wire bonding process, the reinforcing ribs can effectively stabilize the structure between the base island and the frame 10, so that the problem that the performance of a finally obtained product is influenced due to bending deformation of the second base island 31 caused by unbalanced stress in the wire bonding process is avoided; during packaging, after the packaging colloid 60 is obtained by injection molding and packaging, each boss can protrude out of the bottom surface of the packaging colloid 60, and the bottom surface of each boss is sunk into a groove corresponding to the injection molding cavity, so that plastic is prevented from spreading to the bottom surface of the boss, each boss can be ensured to form a pin structure for realizing welding with a PCB, namely, the internal chip 50 of each boss can be ensured to be communicated with an external circuit, the reliability of the performance of the finally obtained product is improved, and the processing is convenient and reliable; when cutting, each reinforcing rib and each conductive pin are cut, and then an independent product can be separated from the frame 10. The utility model discloses a lead frame can be used to make semiconductor products such as DFN packaging structure's field effect transistor.
In this embodiment, the frame 10 is provided with the positioning holes 11, and the lead frame can be reliably positioned through the positioning holes 11, so that the processing precision is improved.
In this embodiment, the first reinforcing rib 23 and the second reinforcing rib 33 are connected to two opposite sides in the frame 10, and the first conductive pin 22, the second conductive pin 32 and the third conductive pin 41 are connected to the other two sides in the frame 10, that is, the reinforcing ribs and the conductive pins are not located at the same side, so that short circuit of the conductive pins or electronic components and circuit boards connected thereto caused by the reinforcing ribs can be avoided, and the reliability of the overall structure can be effectively improved.
In the present embodiment, the thicknesses of the first boss 211, the second boss 221, the third boss 311, the fourth boss 321, and the fifth boss 411 are all 0.03 to 0.05mm, and preferably, all the thicknesses are 0.04 mm.
In the present embodiment, the width of each of the first ribs 23 and the second ribs 33 is 0.12 to 0.18mm, preferably 0.15mm, and the thickness of each of the first ribs 23 is preferably 0.1 to 0.12 mm.
In this embodiment, first narrowing rib 222 is further connected between first conductive pin 22 and frame 10, the width of first narrowing rib 222 is smaller than that of first conductive pin 22, second narrowing rib 322 is further connected between second conductive pin 32 and frame 10, the width of second narrowing rib 322 is smaller than that of second conductive pin 32, third narrowing rib 412 is further connected between third conductive pin 41 and frame 10, the width of third narrowing rib 412 is smaller than that of third conductive pin 41, the position of the narrowing rib is only required to be cut during cutting, the resistance received during cutting can be effectively reduced, the reliability of cutting is improved, and product cracking is avoided. Preferably, the second boss 221 may be further fixed to the back surface of the first narrowing rib 222, the fourth boss 321 may be further fixed to the back surface of the second narrowing rib 322, and the fifth boss 411 may be further fixed to the back surface of the third narrowing rib 412.
Based on the above described embodiment, the first 222, second 322 and third 412 narrowing ribs have a width of 0.2 to 0.25mm, preferably 0.22 mm.
The embodiment of the utility model provides a still disclose a prevent packaging material piece of buckling deformation, including the lead frame of above arbitrary one kind prevent the bending deformation, still include chip 50 and packaging colloid 60, preferably, chip 50 is triode chip 50, chip 50 welds in the front of first base island 21, the front of second base island 31 and the front of third conductive pin 41 all are connected with each electrode of chip 50 through wire 51, first base island 21, the equal cladding of second base island 31 and chip 50 is in packaging colloid 60, first boss 211, second boss 221, third boss 311, the equal protrusion in packaging colloid 60's bottom surface of fourth boss 321 and fifth boss 411, first conductive pin 22, first strengthening rib 23, second conductive pin 32, second strengthening rib 33 and third conductive pin 41 all run through packaging colloid 60's lateral wall. When the narrowing ribs are provided, the connection surfaces between the narrowing ribs and the conductive pins are coplanar with the side surfaces of the encapsulant 60.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. The bending deformation prevention lead frame is characterized by comprising a frame (10), wherein a first welding disk assembly (20), a second welding disk assembly (30) and a third welding disk assembly (40) which are not in contact with each other are arranged in the frame (10);
the first pad assembly (20) comprises a first base island (21), two sides of the first base island (21) are connected with the frame (10) through a plurality of first conductive pins (22), the other side of the first base island (21) is connected with the frame (10) through a first reinforcing rib (23), a first boss (211) is fixed on the back of the first base island (21), a second boss (221) is fixed on the back of the first conductive pin (22), and a gap is formed between the first boss (211) and the second boss (221);
the second pad assembly (30) comprises a second base island (31), one end of the second base island (31) is connected with the frame (10) through a second conductive pin (32), one side of the second base island (31) is connected with the frame (10) through a second reinforcing rib (33), a third boss (311) is fixed on the back of the second base island (31), a fourth boss (321) is fixed on the back of the second conductive pin (32), and a gap is formed between the third boss (311) and the fourth boss (321);
the third pad assembly (40) comprises a third conductive pin (41), one side of the third conductive pin (41) is connected with the frame (10), and a fifth boss (411) is fixed on the back of the third conductive pin.
2. Lead frame against bending deformation according to claim 1, characterized in that the frame (10) is provided with positioning holes (11).
3. A kink-resistant lead frame according to claim 1, characterized in that said first reinforcement bar (23) and said second reinforcement bar (33) are connected to opposite sides in said frame (10), and said first conductive lead (22), said second conductive lead (32) and said third conductive lead (41) are connected to the other two sides in said frame (10).
4. A bending deformation prevention lead frame according to claim 1, wherein the thickness of the first boss (211), the second boss (221), the third boss (311), the fourth boss (321) and the fifth boss (411) are all 0.03-0.05 mm.
5. The bending deformation prevention lead frame according to claim 1, wherein the width of each of the first reinforcing rib (23) and the second reinforcing rib (33) is 0.12-0.18 mm.
6. A bending deformation prevention lead frame according to claim 1, wherein a first narrowing rib (222) is connected between the first conductive pin (22) and the frame (10), the width of the first narrowing rib (222) is smaller than that of the first conductive pin (22), a second narrowing rib (322) is connected between the second conductive pin (32) and the frame (10), the width of the second narrowing rib (322) is smaller than that of the second conductive pin (32), a third narrowing rib (412) is connected between the third conductive pin (41) and the frame (10), and the width of the third narrowing rib (412) is smaller than that of the third conductive pin (41).
7. A fold-deformation-resistant lead-frame according to claim 6, characterized in that the width of the first (222), second (322) and third (412) narrowing ribs is 0.2-0.25 mm.
8. A warpage-preventing package material sheet, comprising the warpage-preventing lead frame of any one of claims 1 to 7, further comprising a chip (50) and a package adhesive (60), wherein the chip (50) is soldered to the front surface of the first base island (21), the front surfaces of the second base island (31) and the third conductive pin (41) are connected to the chip (50) through a wire (51), the first base island (21), the second base island (31) and the chip (50) are all covered in the package adhesive (60), the first protrusion (211), the second protrusion (221), the third protrusion (311), the fourth protrusion (321) and the fifth protrusion (411) all protrude from the bottom surface of the package adhesive (60), and the first conductive pin (22), the first stiffener (23), and the first conductive adhesive (60), The second conductive pin (32), the second reinforcing rib (33) and the third conductive pin (41) penetrate through the side wall of the packaging colloid (60).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022682305.9U CN213401185U (en) | 2020-11-18 | 2020-11-18 | Prevent bending deformation's lead frame and encapsulation tablet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022682305.9U CN213401185U (en) | 2020-11-18 | 2020-11-18 | Prevent bending deformation's lead frame and encapsulation tablet |
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| Publication Number | Publication Date |
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| CN213401185U true CN213401185U (en) | 2021-06-08 |
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| CN202022682305.9U Active CN213401185U (en) | 2020-11-18 | 2020-11-18 | Prevent bending deformation's lead frame and encapsulation tablet |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420664A (en) * | 2022-01-18 | 2022-04-29 | 广东气派科技有限公司 | Packaging structure of multi-base-island high-power module QFN |
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2020
- 2020-11-18 CN CN202022682305.9U patent/CN213401185U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420664A (en) * | 2022-01-18 | 2022-04-29 | 广东气派科技有限公司 | Packaging structure of multi-base-island high-power module QFN |
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