JP3111270B2 - Transfer arm cleaning device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning a transfer arm for holding and transferring a plurality of plate-like workpieces in a line.

[0002]

2. Description of the Related Art In a semiconductor wafer cleaning apparatus, a large number of semiconductor wafers, for example, 25 semiconductor wafers are arranged in a line in a direction substantially perpendicular to a plate surface (wafer surface) at substantially equal intervals in order to improve the cleaning efficiency. , The wafers are immersed in the cleaning treatment liquid at one time (as a set) while being held by a transfer device such as a wafer chuck.

FIG. 9 shows a configuration of a semiconductor wafer cleaning apparatus using this type of transfer apparatus. In this cleaning device,
The processing bath 100 contains a processing liquid PQ for cleaning a semiconductor wafer W as an object to be processed. The transfer robot 102 is configured to run in the direction of arrow Y and move back and forth between the processing tank 100 and a wafer loading / unloading port (not shown). The transfer robot 102 is equipped with a chuck drive unit 104 that can move up and down in the direction of arrow Z (vertical direction), and a wafer chuck (transfer device) 106 is attached to the chuck drive unit 104.

The wafer chuck 106 has a pair of horizontal support rods 110A and 110B attached to the chuck driving unit 104 so as to be able to expand and contract and rotate.
Vertical frame rods 112A, 114A, 112B, 114B fixed to the distal end and the proximal end of 110B, respectively.
Between the vertical frame rods 112A and 114A and 11
2B and 114B, two wafer supporting rods 116A and 118A and 116B and 118B, respectively.
(Behind the wafer W and cannot be seen in FIG. 9). Horizontal support rod 110A, vertical frame rod 11
2A, 114A and wafer support rods 116A, 118A
Integrally constitute one transfer arm 120A, and include a horizontal support rod 110B and vertical frame rods 112B and 114B.
The wafer support rods 116B and 118B are integrated to form the other transfer arm 120B.

When the horizontal support rods 110A and 110B are rotated by the rotation of the chuck driving unit 104, the two transfer arms 120A and 120B are opened and closed in the directions of arrows CA and CB to collectively collect one set of wafers W1 to W25. It is designed to be detachably gripped. Each wafer support rod 116A, 1
18A, 116B, and 118B, the wafers W1 to W
Grooves G1 to G25 are formed at substantially constant intervals to hold the 25's arranged in a line in a direction perpendicular to the plate surface.
As shown, these wafers W1 to W25 are gripped by both transfer arms 120A and 120B such that their lower ends protrude below lower wafer support rods 118A and 118B.

FIG. 9 shows a state before and after the cleaning process, that is, a state immediately before the wafers W1 to W25 are put into the processing bath 100 or immediately after the wafers W1 to W25 are taken out of the processing bath 100. When performing the cleaning process, the wafer chuck 106 is lowered into the processing bath 100 by the downward movement of the chuck driving unit 104. In the processing tank 100, the wafers W1 to W25
The wafer boat (not shown) for holding the processing liquid P
Q is disposed at a predetermined position below the liquid level, and the wafer W is transferred from the wafer chuck 106 to the wafer boat in the processing liquid PQ.
1 to W25 are collectively transferred.

Therefore, after the wafer chuck 106 transfers the wafers W1 to W25 to the wafer boat in the processing tank 100, the wafer chuck 106 is temporarily left empty. While the hand is vacant, the transfer robot 102 moves to the wafer chuck cleaning unit (transfer arm cleaning unit) close to the processing tank 100 as necessary, where the transfer arms 120A and 120A are moved.
OB cleaning is performed.

In general, in the transfer arm cleaning section, first, spray cleaning is performed by spraying a cleaning liquid, such as pure water, for washing off processing liquid, particles and the like attached to each section of the transfer arms 120A, 120B, and then drying. For example, liquid is removed by blowing gas such as air.

[0009]

However, various types of transfer arm cleaning devices have been conventionally known, but all have problems in efficiency and safety, particularly in efficiency and safety of liquid removal (drying processing). For example, there are problems such as incomplete drainage, a relatively long time required for drainage, or water droplets from the drainage sticking to other parts of the transfer arm or scattering to the next processing liquid tank. there were.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a transfer arm cleaning apparatus capable of performing the cleaning and drying of the transfer arm with good efficiency and safety.

[0011]

In order to achieve the above object, a first transfer arm cleaning apparatus of the present invention comprises a plurality of plate-like objects to be processed which are arranged at a predetermined interval. A transfer arm cleaning device for cleaning the transfer arm of a transfer device gripping and transferring by the transfer arm, wherein the transfer arm is configured to be able to enter and exit in a substantially vertical direction from an upper surface opening; In the room, each discharge port is arranged in a row or a plurality of rows in a substantially horizontal direction on one side or both sides of the passage of the transfer arm toward a cleaning position at a predetermined height set on the passage of the transfer arm. A cleaning nozzle, a cleaning liquid supply unit configured to supply a cleaning liquid to the cleaning nozzle, and a predetermined position higher than a cleaning position of the cleaning nozzle set on the passage of the transfer arm in each of the discharge ports in the cleaning chamber. One or both sides of the passage of the transfer arm are arranged in a row or a plurality of rows in a substantially horizontal direction toward the liquid draining position, and most of the discharge ports face obliquely downward in a plane substantially perpendicular to the nozzle arrangement direction. numerous gas nozzle has a gas supply means for supplying a drying gas into the gas nozzle, wherein the transfer arm is the cleaning solution or before
While the drying gas is being blown, the transfer
The nozzle array of the cleaning nozzle or the gas nozzle
Means for moving in parallel with the direction .

In a second transfer arm cleaning apparatus of the present invention, a plurality of plate-like objects to be processed are arranged at predetermined intervals.
Transport device that grips and transports with a pair of transport arms in the upright position
Transfer arm cleaning device for cleaning the transfer arm
Wherein the transfer arm is substantially perpendicular to the upper surface opening.
A cleaning chamber configured to be able to enter and exit the
Each discharge port is set on the passage of the transfer arm within
Path of the transfer arm toward the cleaning position at a predetermined height
Nearly horizontal single or multiple rows on one or both sides
A number of cleaning nozzles arranged and a cleaning liquid
Cleaning liquid supply means for supplying
An outlet is set on the cleaning arm set on the passage of the transfer arm.
Forward to a predetermined draining position higher than the rinsing position
Almost horizontally on one or both sides of the transfer arm passage
They are arranged in one or more rows and most of the outlets are nozzles
Obliquely downward in a plane almost perpendicular to the arrangement direction
A number of gas nozzles and a drying gas
Gas supply means for supplying a gas, wherein the cleaning chamber is a chamber.
One transport door is separated by a partition plate provided at the center of
Cleaning chamber for cleaning the arm and the other transfer arm
And a second cleaning chamber for cleaning the
And the washing nozzle and the washing nozzle in each of the second washing chambers.
The configuration was such that a gas nozzle was provided.

[0013] First or second transfer arm cleaning of the present invention
In the apparatus, preferably, each row of the gas nozzles
In other words, the discharge port of the gas nozzle in the middle
It is provided diagonally downward in a substantially vertical plane,
The outlet of the gas nozzle is inclined at an angle to the vertical plane.
The configuration may be provided. In another preferred embodiment
The washing nozzle is located on one side of the transfer arm passage or
One or more cleaning swaths arranged approximately horizontally on both sides
Provided at predetermined intervals in each of the play pipes,
The cleaning spray pipe was open at both ends and opened
A configuration in which a common cleaning liquid supply unit is connected to both ends.
It may be. In another preferred embodiment, the transfer arm
When the cleaning position rises along the transfer arm path,
Cleaning liquid can be sprayed from the cleaning nozzle
It may be. In another preferred embodiment, the transfer arm
When the liquid rises along the transfer arm path,
The drying gas is sprayed from the gas nozzle at the position
May be adopted . As still another preferred embodiment,
On the upper surface of the cleaning chamber to pass through the transfer arm
Configuration with a shielding plate with openings
No.

[0014]

According to the present invention, most (for example, an intermediate portion) of a large number of liquid drain gas nozzles arranged substantially horizontally in a row on both sides or one side of the transfer arm passage (for example, an intermediate portion) move toward the liquid drain position in the nozzle arrangement direction. By injecting a liquid for draining liquid (for example, air) obliquely downward in a substantially vertical plane, the droplets attached to each part of the transfer arm, particularly the horizontal part, follow the shortest path from the position in a substantially vertical direction. Shake off. As a result, the liquid is drained efficiently in a short time.

The first transfer arm cleaning device of the present invention
The transfer arm moves the cleaning nozzle during the cleaning / drying operation.
Move parallel to the nozzle or gas nozzle array direction
The cleaning liquid or gas nozzle from the cleaning nozzle
The gas for draining from
Purification or drainage is performed effectively and efficiently.

Also, a second transfer arm cleaning apparatus according to the present invention.
In, separated from each other by the partition plate (cut off)
Since the first and second cleaning chambers are formed, these
A pair of transfer arms are shielded from each other in the first and second cleaning chambers.
Receive simultaneous or selective cleaning / drying process when disconnected
It is possible.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIGS. 1 to 4 show the main structure of a transfer arm cleaning apparatus according to an embodiment of the present invention. FIG. 1 is a partially exploded perspective view, and FIG. 2 is a view parallel to the arm longitudinal direction. 3 is a longitudinal sectional view of a plane perpendicular to the arm longitudinal direction, and FIG. 4 is a transverse sectional view. FIG.
FIGS. 6A and 6B are a cross-sectional view and a vertical cross-sectional view illustrating the configuration and orientation of the discharge port of the liquid drain gas nozzle in the transfer arm cleaning apparatus of the embodiment. FIG. 7 is a partially exploded perspective view showing an X-axis driving mechanism in the chuck driving unit in the embodiment.

The transfer arm washing apparatus in this embodiment, for example, may be placed next to or on the same row of the semiconductor wafer cleaning apparatus as shown in FIG. Accordingly, the transfer robot 102 and the wafer chuck 106 in this embodiment may have the same configurations and functions as those denoted by the same reference numerals in FIG. 9 , and a detailed description thereof will be omitted. Further, since the common with conventional for even basic functions chuck drive unit 104, FIG. 9
The same reference numerals are given to the components.

As shown in FIGS. 1 to 4, the transfer arm cleaning apparatus in this embodiment has a box-shaped casing 10. The housing 10 includes a pair of side plates 12 and 14 extending in the ZX plane and a pair of side plates 1 extending in the YZ plane.
6, 18 and a bottom plate 20 and a top plate 2 extending in the XY plane.
And 2.

As shown in FIGS. 2 and 4, a pair of shielding plates 24 and 26 are provided at predetermined intervals inside the side plates 16 and 18 in the YZ plane opposed to each other, and the side plates 12 and
14. The shielding plates 24 and 26, the side plates 12, 14 and the upper plate 22 form a cleaning chamber 28 having an open bottom.
Are formed. Further, the cleaning room 28 is divided into a first cleaning room 28A and a second cleaning room 28B by a partition plate 30 provided in the center of the room and extending in the ZX plane.

The upper plate 22 is a shielding plate on the upper surface of the cleaning chamber 28 for blocking the room from the outside. Openings 22A and 22B are formed in the upper plate 22 so that both transfer arms 120A and 120B of the wafer chuck 106 can enter and exit the cleaning chamber 28 in a substantially vertical direction. The space directly below these openings 22A, 22B is the passages 32A, 3 of the two transfer arms 120A, 120B in the cleaning chamber 28.
2B.

At the upper part of the partition plate 30 inside the transfer arm passages 32A and 32B, a pipe 34 for cleaning spray is provided substantially horizontally (X direction) across the plate 30.
The first cleaning chamber 28A and the second cleaning chamber 28 of this pipe 34
As shown in FIG. 4, a large number of cylindrical cleaning nozzles WZ are mounted in a line at a constant pitch on each of both side surfaces facing B. The discharge port of each cleaning nozzle WZ is shown in FIG.
As shown in FIG. 4, the transfer arm passages 32A, 32B are obliquely downward in a plane perpendicular to the nozzle arrangement direction and in the first and second cleaning chambers 28A, 28B.
It faces the cleaning position HW of a predetermined height set on B.

The cleaning spray pipe 34 is open at both ends. As shown in FIG. 2, the base end is connected to a pipe 36 outside the shielding plate 26, and the tip side is a piping 38 outside the shielding plate 24. It is connected to the. The pipe 38 bypasses the lower side of the cleaning chamber 28 in the box 10 and is connected to the pipe 36.
Is connected to an external pipe 42 via a connector 40, and further connected to a cleaning liquid supply source (not shown) via the pipe 42.

The cleaning liquid from the cleaning liquid supply source is supplied to a pipe 42,
It is introduced into the cleaning spray pipe 34 through the connector 40 and the pipes 36 and 38, and is directed from the cleaning nozzles WZ on both sides of the pipe 34 to the respective cleaning positions HW of the first and second cleaning chambers 28A and 28B. Injection is performed at a wide angle, for example, 150 °.

In the first and second cleaning chambers 28A and 28B, a pair of liquid drainers are provided on both sides (inside and outside) of each of the transfer arm passages 32A and 32B at a position slightly higher than the cleaning spray pipe 34. Gas piping (36
A, 38A) and (36B, 38B) are provided substantially horizontally (X direction). As shown in FIG. 1, a large number of open-type gas nozzles DZ are bored in a line at a constant pitch on the side surface of each of the liquid drain gas pipes on the side of the transfer arm passage.

As shown in FIG. 3, the discharge port of each gas nozzle DZ faces a liquid draining position HD higher than the washing position HW set on each of the transfer arm passages 32A and 32B. Further, as shown in FIGS. 5 and 6, at least the discharge port of each gas nozzle DZ in the middle portion is in the nozzle arrangement direction (X
Direction) obliquely downward in a plane (YZ plane) perpendicular to the direction. The gas nozzles DZ at both ends are arranged so that the draining gas is effectively blown to the outer peripheral surfaces or roots of the vertical frame rods 112A, 114A, 112B, 114B.
It may be provided at an angle inclined with respect to the Z plane.

The liquid drain gas pipes (36A, 38A) in the first cleaning chamber 28A are open at the base end and connected to the gas introduction buffer chamber 44A, and are closed at the front end to close the shielding plate 2A.
4 is fixed. The buffer chamber 44A is provided with the shielding plate 26.
Is connected to an external pipe 50A via a pipe 46A and a connector 48A on the outer side of the outside, and is connected to a gas supply source (not shown) via the external pipe 50A. A gas for draining liquid from a gas supply source, for example, air is supplied to the pipe 50.
A, is introduced into the buffer chamber 44A through a connector 48A and the pipe 46A, which sends it to a pair of draining gas pipe (36A, 38A), the gas pipe 36A, 38
It is adapted to be substantially straight injected toward the draining position HD than gas nozzles DZ of A.

The liquid drain gas pipes (36B, 38B) in the second cleaning chamber 28B have the same pipe connection structure as the liquid drain gas pipes (36A, 38A) in the first cleaning chamber 28A. Air from the supply source is pipe 50
B, the connector 48B and the pipe 46B are introduced into the buffer chamber 44B and sent therefrom to a pair of liquid drain gas pipes (36B, 38B).
B is sprayed from the gas nozzle DZ toward the liquid draining position HD.

As shown in FIG. 3, an exhaust port 52 and a drain port 54 are provided near the bottom of the casing 10. The exhaust port 52 is connected to an exhaust pump (not shown) via an exhaust pipe 56.
It is connected to the. The drain port 54 is connected to a drain tank (not shown) via a drain pipe 58. An exhaust damper 60 may be provided in the exhaust pipe 56.

Next, the operation of the transfer arm cleaning apparatus in this embodiment will be described.

When cleaning the transfer arm, as shown in FIG. 1, the transfer robot 102 carries the empty wafer chuck 106 (not holding the semiconductor wafer W) to the main transfer arm cleaning apparatus. come. Then, both transport arms 120A, 120B are operated by the chuck driving unit 104.
Are substantially parallel to each other and positioned just above the chuck passage openings 22A and 22B, respectively.
The two lifting drive units operate to lower the chuck drive unit 104 and the wafer chuck 106 integrally. As a result, as shown in FIG.
B enters the first and second cleaning chambers 28A and 28B substantially perpendicularly from the openings 22A and 22B as indicated by dotted lines 120A 'and 120B', respectively.
120B ".

In the first and second washing chambers 28A and 28B, a plurality of washing nozzles WZ provided in a row on both sides of the washing spray pipe 34 respectively provide the transfer arm passage 3 with a plurality of washing nozzles WZ.
The cleaning liquid is sprayed toward the cleaning position HW on 2A, and a pair of gas pipes (36A, 38A), (36B,
38B), a plurality of gas nozzles DZ provided in a line inside each of the liquid supply positions HD on the transfer arm passage 32A.
Air is being sprayed toward.

Therefore, both transfer arms 120A, 120A
0B goes down to the 114A "and 114B" positions, respectively, and HW rises to the 114A and 114B positions.
The cleaning liquid can be sprayed from each nozzle WZ of the pipe 34 at the position. With this cleaning liquid spray, part or most of the processing liquid, particles, and the like attached to each part of the arm are washed off.

The two transfer arms 120A and 120B are indicated by a chain line 1.
After descending to the position of 20A ", 120B", the lifting / lowering drive unit of the transfer robot 102 lifts the wafer chuck 106 and lifts both transfer arms 120A, 120B from the first and second cleaning chambers 28A, 28B. When the two transfer arms 120A and 120B are lifted and moved upward, first, at the cleaning position HW, the remaining processing liquid and particles are washed off by the cleaning liquid spray from the cleaning nozzle WZ, and immediately thereafter, the gas nozzle DZ at the liquid discharging position HD. Drain the cleaning solution with an air knife from As a result, the two transfer arms 120A and 120B are cleaned and dried in the first and second cleaning chambers 28.
A, 28B. Alternatively, the cleaning may be performed while being lifted, and the transfer arms 120A and 120B may be again lowered to the positions of 114A "and 114B", and the drying may be performed while being lifted again. (At this time, both sides or one side may be used.)

The cleaning solution fell to the bottom of the housing 10 drain port 54
Through the drain pipe 58 to the drain tank side.
Above the transfer arm cleaning device, a clean air supply device for supplying clean air into the cleaning chamber 28 in a downflow manner may be provided. The cleaning air supply device may be provided in the cleaning chambers 28A and 28B from the upper openings 22A and 22B. The air that has entered is exhausted from an exhaust port 52 at the bottom of the housing 10 through an exhaust pipe 56.

In the transfer arm cleaning apparatus of this embodiment, at least the middle gas nozzle DZ of the plurality of gas nozzles DZ provided in a line on both sides of each of the transfer arm passages 32A and 32B is directed toward the liquid discharge position HD. Then, the liquid draining gas (air) is jetted obliquely downward in a plane (YZ plane) substantially perpendicular to the nozzle arrangement direction (X direction). Due to such an obliquely downward air knife effect, for example, as shown in FIG.
When (118B) passes through the draining position HD due to the upward movement, the droplets attached to the respective portions of the support rod 118A (118B) are moved from that position in a substantially vertical direction (in the YZ plane) as indicated by the curved arrow LM. ) It is shaken off the outer peripheral surface of the support rod 118A (118B), that is, following the shortest path. Therefore, each transfer arm 120A, 120B
Immediately after the cleaning liquid spray, it is efficiently wiped off in a short time.

In the transfer arm cleaning apparatus of the present embodiment, a partition plate 30 is provided at the center of the cleaning chamber 28 so that the pair of transfer arms 120A and 120B are independent (cut off) of the first and second transfer arms. Cleaning and drying at the same time in the cleaning chambers 28A and 28B. Thus, for example, the droplets of the cleaning liquid spray on one transfer arm 120A do not adhere to the dried portion of the other transfer arm 120B.

In the above operation, the two transfer arms 120 are used.
Although A and 120B were simultaneously cleaned and dried, the transfer arm cleaning apparatus of the present embodiment can also perform cleaning, drying, or drying one by one, so that, for example, when the supply capacity of the draining gas is small. Can also be accommodated. That is, the gas supply from the liquid supply gas supply source to the liquid discharge gas pipes (36A, 38A) and (36B, 38B) is selectively switched by a fluid switching means such as an air operated valve, and the first cleaning is performed, for example. Room 28A
The transfer arm 120A may be cleaned and dried on the side, and then the transfer arm 120B may be cleaned and dried on the second cleaning chamber 28B side. By such single-sided drying, the gas pressure of the liquid for draining can be doubled, and effective draining can be performed.

In this case, when the transfer arm 120B is washed and dried, the transfer arm 12A which has already been washed and dried also descends again together with the transfer arm 120B. Since the transfer arm 28B or both transfer arm passages 32A and 32B are shut off, there is no possibility that the droplets of the cleaning liquid spray on the transfer arm 120B will fall on the transfer arm 120A side.

The first and second cleaning chambers 28A, 28A, 2
8B may be provided with separate cleaning spray pipes, and each pipe may be provided with a cleaning liquid nozzle WZ. In this case, the same one-side operation (cleaning) as described above can be performed. Can also be reduced.

In the transfer arm cleaning apparatus of this embodiment, the transfer arm passage openings 22A, 22
Since the shield plate 22 having B is provided to block the inside and the outside of the room, the droplets of the cleaning liquid spray are prevented from leaking to the outside of the apparatus. Therefore, even if a chemical solution tank or the like is arranged adjacent to the present apparatus, there is no danger of the cleaning liquid spray entering the apparatus, which is safe.

Further, in the transfer arm cleaning apparatus of this embodiment, during the cleaning / drying operation, as shown by the arrow X in FIG.
In the arrangement direction (X direction) of the nozzles, a function of repeatedly reciprocating a predetermined stroke, for example, the pitch of the gas nozzles DZ. Thus, both transfer arms 120A,
120B reciprocates in the same direction, so that the gas nozzle D
The draining gas from Z hits each part of the arm evenly,
Even if the interval between the gas nozzles DZ is large, that is, even if the number of the gas nozzles DZ is small, it is possible to perform effective liquid drainage.

FIG. 7 shows a chuck driving unit 1 for causing the transfer arms 120A and 120B to perform such a reciprocating movement.
4 shows the mechanism inside. A pair of arm drive shafts 62A, 62
The base ends of B are integrally connected to each other, and the front end is connected to both horizontal support bars 110A and 110B of the wafer chuck 106, respectively. X-axis drive motor 6 fixed to both arm drive shafts 62A, 62B via mounting support plate 63
A ball screw 65 is connected to the motor drive shaft 4, and a ball nut 68 fixed to the chuck base 66 is screwed to the ball screw 65. When the X-axis drive motor 64 rotates, the X-axis drive motor 64 and both arm drive shafts 6
2A and 62B integrally move forward or backward in the X direction according to the rotation direction, and the amount of movement corresponds to the motor rotation angle.

In this embodiment, during the cleaning / drying operation of the transfer arm, the X-axis drive motor 64 is alternately rotated forward and backward at a predetermined rotation angle by a preset program control, thereby making the two arm drive shafts rotate. The transfer arms 62A, 62B and thus both transfer arms 120A, 120B may be reciprocated at a predetermined stroke.

FIG. 8 shows a configuration example of a semiconductor wafer cleaning system to which the transfer arm cleaning apparatus according to the above-described embodiment is applicable. This cleaning system includes an input buffer mechanism 70, a cleaning device main body 72, and an output buffer mechanism 73. A loader section (wafer carry-in section) 74 and an unloader section (wafer carry-out section) 76 are provided at both ends of the cleaning apparatus main body 72, respectively, and a plurality of, for example, nine processing sections 78a to 78i are arranged in a line at an intermediate section. Have been. For example, the first processing section 78a is a transfer arm cleaning / drying section, the second processing section 78b is a wafer chemical cleaning section, the third and fourth processing sections 78c and 78d are a wafer water cleaning section, and a fifth processing section, respectively. Reference numeral 78e is a wafer chemical cleaning section, sixth and seventh processing sections 78f and 78g are wafer rinsing sections, eighth processing section 78h is a wafer chemical cleaning section, and ninth processing section 78i is a transfer arm cleaning and drying section. . The transfer arm cleaning apparatus according to the above-described embodiment may be installed in the transfer arm cleaning / drying unit (the first and ninth processing units 78a and 78i).

In front of these processing units 78a to 78i, a plurality of, for example, three transfer robots 102, 1 each having a wafer chuck 106, 106, 106a are provided.
02 and 102 are arranged so as to be movable in the arrow Y direction. Each transfer robot 102 is restricted in movement or transfer range in the Y direction, and accesses only the processing unit 78 assigned to each transfer robot 102.

The input buffer mechanism 70 and the output buffer mechanism 73 have a carrier transport arm 86 for transporting the wafer carrier C, and a wafer carrier C.
, A carrier mounting table 90 for transferring a wafer carrier C to and from the outside of the system, a carrier elevator 92 for raising or lowering an empty wafer carrier C, and the like. I have. In the cleaning device main body 72, a carrier transport mechanism 94 is provided from the upper portion of the loader portion 74 to the unloader portion 76 through above the transport devices 82a to 82c.

The wafer carrier C emptied by the input buffer mechanism 70 is transferred to a carrier transport mechanism 94 by a carrier elevator 92 and transported to an output buffer mechanism 73. During the transfer, the wafer carrier C is cleaned by a cleaning device such as a shower device, and after the cleaning, is dried by a drying device such as a dry air sprayer. Therefore, in the output buffer mechanism 73, the cleaned wafer is transferred and housed in the cleaned and dried clean wafer carrier C.

Although several preferred embodiments of the present invention have been described above, the present invention is not limited to those embodiments, and various modifications and changes are possible within the scope of the technical idea. is there. For example, the arrangement position and number of the cleaning liquid nozzle WZ and the draining gas nozzle DZ, or the shape and size of each nozzle can be arbitrarily selected. Therefore, in the above embodiment, a pair of drainage gas pipes (36A, 38A) are provided on both sides of each transfer arm passage 32A, 32B.
Although (36B, 38B) are provided, for example, they may be provided only on one side, or may be provided in a plurality of stages. Further, a cleaning liquid other than pure water may be used, and the gas for draining the liquid is not limited to air, and for example, nitrogen gas or the like may be used. The means for driving the transfer arm for the washing / drying process is not limited to the one described in the above embodiment, and any arm driving means is possible.

Although the above embodiment relates to an apparatus for cleaning a transfer arm for transferring a semiconductor wafer, the present invention transfers another plate-like object to be processed, such as an LCD substrate or a glass substrate. The present invention is also applicable to an apparatus for cleaning a transfer arm.

[0052]

According to the first transfer arm cleaning apparatus of the present invention,
The transfer arm during the cleaning / drying operation.
Or move in parallel with the nozzle arrangement direction of the gas nozzle
The cleaning liquid or gas nozzle from the cleaning nozzle.
If the gas for draining from the spill hits each part of the arm evenly
Cleaning and draining can be performed effectively and efficiently.
it can.

According to the second transfer arm cleaning apparatus of the present invention, the cleaning chamber is divided into the first and second cleaning chambers which are independent from each other by the partition plate, and the first and second cleaning chambers form a pair. The transfer arms can be simultaneously or selectively cleaned and dried in a state of being cut off from each other, improving the use efficiency of the cleaning liquid or gas for draining and improving the quality of the cleaning and drying processing. Can also be measured.

[0054]

[Brief description of the drawings]

FIG. 1 is a partially exploded perspective view showing a main configuration of a transfer arm cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of a main part of the transfer arm cleaning apparatus in the embodiment, taken on a plane parallel to the arm longitudinal direction.

FIG. 3 is a longitudinal sectional view showing a main structure of the transfer arm cleaning apparatus in the embodiment, taken on a plane perpendicular to the arm longitudinal direction.

FIG. 4 is a cross-sectional view showing a main configuration of a transfer arm cleaning device in the embodiment.

FIG. 5 is a cross-sectional view showing the configuration and orientation of a discharge port of a liquid drain gas nozzle in the transfer arm cleaning apparatus of the embodiment.

FIG. 6 is a vertical cross-sectional view showing a configuration and an orientation of a discharge port of a liquid drain gas nozzle in the transfer arm cleaning apparatus of the embodiment.

FIG. 7 is a partially exploded perspective view showing an X-axis drive mechanism in a chuck drive unit for reciprocating a transfer arm during a cleaning / drying process in the embodiment.

FIG. 8 is a perspective view showing a configuration example of a semiconductor wafer cleaning system to which the transfer arm cleaning apparatus according to the embodiment can be applied.

FIG. 9 is a perspective view showing a configuration example of a semiconductor wafer cleaning apparatus using a transfer arm according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Case 22 Upper plate (shielding plate) 22A, 22B Opening (transport arm passage opening) 28 Cleaning room 28A First cleaning room 28B Second cleaning room 30 Partition plate 34 Cleaning spray piping 36A, 38A, 36B, 38B Gas pipe WZ cleaning nozzle DZ gas nozzle 102 transfer robot 104 chuck drive unit 106 wafer chuck 120A, 120B transfer arm

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/304 643 H01L 21/304 651

Claims (7)

(57) [Claims] 1. A transfer arm cleaning device for cleaning a transfer arm of a transfer device that holds and transfers a plurality of plate-shaped workpieces at predetermined intervals while holding the pair of transfer arms. A cleaning chamber configured so that the transfer arm can enter and exit in a substantially vertical direction from an upper surface opening; and each discharge port in the cleaning chamber at a cleaning position of a predetermined height set on a passage of the transfer arm. A large number of washing nozzles arranged in a row or a plurality of rows substantially horizontally on one or both sides of the passage of the transfer arm, washing liquid supply means for supplying a washing liquid to the washing nozzles, and respective discharge ports in the washing chamber Are aligned substantially horizontally in one or both sides of the passage of the transfer arm toward a predetermined liquid draining position higher than the washing position of the washing nozzle set on the passage of the transfer arm. Others are arranged in a plurality of rows,
Most of the discharge ports and a number of gas nozzles that is obliquely downward in a substantially vertical plane to the nozzle arrangement direction, and a gas supply means for supplying a drying gas into the gas nozzle, wherein the transfer arm is the cleaning solution Or blow the drying gas
While the transfer arm is being tightened,
Or parallel to the nozzle arrangement direction of the gas nozzle
Conveying arm cleaning apparatus characterized by comprising a means for. 2. A plurality of plate-like objects to be processed are arranged at predetermined intervals.
In a state where they are arranged
Transfer arm for cleaning the transfer arm of the transfer device
In the cleaning device, the transfer arm moves in and out of the upper surface opening in a substantially vertical direction.
A cleaning chamber configured such that each discharge port is located on a passage of the transfer arm in the cleaning chamber.
To the cleaning position at a predetermined height set in
Near one side or both sides of the
Are arranged in a plurality of rows, a large number of cleaning nozzles , cleaning liquid supply means for supplying a cleaning liquid to the cleaning nozzles, and each discharge port in the cleaning chamber on the passage of the transfer arm.
Predetermined higher than the cleaning position of the cleaning nozzle set to
One side of the passage of the transfer arm or
Are arranged almost horizontally in one or more rows on both sides,
Most outlets are almost perpendicular to the nozzle arrangement direction
A number of gas nozzles that are obliquely downward in the gas supply means for supplying a gas for drying to the gas nozzles
The washing room is provided by a partition plate provided at the center of the room.
Cleaning chamber for cleaning one transfer arm
Divided into a second cleaning chamber for cleaning one transfer arm
And the cleaning chamber is provided in each of the first and second cleaning chambers.
A transfer arm cleaning device provided with a chisel and the gas nozzle . 3. The gas nozzle of each row has an intermediate portion.
Outlet of gas nozzle is almost perpendicular to nozzle arrangement direction
Are provided diagonally downward in a flat surface and the gas nozzles at both ends are
The discharge port is provided at an inclined angle with respect to the vertical plane.
The transfer arm cleaning device according to claim 1 or 2, wherein 4. The transfer nozzle according to claim 1, wherein the cleaning nozzle is provided in the transfer arm passage.
One or more placed almost horizontally on one or both sides
Provided at predetermined intervals in each of the cleaning spray pipes
Each of the cleaning spray pipes is open at both ends, and
The same cleaning liquid supply means is connected to both open ends.
The transfer arm cleaning apparatus according to claim 1, wherein 5. The transfer arm is connected to the transfer arm passage.
From the washing nozzle at the washing position when ascending along
The cleaning liquid according to any one of claims 1 to 4, wherein the cleaning liquid is sprayed.
Placing the transfer arm washing apparatus. 6. The transfer arm passage in the transfer arm passage.
Ascending along the gas nozzle at the draining position
The drying gas according to any one of claims 1 to 5,
A transfer arm cleaning apparatus according to any one of the above. 7. The transfer arm is provided on an upper surface of the cleaning chamber.
There is a shielding plate with an opening for passing through
The transfer arm cleaning apparatus according to claim 1 .