JPH06196465A - Semiconductor wafer cleaning device - Google Patents

Abstract

PURPOSE:To enable a cleaning device where a semiconductor wafer is chemically treated and cleaned with pure water to be enhanced in throughput and to prevent dried water droplet marks and a natural oxide film from being produced on the surface of wafers in transit. CONSTITUTION:Treating chambers 2, 3, 4, and 5 are continuously connected together, a rotating device 13 equipped with a rotary disc 10 which holds a wafer 11 is made to move through the chambers 2 to 5 one after another. At this point, partitioning panels 22, 32, and 42 of the chambers 2 to 5 are made to recede upwards. Spray nozzles 21, 31, 41, and 51 are provided inside the chambers 2 to 5 respectively, and discharge orifices 23, 33, 43, and 53 of waste liquid are also provided respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer cleaning apparatus in a semiconductor element manufacturing process using a semiconductor wafer as a substrate.

[0002]

2. Description of the Related Art Conventionally, a semiconductor wafer wet cleaning apparatus is
It can be roughly classified into a rotary spray type cleaning device and an immersion type cleaning device. In the rotary spray type cleaning device, as shown in FIG.
While the wafer 11 held by the wafer holding frame 12 is rotated by the rotating plate 10 in the single processing chamber 6, chemicals and pure water are sequentially ejected from the spray 61 for processing. In the immersion type cleaning device, as shown in FIG.
0, 120, deionized water tanks 110, 130, 140, 150, etc. are independently arranged side by side, and the robot 170 sequentially dips and pulls the wafers in these dipping tanks and sequentially moves them to the next dipping tank. Proceed.

[0003]

Since the rotary spray type cleaning apparatus performs processing by sequentially switching the spray liquid in a single processing chamber, the next batch of wafers is loaded until the processing steps of a series of batches are completed. Therefore, there is a problem that throughput is low. The immersion type cleaning device has a chemical solution tank, a pure water immersion tank, etc., and has circulation equipment such as robots. Since it is an open tank, it is necessary to adjust the atmosphere of the installation chamber. A large occupied area is required, for example, it is necessary to separate the chamber by the curtain 190 from the ceiling 180 and transfer the wafer through the water tank 140. The spin dryer 160 is required at the final stage of the process.

It is an object of the present invention to provide a cleaning device which has a high throughput and a small device occupation area.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a plurality of spray chambers for treating a semiconductor wafer with a chemical solution and cleaning with pure water, and the spray chambers are sequentially connected. A cleaning device for a semiconductor wafer, characterized in that a moving device for moving a wafer is provided, and a partition curtain that can be opened and closed is provided at a continuous portion of each chamber.

[0006]

The present invention is an apparatus which combines the advantages of the conventional rotary spray type cleaning apparatus and the conventional immersion type cleaning apparatus. A plurality of spray chambers are installed side by side and the wafer is moved.
Throughput is improved by loading the next batch of wafers when the wafer advances to the next process. Takes up more space than a single chamber spray cleaner,
Less than immersion cleaning equipment.

[0007]

EXAMPLE FIG. 1 shows a side view of an apparatus 1 according to an embodiment of the present invention. In this embodiment, processing chambers 2, 3, 4, 5 are connected in series, and a rotating device 13 having a rotating disk 10 for holding a wafer 11 is inserted into each chamber from the back side of the drawing. There is. Each room has a spray nozzle 21, 31, 41, 5
1, respectively, and drainage outlets 23, 33, 4 for draining liquid.
3, 53 are provided. The rotating device 13 includes the processing chamber 2,
The partition plates 22, 32, 42 of the respective chambers are retracted upwards.

The rear surfaces of the processing chambers 2 and 5 can be opened so that the rotating device 13 can move in and out of the processing chambers.
The wafer 11 can be mounted and demounted. Processing room 2 is SC
-1 processing, SC-2 processing in the processing chamber 4, pure water rinsing processing in the processing chambers 3 and 5, and draining and drying in the processing chamber 5. When the following washings (a) to (e) were performed, the throughputs of the apparatus of the embodiment shown in FIG. 1 and the conventional apparatuses shown in FIGS. 2 and 3 were compared. Each processing time is as follows. (A) SC-1 treatment: 10 min (b) Pure water rinse: 10 min (c) SC-2 treatment: 10 min (d) Pure water rinse: 10 min (e) Drying: 5 min Throughput is the rotary spray cleaning of FIG. The apparatus had 1.33 batches / hr, the immersion cleaning apparatus of FIG. 3 had 6 batches / hr, and the example of FIG. 1 had 6 batches / hr.

Further, in the embodiment, the pool area 140 and the final rinse tank 15 are occupied areas as compared with the immersion type cleaning tank.
0, it became smaller by the amount of spin dryer 160.

[0010]

In the apparatus of the present invention, since the wafer is not pulled up into the air, there is no drying of the wafer during transportation, formation of water marks, and formation of natural oxide film. Further, it is easy to replace the inside of the processing chamber with N ₂ , and the generation of a natural oxide film can be prevented.

[Brief description of drawings]

FIG. 1 is a side view of a cleaning device according to an embodiment.

FIG. 2A is a side view of a conventional device, and FIG. 2B is a B of FIG.
FIG.

FIG. 3 is a side view of a conventional device.

[Explanation of symbols]

 1 Cleaning Device 2, 3, 4, 5, 6 Processing Chamber 10 Rotating Plate 11 Wafer 12 Wafer Holding Frame 13 Rotating Device 21, 31, 41, 51 Spray Nozzle 22, 32, 42 Partition Wall 23, 33, 43, 53 Discharge Liquid mouth

Claims (1)

[Claims] 1. A plurality of spray chambers for performing chemical liquid treatment on semiconductor wafers and cleaning with pure water are provided in series, and a moving device for sequentially moving the wafers in the spray chambers provided is provided. An apparatus for cleaning a semiconductor wafer, which is provided with a partition curtain that can be freely opened and closed.