CN109712906B - Wafer storage device with cleaning function and semiconductor production equipment - Google Patents
Wafer storage device with cleaning function and semiconductor production equipment Download PDFInfo
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- CN109712906B CN109712906B CN201711009584.9A CN201711009584A CN109712906B CN 109712906 B CN109712906 B CN 109712906B CN 201711009584 A CN201711009584 A CN 201711009584A CN 109712906 B CN109712906 B CN 109712906B
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- 238000003860 storage Methods 0.000 title claims abstract description 78
- 238000004140 cleaning Methods 0.000 title claims abstract description 64
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000005192 partition Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000007789 gas Substances 0.000 claims description 79
- 230000001105 regulatory effect Effects 0.000 claims description 23
- 238000012806 monitoring device Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 4
- 230000003139 buffering effect Effects 0.000 claims description 3
- 230000001276 controlling effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 136
- 239000002184 metal Substances 0.000 description 18
- 230000007547 defect Effects 0.000 description 5
- 238000010923 batch production Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000002253 acid Substances 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides a wafer storage device with a cleaning function and semiconductor production equipment, wherein the wafer storage device with the cleaning function comprises: the buffer material storage rack and the cleaning system comprise a frame and a plurality of partition plates, wherein the partition plates are fixed on the frame and isolate a plurality of placing areas for placing wafer boxes in the frame; the cleaning system is arranged on the buffer storage rack and comprises an air inlet pipeline assembly and an air outlet pipeline assembly; one end of the air inlet pipeline component is communicated with the gas source, and the other end of the air inlet pipeline component is communicated with the air inlet; one end of the exhaust pipeline component is communicated with the exhaust port; the cleaning system is used for introducing cleaning gas into the wafer box so as to clean the interior of the wafer box. The invention can clean the interior of the wafer box temporarily stored in the buffer storage area in the semiconductor equipment between processes or batches so as to remove residual gas in the wafer box, thereby effectively preventing the wafer in the wafer box from being polluted.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer storage device with a cleaning function and semiconductor production equipment.
Background
In a conventional semiconductor batch process (e.g., a diffusion process batch process), a wafer cassette containing wafers to be processed is typically temporarily stored in a buffer stocker of a batch processing equipment between front and middle stages. However, after the wafer is not subjected to a process, such as a process before the diffusion process, the reaction gas, air, reaction product gas, and the like remain in the wafer cassette, and the buffer storage area of the conventional batch processing apparatus only serves to temporarily store the wafer cassette, and cannot clean the wafer cassette to remove the gas remaining therein. If the residual gas in the wafer box can not be removed in time, the residual gas can pollute or damage the wafers in the wafer box after a certain Q-time: if F remains in the wafer cassette as shown in FIG. 1-Or Cl-Then, F remains-Or Cl-The etching solution reacts with water vapor in the air to generate acid gas to corrode a metal interconnection layer 12 connected with an internal metal layer 11 on the surface of a semiconductor device in a wafer, so that an etching hole 13 is formed in the metal interconnection layer 12, and the performance of the semiconductor device is further influenced; as shown in fig. 2, residual gas in the wafer box reacts with the side surface of the metal connection pillar 14 connected to the metal layer 11, and a foot-shaped defect 15 is formed on the side surface of the metal connection pillar 14, thereby affecting the performance of the semiconductor device, wherein the metal connection pillar 14 is located in the dielectric layer 16; as shown in fig. 3, if air remains in the wafer cassette, the metal layer 11 and the wafer cassette are connected to each otherThe contact surface of the metal connection post 14 is oxidized to form an interfacial oxide layer 17, thereby affecting the connection effect between the metal layer 11 and the metal connection post 14.
In order to remove the residual gas in the wafer cassette, a conventional solution is to transfer the wafer cassette, which has been processed in one process or one batch, out of the semiconductor manufacturing equipment, and temporarily store the wafer cassette in a specific storage area to purge the wafer cassette by introducing nitrogen gas. However, this method requires that the wafer cassette is transferred to the semiconductor device for storage after one process or one batch process is completed, and then the wafer cassette is transferred back to the semiconductor device for the next process or the next batch process, which will increase the time interval between processes or batches and thus affect the production efficiency.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer storage device with a cleaning function and a semiconductor manufacturing apparatus, which are used to solve the problems that the buffer storage area in the semiconductor manufacturing apparatus in the prior art cannot clean the inside of the wafer cassette placed thereon, and cannot remove the residual gas in the wafer cassette thereon, and the problem that the production efficiency is low because the wafer cassette is transferred out of the semiconductor apparatus to a specific storage area for temporary cleaning in order to remove the residual gas in the wafer cassette.
In order to achieve the above and other related objects, the present invention provides a wafer storage device with a cleaning function, located in a semiconductor manufacturing apparatus, for temporarily storing a wafer box, the wafer box being provided with an air inlet and an air outlet communicated with the interior thereof,
the wafer storage device with the cleaning function comprises:
the buffer storage rack comprises a frame and a plurality of partition plates, wherein the partition plates are fixed on the frame and isolate a plurality of placing areas for placing the wafer boxes in the frame;
the cleaning system is arranged on the buffer storage rack and comprises an air inlet pipeline assembly and an air outlet pipeline assembly; one end of the air inlet pipeline assembly is communicated with a gas source, and the other end of the air inlet pipeline assembly is communicated with the air inlet; one end of the exhaust pipeline component is communicated with the exhaust port; the cleaning system is used for introducing cleaning gas into the wafer box so as to clean the interior of the wafer box.
As a preferable scheme of the present invention, the air intake pipe assembly includes an air intake port and an air intake pipe; the air inlet port is arranged on each partition plate, one end of the air inlet port is communicated with the air inlet, and the other end of the air inlet port is communicated with the air inlet pipeline; one end of the air inlet pipeline, which is far away from the air inlet port, is communicated with the gas source;
the exhaust pipeline assembly comprises an exhaust port and an exhaust pipeline; the exhaust port is arranged on each partition plate, one end of the exhaust port is communicated with the exhaust port, and the other end of the exhaust port is communicated with the exhaust pipeline.
As a preferable aspect of the present invention, the air inlet port includes an air inlet nozzle or an air inlet hole; the exhaust port includes an exhaust nozzle or an exhaust vent.
As a preferred scheme of the present invention, the air inlet port and the air inlet are arranged up and down correspondingly; the exhaust port and the exhaust port are arranged up and down correspondingly.
As a preferred scheme of the present invention, the air intake pipeline includes a primary air intake pipeline and a plurality of branch air intake pipelines; one end of the main air inlet pipeline is communicated with the gas source, and the other end of the main air inlet pipeline is communicated with one end of each branch air inlet pipeline; one end of each branch air inlet pipeline, which is far away from the main air inlet pipeline, is communicated with the air inlet ports arranged on the partition boards in a one-to-one correspondence mode.
As a preferable aspect of the present invention, the wafer storage apparatus with a cleaning function further includes:
the first flow monitoring device is arranged on the main air inlet pipeline and used for monitoring the gas flow of the main air inlet pipeline;
and the second flow monitoring device is arranged on each branch gas inlet pipeline and each exhaust pipeline and is used for monitoring the gas flow in each branch gas inlet pipeline and the gas flow discharged from each wafer box.
As a preferable scheme of the present invention, the wafer storage device with a cleaning function further includes an alarm device, where the alarm device is connected to the second flow monitoring devices disposed on the branch gas inlet pipelines, and is configured to send an alarm when the second flow monitoring devices monitor that a gas flow in the branch gas inlet pipelines exceeds a set value.
As a preferable aspect of the present invention, the wafer storage device with a cleaning function further includes a first pressure regulating valve, which is disposed in the main air inlet pipeline and is adapted to regulate the gas flow rate of the main air inlet pipeline and the gas flow rate of each of the branch air inlet pipelines.
As a preferable aspect of the present invention, the wafer storage apparatus with a cleaning function further includes:
the second pressure regulating valve is arranged on each branch air inlet pipeline;
and the control device is communicated with the wafer detection device and the second pressure regulating valve and is suitable for controlling the second pressure regulating valve to be opened or closed according to the wafer condition in the wafer box detected by the wafer detection device.
As a preferable scheme of the present invention, when the wafer detection device detects that there is no wafer in the wafer box or the wafer in the wafer box is a virtual wafer, the control device controls the second pressure regulating valve to close to stop introducing gas into the wafer box.
In a preferred embodiment of the present invention, the gas source is a nitrogen gas source.
The present invention also provides a semiconductor production apparatus including:
the wafer cleaning device comprises a buffer storage area, wherein a wafer storage device with a cleaning function is arranged in the buffer storage area;
a wafer loading zone having a load-lock vacuum; the wafer loading area is connected to the buffer storage area;
a batch-type diffusion processing chamber connected to the wafer loading region.
As described above, the wafer storage device with a cleaning function and the semiconductor manufacturing apparatus provided by the present invention have the following advantages: according to the wafer storage device with the cleaning function, which is positioned in the buffer storage area in the semiconductor production equipment, the cleaning system is arranged on the buffer storage frame, so that the interior of the wafer box which is temporarily stored in the buffer storage area in the semiconductor equipment can be cleaned between processes or batches to remove residual gas in the wafer box, the wafer in the wafer box can be effectively prevented from being polluted, and particle defects and oxide layers cannot be generated on the surface of the wafer in the wafer box; in addition, the inside of the wafer box can be cleaned without transferring the wafer box out of the semiconductor production equipment, so that the time interval between processes or between batches can be shortened, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic structural view illustrating an etched hole formed in an interconnect metal layer in the prior art.
Fig. 2 is a schematic structural diagram illustrating a foot-shaped defect formed on the surface of a metal connecting stud in the prior art.
Fig. 3 is a schematic structural diagram of a prior art structure in which an interfacial oxide layer is formed on a contact surface between a metal connection pillar and a metal layer.
Fig. 4 is a schematic structural diagram of a wafer storage device with a cleaning function according to an embodiment of the invention.
Fig. 5 is a schematic structural view illustrating a wafer cassette according to an embodiment of the present invention being placed on a partition plate of a buffer storage rack.
Fig. 6 is a schematic partial structure diagram of a semiconductor manufacturing apparatus according to a second embodiment of the present invention.
Description of component reference numerals
11 metal level 12 interconnect metal level
13 etching hole 14 metal connecting column
15-footed defect 16 dielectric layer
17 interfacial oxide layer
2 wafer storage device
20 buffering storage rack
201 frame 202 spacer
203 intake port 204 exhaust port
21 cleaning system
211 air inlet pipeline assembly
2111 intake conduit 2112 primary intake conduit
2113 branch air inlet pipeline
212 exhaust line assembly 2121 exhaust line
205 first flow monitoring device 206 second flow monitoring device
207 first pressure regulating valve 208 second pressure regulating valve
30 wafer box
31 inlet and 32 outlet
4 semiconductor production equipment
40 buffer stockpiling zone
41 wafer loading zone 42 batch type diffusion processing chamber
43 load-lock vacuum device 44 boat
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 4 to 6. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
Referring to fig. 4 and 5, the present invention provides a wafer storage device with a cleaning function, the wafer storage device with a cleaning function is located in a semiconductor manufacturing apparatus and is used for temporarily storing a wafer box 30, and the wafer box 30 is provided with an air inlet 31 and an air outlet 32 communicated with the inside thereof; the wafer storage device with the cleaning function comprises: the wafer cleaning system comprises a buffer storage frame 20 and a cleaning system 21, wherein the buffer storage frame 20 comprises a frame 201 and a plurality of partition plates 202, the partition plates 202 are fixed on the frame 201, and a plurality of placing areas for placing the wafer cassettes 30 are separated in the frame 201; the wafer cassette 30 is placed on the partition plate 202; the cleaning system 21 is disposed on the buffer storage rack 20, and the cleaning system 21 includes an air inlet pipeline assembly 211 and an air outlet pipeline assembly 212; one end of the air inlet pipeline assembly 2111 is communicated with the air source 213, and the other end is communicated with the air inlet 31; one end of the exhaust pipeline assembly 212 is communicated with the exhaust port 32; the cleaning system 21 is configured to introduce a cleaning gas into the wafer cassette 30 to clean the inside of the wafer cassette 30.
By way of example, the semiconductor manufacturing apparatus may be, but is not limited to, a batch-type processing apparatus, and preferably, in this embodiment, the semiconductor manufacturing apparatus is a batch-type processing apparatus of a diffusion process.
It should be noted that, for convenience of illustration, the wafer cassette 30 is not placed on the partition plate 202 in the buffer storage rack 20 in fig. 4.
Illustratively, the intake conduit assembly 211 includes an intake port 203 and an intake conduit 2111; the air inlet port 203 is arranged on each partition plate 202, one end of the air inlet port is communicated with the air inlet 31, and the other end of the air inlet port is communicated with the air inlet pipeline 2111; the end of the air inlet conduit 2111 remote from the air inlet port 203 communicates with the gas source; the exhaust conduit assembly 212 includes an exhaust port 204 and an exhaust conduit 2121; the exhaust port 204 is disposed on each partition 202, and has one end communicating with the exhaust port 32 and the other end communicating with the exhaust duct 2121.
In one example, the air inlet port 203 is an air inlet nozzle that extends through the baffle plate 202 from the bottom of the baffle plate 202 to ensure that the upper end of the air inlet nozzle is above the baffle plate 202; the nozzle of the air inlet nozzle is communicated with the air inlet 31, and may be inserted into the air inlet 31, and the other end of the air inlet nozzle is communicated with the air inlet pipeline 2111. The exhaust port 204 is an exhaust nozzle which penetrates the partition plate 202 from the bottom of the partition plate 202 to ensure that the upper end of the exhaust nozzle is positioned above the partition plate 202; the nozzle of the exhaust nozzle is communicated with the exhaust port 32, and may be inserted into the exhaust port 32, and the other end of the exhaust nozzle is communicated with the exhaust pipe 2121.
In another example, the intake port 203 is an intake port; the exhaust port 204 is an exhaust hole.
As an example, the gas inlet port 203 and the gas inlet 31 are arranged in a vertically corresponding manner, that is, when the gas inlet port 203 is a gas inlet hole, after the wafer cassette 30 is placed on the partition plate 202, the gas inlet port 203 and the gas inlet 31 are vertically and correspondingly attached; the exhaust port 204 and the exhaust port 32 are correspondingly arranged up and down, that is, when the exhaust port 204 is an exhaust hole, the wafer box 30 is placed on the partition plate 202, and then the exhaust port 204 and the exhaust port 32 are correspondingly attached up and down.
By way of example, as shown in FIG. 4, the intake conduit 2111 includes a primary intake conduit 2112 and a number of secondary intake conduits 2113; one end of the primary air inlet pipeline 2112 is communicated with the gas source, and the other end of the primary air inlet pipeline is communicated with one end of each branch air inlet pipeline 2113; one end of each branch air inlet pipe 2113, which is far away from the main air inlet pipe 2112, is in one-to-one correspondence with the air inlet ports 203 provided on each partition plate 202.
As an example, the number of the branch intake pipes 2113 and the intake ports 203 is 8 in fig. 4, but this is not exemplified in an actual example.
It should be noted that for convenience of illustration, the end of the branch intake conduit 2113 remote from the primary intake conduit 2112 in fig. 4 is not shown connected to the intake port 203, only the portion of the branch intake conduit 2113 external to the frame 201 is shown in fig. 4, the portion of the branch intake conduit 2113 within the frame 201 is not shown, and in actual configuration, the end of the branch intake conduit 2113 remote from the primary intake conduit 2112 extends into the frame 201 and communicates with the intake port 203.
It should be further noted that, for convenience of illustration, only the portion of the exhaust pipe 2121 located outside the frame 201 is illustrated in fig. 4, the portion of the exhaust pipe 2121 located inside the frame 201 is not illustrated, and in an actual structure, one end of the exhaust pipe 2121 near the frame 201 extends into the frame 201 and is communicated with the exhaust port 204.
As an example, the wafer storage device with a cleaning function further includes: a first flow monitoring device 205, where the first flow monitoring device 205 is disposed on the primary air intake conduit 2112, and is configured to monitor a gas flow of the primary air intake conduit 2112; and a second flow rate monitoring device 206, wherein the second flow rate monitoring device 206 is provided in each of the branch gas inlet pipes 2113 and the exhaust pipe 2121, and is configured to monitor a flow rate of gas in each of the branch gas inlet pipes 2113 and a flow rate of gas exhausted from each of the wafer cassettes 30.
As an example, the wafer storage apparatus with a cleaning function further includes an alarm device 209, where the alarm device 209 is connected to the second flow rate monitoring device 206 disposed on each of the branch gas pipes 2113, and is configured to send an alarm when the second flow rate monitoring device 206 monitors that the gas flow rate in the branch gas pipe 2113 exceeds a set value.
As an example, the wafer storage device with cleaning function further includes a first pressure regulating valve 207, where the first pressure regulating valve 207 is disposed in the main gas inlet pipe 2112 and is adapted to regulate the gas flow of the main gas inlet pipe 2112 and the gas flow of each of the branch gas inlet pipes 2113.
As an example, the wafer storage device with a cleaning function further includes: a second pressure regulating valve 208, the second pressure regulating valve 208 being provided in each of the branch intake pipes 2113; a control device 210, wherein the control device 210 is in communication with a wafer detecting device (not shown) and the second pressure regulating valve 208, and is adapted to control the second pressure regulating valve 208 to open or close according to the condition of the wafer in the wafer cassette 30 detected by the wafer detecting device. Specifically, when the wafer detecting device detects that there is no wafer in the wafer box 30 or the wafer in the wafer box 30 is a dummy wafer, the control device 210 controls the second pressure regulating valve 208 to close to stop introducing gas into the wafer box 30. That is, when there is no wafer or a dummy wafer in the wafer box 30, the second pressure regulating valve 208 is closed, and the wafer box 30 is not purged by introducing a purge gas.
As an example, the gas source 213 is a nitrogen gas source, i.e., the purge gas introduced into the wafer box 30 is nitrogen gas. Of course, in other examples, the gas source 213 may also be an inert gas source, and the like.
It should be noted that the dashed arrows in fig. 5 indicate the flowing direction of the cleaning gas, that is, the cleaning gas enters the wafer box 30 from the gas inlet 31 to clean the inside of the wafer box 30, and then the cleaning gas with the residual gas in the wafer box 30 is discharged out of the wafer box 30 from the gas outlet 32.
Example two
Referring to fig. 6, the present invention further provides a semiconductor manufacturing apparatus 4, wherein the semiconductor manufacturing apparatus 4 is a batch type processing apparatus, preferably, in this embodiment, the semiconductor manufacturing apparatus 4 is a batch processing apparatus of a diffusion process, and the semiconductor manufacturing apparatus 4 includes: a buffer storage area 40, wherein a wafer storage device with a cleaning function as described in the first embodiment is arranged in the buffer storage area 40; a wafer loading zone 41, said wafer loading zone 41 having a load-lock vacuum 43; the wafer loading area 41 is connected to the buffer stocker area 40; a batch type diffusion processing chamber 42, the batch type diffusion processing chamber 42 being connected to the wafer loading zone 41.
As an example, the semiconductor production equipment 4 further comprises a wafer boat 44, wherein the wafer boat 44 is located in the wafer loading area 41 and is used for loading the wafer box 30; the boat 41 may be transported back and forth between the wafer loading zone 41 and the batch-type diffusion processing chamber 42.
In summary, the present invention provides a wafer storage device with a cleaning function and a semiconductor manufacturing apparatus, wherein the wafer storage device with a cleaning function is located in the semiconductor manufacturing apparatus and is used for temporarily storing a wafer box, an air inlet and an air outlet communicated with the inside of the wafer box are arranged on the wafer box, and the wafer storage device with a cleaning function includes: the buffer storage rack comprises a frame and a plurality of partition plates, wherein the partition plates are fixed on the frame and isolate a plurality of placing areas for placing the wafer boxes in the frame; the cleaning system is arranged on the buffer storage rack and comprises an air inlet pipeline assembly and an air outlet pipeline assembly; one end of the air inlet pipeline assembly is communicated with a gas source, and the other end of the air inlet pipeline assembly is communicated with the air inlet; one end of the exhaust pipeline component is communicated with the exhaust port; the cleaning system is used for introducing cleaning gas into the wafer box so as to clean the interior of the wafer box. According to the wafer storage device with the cleaning function, which is positioned in the buffer storage area in the semiconductor production equipment, the cleaning system is arranged on the buffer storage frame, so that the interior of the wafer box which is temporarily stored in the buffer storage area in the semiconductor equipment can be cleaned between processes or batches to remove residual gas in the wafer box, the wafer in the wafer box can be effectively prevented from being polluted, and particle defects and oxide layers cannot be generated on the surface of the wafer in the wafer box; in addition, the inside of the wafer box can be cleaned without transferring the wafer box out of the semiconductor production equipment, so that the time interval between processes or between batches can be shortened, and the production efficiency is improved.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (8)
1. The utility model provides a wafer storage device with cleaning function, is located semiconductor production facility for the wafer box of keeping in, be provided with air inlet and the gas vent rather than inside being linked together on the wafer box, its characterized in that, semiconductor production facility includes buffering storage area, be provided with in the buffering storage area wafer storage device, wafer storage device includes:
the buffer storage rack comprises a frame and a plurality of partition plates, the partition plates are fixed on the frame, a plurality of placing areas for placing the wafer boxes are isolated in the frame, and the wafer boxes are placed on the partition plates; and a process for the preparation of a coating,
the cleaning system is arranged on the buffer storage rack and comprises an air inlet pipeline assembly and an air outlet pipeline assembly; one end of the air inlet pipeline assembly is communicated with a gas source, and the other end of the air inlet pipeline assembly is communicated with the air inlet through the partition plate; one end of the exhaust pipeline component is communicated with the exhaust port through the partition plate; the cleaning system is used for introducing cleaning gas into the wafer box so as to clean the interior of the wafer box;
the air inlet pipeline assembly comprises an air inlet port and an air inlet pipeline; the air inlet port is arranged on each partition plate, one end of the air inlet port is communicated with the air inlet, and the other end of the air inlet port is communicated with the air inlet pipeline; one end of the air inlet pipeline, which is far away from the air inlet port, is communicated with the gas source;
the exhaust pipeline assembly comprises an exhaust port and an exhaust pipeline; the exhaust port is arranged on each partition plate, one end of each exhaust port is communicated with the exhaust port, and the other end of each exhaust port is communicated with the exhaust pipeline;
the air inlet pipeline comprises a main air inlet pipeline and a plurality of branch air inlet pipelines; one end of the main air inlet pipeline is communicated with the gas source, and the other end of the main air inlet pipeline is communicated with one end of each branch air inlet pipeline; one end of each branch air inlet pipeline, which is far away from the main air inlet pipeline, is respectively communicated with the air inlet ports arranged on the partition boards in a one-to-one correspondence manner;
the wafer storage device further comprises a first pressure regulating valve, wherein the first pressure regulating valve is arranged on the main air inlet pipeline and is suitable for regulating the gas flow of the main air inlet pipeline and the gas flow of each branch air inlet pipeline;
the wafer storage device also comprises a second pressure regulating valve and a control device, wherein the second pressure regulating valve is arranged on each branch air inlet pipeline; the control device is communicated with the wafer detection device and the second pressure regulating valve and is suitable for controlling the second pressure regulating valve to be opened or closed according to the wafer condition in the wafer box detected by the wafer detection device.
2. The wafer storage device with cleaning function as claimed in claim 1, wherein the air inlet port comprises an air inlet nozzle or an air inlet hole; the exhaust port includes an exhaust nozzle or an exhaust vent.
3. The wafer storage device with the cleaning function as claimed in claim 1, wherein the air inlet port is arranged corresponding to the air inlet up and down; the exhaust port and the exhaust port are arranged up and down correspondingly.
4. The wafer storage device with cleaning function as claimed in claim 1, further comprising:
the first flow monitoring device is arranged on the main air inlet pipeline and used for monitoring the gas flow of the main air inlet pipeline; and
and the second flow monitoring device is arranged on each branch gas inlet pipeline and each exhaust pipeline and is used for monitoring the gas flow in each branch gas inlet pipeline and the gas flow discharged from each wafer box.
5. The wafer storage device with the cleaning function as claimed in claim 4, further comprising an alarm device, wherein the alarm device is connected to the second flow monitoring device disposed on each of the branch gas pipes, and configured to send an alarm when the second flow monitoring device monitors that the gas flow in the branch gas pipe exceeds a set value.
6. The wafer storage device with the cleaning function as claimed in claim 1, wherein when the wafer detection device detects that there is no wafer in the wafer box or the wafer in the wafer box is a virtual wafer, the control device controls the second pressure regulating valve to close to stop introducing the gas into the wafer box.
7. The wafer storage device with the cleaning function according to any one of claims 1 to 6, wherein the gas source is a nitrogen gas source.
8. A semiconductor production apparatus, characterized in that the semiconductor production apparatus comprises:
the wafer storage device with the cleaning function is arranged in the buffer storage area, and the wafer storage device with the cleaning function is arranged in the buffer storage area;
the wafer loading area is provided with a loading interlocking vacuum device and is connected to the buffer storage area; and
a batch-type diffusion processing chamber connected to the wafer loading region.
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| CN201711009584.9A CN109712906B (en) | 2017-10-25 | 2017-10-25 | Wafer storage device with cleaning function and semiconductor production equipment |
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| CN113451183B (en) * | 2020-06-03 | 2023-03-31 | 重庆康佳光电技术研究院有限公司 | Wafer box |
| CN112509941B (en) * | 2020-11-09 | 2023-05-16 | 粤芯半导体技术股份有限公司 | Method and device for improving corrosion defect of aluminum etching process |
| CN114623862B (en) * | 2020-12-11 | 2024-04-16 | 中国科学院微电子研究所 | Semiconductor measuring equipment and cleaning method |
| CN113871282B (en) * | 2021-09-26 | 2023-01-20 | 长鑫存储技术有限公司 | Gas cleaning equipment, method, device, control system and storage medium |
| CN117133691B (en) * | 2023-10-25 | 2024-01-23 | 江苏芯梦半导体设备有限公司 | Environment detection method, detection device and cleaning equipment for wafer box after cleaning |
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