CN1320625C - Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution - Google Patents
Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution Download PDFInfo
- Publication number
- CN1320625C CN1320625C CNB031092217A CN03109221A CN1320625C CN 1320625 C CN1320625 C CN 1320625C CN B031092217 A CNB031092217 A CN B031092217A CN 03109221 A CN03109221 A CN 03109221A CN 1320625 C CN1320625 C CN 1320625C
- Authority
- CN
- China
- Prior art keywords
- wafer box
- open type
- front open
- gas
- type wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010943 off-gassing Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 37
- 238000007664 blowing Methods 0.000 claims abstract description 51
- 238000004140 cleaning Methods 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 163
- 239000007789 gas Substances 0.000 claims description 46
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000011109 contamination Methods 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000003749 cleanliness Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a front open type wafer box which can avoid outgassing contamination. The front open type wafer box at least is composed of a main body of the front open type wafer box and a cleaning device, wherein the main body of the front open type wafer box is provided with an opening part and a bottom plate which is opposite to the opening part; the cleaning device at least is provided with a gas blowing member in the main body of the front open type wafer box as well as a gas supply device which is connected with the gas blowing member and supplies gas to the gas blowing member.
Description
Technical field
The invention relates to a kind of manufacture of semiconductor and equipment, and particularly relevant for a kind of method of avoiding open wafer box before the outgassing pollution and avoiding outgassing pollution.
Background technology
Along with the integration of the semiconductor element of integrated circuit increases day by day, it is especially important that the accuracy of relative processing procedure just seems.Because, promptly may will cause the failure of processing procedure in processing procedure, cause the damage of wafer or scrap, thereby expend great amount of cost in case mistake (Error) slightly takes place or pollute.
In the general manufacture of semiconductor, the board of manufacture of semiconductor is made up of several modules (processing procedure/transmission/storage/safety interlocking/reacting gas), and, wafer is transmitted between processing procedure module and storage module by wafer transfer system (Wafer TransferSystem).And the transmission of wafer is to utilize robotic arm (Robot Blade), wafer is taken out from wafer carrier, be sent to and carry out the processing procedure reaction in the process reaction room, and after processing procedure finishes, wafer is passed back, send back to again in the wafer carrier, to carry out a series of fabrication steps.
8 cun wafers of tradition are to use a kind of standard mechanical interface (Standard MechanicalInter-Face, wafer carrier SMIF) of being called.Yet along with the progress of semiconductor fabrication, wafer size has increased to 12 cun, and the wafer carrier of its use is different with the wafer carrier of 8 cun wafers, be called front open type wafer box (Front Opening Unified Pod, FOUP), to be fit to bigger wafer.This kind front open type wafer box (FOUP) is that wafer is fixedly remained in the confined space, with the dust pollution wafer in the defence atmosphere.In the time wafer will being written into process apparatus, opening the lid of front open type wafer box (FOUP) again, and utilize the mechanical arm wafer of taking.
Look schematic diagram on a kind of semi-conductor processing equipment of Fig. 1 illustrate for existing processing wafer.Please refer to shown in Figure 1ly, this process apparatus 100 comprises reative cell 102, loads interlock region (Load_Lock) 104, mini environments district (Mini Environment) 106, mechanical arm 108,110 and front open type wafer cassette holder 112.
When carrying out reaction procedure, earlier front open type wafer box 114 is fixed on the front open type wafer cassette holder 112.When the wafer in will making front open type wafer box 114 is written into reative cell 102, utilizes take wafer in the front open type wafer box 114 of mechanical arms 108 in the mini environments district 106 earlier, and place it on the brilliant boat 116 that loads interlock region 104.Then transmitting brilliant boat 116 to reative cell 102 with mechanical arm 110 again reacts.After reaction finishes, utilize mechanical arm 110 to shift out brilliant boat 116 again, and utilize mechanical arm 108 to take behind the wafer on the brilliant boat 116, transmit wafer and get back in the front open type wafer box 114.Then, repetition above-mentioned steps each wafer in front open type wafer box is all reacted and is finished.
In above-mentioned steps is to carry out the processing procedure reaction with single wafer.And can place tens of wafer usually in the general front open type wafer box, therefore need a period of time just can make the interior wafer of whole front open type wafer box all carry out processing procedure and finish.So, when wafer is put back in the front open type wafer box through handling, if the wafer of treated mistake produces the phenomenon (Outgassing) of giving vent to anger, then the gas that diffuses out from wafer (as phosphorus gas) can be full of front open type wafer box inside, and other the untreated wafers in the polluting wafer box cause the acceptance rate of product to reduce.
Summary of the invention
A purpose of the present invention can prevent that wafer from polluting each other because of the phenomenon of giving vent to anger, and can promote the product fine rate for a kind of method of avoiding open wafer box before the outgassing pollution and avoiding outgassing pollution is provided.
The invention provides a kind of outgassing pollution open wafer box before of avoiding, this front open type wafer box is made of front open type wafer box body and cleaning device.The front open type wafer box body possesses peristome and base plate, and base plate is relative with peristome.Cleaning device possess at least the air blowing member that is arranged within the front open type wafer box body is arranged and connect the air blowing member and supply gas to the gas supply device of the member of blowing.
Wherein, the air blowing member is to be arranged at the base plate both sides, and the member of giving vent to anger can be filter or nozzle.The gas that blows out from the air blowing member can be inert gas or nitrogen.
Cleaning device is installed in the present invention additional in front open type wafer box, therefore the jet gas that of this cleaning device can avoid wafer to pollute each other with the gas band that diffuses out from wafer from front open type wafer box.And therefore this kind front open type wafer box simple structure does not need to change in addition the design of processing apparatus, and can save the cost of process apparatus.In addition, this kind front open type wafer box is free to load and unload from processing apparatus, and its application is comparatively easy, and the air blowing member has the function of filtration simultaneously, has certain cleanliness factor and can keep front open type wafer box.
The invention provides a kind of method of avoiding outgassing pollution, the method is earlier plural wafer to be written into a front open type wafer box, but this front open type wafer box inside is provided with a cleaning device of blow gas at least.Then, carry out untreated wafer to process reaction room from front open type wafer box, and in process reaction room, wafer is handled.Then, pass treated wafer back front open type wafer box after, repeat above-mentioned steps all wafers in front open type wafer box all through handling.Wherein carry out above-mentioned steps during, utilize cleaning device blow gas, with cleaning front open type wafer box inside, avoid wafer to pollute each other because of the phenomenon of giving vent to anger.
Above-mentioned cleaning device possess at least the air blowing member that is arranged within the front open type wafer box body is arranged and connect the air blowing member and supply gas to the gas supply device of the member of blowing.The air blowing member is to be arranged at the base plate both sides, and the member of giving vent to anger can be filter or nozzle.The gas that blows out from the air blowing member can be inert gas or nitrogen.
The present invention carry out the manufacture of semiconductor step during, utilize the front open type wafer box add cleaning device, therefore the gas band that will diffuse out from wafer can avoid wafer to pollute each other because of the phenomenon of giving vent to anger from front open type wafer box.And therefore this kind front open type wafer box simple structure does not need to change in addition the design of processing apparatus, and can save the cost of process apparatus.In addition, this kind front open type wafer box is free to load and unload from processing apparatus, and its application is comparatively easy, and the air blowing member has the function of filtration simultaneously, has certain cleanliness factor and can keep front open type wafer box.
Description of drawings
Fig. 1 illustrate is for looking schematic diagram on existing a kind of semi-conductor processing equipment of handling wafer;
Fig. 2 illustrate is the perspective view of front open type wafer box of the present invention;
Fig. 3 illustrate is for looking schematic diagram on a kind of semi-conductor processing equipment of handling wafer that is equiped with front open type wafer box of the present invention.
Embodiment
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Fig. 2 is the perspective view that illustrates front open type wafer box of the present invention.
Please refer to shown in Figure 2ly, front open type wafer box 200 of the present invention comprises front open type wafer box body 202 and cleaning device 204.Cleaning device 204 for example is to be made of air blowing member 206a～206d, gas supply device 208,210,212 of pipelines.
Then, the operating principle of front open type wafer box of the present invention is described, at first utilize gas supply device 208 supply gas (for example being nitrogen), gas is through pipeline 210 then, 212 arrival air blowing member 206a～206d also flow in the front open type wafer box 200, when gas during by air blowing member 206a～206d, micronic dust in the gas or other impurity can be filtered by air blowing member 206a～206d, and gas will become laminar condition 216 after by air blowing member 206a～206d, and brush wafer 214 surfaces and take away the impurity that wafer 214 diffusion into the surfaces go out, make to have certain cleanliness factor in the front open type wafer box.
In the above description, the number of air blowing member is to be that example is done explanation with four, and the number of the member of blowing certainly is not defined as four, and can be actual needs and suitable number is set.And, be to be arranged on the left and right sides of the base plate relative at the air blowing member with the opening of front open type wafer box body.Certainly.The air blowing member also can be arranged on both sides up and down or any position of base plate, on the whole even base plate.
Fig. 3 illustrate is the top view of manufacture of semiconductor device that front open type wafer box of the present invention is set.Please refer to shown in Figure 3, processing procedure adorn 300 comprise reative cell 302, load interlock region 304, mini environments district 306, mechanical arm 308,310, front open type wafer cassette holder 312 and front open type wafer box 314.Wherein, front open type wafer box 314 is to be arranged on the front open type wafer cassette holder 312, and is provided with cleaning device 316 in the front open type wafer box 314.
Then the operating principle that possesses the processing apparatus that front open type wafer box of the present invention is arranged is loaded onto in explanation.
At first, wafer is written in the front open type wafer box 314, then when the wafer in the front open type wafer box 314 is written into reative cell 302, stretches into the wafer of taking in the front open type wafer box 314 with the mechanical arm 308 in mini environments district 306.Mechanical arm 308 is taken behind the wafer, wafer is positioned on the brilliant boat that loads interlock region 304, and then is sent to reative cell 302 with the brilliant boat that the mechanical arm 310 that loads interlock region 304 will be placed with wafer and reacts.
After wafer being carried out the processing procedure end, elder generation shifts out from reative cell 302 with the brilliant boat that the mechanical arm 310 that loads interlock region 304 will be placed with wafer, take behind the wafer on the brilliant boat with the mechanical arm 308 in mini environments district 306 again, wafer is put back in the front open type wafer box 314.Then, repeat same action again and other the wafer in the front open type wafer box 314 is delivered in the reative cell 302 in regular turn reacted, wafers all in front open type wafer box 314 are all finished processing procedure.First wafer in the front open type wafer box 314 is being reacted in the process that last wafer in the front open type wafer box 314 is reacted, open the cleaning device 316 on the front open type wafer box, gas is sent from gas supply device 316c, and by behind the pipeline 316b, from being arranged at the air blowing member 316a ejection in the front open type wafer box 314.So, when the wafer of treated mistake produces exhaust phenomenon (Outgassing), can be in front open type wafer box 314 from the gas (as phosphorus gas) that wafer diffuses out by the gas band that blows out from air blowing member 316a, therefore can avoid other the untreated wafers in the polluting wafer box, cause the acceptance rate of product to reduce.
Described according to the embodiment of the invention, in front open type wafer box, install cleaning device additional, this cleaning device is jetted the gas that can be with the gas band that diffuses out from wafer from front open type wafer box, therefore carry out the manufacture of semiconductor step during, can avoid wafer to pollute each other because of the phenomenon of giving vent to anger.
And cleaning device is directly installed in the present invention additional in front open type wafer box, and therefore its simple structure does not need to change in addition the design of processing apparatus, and can save the cost of process apparatus.
In addition, front open type wafer box of the present invention is free to load and unload from processing apparatus, and its application is comparatively easy, and the air blowing member has the function of filtration simultaneously, has certain cleanliness factor and can keep front open type wafer box.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (10)
1. avoid outgassing pollution open wafer box before for one kind, it is characterized in that, comprise at least:
One front open type wafer box body comprises a peristome and a base plate, and this base plate is relative with this peristome; And
One cleaning device, this cleaning device comprises;
At least one air blowing member is arranged within this front open type wafer box body, and is arranged at this base plate both sides; And
One gas supply device connects this air blowing member, and supplies with a gas to this member of blowing.
2. the outgassing pollution open wafer box before of avoiding as claimed in claim 1 is characterized in that wherein this member of giving vent to anger comprises filter.
3. the outgassing pollution open wafer box before of avoiding as claimed in claim 1 is characterized in that wherein this member of giving vent to anger comprises nozzle.
4. the outgassing pollution open wafer box before of avoiding as claimed in claim 1 is characterized in that wherein this gas comprises inert gas.
5. the outgassing pollution open wafer box before of avoiding as claimed in claim 1 is characterized in that wherein this gas comprises nitrogen.
6. a method of avoiding outgassing pollution is characterized in that, this method comprises:
(a) plural wafer is written into a front open type wafer box, but this front open type wafer box inside is provided with a cleaning device of blow gas at least, this cleaning device comprises an at least one air blowing member and a gas supply device, this air blowing member is arranged within this front open type wafer box body, and be arranged at this base plate both sides, this gas supply device connects the air blowing member, and supplies with a gas to this member of blowing;
(b) carry out untreated wafer to a process reaction room from this front open type wafer box;
(c) in this process reaction room, handle this wafer;
(d) pass this treated wafer back this front open type wafer box;
(e) repeating step (b) is to step (d), and those wafers in this front open type wafer box are all through handling; And
(f) in step (b) during the step (e), utilize this cleaning device to blow out a gas, to clean this front open type wafer box inside, avoid those wafers to pollute each other because of the phenomenon of giving vent to anger.
7. the method for avoiding outgassing pollution as claimed in claim 6 is characterized in that, wherein this member of giving vent to anger comprises filter.
8. the method for avoiding outgassing pollution as claimed in claim 6 is characterized in that, wherein this member of giving vent to anger comprises nozzle.
9. the method for avoiding outgassing pollution as claimed in claim 6 is characterized in that wherein this gas comprises inert gas.
10. the method for avoiding outgassing pollution as claimed in claim 6 is characterized in that wherein this gas comprises nitrogen.
11. the method for avoiding outgassing pollution as claimed in claim 6 is characterized in that, wherein in step (f), this gas that blows out comprises and is laminar condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031092217A CN1320625C (en) | 2003-04-03 | 2003-04-03 | Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031092217A CN1320625C (en) | 2003-04-03 | 2003-04-03 | Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1536639A CN1536639A (en) | 2004-10-13 |
| CN1320625C true CN1320625C (en) | 2007-06-06 |
Family
ID=34319241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031092217A Expired - Fee Related CN1320625C (en) | 2003-04-03 | 2003-04-03 | Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1320625C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685788B (en) * | 2008-09-23 | 2012-05-09 | 家登精密工业股份有限公司 | Front open type wafer box with latch and airtight structure |
| CN104752261B (en) * | 2013-12-30 | 2019-01-18 | 北京北方华创微电子装备有限公司 | Wafer blow device, system and method |
| CN108962804B (en) * | 2017-05-19 | 2021-08-10 | 沈阳芯源微电子设备股份有限公司 | Uninterrupted film feeding and returning device and control method |
| CN109712906B (en) * | 2017-10-25 | 2021-05-11 | 长鑫存储技术有限公司 | Wafer storage device with cleaning function and semiconductor production equipment |
-
2003
- 2003-04-03 CN CNB031092217A patent/CN1320625C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1536639A (en) | 2004-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4581032B2 (en) | Substrate processing apparatus, pod opening / closing apparatus, substrate processing method, and semiconductor device manufacturing method | |
| JP4516966B2 (en) | Semiconductor manufacturing apparatus, substrate loading / unloading method, and semiconductor device manufacturing method | |
| JP5934165B2 (en) | Workpiece stocker arranged in a ring | |
| KR100795766B1 (en) | Substrate processing apparatus | |
| US20060215347A1 (en) | Processing apparatus and recording medium | |
| US20060056952A1 (en) | Nonproductive wafer buffer module for substrate processing apparatus | |
| JP2009147368A (en) | Method of manufacturing semiconductor device by multichamber system | |
| JP2005150706A (en) | Substrate transfer container, device, and method | |
| JPH04229633A (en) | Apparatus and method for vacuum conveyance and treatment of wafer | |
| JP2006351868A (en) | Processing system and processing method | |
| EP3605598A1 (en) | Thin-plate substrate holding finger and transfer robot provided with said finger | |
| US20040177926A1 (en) | Method and apparatus for processing substrates and method for manufacturing a semiconductor device | |
| CN101617397B (en) | Removable compartments for workpiece stocker | |
| CN115132629B (en) | Multi-size compatible type closed substrate box loading port | |
| CN1320625C (en) | Open wafer box before prevetion of outgassing pollution and method for preventing outgassing pollution | |
| JP4255222B2 (en) | Substrate processing apparatus, substrate processing method, and semiconductor device manufacturing method | |
| JP2006086308A (en) | Semiconductor manufacturing device | |
| US7308757B2 (en) | Intermediate product manufacturing apparatus, and intermediate product manufacturing method | |
| US20040069409A1 (en) | Front opening unified pod door opener with dust-proof device | |
| JP2005079250A (en) | Substrate processing apparatus | |
| JP2006351864A (en) | Processing system and processing method | |
| KR100760992B1 (en) | A position change apparatus of substrate | |
| US20150221537A1 (en) | Container interchanging method | |
| JP2005235916A (en) | Thin-film solar cell manufacturing system | |
| KR102332805B1 (en) | Improved High Density Tec-Cell Carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070606 Termination date: 20100403 |